CN106999988A - Test pallet for testing, sorting machine and the interface board for test machine - Google Patents

Test pallet for testing, sorting machine and the interface board for test machine Download PDF

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Publication number
CN106999988A
CN106999988A CN201580063135.5A CN201580063135A CN106999988A CN 106999988 A CN106999988 A CN 106999988A CN 201580063135 A CN201580063135 A CN 201580063135A CN 106999988 A CN106999988 A CN 106999988A
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CN
China
Prior art keywords
correction
hole
insert
pin
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201580063135.5A
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Chinese (zh)
Other versions
CN106999988B (en
Inventor
罗闰成
黄正佑
崔僖峻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Techwing Co Ltd
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Techwing Co Ltd
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Filing date
Publication date
Application filed by Techwing Co Ltd filed Critical Techwing Co Ltd
Priority claimed from PCT/KR2015/011433 external-priority patent/WO2016080670A1/en
Publication of CN106999988A publication Critical patent/CN106999988A/en
Application granted granted Critical
Publication of CN106999988B publication Critical patent/CN106999988B/en
Active legal-status Critical Current
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices

Abstract

The present invention is on the test pallet for testing, sorting machine and the interface board for test machine.The insert of test pallet has the second correction hole, and the socket guiding piece of interface board has the second correction pin.In addition, the test jack of interface board has alignment hole, and interface board has alignment pin, to correct the position of insert by stages.And then, the wall of the correction hole formed in the body of insert is cut open so that incision hole system is formed around correction hole.The present invention can by by stages sequentially the position of correction insert and accurately correct the position of insert.Because correction pin system is not blocked closely to correction hole, correction hole system forms less so that the position of insert can more accurately be corrected.

Description

Test pallet for testing, sorting machine and the interface board for test machine
Technical field
The present invention is on the test pallet and interface board for testing, sorting machine, and semiconductor element is loaded on testing, sorting On machine, interface board system is connected with semiconductor element in a tester.
Background technology
Testing, sorting machine will be moved to test pallet by the semiconductor element manufactured by specified processing procedure from client's pallet;Together When support to be loaded into the test of semiconductor element on test pallet by test machine;And then by semiconductor element from test Pallet is moved to client's pallet, while pressing grade separation semiconductor element according to test result.This testing, sorting machine has passed through Various open files and disclose.
There is test pallet insert to be installed in the structure of installation frame, and insert has placement space, semiconductor element Part is inserted into and is placed in each of insert.
The each of insert has support member, to support the semiconductor element being placed on placement space.
Support member can be, such as Korean Patent No. 10-0801927 integrally injection-molded with the body series of insert Disclosed person, or can be with formed by film type, the person as disclosed by Korean Patent Publication No. the 10-2010-0081131st.
Semiconductor element system places and is fixed in the placement space of insert.In addition, being placed in semiconductor element In state on the placement space of insert, semiconductor element is electrically connected to the test on the interface board for being arranged on test machine Socket.Therefore, there is the demand of the position of correction insert, by the semiconductor element in insert and test jack accurately Be electrically coupled.So, insert system is attached to installation frame in a movable manner.In addition, insert has correction Hole, and interface board has socket guiding piece, there is socket guiding piece correction to sell, and correction pin is inserted into correction hole (referring to Korea Spro State's patent publication No. the 10-2013-0059485th, is hereinafter referred to as " prior art ").
Meanwhile, with the development of product body technique, the size of semiconductor element reduces, but with increased number of terminal.This What interval and the size system of terminal outside, between ball terminals also reduced.So, there is the ever-increasing end in semiconductor element More accurately and stably implement the demand of electrical connection between son and test machine.
However, in the prior art, the manufacturing tolerance between correction pin and correction hole should be considered to be properly inserted into Correction pin is into correction hole.What is more, is also considered as existing in the mutual alignment between socket guiding piece and test jack There is manufacturing tolerance.Therefore, the internal diameter system of correction hole is more than the diameter of correction pin so that even if the center of correction pin is slightly offset from school The center in positive hole, correction pin can be inserted into correction hole.Discounting for manufacturing tolerance, due to being inserted into correction hole when correction pin When produced error, manufacturing tolerance may result in the infringement of operating trouble or insert, and therefore, semiconductor element and survey Electrical connection between examination socket can not suitably reach.If in addition, correction pin is inserted into school in the way of forced mating In positive hole, it is likely difficult to remove correction pin from correction hole afterwards.
