CN104817881B - A kind of water off-type protection ink and preparation method thereof - Google Patents

A kind of water off-type protection ink and preparation method thereof Download PDF

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Publication number
CN104817881B
CN104817881B CN201510208566.8A CN201510208566A CN104817881B CN 104817881 B CN104817881 B CN 104817881B CN 201510208566 A CN201510208566 A CN 201510208566A CN 104817881 B CN104817881 B CN 104817881B
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water
ink
parts
methyl
epoxy
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CN104817881A (en
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吴昆�
罗志有
史珺
沈璐
胡文光
曹昕
吕满庚
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Guoke Guanghua (Nanxiong) New Materials Research Institute Co.,Ltd.
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Guangzhou Chemical Co Ltd of CAS
Nanxiong Material Production Base of Guangzhou Chemical Co Ltd of CAS
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1483Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing sulfur
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/106Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09D11/107Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

The invention discloses a kind of water off-type protection ink and preparation method thereof, it is by introducing the methyl propane sulfonic acid molecular structure of 2 acrylamide of hydrophily 2, design and synthesize the epoxy acrylic resin containing hydrophilic radical, then based on the epoxy acrylic resin, by the screening of the auxiliary agents such as diluent, inserts, defoamer, optimization, water off-type protection ink is obtained.This protection ink is presented superior adhesive force on touch screen face glass or OGS glass basis, without phenomenons such as hollowing, alices in cutting scribing, CNC finishing impression technical process, common hot water demoulding can be used, protecting film slabbing comes off during demoulding, easily filtering and separation, to glass fanout free region, automation technolo degree is high, safety and environmental protection.

Description

A kind of water off-type protection ink and preparation method thereof
Technical field
The present invention relates to chemical field, more particularly to a kind of water off-type protection ink and preparation method thereof.
Background technology
Touch screen is a kind of easy man-machine interaction mode, be mainly used in mobile communication, automobile middle control, Industry Control, The fields such as multimedia teaching.Than relatively thin, surface smoothness requirement is again high, forming difficulty, manufacturing process ratio for touch screen face glass General plate glass is much more complex, in the manufacturing process of touch screen, from sliver, imitative type, CNC until operations, all pole such as polishings A certain degree of scratch is easily caused to glass substrate in board or other operations, its scratch rate is general more than 42%, increases The manufacturing cost of enterprise simultaneously constrains the production capacity of enterprise.So, need to be pasted on face glass surface when touch screen is processed All kinds of protective materials, mainly use two kinds of protective materials both at home and abroad:Peelable glue and protection ink.But, peelable glue is usually heat Curable type, and need peel manually to remove;Protection ink can be with automatic printing and demoulding, effectively save time and cost of labor, therefore Protection ink has quite obvious technology and economic advantages, is highly suitable for the glass protection of touch screen.
Current touch screen face glass protection ink is main to be taken off based on film product with alkali, such as patent " UV glass protections ink " (application number:201110424007.2), " glass protection ink and preparation method thereof " (application number:201210274017.7) introduce Acrylic resin modified is the protection ink of main body.But, such protection ink needs to use alkaline water in de-filming process Solution (the NaOH aqueous solution), perishable glass, cleaning is difficult and produces a large amount of alkali waste waters, and easily generation environment pollution and safety are hidden Suffer from.
The content of the invention
It is an object of the invention to overcome shortcoming present in prior art, there is provided a kind of environment-friendly, low cost, technique Simple water off-type protection ink, in touch screen face glass or one-chip type touch panel (OGS) glass processing.
The preparation method of ink is protected another object of the present invention is to provide a kind of above-mentioned water off-type.
The purpose of the present invention is achieved through the following technical solutions:
A kind of water off-type protects ink, counts by weight, including following components:
Described epoxy acrylic resin is prepared by the following method:Epoxy resin, catalyst, polymerization inhibitor are added In reactor, 95~105 DEG C are warming up to, the mixing of acrylic acid (AA) and 2- acrylamide-2-methyl propane sulfonics (AMPS) is molten Liquid constant pressure funnel slowly, is continuously added dropwise 40~100 minutes, and 2~4 hours are incubated at 100~120 DEG C after completion of dropping, is obtained To epoxy acrylic resin.Chemical equation and product structure formula are schematically as follows.
