CN107022226A - SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition - Google Patents
SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition Download PDFInfo
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- CN107022226A CN107022226A CN201710069863.8A CN201710069863A CN107022226A CN 107022226 A CN107022226 A CN 107022226A CN 201710069863 A CN201710069863 A CN 201710069863A CN 107022226 A CN107022226 A CN 107022226A
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- resistanresin
- high temperature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Drawn the invention discloses a kind of SD card with electronics wheat and resist bright trace High temperature-resistanresin resin composition, it is formulated by the raw material of following parts by weight：5~15 parts of makrolon, 5~15 parts of PBT, 2~9 parts of ABS, alkyd modified 0.5~5 part of organic siliconresin, 2~9 parts of nitrocotton resin, 0.5~4 part of dispersant, 0.5~3 part of defoamer, 0.5~3 part of levelling agent, 2~9 parts of 75 carbon blacks of Mitsubishi MA, 5~15 parts of copper-chrome black, inorganic iron black 1~5 part, 5~15 parts of filler, 5~11 parts of cyclohexanone, 5~15 parts of propylene-glycol ethyl ether acetate, 15~22 parts of isophorone, 0.5~4 part of dibasic ester, 0.5~3 part of silica.This resin combination adjusts the rate of volatilization of solvent by the cooperation of different amounts solvent, makes ink setting completely, when overlaying piece, without vestige, make ink surface smooth in ink surface in the case where each component is particularly the mutual synergy of five kinds of resins, hardness is high, when overlaying piece, no vestige.
Description
Technical field
The invention belongs to technical field of ink, and in particular to a kind of SD card draws anti-bright trace fire resistant resin to combine with electronics wheat
Thing and preparation method thereof.
Background technology
Mylar film, is generally referred to by cross cutting（DIECUT）By drawing or specified stamp is into sheet material.Wheat, which is drawn, metal
With nonmetallic two kinds, metal mylar film it is conventional have the drawing of copper foil wheat, aluminium foil wheat is drawn, and main function is conductive；And nonmetallic wheat is drawn
It is insulating effect mostly, common materials have PC, PET, for the surface protection of thin film switch or electronic and electrical equipment, or part is absolutely
Edge.The color of mylar film has a variety of, conventional to have transparent, white, black, and other colors can require to print according to specified.Mylar film
With high insulation resistance, proof voltage is high, moisture resistant, gas, the invasion and attack of hyperpyrexia and chemical substance, low-shrinkage, be difficult it is brittle resistance to
The characteristics such as abrasion.
Common ink has process to print glue on ink in the manufacturing process that wheat pulls on after printing, then pastes small pieces and protects
Cuticula, and be deposited in and bright trace occurs around small post-chip to have a strong impact on the quality that printing and electronics wheat are drawn.
The content of the invention
The purpose of the present invention is to draw to resist bright trace high temperature resistant tree on the basis of existing technology there is provided a kind of SD card electronics wheat
Oil/fat composition.
Drawn it is a further object of the present invention to provide a kind of above-mentioned SD card with electronics wheat and resist bright trace High temperature-resistanresin resin composition
Preparation method.
The purpose of the present invention can be reached by following measures：
A kind of SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, and it is formulated by the raw material of following parts by weight：It is poly-
5~15 parts of carbonic ester, 5~15 parts of PBT, 2~9 parts of ABS, alkyd modified 0.5~5 part of organic siliconresin, nitrocotton resin 2~
9 parts, 0.5~4 part of dispersant, 0.5~3 part of defoamer, 0.5~3 part of levelling agent, 2~9 parts of Mitsubishi's MA-75 carbon blacks, copper-chrome black 5
~15 parts, inorganic iron black 1~5 part, 5~15 parts of filler, 5~11 parts of cyclohexanone, 5~15 parts of propylene-glycol ethyl ether acetate, different Buddhist
15~22 parts of ketone of that, 0.5~4 part of dibasic ester, 0.5~3 part of silica.