Therefore, known techniques for when the slight gap between the terminal in micronized and reduce size terminal when it is accurate The position of ground correction insert has limitation.
The content of the invention
Technical problem
The present invention has made great efforts the above mentioned problem for solving to occur in known techniques, and purpose of the present invention system provides a kind of skill Art, to correct the position of insert step by step.
It is a further object of the present invention to provide a kind of technology, to minimize as the error caused by manufacturing tolerance.
Technical scheme
To reach above-mentioned purpose, in first aspect of the present invention, the present invention provides a kind of for testing, sorting machine Test pallet, comprising:Insert, the placement space being respectively placed on semiconductor element;And installation frame, insert quilt It is attached on installation frame, that can move, wherein insert is included:Body, with placement space;Support member, be and this Body is integrally formed or is to be attached to body, to support the semiconductor element being positioned on placement space;And retainer, for fixing Semiconductor element, to prevent from being positioned over the separation of the semiconductor element on placement space, and wherein body includes:First correction hole, First correction pin of the socket guiding piece being arranged on the interface board of test machine can be inserted into the first correction hole;And second correction Hole, the second correction pin of socket guiding piece can be inserted into the second correction hole.
When test jack of the insert close to interface board, the first correction pin is primarily inserted in the first correction hole and the Second revisal positive pin is posteriorly inserted in the second correction hole so that sold by the first correction hole and the first correction the position of insert Start and primarily corrected, and then by the start of the second correction hole and the second correction pin by posteriorly and accurately school Just.
After the first correction pin is inserted into the first correction hole, the second correction pin is inserted into the second correction hole, Because the ledge system of the first correction pin is high compared with the ledge of the second correction pin.
Second correction hole ties up to the elongated hole extended in side directions.
Second correction hole ties up to the elongated hole that the side of flat line is upwardly extended, and flat line is by the center of the second correction hole and inserts Enter the center of part.
According to first aspect of the present invention, the invention provides a kind of interface board for test machine, comprising:Test is inserted Seat, test jack is connected with the semiconductor element in the insert of test pallet;Socket guiding piece, for correcting insert Position, test jack is electrically connected with semiconductor element;And installing plate, test jack and socket guiding piece are installed in installation On plate, wherein socket guiding piece is included:First correction pin, the first correction pin is inserted into the first correction to be formed in insert Kong Zhong, primarily to correct the position of insert;And second correction pin, be inserted into the second correction hole to be formed in insert In, posteriorly to correct the position of insert.
When insert is close to during test jack, the position of insert is primarily corrected, while the first correction pin is by first Ground is inserted into the first correction hole, and is then inserted into the position of part and is corrected posteriorly and accurately, while the second correction pin quilt Posteriorly it is inserted into the second correction hole.
After the first correction pin is inserted into the first correction hole, the second correction pin is inserted into the second correction hole, Because the ledge system of the first correction pin is high compared with the ledge of the second correction pin.
Test jack has alignment hole, and socket guiding piece has alignment pin, and alignment pin is inserted into alignment hole.
It is online that second correction pin and alignment pin are arranged on same axis.
Second correction pin is with the plan cross-sectional for extending and being formed ellipse in side directions.
In the second aspect of the present invention, the present invention provides a kind of test pallet for testing, sorting machine, comprising:Insertion Part, the placement space being respectively placed on semiconductor element;And installation frame, insert is mounted on installation frame, That can move, wherein insert is included:Body, with placement space;Support member, be and body is integrally formed or tying is closed To body, to support the semiconductor element being positioned on placement space;And retainer, for fixing semiconductor element, to prevent The semiconductor element separation on placement space is positioned over, wherein body includes:Correction hole, is arranged on the interface board of test machine The correction pin system of socket guiding piece is inserted into correction hole, and wherein the wall of correction hole is partly cut, to reduce correction Contact area between hole and the correction pin being inserted into correction hole.
Body has a plurality of incision holes being formed in the outside of correction hole in a circumferential direction so that when quilt is sold in correction When being inserted into correction hole, with correct pin contacts correction hole wall contact area can backward, move outwardly from and by Elasticity and be resumed.