Described epoxy resin is bisphenol A type epoxy resin, at least one in model E54, E51, E44 or E20;Institute The catalyst stated is triethylamine, triethanolamine, TBAB, tetramethyl ammonium chloride, N, N- dimethyl benzylamines, triphenylphosphine In at least one;Polymerization inhibitor is hydroquinones, adjacent methyl hydroquinone, MEHQ, 1,4-benzoquinone and the tertiary fourths of 2,6- bis- At least one in base -4- methylphenols.
Epoxy resin epoxy group:Acrylic acid:The mol ratio of 2- acrylamide-2-methyl propane sulfonics is 1:(0.8~ 1.5):(1.2~2.4);The consumption of described catalyst is preferably the 0.1%~0.3% of epoxy resin quality;Described inhibition The consumption of agent is preferably the 0.1%~0.2% of the quality sum of acrylic acid and 2- acrylamide-2-methyl propane sulfonics.
Described reactive diluent is lauryl methacrylate, acrylic acid tetrahydrofuran ester, the propylene of ethoxylated bisphenol A bis- Acid esters, 1,6- EDIAs, GDMA, neopentylglycol diacrylate, DPG dipropyl Olefin(e) acid ester, tripropylene glycol diacrylate, hydroxyethyl methacrylate, hydroxy propyl methacrylate, Glycidyl methacrylate are sweet Oily ether, TEGDMA, dimethacrylate, trimethylolpropane trimethacrylate, season At least one in penta tetrol triacrylate, tetramethylol methane tetraacrylate or the acrylate of tripentaerythritol six.
Described light trigger is 2- methyl isophthalic acids-[4- (methyl mercapto) phenyl] -2- morpholinyl -1- acetone, 2,4,6- front threes Base benzoyl-diphenyl phosphate oxidation, benzoin dimethylether, 2- hydroxy-2-methyl -1- phenyl -1- acetone, 1- hydroxy-cyclohexyls Phenyl ketone, benzophenone, 4- benzoyls -4- methyl-diphenyl sulfide, isopropyl thioxanthone, 4- (N, N- dimethylamino) One or more mixtures in ethyl benzoate, 2- EAQs.
Described inserts is talcum powder, calcium carbonate, mica powder, diatomite, barium sulfate, aluminium hydroxide, kaolin, dioxy At least one in SiClx, carbon black, trbasic zinc phosphate or titanium dioxide.
Described defoamer is siliceous class defoamer, can help froth breaking and printing off-network effect, makes printing effect more beautiful See.
Described pigment is blue pigment phthalocyanine blue, white organic color or black organic-silicon color.
Described adhesion promoter is hydroxylethyl acyl phosphate, dihydroxy ethyl methacryl phosphate, methyl Acryloyl group trimethoxy silane, methylacryloyl triethoxysilane, methylacryloyl tripropoxy silane, propyl group three At least one in hydroxylethyl acyl titanate esters or propyl group trihydroxyethyl methacryl titanate esters.
The water off-type protects the preparation method of ink, is to weigh each component by above-mentioned parts by weight, by epoxy acrylic Resin mixes with reactive diluent, then mixes light trigger, inserts, defoamer, pigment and adhesion promoter, through at a high speed Uniform thick liquid is formed after stirring, then thick liquid is poured into grinder grinding, obtain water off-type protection ink.
The present invention is designed and synthesized and contains parent by introducing hydrophily 2- acrylamide-2-methyl propane sulfonic molecular structures The epoxy acrylic resin of water base group, then based on the epoxy acrylic resin, by diluent, inserts, defoamer Screening, optimization Deng auxiliary agent, prepare the water off-type protection ink with good adhesion and the de- effect of water, and it is by screen printing Brush, UV solidifications, superior adhesive force is presented on touch screen face glass or OGS glass basis, in cutting scribing, CNC finishing impressions Without phenomenons such as hollowing, alices in technical process, so as to realize the purpose of protective glass substrate, and can be de- using common hot water Film, protecting film slabbing comes off during demoulding, easily filtering and separation, and to glass fanout free region, automation technolo degree is high, safety collar Protect.
