CN106992128A - A kind of surface defect detection apparatus of solar silicon wafers - Google Patents
A kind of surface defect detection apparatus of solar silicon wafers Download PDFInfo
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- CN106992128A CN106992128A CN201710400023.5A CN201710400023A CN106992128A CN 106992128 A CN106992128 A CN 106992128A CN 201710400023 A CN201710400023 A CN 201710400023A CN 106992128 A CN106992128 A CN 106992128A
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- sucker
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- taking pictures
- detection apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention relates to a kind of surface defect detection apparatus of solar silicon wafers, include gripper components, circular orbit, detection part, drive system and control system, wherein detection part includes part one and the part two of taking pictures of taking pictures, the part one of taking pictures is located at the lower section of the sucker, the position of the part one of taking pictures is adapted to the rotary motion trace of the sucker, the part one of taking pictures is used for the bottom surface for shooting silicon chip, and the part two of taking pictures is used for the top surface for shooting the silicon chip.It only need to can once pick and place and rotate the shooting that can be achieved to the silicon chip positive and negative to the silicon chip by the sucker using the present apparatus, to carry out the detection of apparent size and flaw to the silicon chip, without the silicon chip is carried out into turn-over, simplify the structure of grasping mechanism, operating process is short, efficiency high, it is easy to detect, reduce mechanical loss, it is to avoid silicon chip product extraneoas loss, presentation quality is improved, cost is reduced.
Description
Technical field
The present invention relates to solar silicon wafers detection technique field, the surface defects detection of particularly a kind of solar silicon wafers is filled
Put.
Background technology
The main composition part of solar panels is solar silicon wafers, and the photoelectric converting function efficiency of solar silicon wafers is constantly carried
Rise, have particularly important application in aspects such as civilian, national defence, Aeronautics and Astronautics, it has also become indispensable in the peace and quiet energy
One of member, industry is ardent to solar silicon wafers demand, and the exterior quality of solar silicon wafers can directly influence it is follow-up too
The making of positive energy cell piece and conversion efficiency etc., while solar silicon wafers are very frivolous, in automated manufacturing and detection process, slightly
Have accidentally, it is possible to cause damaged, the unfilled corner microscopic checks that even naked eyes can not be observed, reduce production efficiency, increase is produced into
This, therefore to lift the quality of solar silicon wafers, it is necessary to carry out detection classification to solar silicon wafers.
It is existing when carrying out the detection such as appearance and size, open defect to silicon chip, it is necessary to shoot the upper and lower surface of silicon chip respectively
Technology, frequently with the one side for first shooting silicon chip, shoots another side, during the process again when taking pictures after silicon chip then is carried out into turn-over
Between longer, inefficiency, it is damaged to easily cause silicon chip, increases defect rate.
The content of the invention
The goal of the invention of the present invention is to overcome prior art carrying out silicon chip the long efficiency of process time of outward appearance detection
Low, mechanical loss is big, and easily causing the above-mentioned deficiency such as silicon chip breakage, there is provided a kind of surface defects detection of solar silicon wafers dress
Put, shorten mechanical trip, improve operating efficiency, reduce mechanical loss, improve presentation quality.
To achieve these goals, the technical solution adopted by the present invention is：
A kind of surface defect detection apparatus of solar silicon wafers, including：
Gripper components, comprising at least one sucker, all suckers are generally aligned in the same plane；
Circular orbit, all suckers are slidably connected on the circular orbit；
Detection part, comprising part one and the part two of taking pictures of taking pictures, the part one of taking pictures is located at the lower section of the sucker, described
The take pictures position of part one is adapted to the rotary motion trace of the sucker, and the part one of taking pictures is used for the bottom surface for shooting silicon chip, described
Part two of taking pictures is used for the top surface for shooting the silicon chip；
Drive system, drives the gripper components and detection part；
Control system, controls the drive system.