In a kind of preferred scheme, this resin combination is formulated by the raw material of following parts by weight：Makrolon 7~13
Part, 7~13 parts of PBT, 3~7 parts of ABS, alkyd modified 0.5~3 part of organic siliconresin, 2~7 parts of nitrocotton resin, dispersant
0.5~3 part, 0.5~2 part of defoamer, 0.5~2 part of levelling agent, 2~7 parts of Mitsubishi's MA-75 carbon blacks, 7~13 parts of copper-chrome black is inorganic
It is iron black 1~5 part, 7~13 parts of filler, 5~11 parts of cyclohexanone, 7~13 parts of propylene-glycol ethyl ether acetate, isophorone 15~22
Part, 0.5~3 part of dibasic ester, 0.5~2 part of silica.
In another preferred scheme, this resin combination is formulated by the raw material of following parts by weight：Makrolon 8~
12 parts, 8~12 parts of PBT, 4~6 parts of ABS, alkyd modified 1~3 part of organic siliconresin, 3~6 parts of nitrocotton resin, dispersant
0.5~3 part, 0.5~2 part of defoamer, 0.5~2 part of levelling agent, 3~7 parts of Mitsubishi's MA-75 carbon blacks, 8~12 parts of copper-chrome black is inorganic
It is iron black 1~5 part, 8~12 parts of filler, 6~11 parts of cyclohexanone, 8~12 parts of propylene-glycol ethyl ether acetate, isophorone 15~22
Part, 1~3 part of dibasic ester, 0.5~2 part of silica.
In a kind of preferred scheme, this resin combination is formulated by the raw material of following parts by weight：Makrolon
10 parts, 10 parts of PBT, 5 parts of ABS, alkyd modified 2 parts of organic siliconresin, 5 parts of nitrocotton resin, 2 parts of dispersant, defoamer 1
Part, 1 part of levelling agent, 35 parts of Mitsubishi's MA-75 carbon blacks, 10 parts of copper-chrome black, inorganic iron black 4 parts, 10 parts of filler, 8 parts of cyclohexanone, third
10 parts of glycol ether acetate, 18 parts of isophorone, 2 parts of dibasic ester, silica 1 part.
PBT in the present invention is selected from the husky uncle basis 325M-54018 or G6 HR Unc of BASF Ultradu B 2300.
ABS in the present invention is selected from strange U.S. PA-765A or LG chemistry XR-407E.
It is alkyd modified organic that alkyd modified organic siliconresin in the present invention is selected from pretty happy JY 7100 or SHIN-ETSU HANTOTAI KR-5206
Silicones.
Dispersant in the present invention is selected from EFKA4560 or the dispersants of SN 5040.
Defoamer in the present invention be selected from surfynol MD 20, Surfynol 104E, Tego 825, BYK 020 or
BYK028 defoamers.
Levelling agent in the present invention is selected from BYK333, BYK361, Glide 432, Flow 300 or the levellings of Efka 3600
Agent.
Nitrocotton resin in the present invention may be selected from 1/2 second nitrocotton liquid or 1/4 second nitrocotton liquid.
Inorganic iron oxide black in the present invention may be selected from 7# iron oxide blacks.
Filler in the present invention be selected from kaolin, bentonite, talcum powder, barium sulfate, flatting silica, titanium dioxide, calcite in powder,
Wollastonite, dolomite dust, transparent powder or calcium carbonate.
A kind of above-mentioned SD card draws the preparation method for resisting bright trace High temperature-resistanresin resin composition with electronics wheat：In temperature 20 DEG C~80
First cyclohexanone, propylene-glycol ethyl ether acetate, isophorone, dibasic ester are well mixed at DEG C, then add makrolon,
PBT, ABS, alkyd modified organic siliconresin and nitrocotton resin, stir hybrid reaction, add filler, Mitsubishi's MA-75 carbon
Black, inorganic iron black and copper-chrome black, high-speed stirred is uniform, is ground to after being stirred behind fineness≤5 μm, continuously adds defoamer, stream
Flat agent, dispersant and silica, stir.
The electronics wheat of the present invention draws ink to can apply to the printing aspect that SD card electronics wheat draws material, can also enter one
Step is applied in terms of the printing of other field product material.