The present invention has the following advantages that and effect compared with prior art:
(1) it is basic molecular framework with epoxy resin, introduces soft segment and the carboxyl isopolarity groups such as alkane, significantly carries Height protection ink pliability and glass attachment power, without phenomenons such as hollowing, alices in cutting scribing, CNC finishing impression processing procedures, effectively protect Shield glass baseplate.
(2) AMPS and AA is introduced, regulation and control protection ink cured film hydrophily uses common hot water demoulding technique, it is to avoid pass System infringement of the alkali lye demoulding technique to glass and circuit, automation technolo degree is high, and it is safer with it is environmentally friendly.
(3) compared to traditional heat cured system (needing to complete solidification in about 20 minutes or so), this protection ink is solidified using UV, several Solidification can be completed within ten seconds, operating efficiency is higher.
Brief description of the drawings
Fig. 1 is the infrared spectrogram of synthesizing epoxy acrylic resin in embodiment 1.
Fig. 2 is the nuclear magnetic spectrogram of synthesizing epoxy acrylic resin in embodiment 1.
Specific embodiment
Further detailed description, but embodiments of the present invention not limited to this are done to the present invention with reference to embodiment.
Embodiment 1
100 grams of (0.44mol) epoxy resin (E-44), 0.2 gram of triphenylphosphine, 0.14 gram of hydroquinones are added into reactor In, 100 DEG C are warming up to, 32.5 grams (0.45mol) AA and 150 gram of mixed solution of (0.72mol) AMPS is slow with constant pressure funnel Slowly it is, continuous to be added dropwise 60 minutes, 3 hours are incubated at 110 DEG C after completion of dropping, obtain epoxy acrylic resin.Fig. 1 and Fig. 2 points Not Wei epoxy acrylic resin infrared and nuclear magnetic spectrogram, C=C ,-NH as seen from the figure2- C=O ,-CH-O ,-CH-SO3-、- CH3Deng the presence of characteristic peak, this demonstrate that the successful synthesis of target product.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 20 parts of lauryl methacrylate, 1- hydroxyl rings 5 parts of hexyl phenyl ketone, 25 parts of talcum powder, 0.5 part of defoamer, 1.0 parts of phthalocyanine blue, methylacryloyl trimethoxy silane 2.5 parts.Epoxy acrylic resin is mixed with reactive diluent, light trigger, filler, pigment, defoamer etc. is mixed, through at a high speed Homogeneous thick liquid is formed after stirring, preservative oil ink finished product is obtained after the thick liquid is entered into grinder grinding.
Embodiment 2:
100 grams of (0.44mol) epoxy resin (E-44), 0.2 gram of triphenylphosphine, 0.14 gram of hydroquinones are added into reactor In, 100 DEG C are warming up to, 32.5 grams (0.45mol) AA and 150 gram of mixed solution of (0.72mol) AMPS is slow with constant pressure funnel Slowly it is, continuous to be added dropwise 60 minutes, 3 hours are incubated at 110 DEG C after completion of dropping, obtain epoxy acrylic resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 25 parts of hydroxyethyl methacrylate, 1- hydroxyl rings 5 parts of hexyl phenyl ketone, 25 parts of talcum powder, 0.5 part of defoamer, 1.0 parts of phthalocyanine blue, methylacryloyl trimethoxy silane 2.5 parts.Epoxy acrylic resin is mixed with reactive diluent, light trigger, filler, pigment, defoamer etc. is mixed, through at a high speed Homogeneous thick liquid is formed after stirring, preservative oil ink finished product is obtained after the thick liquid is entered into grinder grinding.
