CN107022235A - A kind of electronics wheat draws high covering black-colored resin composition - Google Patents
A kind of electronics wheat draws high covering black-colored resin composition Download PDFInfo
- Publication number
- CN107022235A CN107022235A CN201710076999.1A CN201710076999A CN107022235A CN 107022235 A CN107022235 A CN 107022235A CN 201710076999 A CN201710076999 A CN 201710076999A CN 107022235 A CN107022235 A CN 107022235A
- Authority
- CN
- China
- Prior art keywords
- parts
- black
- resin composition
- colored resin
- pbt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Covering black-colored resin composition is drawn high the invention discloses a kind of electronics wheat, it is formulated by the component of following parts by weight：2~9 parts of 411 polyester resin of 60~70 parts of PBT, Degussa L, 0.5~5 part of dispersant, 0.5~3 part of defoamer, 0.5~3 part of levelling agent, 5~15 parts of Cabot M L carbon blacks, 6~16 parts of copper-chrome black, 2~8 parts of wax powder, 2~8 parts of trimethylbenzene, 0.5~5 part of durene.This electronics wheat draws high covering high glaze resin combination using two kinds of resin compoundings, by their mutual synergy, and under the cooperation of other components, can make resin combination film while having high covering performance, high rigidity and high adhesion force.
Description
Technical field
The invention belongs to ink resin compositions field, and in particular to a kind of electronics wheat draws high covering black-colored resin composition
And preparation method thereof.
Background technology
Mylar film, is generally referred to by cross cutting（DIECUT）By drawing or specified stamp is into sheet material.Wheat, which is drawn, metal
With nonmetallic two kinds, metal mylar film it is conventional have the drawing of copper foil wheat, aluminium foil wheat is drawn, and main function is conductive；And nonmetallic wheat is drawn
It is insulating effect mostly, common materials have PC, PET, for the surface protection of thin film switch or electronic and electrical equipment, or part is absolutely
Edge.The color of mylar film has a variety of, conventional to have transparent, white, black, and other colors can require to print according to specified.Mylar film
With high insulation resistance, proof voltage is high, moisture resistant, gas, the invasion and attack of hyperpyrexia and chemical substance, low-shrinkage, be difficult it is brittle resistance to
The characteristics such as abrasion.
Due to constantly bringing forth new ideas for production technology processing procedure, the demand proposed at present is met in its FPC（FPC）On
It is high cover black ink, and existing ink cannot concurrently reach the requirement of high covering, high glaze and high adhesion force.
The content of the invention
The purpose of the present invention is to draw high covering black-colored resin composition there is provided a kind of electronics wheat on the basis of existing technology
And preparation method thereof.
The purpose of the present invention can be reached by following measures：
A kind of electronics wheat draws high covering black-colored resin composition, and it is formulated by the component of following parts by weight：PBT 60~70
Part, 2~9 parts of Degussa L-411 polyester resin, 0.5~5 part of dispersant, 0.5~3 part of defoamer, 0.5~3 part of levelling agent, card
Rich 5~15 parts of spy M-L carbon blacks, 6~16 parts of copper-chrome black, 2~8 parts of wax powder, 2~8 parts of trimethylbenzene, 0.5~5 part of durene.
In a kind of preferred scheme, electronics wheat draw high cover black-colored resin composition by following parts by weight component prepare and
Into：2~7 parts of 62~68 parts of PBT, Degussa L-411 polyester resin, 0.5~4 part of dispersant, 0.5~2 part of defoamer, levelling
0.5~2 part of agent, 5~12 parts of Cabot M-L carbon blacks, 6~13 parts of copper-chrome black, 2~6 parts of wax powder, 2~6 parts of trimethylbenzene, durene
0.5~3 part.
In another preferred scheme, electronics wheat draws high the component preparation for covering black-colored resin composition by following parts by weight
Form：3~5 parts of 63~67 parts of PBT, Degussa L-411 polyester resin, 1~3 part of dispersant, 0.5~2 part of defoamer, levelling
0.5~2 part of agent, 6~10 parts of Cabot M-L carbon blacks, 8~11 parts of copper-chrome black, 3~5 parts of wax powder, 3~5 parts of trimethylbenzene, durene 1
~3 parts.