Beneficial effects of the present invention：
This resin combination adjusts the rate of volatilization of solvent by the cooperation of different amounts solvent, makes ink setting completely, overlays
During piece, no vestige makes ink surface smooth in ink surface, hardness in the case where each component is particularly the mutual synergy of five kinds of resins
Height, when overlaying piece, no vestige.Meanwhile, the ink coating that the resin combination is obtained also has high rigidity, high adhesion force, resistance to height
The performances such as temperature, high covering, high-leveling, high-insulativity, draw for electronics wheat and provide better working condition.
Embodiment
Present disclosure is described further with reference to embodiments.But protection scope of the present invention is not limited to following
Each embodiment.
The preparation method of resin combination is in following example：First by cyclohexanone, propylene-glycol ethyl ether acetate, different Fo Er
Ketone, dibasic ester are well mixed, and then add makrolon, PBT, ABS, alkyd modified organic siliconresin and nitrification cotton plant
Fat, stirs hybrid reaction, adds filler, Mitsubishi's MA-75 carbon blacks, inorganic iron black and copper-chrome black, and high-speed stirred is uniform, is stirred
After be ground to behind fineness≤5 μm, continuously add defoamer, levelling agent, dispersant and silica, stir.
Embodiment 1
The raw material of each parts by weight of resin combination is：10 parts of makrolon, PBT（Husky uncle basis 325M-54018）10 parts, ABS
（PA-765A）5 parts, alkyd modified 7,100 2 parts of organic siliconresin JY, 1/4 second 5 parts of nitrocotton resin, dispersant EFKA4560
2 parts, 020 1 parts of defoamer BYK, 1 part of levelling agent BYK333,35 parts of Mitsubishi's MA-75 carbon blacks, 10 parts of copper-chrome black, 7# iron oxide
Black 4 parts, 10 parts of titanium dioxide, 8 parts of cyclohexanone, 10 parts of propylene-glycol ethyl ether acetate, 18 parts of isophorone, 2 parts of dibasic ester, two
1 part of silica.
Embodiment 2
The raw material of each parts by weight of resin combination is：12 parts of makrolon, PBT（Husky uncle basis 325M-54018）13 parts, ABS
（PA-765A）4 parts, alkyd modified 7,100 3 parts of organic siliconresin JY, 1/4 second 4 parts of nitrocotton resin, dispersant EFKA4560
2 parts, 020 1 parts of defoamer BYK, 1 part of levelling agent BYK333,30 parts of Mitsubishi's MA-75 carbon blacks, 15 parts of copper-chrome black, 7# iron oxide
Black 4 parts, 9 parts of flatting silica, 9 parts of cyclohexanone, 9 parts of propylene-glycol ethyl ether acetate, 19 parts of isophorone, 2 parts of dibasic ester, dioxy
1 part of SiClx.
Embodiment 3
The raw material of each parts by weight of resin combination is：9 parts of makrolon, PBT（The G6 HR of BASF Ultradu B 2300
Unc）9 parts, ABS（XR-407E）6 parts, alkyd modified 3 parts of organic siliconresin KR-5206,1/4 second 5 parts of nitrocotton resin, point
1 part of 2 parts of powder EFKA4560, defoamer Surfynol 104E, 300 1 parts of levelling agent Flow, Mitsubishi's MA-75 carbon blacks 38
Part, 7 parts of copper-chrome black, 4 parts of 7# iron oxide blacks, 8 parts of talcum powder, 7 parts of cyclohexanone, 11 parts of propylene-glycol ethyl ether acetate, isophorone
18 parts, 2 parts of dibasic ester, silica 1 part.
Embodiment 4
The raw material of each parts by weight of resin combination is：9 parts of makrolon, PBT（The G6 HR of BASF Ultradu B 2300
Unc）11 parts, ABS（XR-407E）6 parts, alkyd modified 2 parts of organic siliconresin KR-5206,1/4 second 6 parts of nitrocotton resin, point
1 part of 5,040 2 parts of powder SN, defoamer Surfynol 104E, 300 1 parts of levelling agent Flow, 33 parts of Mitsubishi's MA-75 carbon blacks,
13 parts of copper-chrome black, 4 parts of 7# iron oxide blacks, 11 parts of kaolin, 9 parts of cyclohexanone, 9 parts of propylene-glycol ethyl ether acetate, isophorone 19
Part, 2 parts of dibasic ester, silica 1 part.