Beneficial effect
According to the first aspect, the present invention has the following effects that.
First, the present invention can accurately correct the position of insert, without causing any damage to insert, because inserting The position for entering part is approximately corrected, and is accurately corrected then later.
Second, the present invention can more accurately correct the position of insert, because minimizing when test jack and socket guiding Part assembling tolerance (manufacturing tolerance) produced when assembled.
3rd, the present invention can accurately correct the position of insert, but regardless of the thermal contraction or thermal expansion of insert.
In addition, according to the second aspect, the present invention has the following effects that.
First, even if correction pin is forcibly adapted into correction hole, easily it can be moved after correction pin from correction hole Remove, because the contact friction between correction pin and the wall of correction hole is reduced.
Second, correction pin can more easily be removed from correction hole because the wall of correction hole can be moved to it is elastic Recover on ground.
Brief description of the drawings
Fig. 1 is the plan of the test pallet for testing, sorting machine according to the first embodiment of the present invention.
Fig. 2 is the plan of the interface board for test machine according to the first embodiment of the present invention.
Fig. 3 is to show the side view applied to Fig. 2 interface board and the bonding state of socket guiding piece
Fig. 4 to Fig. 6 be Fig. 1 test pallet and Fig. 2 interface board critical piece amplification concept map, to explain this hair The operation of the critical piece of bright first embodiment.
Fig. 3 is to show the side view applied to Fig. 2 interface board and the bonding state of socket guiding piece
Fig. 4 to Fig. 6 be Fig. 1 test pallet and Fig. 2 interface board critical piece amplification concept map, to explain this hair The operation of the critical piece of bright first embodiment.
Fig. 7 be show the second correction hole to be formed in various types of inserts forming position with reference to figure.
Fig. 8 is the plan of the test pallet for testing, sorting machine according to the second embodiment of the present invention.
Fig. 9 is the amplification stereogram of Fig. 8 critical piece.
Symbol description
100、700:Insert
110:Insert
111:Body
CH1:First correction hole CH2:Second correction hole
112:Support member
113:Retainer
120:Installation frame
200:Interface board
210:Test jack
AH:Alignment hole
220:Socket guiding piece
CP1:First correction pin CP2:Second correction pin
AP:Alignment pin
230:Installing plate
Embodiment
Presently preferred embodiments of the present invention is made in detail now with reference to accompanying drawing.To simplify explanation, the explanation repeated will be by Omit or reduce.
<Embodiment 1>
1. the test pallet for testing, sorting machine
Fig. 1 is that the plan for the test pallet 100 for being used for testing, sorting machine according to the first embodiment of the present invention (is hereinafter referred to as For " test pallet ").
A plurality of inserts 110 and installation frame 120 are included according to the test pallet 100 of first embodiment.
The each of insert 110 includes body 111, support member 112 and retainer 113.
Body 111 has the placement space SS that semiconductor element can be placed on.In addition, body 111 has two the One correction hole CH1 and four the second correction hole CH2.
First correction hole CH1 is formed with the internal diameter after manufacturing tolerance is considered, and this is in [prior art] Description.Positions of the first correction hole CH1 primarily to correct insert 110.
Second correction hole CH2 systems are formed posteriorly, more accurately to correct the position of insert, and the position of insert is Primarily corrected by the first correction hole CH1 start.Therefore, the position system of insert 110 is by the first correction hole Primarily corrected, and then, by the second correction hole CH2 by more accurately secondary correction.Second correction hole CH2 systems are formed In the center O based on insert 1101Cross hairs CL on, and be to form longer on cross hairs CL direction.In other words, When feeling concerned about the center O positioned at insert in cross hairs CL1During place, positioned at the second online correction hole CH2 of cross hairs CL X-axis It is elongated hole, each positioned at the second online correction hole CH2 of cross hairs CL X-axis is long in the X-axis direction, and positioned at ten Second correction hole CH2 of wordline CL Y-axis line is elongated hole, positioned at the second correction hole CH2 of cross hairs CL Y-axis line each It is all elongated in the Y-axis direction.In this, X-axis and Y-axis system pass through the second correction hole CH2 center and the center O of insert 1101 Flat line.Because the second correction hole CH2 is elongated hole, even if center O of the insert 110 based on insert 1101And thermal expansion or Shrink, insert can keep its function.