In a kind of more preferably scheme, electronics wheat draws high the component preparation for covering black-colored resin composition by following parts by weight
Form：4 parts of 65 parts of PBT, Degussa L-411 polyester resin, 2 parts of dispersant, 1 part of defoamer, 1 part of levelling agent, Cabot M-L
8 parts of carbon black, 9 parts of copper-chrome black, 4 parts of wax powder, 4 parts of trimethylbenzene, 2 parts of durene.
The PBT resin of the present invention may be selected from the husky uncle basis 325M-54018 or G6 HR of BASF Ultradu B 2300
Unc。
The dispersant of the present invention is selected from EFKA4560 or the dispersants of SN 5040.
The present invention defoamer be selected from surfynol MD 20, Surfynol 104E, Tego 825, BYK 020 or
BYK028 defoamers.
The levelling agent of the present invention is selected from BYK333, BYK361, Glide 432, Flow 300 or the levelling agents of Efka 3600.
The preparation method for covering black-colored resin composition is drawn high the invention discloses a kind of above-mentioned electronics wheat：20 DEG C~80
First trimethylbenzene and durene are well mixed at DEG C, PBT and Degussa L-411 polyester resin is then added, hybrid reaction is stirred,
Cabot M-L carbon blacks and copper-chrome black are added, high-speed stirred is uniform, is ground to after being stirred behind fineness≤5 μm, continuously adds and disappear
Infusion, dispersant, levelling agent and wax powder, stir.
Beneficial effects of the present invention：This electronics wheat draws high covering high glaze resin combination using two kinds of resin compoundings, leads to
Their mutual synergy is crossed, and under the cooperation of other components, resin combination film can be made while having high covering
Performance, high rigidity and high adhesion force.
Embodiment
Present disclosure is described further with reference to embodiments.But protection scope of the present invention is not limited to following
Each embodiment.
The preparation method of resin combination is in following example：First trimethylbenzene and durene are well mixed at 60 DEG C,
Then PBT and Degussa L-411 polyester resin are added, hybrid reaction is stirred, adds Cabot M-L carbon blacks and copper-chrome black, it is high
Speed stirs, and is ground to after being stirred behind fineness≤5 μm, continuously adds defoamer, dispersant, levelling agent and wax powder, stirring
Uniformly.
Embodiment 1
The raw material of each parts by weight of resin combination is constituted：4 parts of 65 parts of PBT, Degussa L-411 polyester resin, dispersant 2
Part, 1 part of defoamer, 1 part of levelling agent, 8 parts of Cabot M-L carbon blacks, 9 parts of copper-chrome black, 4 parts of wax powder, 4 parts of trimethylbenzene, durene 2
Part.
Embodiment 2
The raw material of each parts by weight of resin combination is constituted：6 parts of 62 parts of PBT, Degussa L-411 polyester resin, dispersant 2
Part, 1 part of defoamer, 1 part of levelling agent, 9 parts of Cabot M-L carbon blacks, 8 parts of copper-chrome black, 4 parts of wax powder, 4 parts of trimethylbenzene, durene 2
Part.
Embodiment 3
The raw material of each parts by weight of resin combination is constituted：3 parts of 67 parts of PBT, Degussa L-411 polyester resin, dispersant 1
Part, 2 parts of defoamer, 1 part of levelling agent, 8 parts of Cabot M-L carbon blacks, 9 parts of copper-chrome black, 4 parts of wax powder, 5 parts of trimethylbenzene, durene 1
Part.
Embodiment 4
The raw material of each parts by weight of resin combination is constituted：5 parts of 63 parts of PBT, Degussa L-411 polyester resin, dispersant 2
Part, 1 part of defoamer, 1 part of levelling agent, 9 parts of Cabot M-L carbon blacks, 8 parts of copper-chrome black, 4 parts of wax powder, 3 parts of trimethylbenzene, durene 3
Part.
Comparative example 1
Degussa L-411 polyester resin in embodiment 1 is removed, and PBT consumption is changed to 69 parts, other be the same as Examples 1.
Comparative example 2
PBT in embodiment 1 is removed, and the consumption of Degussa L-411 polyester resin is changed to 69 parts, other be the same as Examples 1.
Comparative example 3
The consumption of PBT in embodiment 1 is changed to 40 parts, other be the same as Examples 1.