Embodiment 3:
100 grams of (0.44mol) epoxy resin (E-44), 0.2 gram of triphenylphosphine, 0.14 gram of hydroquinones are added into reactor In, 100 DEG C are warming up to, 32.5 grams (0.45mol) AA and 150 gram of mixed solution of (0.72mol) AMPS is slow with constant pressure funnel Slowly it is, continuous to be added dropwise 60 minutes, 3 hours are incubated at 110 DEG C after completion of dropping, obtain epoxy acrylic resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 25 parts of hydroxyethyl methacrylate, 2- methyl- 1- [4- (methyl mercapto) phenyl] 6 parts of -2- morpholinyl -1- acetone, 3 parts of isopropyl thioxanthone, 25 parts of titanium dioxide, defoamer 0.5 part, 1.0 parts of phthalocyanine blue, 2.5 parts of methylacryloyl trimethoxy silane.By epoxy acrylic resin and reactive diluent Mixing, mixes light trigger, filler, pigment, defoamer etc., homogeneous thick liquid is formed after high-speed stirred, by the viscous fluid Body obtains preservative oil ink finished product after entering grinder grinding.
Embodiment 4:
100 grams of (0.44mol) epoxy resin (E-44), 0.2 gram of triphenylphosphine, 0.14 gram of hydroquinones are added into reactor In, 100 DEG C are warming up to, 32.5 (0.45mol) grams of mixed solution of AA and 150 gram of (0.72mol) AMPS is slow with constant pressure funnel Slowly it is, continuous to be added dropwise 60 minutes, 3 hours are incubated at 110 DEG C after completion of dropping, obtain epoxy acrylic resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 40 parts of lauryl methacrylate, 1- hydroxyl rings 5 parts of hexyl phenyl ketone, 5 parts of silica 1,0.5 part of defoamer, 1.0 parts of phthalocyanine blue, methylacryloyl trimethoxy silane 2.5 parts.Epoxy acrylic resin is mixed with reactive diluent, light trigger, filler, pigment, defoamer etc. is mixed, through at a high speed Homogeneous thick liquid is formed after stirring, preservative oil ink finished product is obtained after the thick liquid is entered into grinder grinding.
Embodiment 5:
By 100 grams of (0.44mol) epoxy resin (E-51), 0.3 gram of N, N- dimethyl benzylamines, 0.25 gram of tertiary fourth of 2,6- bis- Base -4- methylphenols are added in reactor, 100 DEG C are warming up to, by 40 grams (0.55mol) AA and 200 gram of (0.97mol) AMPS's Mixed solution constant pressure funnel slowly, is continuously added dropwise 60 minutes, and 3 hours are incubated at 110 DEG C after completion of dropping, obtains epoxy third Olefin(e) acid resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 1,6- 15 parts of EDIA, methyl 15 parts of glycidyl ether, 5 parts of 1- hydroxycyclohexyl phenyl ketones, 20 parts of talcum powder, 5 parts of silica, defoamer 0.5 Part, 1.0 parts of phthalocyanine blue, 2.5 parts of methylacryloyl trimethoxy silane.Epoxy acrylic resin is mixed with reactive diluent Close, mix light trigger, filler, pigment, defoamer etc., homogeneous thick liquid is formed after high-speed stirred, by the thick liquid Preservative oil ink finished product is obtained after entering grinder grinding.
Embodiment 6:
By 100 grams of (0.44mol) epoxy resin (E-51), 0.3 gram of N, N- dimethyl benzylamines, 0.25 gram of tertiary fourth of 2,6- bis- Base -4- methylphenols are added in reactor, 100 DEG C are warming up to, by 40 grams (0.55mol) AA and 200 gram of (0.97mol) AMPS's Mixed solution constant pressure funnel slowly, is continuously added dropwise 60 minutes, and 3 hours are incubated at 110 DEG C after completion of dropping, obtains epoxy third Olefin(e) acid resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 20 parts of hydroxyethyl methacrylate, 1,6- second two 10 parts of alcohol acrylate, 2- methyl isophthalic acids-[4- (methyl mercapto) phenyl] 6 parts of -2- morpholinyl -1- acetone, isopropyl thioxanthone 3 Part, 20 parts of trbasic zinc phosphate, 5 parts of silica, 0.5 part of defoamer, 1.0 parts of phthalocyanine blue, methylacryloyl trimethoxy silane 2.5 Part.Epoxy acrylic resin is mixed with reactive diluent, light trigger, filler, pigment, defoamer etc. is mixed, through high-speed stirring Homogeneous thick liquid is formed after mixing, preservative oil ink finished product is obtained after the thick liquid is entered into grinder grinding.