On the first correction hole CH1 and the second correction hole CH2, the present invention will be described in more detail afterwards.
Support member 112 supports the semiconductor element being positioned on placement space SS.Support member 112 is made with film Into and be bound to body 111.In addition, support member 112 has exposing hole EH, exposing hole EH formation is used to induced semiconductor element Appropriate placement and expose the terminal of semiconductor element to the open air towards the test jack.Certainly, according to circumstances, support member 112 can It is integrally formed with body 111.
Retainer 113 is referred to alternatively as breech lock or holding meanss and is bound to body 111, that can operate.Retainer 113 is consolidated It is scheduled on the semiconductor element supported during the state that semiconductor element is placed on placement space SS by support member 112.Make For reference, fixed by retainer 113 and discharge semiconductor element system and reached by the shedding motion of separation (referring to Korean Patent Publication number the 10-2011-0121063rd).
Insert 110 is to be coupled by coupler (not shown) and on installation frame 120, coupler can be included Screw bolt and nut, can slightly move.
2. the interface board for test machine
Fig. 2 be the interface board 200 for test machine according to the first embodiment of the present invention plan (be hereinafter referred to as " Interface board ").
A plurality of test jacks 210, socket guiding piece 220 are included according to the interface board 200 of the first embodiment of the present invention And installing plate 230.
Test jack 210 has the socket electrically connected with the semiconductor element on the insert 110 of test pallet 100 Part 211.In addition, test jack 210 has the bolt hole BH1 and center O based on test jack 2102And formed in cross hairs Four positioning hole AH on CL.
Socket guiding piece 220 corrects the insert 110 for the electrical connection between test jack 210 and semiconductor element Position.Therefore, socket guiding piece 220 is included in two first correction pins at the position for corresponding to two the first correction hole CH1 The CP1 and four second correction pin CP2 at the position corresponding to four the second correction hole CH2.In addition, as shown in Figure 3, four Individual alignment pin AP is arranged at the position corresponding to four alignment hole AH.
First correction pin CP1 primarily corrects the position of insert 110, while the first correction pin CP1 is inserted into first In correction hole CH1.
Second correction pin CP2 more accurately, posteriorly correction insert 110 (this position is by primarily school for position Just), while the second correction pin CP2 is inserted into the second correction hole CH2.The plane that second correction pin CP2 has ellipse is cutd open Face, corresponding to the second correction hole CH2 for elongated hole.
In addition, in the second correction pin CP2 section, the diameter system of the second correction pin CP2 short radius side is no better than The diameter of second correction hole CH2 short radius side, and the diameter system of the second correction pin CP2 major radius side is slightly shorter than the second school The diameter of positive hole CH2 major radius side.This is the expansion and the correction pin of test jack 210 or second in order to consider insert 110 CP2 thermal expansion.In other words, even if that the second correction pin CP2 systems expand according to thermal expansion or unexpanded, it is contemplated that heat Motion on expansion direction, spare space should be formed in the second correction hole CH2.Because section system is formed as ellipse, than the Second correction pin CP2 of one correction pin CP1 relative thins intensity can be reinforced.
Especially, as shown in Figure 3, projecting heights of the first correction pin CP1 projecting height H1 than the second correction pin CP2 H2 is higher.Therefore, the first correction pin CP1 is primarily directed at the position of insert 110, while the first correction pin CP1 is by primarily It is inserted into the first correction hole CH1, and then, the second correction pin CP2 posteriorly and is accurately aligned with the position of insert 110, The second correction pin CP2 is inserted into the second correction hole CH2 simultaneously.Certainly, according to circumstances, the structure of insert can be changed, made Identical can be configured in highly by obtaining the first correction pin and the second correction pin, but first be inserted into the first correction in the first correction pin After in hole, the second correction pin is inserted into the second correction hole.
Alignment pin AP is inserted into alignment hole AH.Socket guiding piece 220 and test jack 210 can be with socket guiding pieces State that mutual alignment system between 220 and test jack 210 is accurately set up by alignment pin AP and alignment hole AH and It is installed in installing plate 230.In this, as shown in Figure 3, CP2 and four alignment pin AP of four second correction pins can be with identical Form and be arranged on identical axle SA1、SA2And SA3On.CP2 and four alignment pin AP of four second correction pins can be by entirety Ground is individually formed.Certainly, such as situation needs, alignment pin can be formed at the diverse location from the second correction pin.