Comparative example 4
The consumption of Degussa L-411 polyester resin in embodiment 1 is changed to 15 parts, other be the same as Examples 1.
Embodiment 5：Film performance is tested
Resin combination obtained by each embodiment is printed on PET base material surface, baking box is put into after being completed for printing 60 DEG C roasting 30
Minute, film is obtained, film is tested.
The adhesive force of film is with reference to standard GB/T/T9286-1998《The lattice of drawing of paint and varnish paint film are tested》[enter
The stroke lattice tape pull method of row ten is tested, and test result is expressed as 0-5 grades, wherein 0 grade best, 5 grades worst.
The hardness of film is with reference to standard GB/T/T6739-1996《Hardness of film pencil determination method》It is measured, is divided into
Totally 13 grades of 6H to 6B, wherein 6H is most hard, and 6B is most soft.
Film is covered using this resin combination is printed on mylar film, and mylar film is placed under LED after drying
Look after, can't see LED light line good for 0 grade, it can be seen that LED light line is 1 grade poor.
The ink film that each example is obtained by more than carries out performance test, as a result such as following table.
| Performance | Hardness H | Adhesive force | Opacity |
| Embodiment 1 | 4 | 2 | 0 |
| Embodiment 2 | 3 | 2 | 0 |
| Embodiment 3 | 3 | 3 | 0 |
| Embodiment 4 | 3 | 2 | 0 |
| Comparative example 1 | 1 | 5 | 1 |
| Comparative example 2 | 1 | 5 | 1 |
| Comparative example 3 | 2 | 5 | 1 |
| Comparative example 4 | 2 | 4 | 1 |
Claims (8)
1. a kind of electronics wheat draws high covering black-colored resin composition, it is characterised in that it prepared by the component of following parts by weight and
Into：2~9 parts of 60~70 parts of PBT, Degussa L-411 polyester resin, 0.5~5 part of dispersant, 0.5~3 part of defoamer, levelling
0.5~3 part of agent, 5~15 parts of Cabot M-L carbon blacks, 6~16 parts of copper-chrome black, 2~8 parts of wax powder, 2~8 parts of trimethylbenzene, durene
0.5~5 part.
2. electronics wheat according to claim 1 draws high covering black-colored resin composition, it is characterised in that it is by following weight
The component of part is formulated：2~7 parts of 62~68 parts of PBT, Degussa L-411 polyester resin, 0.5~4 part of dispersant, froth breaking
0.5~2 part of agent, 0.5~2 part of levelling agent, 5~12 parts of Cabot M-L carbon blacks, 6~13 parts of copper-chrome black, 2~6 parts of wax powder, front three
2~6 parts of benzene, 0.5~3 part of durene.
3. electronics wheat according to claim 2 draws high covering black-colored resin composition, it is characterised in that it is by following weight
The component of part is formulated：3~5 parts of 63~67 parts of PBT, Degussa L-411 polyester resin, 1~3 part of dispersant, defoamer
0.5~2 part, 0.5~2 part of levelling agent, 6~10 parts of Cabot M-L carbon blacks, 8~11 parts of copper-chrome black, 3~5 parts of wax powder, trimethylbenzene 3
~5 parts, 1~3 part of durene.
4. electronics wheat according to claim 3 draws high covering black-colored resin composition, it is characterised in that it is by following weight
The component of part is formulated：4 parts of 65 parts of PBT, Degussa L-411 polyester resin, 2 parts of dispersant, 1 part of defoamer, levelling agent 1
Part, 8 parts of Cabot M-L carbon blacks, 9 parts of copper-chrome black, 4 parts of wax powder, 4 parts of trimethylbenzene, 2 parts of durene.
5. the electronics wheat according to any one in Claims 1 to 4 draws high covering black-colored resin composition, it is characterised in that
The PBT is selected from the husky uncle basis 325M-54018 or G6 HR Unc of BASF Ultradu B 2300.
6. the electronics wheat according to any one in Claims 1 to 4 draws high covering black-colored resin composition, it is characterised in that
The dispersant is selected from EFKA4560 or the dispersants of SN 5040；Defoamer be selected from surfynol MD 20, Surfynol 104E,
Tego 825, BYK 020 or BYK028 defoamers.