Embodiment 7:
By 100 grams of (0.44mol) epoxy resin (E-51), 0.3 gram of N, N- dimethyl benzylamines, 0.25 gram of tertiary fourth of 2,6- bis- Base -4- methylphenols are added in reactor, 100 DEG C are warming up to, by 40 grams (0.55mol) AA and 200 gram of (0.97mol) AMPS's Mixed solution constant pressure funnel slowly, is continuously added dropwise 60 minutes, and 3 hours are incubated at 110 DEG C after completion of dropping, obtains epoxy third Olefin(e) acid resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 20 parts of lauryl methacrylate, 1- hydroxyl rings 5 parts of hexyl phenyl ketone, 20 parts of talcum powder, 5 parts of carbon black, 0.5 part of defoamer, 1.0 parts of black organic-silicon color, methacryl 2.5 parts of base trimethoxy silane.Epoxy acrylic resin is mixed with reactive diluent, mix light trigger, filler, pigment, Defoamer etc., forms homogeneous thick liquid after high-speed stirred, and preservative oil is obtained after the thick liquid is entered into grinder grinding Black finished product.
Embodiment 8:
By 100 grams of (0.44mol) epoxy resin (E-51), 0.3 gram of N, N- dimethyl benzylamines, 0.25 gram of tertiary fourth of 2,6- bis- Base -4- methylphenols are added in reactor, 100 DEG C are warming up to, by 40 grams (0.55mol) AA and 200 gram of (0.97mol) AMPS's Mixed solution constant pressure funnel slowly, is continuously added dropwise 60 minutes, and 3 hours are incubated at 110 DEG C after completion of dropping, obtains epoxy Acrylic resin.
Weigh following parts by weight raw material:50 parts of epoxy acrylic resin, 20 parts of hydroxyethyl methacrylate, 1- hydroxyl rings 7.5 parts of hexyl phenyl ketone, 20 parts of talcum powder, 0.5 part of defoamer, 1.0 parts of phthalocyanine blue, methylacryloyl trimethoxy silane 1.5 parts.Epoxy acrylic resin is mixed with reactive diluent, light trigger, filler, pigment, defoamer etc. is mixed, through at a high speed Homogeneous thick liquid is formed after stirring, preservative oil ink finished product is obtained after the thick liquid is entered into grinder grinding.
Comparative example 1:Traditional alkali solubility protects the preparation of ink.
By in 100 grams of epoxy resin (E-44), 0.2 gram of triphenylphosphine, 0.2 gram of hydroquinones addition reactor, it is warming up to 100 DEG C, 43.1 grams of maleic anhydrides are added, 2 hours are incubated at 105 DEG C, obtain modified epoxy.
Weigh following parts by weight raw material:50 parts of modified epoxy, 10 parts of tri (propylene glycol) diacrylate, 1- hydroxyls 5 parts of butylcyclohexyl phenyl ketone, 25 parts of talcum powder, 0.5 part of defoamer, 1.0 parts of phthalocyanine blue.By epoxy acrylic resin and activity Diluent mixes, and mixes light trigger, filler, pigment, defoamer etc., homogeneous thick liquid is formed after high-speed stirred, by this Thick liquid obtains alkali solubility protection ink finished product after entering grinder grinding.
Comparative example 2:The preparation of heat curing-type peelable glue.
The weight portion of vinyl chloride-vinyl acetate copolymer paste resin (vinyl acetate content 15%) 50, terephthalic acid (TPA) two 40 parts of (2- Octyl Nitrites), 2,2,4- trimethyl -1,20 parts of 3- pentanediol diisobutyrates, 1.3 parts of dibutyl tin dilaurate, 2.5 parts of zinc stearate, 4.6 parts of aerosil.By vinyl chloride-vinyl acetate copolymer paste resin and terephthalic acid (TPA) two (2- Octyl Nitrites), 2,2,4- trimethyl -1,3- pentanediol diisobutyrates mixing high-speed stirred is uniform, and dibutyl two is added afterwards Homogeneous thick liquid is formed after tin laurate, zinc stearate, aerosil high-speed stirred, the thick liquid is entered into grinder Heat curing-type peelable glue is obtained after grinding.