Comparative example 1
Makrolon is removed in embodiment 1, and PBT consumption is changed to 20 parts, other be the same as Examples 1.
Comparative example 2
PBT is removed in embodiment 1, and the consumption of makrolon is changed to 20 parts, other be the same as Examples 1.
Comparative example 3
ABS is removed in embodiment 1, and the consumption of alkyd modified organic siliconresin is changed to 7 parts, other be the same as Examples 1.
Embodiment 5：Ink performance is tested
This electronics wheat, which is drawn, resists bright trace ink resin composition to be printed on PET base material surface, and baking box 80 is put into after being completed for printing
DEG C roasting 30 minutes, obtain electronics wheat and draw semi-finished product, the film of the semi-finished product is tested.
Glue is printed on semi-finished product on ink, small pieces diaphragm is then pasted, observes around small post-chip bright trace whether occur,
Its middle grade 0 is does not occur, and grade 1 is to have bright trace phenomenon.
The high temperature resistant of film is not sticked out using film at 170 DEG C in ink in 5 minutes, and its middle grade 0 is good, grade
1 is to stick out phenomenon.
Film PET adhesive force on PC materials with reference to standard GB/T/T9286-1998《Paint and varnish paint film
Draw lattice experiment》[test of ten stroke lattice tape pull methods is carried out, test result is expressed as 0-5 grades, wherein 0 grade best, 5 grades most
Difference.
The hardness of film is with reference to standard GB/T/T6739-1996《Hardness of film pencil determination method》It is measured, is divided into
Totally 13 grades of 6H to 6B, wherein 6H is most hard, and 6B is most soft.
The ink film that each example is obtained by more than carries out performance test, as a result such as following table.
| Performance | Hardness (H) | Adhesive force (grade) | High temperature resistant (grade) | Bright trace phenomenon (grade) |
| Embodiment 1 | 5 | 1 | 0 | 0 |
| Embodiment 2 | 4 | 1 | 0 | 0 |
| Embodiment 3 | 4 | 1 | 0 | 0 |
| Embodiment 4 | 4 | 1 | 0 | 0 |
| Comparative example 1 | 3 | 2 | 1 | 1 |
| Comparative example 2 | 3 | 2 | 1 | 1 |
| Comparative example 3 | 3 | 3 | 1 | 1 |
Claims (10)
1. a kind of SD card with electronics wheat draw resist bright trace High temperature-resistanresin resin composition, it is characterised in that it by following parts by weight raw material
It is formulated：5~15 parts of makrolon, 5~15 parts of PBT, 2~9 parts of ABS, alkyd modified 0.5~5 part of organic siliconresin, nitre
Change 2~9 parts of cotton plant fat, 0.5~4 part of dispersant, 0.5~3 part of defoamer, 0.5~3 part of levelling agent, Mitsubishi's MA-75 carbon blacks 2~9
Part, 5~15 parts of copper-chrome black, inorganic iron black 1~5 part, 5~15 parts of filler, 5~11 parts of cyclohexanone, propylene-glycol ethyl ether acetate 5
~15 parts, 15~22 parts of isophorone, 0.5~4 part of dibasic ester, 0.5~3 part of silica.
2. SD card according to claim 1 with electronics wheat draw resist bright trace High temperature-resistanresin resin composition, it is characterised in that it by
The raw material of following parts by weight is formulated：7~13 parts of makrolon, 7~13 parts of PBT, 3~7 parts of ABS are alkyd modified organic
0.5~3 part of silicones, 2~7 parts of nitrocotton resin, 0.5~3 part of dispersant, 0.5~2 part of defoamer, 0.5~2 part of levelling agent,
2~7 parts of Mitsubishi's MA-75 carbon blacks, 7~13 parts of copper-chrome black, inorganic iron black 1~5 part, 7~13 parts of filler, 5~11 parts of cyclohexanone,
7~13 parts of propylene-glycol ethyl ether acetate, 15~22 parts of isophorone, 0.5~3 part of dibasic ester, 0.5~2 part of silica.