In addition, socket guiding piece 220 has the spiral shell formed at the position corresponding to the bolt hole BH1 of test jack 210 Keyhole BH2.Therefore, test jack 210 and socket guiding piece 220 are arranged on installing plate 230 by bolt (not shown). Therefore, alignment pin AP projecting height h1The alignment hole AH of test jack 210 depth h should be equal to or less than2.Certainly, work people Member temporarily couples test jack 210 and socket guiding piece 220 by previously alignment pin AP is inserted into alignment hole AH Each other, and then, the test jack 210 temporarily coupled and socket guiding piece 220 are bound to installing plate using bolt 230.If however, in the side portion formation screw line of alignment pin, screw linear system towards installing plate, for by alignment pin incite somebody to action Test jack and socket guiding piece are installed on installing plate, and bolt hole and bolt system are unwanted.
3. the operation of critical piece
When test pallet 100 by the pushing unit being arranged in testing, sorting machine close at interface board 200 when, peace Loaded on the insert 110 on test pallet 100 close to (special with reference to South Korea at the test jack 210 on interface board 200 The open 10- of profit).
Fig. 4 to Fig. 7 be Fig. 1 test pallet and Fig. 2 interface board critical piece amplification concept map, to explain this hair The operation of bright critical piece.
Fig. 4 (a) describes the state that insert 110 is at predetermined intervals and separated with test jack 210, and Fig. 4 (b) is retouched It is painted on the first correction hole CH1 and the first correction pin CP1 of socket guiding piece 220 in insert 110 in the state of Fig. 4 (a) Between position relationship and the second correction hole CH2 of insert 110 and the second correction hole CH2 of socket guiding piece 220 between Position relationship.
In Fig. 4 state, when pushing unit is operated with mobile test pallet 100 towards interface board 200, the first correction pin CP1 is primarily directed at the position (as shown in Fig. 5 (b)) of insert 110, while the first correction pin CP1 is inserted into the first school In positive hole CH1 (as shown in Fig. 5 (a)).Therefore, as shown in Fig. 4 (b), the second school is greatly left in the second correction pin CP2 When in positive hole CH2 state (as shown in Fig. 5 (b)), the second correction pin CP2 is corrected, can be inserted into the second correction In the CH2 of hole.
In Fig. 5 state, when insert 110 is continuously moved to test jack 210, as shown in Figure 6, insert 110 position posteriorly, is accurately corrected, while the second correction pin CP2 is inserted into the second correction hole CH2.
As described above, the present invention is on by by the corrections of the first correction hole CH1 and first pin CP1 and by the second correction The technology that hole CH2 and second corrects two stages for selling CP2 and accurately corrects the position of insert 110.However, according to various Applicable example, the 3rd correction hole can be used in the present invention and the 3rd corrects pin or the sequentially accurately school by least four stages The position of positive insert.
4. refer to details
In 100 inserts 110 of Fig. 1 test pallet are applied to, by way of example, the second correction hole CH2 systems are formed In the center O based on insert 1101Cross hairs CL on, and be to form longer on cross hairs CL direction.
However, as shown in Fig. 7 (a), (b) and (c), there is various insert 110A, 110B and 110C.Therefore, it can The second correction hole CH2 can be difficult to configure according to various insert 110A, 10B and 110C on cross hairs CL, and it It is likely difficult to form elongated hole in a different direction.Therefore, can be using various modifications as shown in Figure 7.
As shown in Fig. 7 (a), two the second correction hole CH2-a systems are formed in the edge part office diagonally faced each other, And two the second correction hole CH2-b systems are formed on center line C, insert 110A is split half into laterally symmetric by center line C 's.In addition, the elongated hole that correction hole CH2-a systems extend in a lateral direction, and the fore-and-aft direction of correction hole CH2-b systems in the drawings The elongated hole of upper extension.
As shown in Fig. 7 (b), the second correction hole CH2 systems are formed at the left side and right side based on center line C, center line C Insert 110B is split into half into laterally symmetric.In addition, the second all correction hole CH2 is fore-and-aft direction in the drawings The elongated hole of upper extension.