Properties of product are tested:
The heat curing-type peelable glue of above-mentioned comparative example 2 is coated on glass surface through the mode of silk-screen printing, thickness is formed It is the uniform coating of 25~35um, coating toasts 20 minutes solidify afterwards at 120 DEG C.
The mode of above-mentioned comparative example 1, the protection ink organizine wire mark brush of embodiment 1~8 is coated on glass surface, shape Into the uniform coating that thickness is 25~35um, coating uses high voltage mercury lamp radiation (1200-1600MJ/cm2) and solidify.
The protective coating performance after above-mentioned solidification is tested respectively, method of testing is as follows:
Adhesive force is tested:GB/T9286-1998
Case hardness is tested:GB/T6739-1996
Resistance to cutting fluid test:6 hours in commercially available cutting fluid, observation solidifies membrane stage to soak at room temperature.
Move back film test:Soaked in 85 DEG C of common hot water, observation solidification membrane stage.
Test result is as shown in the table.
Protection ink performance test result
Numbering Adhesive force Hardness Resistance to cutting fluid Move back film
Comparative example 1 2B 2H Without peeling and come off Cannot come off
Comparative example 2 / / Without peeling and come off Cannot come off, need hand avulsion film
Embodiment 1 4B 2H Without peeling and come off 3min completely falls off, noresidue
Embodiment 2 4B 2H Without peeling and come off 4min completely falls off, noresidue
Embodiment 3 5B 2H Without peeling and come off 3min completely falls off, noresidue
Embodiment 4 3B 2H Without peeling and come off 5min completely falls off, noresidue
Embodiment 5 4B 2H Without peeling and come off 4min completely falls off, noresidue
Embodiment 6 5B 2H Without peeling and come off 3min completely falls off, noresidue
Embodiment 7 4B 2H Without peeling and come off 4min completely falls off, noresidue
Embodiment 8 4B 2H Without peeling and come off 5min completely falls off, noresidue
Be can be seen that compared with comparative example (common peelable glue and alkali solubility protection ink) from above-mentioned test result, this is anti- Shield ink has excellent adhesive force, and pure water demoulding is complete, noresidue, can fully meet touch screen face glass and OGS glass Barrier propterty requirement in the processing procedures such as sawing sheet, CNC.
Above-described embodiment is the present invention preferably implementation method, but embodiments of the present invention are not by above-described embodiment Limitation, it is other it is any without departing from Spirit Essence of the invention and the change, modification, replacement made under principle, combine, simplification, Equivalent substitute mode is should be, is included within protection scope of the present invention.

Claims (9)

1. a kind of water off-type protects ink, it is characterised in that count by weight, including following components:
Described epoxy acrylic resin is prepared by the following method:Epoxy resin, catalyst, polymerization inhibitor are added into reaction In device, 95~105 DEG C are warming up to, the mixed solution of acrylic acid and 2- acrylamide-2-methyl propane sulfonics is delayed with constant pressure funnel Slowly, continuously it is added dropwise 40~100 minutes, 2~4 hours is incubated at 100~120 DEG C after completion of dropping, obtains epoxy acrylic tree Fat.
2. water off-type according to claim 1 protects ink, it is characterised in that:Described epoxy resin is bisphenol A-type ring Oxygen tree fat, at least one in model E54, E51, E44 or E20;Described catalyst is triethylamine, triethanolamine, four fourths Base ammonium bromide, tetramethyl ammonium chloride, N, at least one in N- dimethyl benzylamines, triphenylphosphine;Polymerization inhibitor is hydroquinones, neighbour At least one in methyl hydroquinone, MEHQ, 1,4-benzoquinone and 2,6 di tert butyl 4 methyl phenol.
3. water off-type according to claim 1 protects ink, it is characterised in that:Epoxy acrylic resin epoxy group:Third Olefin(e) acid:The mol ratio of 2- acrylamide-2-methyl propane sulfonics is 1:(0.8~1.5):(1.2~2.4);Described catalyst Consumption is the 0.1%~0.3% of epoxy resin quality;The consumption of described polymerization inhibitor is acrylic acid and 2- acrylamide -2- first The 0.1%~0.2% of the quality sum of base propane sulfonic acid.