3. SD card according to claim 2 with electronics wheat draw resist bright trace High temperature-resistanresin resin composition, it is characterised in that it by
The raw material of following parts by weight is formulated：8~12 parts of makrolon, 8~12 parts of PBT, 4~6 parts of ABS are alkyd modified organic
1~3 part of silicones, 3~6 parts of nitrocotton resin, 0.5~3 part of dispersant, 0.5~2 part of defoamer, 0.5~2 part of levelling agent, three
3~7 parts of water chestnut MA-75 carbon blacks, 8~12 parts of copper-chrome black, inorganic iron black 1~5 part, 8~12 parts of filler, 6~11 parts of cyclohexanone, third
8~12 parts of glycol ether acetate, 15~22 parts of isophorone, 1~3 part of dibasic ester, 0.5~2 part of silica.
4. SD card according to claim 3 with electronics wheat draw resist bright trace High temperature-resistanresin resin composition, it is characterised in that it by
The raw material of following parts by weight is formulated：10 parts of makrolon, 10 parts of PBT, 5 parts of ABS, alkyd modified 2 parts of organic siliconresin,
5 parts of nitrocotton resin, 2 parts of dispersant, 1 part of defoamer, 1 part of levelling agent, 35 parts of Mitsubishi's MA-75 carbon blacks, 10 parts of copper-chrome black, filler
10 parts, 8 parts of cyclohexanone, 10 parts of propylene-glycol ethyl ether acetate, 18 parts of isophorone, 2 parts of dibasic ester, silica 1 part.
5. the SD card according to any one in Claims 1 to 4 is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, its
It is characterised by that the PBT is selected from the husky uncle basis 325M-54018 or G6 HR Unc of BASF Ultradu B 2300.
6. the SD card according to any one in Claims 1 to 4 is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, its
It is characterised by that the ABS is selected from strange U.S. PA-765A or LG chemistry XR-407E.
7. the SD card according to any one in Claims 1 to 4 is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, its
It is characterised by that the alkyd modified organic siliconresin is selected from the alkyd modified organic siliconresins of pretty happy JY 7100 or SHIN-ETSU HANTOTAI KR-5206.
8. the SD card according to any one in Claims 1 to 4 is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, its
It is characterised by that the dispersant is selected from EFKA4560 or the dispersants of SN 5040；Defoamer be selected from surfynol MD 20,
Surfynol 104E, Tego 825, BYK 020 or BYK028 defoamers.
9. the SD card according to any one in Claims 1 to 4 is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition, its
It is characterised by that the levelling agent is selected from BYK333, BYK361, Glide 432, Flow 300 or the levelling agents of Efka 3600；
Filler be selected from kaolin, bentonite, talcum powder, barium sulfate, flatting silica, titanium dioxide, calcite in powder, wollastonite, dolomite dust, thoroughly
Bright powder or calcium carbonate.
10. the SD card in a kind of Claims 1 to 4 described in any one is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition
Preparation method, it is characterised in that first by cyclohexanone, propylene-glycol ethyl ether acetate, isophorone, two at 20 DEG C~80 DEG C of temperature
Valency acid esters is well mixed, and then adds makrolon, PBT, ABS, alkyd modified organic siliconresin and nitrocotton resin, stirring
Hybrid reaction, adds filler, Mitsubishi's MA-75 carbon blacks, inorganic iron black and copper-chrome black, and high-speed stirred is uniform, is ground after being stirred
To fineness≤5 μm, defoamer, levelling agent, dispersant and silica are continuously added, is stirred.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710069863.8A CN107022226A (en) | 2017-02-08 | 2017-02-08 | SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710069863.8A CN107022226A (en) | 2017-02-08 | 2017-02-08 | SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107022226A true CN107022226A (en) | 2017-08-08 |
Family
ID=59526285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710069863.8A Withdrawn CN107022226A (en) | 2017-02-08 | 2017-02-08 | SD card is drawn with electronics wheat resists bright trace High temperature-resistanresin resin composition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107022226A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101018833A (en) * | 2004-08-02 | 2007-08-15 | 埃克阿泰克有限责任公司 | Decorative ink system for automotive plastic glazing |
-
2017
- 2017-02-08 CN CN201710069863.8A patent/CN107022226A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101018833A (en) * | 2004-08-02 | 2007-08-15 | 埃克阿泰克有限责任公司 | Decorative ink system for automotive plastic glazing |
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