As shown in Fig. 7 (c), the second correction hole CH2 systems are formed at the left side and right side based on center line C, center line C Insert 110C is split into half into laterally symmetric.In addition, the second all correction hole CH2 is lateral in the drawings The elongated hole of upper extension.
That is, the second correction hole CH2 can be in a variety of ways arranged according to insertion 110A, 110B and 110C shape.
Certainly, the second correction pin of interface board also should according to Fig. 7 insert 100,110A, 110B and 110C it is various Shape and be configured, with the configuration corresponding to second correction hole CH2-a, CH2-b and CH2.
<Embodiment 2>
Fig. 8 be the plan of the test pallet 700 for testing, sorting machine according to the second embodiment of the present invention (hereafter Referred to as " test pallet ").
In this embodiment, test pallet 700 includes a plurality of inserts 710 and installation frame 720.
Insert 710 includes body 711, support member 712 and retainer 713.In this, support member 712 and retainer 713 explanation will be omitted, because they are identical with those components of first embodiment.
Body 711 has the placement space SS that semiconductor element is placed on.In addition, body 711 has correction hole CH With incision hole IH.
The position of insert 710 is corrected, because the school of interface board (identical with the first correction pin in first embodiment) Positive pin is inserted into correction hole CH.In this, as shown in Figure 9, correction hole CH wall W has notch IP, to reduce school Positive hole CH and the correction pin contacts being inserted into correction hole CH contact area.
When incision hole IH is formed such that proper correction pin is inserted into correction hole CH, correction hole CH wall W and school A part for positive pin contacts backward, move outwardly from.In addition, when correction pin is removed from correction hole CH, the wall W being moved rearwards by Move forward, and recover by elasticity by the elasticity of the material for the body 711 for forming insert 710.That is, it is real herein Apply in example, by elasticity, the internal diameter of the correction hole CH before correction pin is inserted into is equal to or less than the diameter of correction pin.So And, because when correcting pin and being inserted into, correction hole CH wall W backward, move outwardly from, correction hole CH gradually broadens so that Correction pin can be sufficiently inserted into correction hole CH.In addition, because preventing correction pin to be forcibly adapted to correction hole CH In, the operational issue that correction pin can not leave correction hole CH is solved.
In this embodiment, the present invention can more accurately correct the position of insert 710, because correction hole CH internal diameter can The internal diameter for the correction hole for being smaller than known techniques is formed by the error minimized caused by manufacturing tolerance.
In addition, the incision hole IH of the notch IP and formation of the wall to form correction hole CH on the outside of correction hole CH Technology can only be applied to the first correction hole CH1 as described in the first embodiment of the present invention, be applied only to such as the present invention The second correction hole CH2 described in first embodiment or application are to all first as described in the first embodiment of the present invention Correction hole CH1 and the second correction hole CH2.
Simultaneously, for purposes of illustration only, embodiments of the invention are separately noted, still, first embodiment and second Embodiment can be implemented together and can respectively be applied to product.
As described above, although the present invention is shown in particular with reference to the example embodiment of subsidiary schema and the present invention And description, tool usually intellectual in this technology it will be understood that the embodiment being exposed in the present invention all system be it is exemplary, And present invention system is not restricted to specific embodiment.It should also be appreciated that protection scope of the present invention should be by following claim Explained, and the such equivalents of claim belong to technical scope of the invention.

Claims (13)

1. a kind of test pallet for testing, sorting machine, including:
Insert, the placement space being placed on semiconductor element;And
Installation frame, the insert is mounted to the installation frame, that can move,
Wherein described insert includes:
Body, with the placement space;
Support member, it is integrally formed or be attached to the body with the body, to support be positioned over the placement space half Conductor element;And
Retainer, for fixing semiconductor element, to prevent the semiconductor element for being positioned over the placement space from separating, and
Wherein described body includes:First correction hole, is arranged on the first correction pin of the socket guiding piece of the interface board of test machine First correction hole can be inserted into;And second correction hole, the second correction pin of the socket guiding piece can be inserted into To second correction hole.
2. it is used for the test pallet of testing, sorting machine as claimed in claim 1, wherein being provided to institute when the insert is close When stating the test jack of interface board, the first correction pin is firstly inserted into first correction hole and second correction sells it Secondary insertion second correction hole so that the position of the insert is by first correction hole and the described first correction pin Effect and corrected first, and by second correction hole and the second correction pin effect and by posteriorly accurately school Just.