4. water off-type according to claim 1 protects ink, it is characterised in that:Described reactive diluent is metering system Sour lauryl, acrylic acid tetrahydrofuran ester, ethoxylated bisphenol A diacrylates, 1,6-HD acrylate, dimethyl allene Sour glycol ester, neopentylglycol diacrylate, propylene glycol diacrylate, tripropylene glycol diacrylate, metering system Sour hydroxyl ethyl ester, hydroxy propyl methacrylate, methyl propenoic acid glycidyl ether, TEGDMA, diethyl two Alcohol dimethylacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate Or at least one in the acrylate of tripentaerythritol six.
5. water off-type according to claim 1 protects ink, it is characterised in that:Described light trigger be 2- methyl isophthalic acids- The double first of [4- (methyl mercapto) phenyl] -2- morpholinyl -1- acetone, 2,4,6- trimethylbenzoy-diphenies phosphorous oxide, styrax Ether, 2- hydroxy-2-methyl -1- phenyl -1- acetone, 1- hydroxycyclohexyl phenyl ketones, benzophenone, 4- benzoyl -4- first One kind or two in base-diphenyl sulfide, isopropyl thioxanthone, 4- (N, N- dimethylamino) ethyl benzoate, 2- EAQs Plant thing mixed above.
6. water off-type according to claim 1 protects ink, it is characterised in that:Described inserts is talcum powder, carbonic acid In calcium, mica powder, diatomite, barium sulfate, aluminium hydroxide, kaolin, silica, carbon black, trbasic zinc phosphate or titanium dioxide It is at least one.
7. water off-type according to claim 1 protects ink, it is characterised in that:Described defoamer is siliceous class froth breaking Agent;Described pigment is blue pigment phthalocyanine blue, white organic color or black organic-silicon color.
8. water off-type according to claim 1 protects ink, it is characterised in that:Described adhesion promoter is ethoxy Acryloyl phosphate, dihydroxy ethyl methacryl phosphate, methylacryloyl trimethoxy silane, methylacryloyl three Ethoxysilane, methylacryloyl tripropoxy silane, propyl group trihydroxyethyl acryloyl titanate esters or propyl group trihydroxyethyl At least one in methacryl titanate esters.
9. the water off-type any one of claim 1~8 protects the preparation method of ink, it is characterised in that:It is by described Parts by weight weigh each component, and epoxy acrylic resin is mixed with reactive diluent, then mix light trigger, inserts, Defoamer, pigment and adhesion promoter, form uniform thick liquid, then thick liquid is poured into grinding after high-speed stirred Machine grinds, and obtains water off-type protection ink.
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CN106280910B (en) * 2016-08-18 2018-03-20 中科院广州化学有限公司南雄材料生产基地 A kind of anti-high pressure jer cutting multifunctional protection material and preparation method thereof
CN107163678A (en) * 2017-06-26 2017-09-15 太仓市鑫鹤印刷包装有限公司 Strong printing-ink of a kind of adhesive force and preparation method thereof
CN109988283B (en) * 2017-12-29 2021-10-08 上海飞凯材料科技股份有限公司 Epoxy acrylic resin and preparation method and application thereof
CN108624219B (en) * 2018-04-28 2021-05-14 东莞市澳中电子材料有限公司 Strong-alkali-resistant and easy-to-remove-glue UV (ultraviolet) curing silk-screen glue and preparation method thereof
CN109021672B (en) * 2018-06-27 2021-08-24 安徽金龙浩光电科技有限公司 Protective printing ink for 3D LOGO etching of mobile phone
CN108864818B (en) * 2018-06-27 2021-08-24 安徽金龙浩光电科技有限公司 Protective printing ink containing silicon dioxide for 3D LOGO etching of mobile phone
CN110577367B (en) * 2018-08-13 2022-03-22 蓝思科技(长沙)有限公司 Glass protection processing technology, glass and equipment
CN112391081B (en) * 2020-10-29 2021-09-10 惠州市百时达化工有限公司 Hot water deinking type peelable glass UV ink and use method thereof
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