7. the electronics wheat according to any one in Claims 1 to 4 draws high covering black-colored resin composition, it is characterised in that
The levelling agent is selected from BYK333, BYK361, Glide 432, Flow 300 or the levelling agents of Efka 3600.
8. the electronics wheat according to any one in Claims 1 to 4 draws high the preparation method for covering black-colored resin composition,
It is characterized in that being first well mixed trimethylbenzene and durene at 20 DEG C~80 DEG C, then add PBT and Degussa L-411 and gather
Ester resin, stirs hybrid reaction, adds Cabot M-L carbon blacks and copper-chrome black, and high-speed stirred is uniform, is ground to after being stirred thin
After≤5 μm of degree, defoamer, dispersant, levelling agent and wax powder are continuously added, is stirred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710076999.1A CN107022235A (en) | 2017-02-13 | 2017-02-13 | A kind of electronics wheat draws high covering black-colored resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710076999.1A CN107022235A (en) | 2017-02-13 | 2017-02-13 | A kind of electronics wheat draws high covering black-colored resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107022235A true CN107022235A (en) | 2017-08-08 |
Family
ID=59526228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710076999.1A Withdrawn CN107022235A (en) | 2017-02-13 | 2017-02-13 | A kind of electronics wheat draws high covering black-colored resin composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107022235A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105199479A (en) * | 2015-09-02 | 2015-12-30 | 王景泉 | Black ink for mylar prepared on basis of PET (polyester) materials and preparation method of black ink |
-
2017
- 2017-02-13 CN CN201710076999.1A patent/CN107022235A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105199479A (en) * | 2015-09-02 | 2015-12-30 | 王景泉 | Black ink for mylar prepared on basis of PET (polyester) materials and preparation method of black ink |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10995232B2 (en) | Flexible conductive ink | |
| CN105199479A (en) | Black ink for mylar prepared on basis of PET (polyester) materials and preparation method of black ink | |
| CN103436099A (en) | Composite conductive printing ink | |
| JP2016106356A (en) | Conductive paste and method for producing conductive film | |
| CN106752385A (en) | A kind of Graphene modified water-soluble electrically conductive ink and preparation method thereof | |
| TW201922960A (en) | Antistatic powder coating composition | |
| CN102341866A (en) | Electrically conductive paste composition and electrically conductive film formed by using same | |
| KR101812514B1 (en) | Conductive metal organic decomposition ink composition having excellent light absorption coefficient and manufacturing method of metal thin film using the ink composition | |
| CN108605425A (en) | Electromagnetic shielding film | |
| CN103408995A (en) | Screen printing ink | |
| CN103937350A (en) | Graphene-rod-like aluminum-doped zinc oxide antistatic coating and preparation method thereof | |
| KR20140111223A (en) | Viscosity modifier for high concentration dispersion of inorganic fine particles and high concentration dispersion of inorganic fine particles which contains the same | |
| CN103923590A (en) | Black resin composition and method for preparing black glue film by using resin composition | |
| JP2014089818A (en) | Heat curable conductive paste | |
| CN113881287A (en) | Water-based graphene conductive ink composition, water-based graphene conductive ink, and preparation method and application thereof | |
| CN107022234A (en) | Electronics wheat draws high covering high adhesion force black-colored resin composition | |
| CN107022235A (en) | A kind of electronics wheat draws high covering black-colored resin composition | |
| CN107025966A (en) | Electronics wheat draws high covering high rigidity black-colored resin composition | |
| CN107022175A (en) | Electronics wheat draws high covering black-colored resin composition | |
| CN102102002A (en) | Adhesive suitable for copper-clad laminate with high tracking index | |
| CN104419249B (en) | A kind of environment-friendly black scrapes the preparation method of ink off | |
| CN107022232A (en) | Electronics wheat draws high covering high adhesion force resin combination | |
| CN107011724A (en) | A kind of electronics wheat, which is drawn, resists bright trace High temperature-resistanresin resin composition | |
| CN109651876A (en) | A kind of environment-friendly water-based high temperature baking vanish ink for screen printing and preparation method thereof | |
| CN107022231A (en) | Corrosion-resistant and high-temperature resistant instrument draws ink with electronics wheat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170808 |