3. it is used for the test pallet of testing, sorting machine as claimed in claim 2, wherein being inserted into the described first correction pin After in first correction hole, the second correction pin is inserted into second correction hole, because first correction The ledge of a ledge the second correction pin of pin is high.
4. it is used for the test pallet of testing, sorting machine as claimed in claim 1, wherein second correction hole ties up to a side The elongated hole form upwardly extended.
5. it is used for the test pallet of testing, sorting machine as claimed in claim 4, wherein second correction hole ties up to straight line The longer elongated hole form in direction, the center of the second correction hole described in the straight-line pass and the center of the insert.
6. it is used for the interface board of a test machine a kind of, including:
Test jack, the test jack is electrically connected with the semiconductor element in the insert of test pallet;
Socket guiding piece, the position for correcting the insert, the test jack is electrically connected with the semiconductor element Connect;And
Installing plate, the test jack and the socket guiding piece are installed on the installing plate,
Wherein described socket guiding piece includes:
First correction pin, the first correction pin is inserted into be formed in one first correction hole of the insert, with first Correct the position of the insert;And
Second correction pin, is inserted into be formed in the second correction hole in the insert, posteriorly to correct the insertion The position of part.
7. it is used for the interface board of testing, sorting machine as claimed in claim 6, wherein when the insert is inserted close to the test During seat, the first correction pin is firstly inserted into first correction hole and makes the position of the insert by school first Just, and then the second correction pin is posteriorly inserted into second correction hole, and makes the position quilt of the insert Posteriorly accurately correct.
8. it is used for the test pallet of testing, sorting machine as claimed in claim 7, wherein being inserted into the described first correction pin After in first correction hole, the second correction pin is inserted into second correction hole, because first correction The ledge of ledge the second correction pin of pin is high.
9. it is used for the interface board of testing, sorting machine as claimed in claim 8, wherein the test jack has alignment hole, and institute Stating socket guiding piece has alignment pin, and the alignment pin is inserted into the alignment hole.
10. it is used for the interface board of testing, sorting machine as claimed in claim 9, wherein the second correction pin and the alignment pin It is provided to same axis.
11. it is used for the interface board of testing, sorting machine as claimed in claim 6, wherein the second correction pin has side direction Long elliptical shape.
12. a kind of insert for testing, sorting machine, including:
Insert, the placement space being placed with semiconductor element;And
Installation frame, the insert is fixedly installed to the installation frame, that can move,
Wherein described insert includes:
Body, with the placement space;
Support member, it is integrally formed or be attached to the body with the body, to support be positioned over the placement space half Conductor element;And
Retainer, for fixing semiconductor element, to prevent the semiconductor element for being positioned over the placement space from separating,
Wherein described body includes:Correction hole, being arranged on the correction pin system of the socket guiding piece of the interface board of test machine can insert Enter to the correction hole, and
One wall of wherein described correction hole is partly cut, with the institute for reducing the correction hole He being inserted into the correction hole State the contact area between correction pin.
13. it is used for the insert of testing, sorting machine as claimed in claim 12, wherein the body is in the outer of the correction hole Side has been circumferentially formed thereon a plurality of incision holes so that when the correction pin is inserted into the correction hole, form described In the wall of correction hole with it is described correction pin contacts part can retreat laterally after elastic recovery.
CN201580063135.5A 2014-11-20 2015-10-28 Test tray for test handler and interface board for test machine Active CN106999988B (en)

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KR10-2014-0162884 2014-11-20
KR20140162884 2014-11-20
KR10-2014-0163536 2014-11-21
KR20140163536 2014-11-21
KR10-2015-0146230 2015-10-20
KR1020150146230A KR102489549B1 (en) 2014-11-20 2015-10-20 Test tray for test handler and interface board for tester
PCT/KR2015/011433 WO2016080670A1 (en) 2014-11-20 2015-10-28 Test tray for test handler and interface board for tester

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CN114904807A (en) * 2021-02-08 2022-08-16 泰克元有限公司 Adapter of sorting machine for electronic component test

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JP6375059B2 (en) 2018-08-15
CN106999988B (en) 2020-04-03
KR20160060546A (en) 2016-05-30
JP2017531803A (en) 2017-10-26

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