Using a kind of surface defect detection apparatus of solar silicon wafers of the present invention, driven by control system control is described
Dynamic system drives all suckers to be moved along the circular orbit, and all suckers are generally aligned in the same plane, and are all connected to
On the rotary part, each sucker is connected with negative pressure source, when the sucker is turned to above silicon chip, the silicon chip position
In the adsorption range of the sucker, the sucker formation negative pressure draws the silicon chip in the original location, then the control system control
The drive system drives the sucker to turn to next station, and when the control system closes negative pressure, the sucker is put down
The silicon chip realizes blanking, when the top surface of silicon chip described in the sucker suction, now using described below the sucker
The bottom surface of silicon chip described in a pair of part of taking pictures is shot to detect, when the unadsorbed silicon chip of the sucker, i.e., in institute
State before silicon chip is drawn or after putting down, shot using the top surface for taking pictures two pairs of silicon chips of part to detect,
The silicon chip only need to can once be picked and placeed by the sucker and rotated i.e. achievable positive and negative to the silicon chip using the present apparatus
The shooting in face, finds that naked eyes can not be observed in the early stage, but easily lead in later process splitting for fragment using detection part
Line defect, to improve the accuracy that the silicon chip carries out apparent size and Defect Detection, while without the silicon chip is carried out
Turn-over is that can detect, and simplifies the structure of grasping mechanism, and operating process is short, and efficiency high is easy to detect, reduces mechanical loss, is reduced
To the frequency of exposure of silicon chip, it is to avoid cause damage to outward appearance, presentation quality is improved, cost is reduced, is configured with multiple suckers
When, the action that a silicon chip can be captured, placed and shot is rotated every time, operating efficiency is further improved, and reduces machine
Tool is lost, when the operating time needed for different suckers is different, and each sucker independent operation is easy to control, while being capable of root
According to the rotational angle of sucker described in the position adjustments of station.
It is preferred that, also comprising display unit.
It is preferred that, also comprising feeding device and blanking device, the position adaptation of the feeding device and blanking device is described
The rotary motion trace of sucker, so that each sucker is realized respectively when rotating to above the feeding device and blanking device station
Feeding and blanking.
In all suckers are generally aligned in the same plane, the sucker rotates to the feeding device crawl silicon chip,
Treat to put down the silicon chip at rotation to blanking device, the feeding device and blanking device are arranged in the rotary motion trace of the sucker
On, the height of the sucker and the angle of rotation are adapted to, so that each sucker rotates to the feeding device and blanking
Feeding and blanking are realized respectively when above device station, using can realize that feeding and blanking grasp during multiple suckers simultaneously
Make, improve mechanical efficiency, be easy to Mechanical course.
It is further preferred that the feeding device includes jacking part and air blowing part.
Because the height of the sucker is fixed, and silicon chip is easily crushed, and is reached between silicon chip to be drawn and the sucker
The negative pressure of the sucker could pick up the silicon chip during certain distance, and the control system controls the jacking part described
Silicon chip jacking ensures that crawl link continues uninterruptedly, to improve operating efficiency, it is to avoid work as institute to the position that the sucker is drawn is adapted to
The silicon chip can not be drawn by stating when sucker reaches upper discharge position；Because silicon chip is relatively light relatively thin, it will wait to inhale using the air blowing part
The silicon chip taken dispels separation, is easy to the sucker to draw, it is to avoid once draw the silicon chip of more than two.
It is further preferred that the feeding device also includes photoelectric sensor.
The photoelectric sensor is used to sense distance of the silicon chip apart from plane where the sucker, can be used for sensing
Whether the silicon chip is had on the sucker, and the control system controls the jacking part jacking institute according to the photoelectric sensor
Silicon chip is stated to adapting position, and be confirmed whether draw silicon chip, it is ensured that crawl everything goes well with your work carry out.
It is further preferred that the part one of taking pictures is located between the feeding device and blanking device, the blanking dress
Transmission belt is set to, the height of the transmission belt is adapted to the sucker.
Between the feeding device and blanking device, the silicon chip is easy to the part of taking pictures by the sucker suction
One shoots the bottom surface of the silicon chip.
It is further preferred that the part two of taking pictures is located at the surface of the transmission belt.
When the silicon chip is positioned in the transmission belt by the sucker, the part two of taking pictures can be to the silicon chip
Top surface is shot.
It is preferred that, vertical connecting plate is slidably connected on the circular orbit, each sucker bolt connection one
The connecting plate.
Vertical connecting plate is slidably connected on the circular orbit, the connecting plate is provided with chute, the sucker spiral shell
The height connect with the chute, being easy to adjust the sucker is tethered, the sucker is convenient for changing, while being conducive to improving strong
Degree, it is to avoid produce rock when rotated.
It is preferred that, also comprising a point of pneumatic module, described point of pneumatic module includes airway tube and sleeve, during the airway tube is
Hollow structure, the sleeve is provided with endoporus, and the lower end of the airway tube is connected with the endoporus, and the upper end of the airway tube is provided with
One opening one, the lower end of the sleeve is provided with least two openings two, and each opening two connects the endoporus, each
The opening two is connected with tracheae one, and the tracheae one connects the sucker, described described point of pneumatic module rotation of drive system driving
Turn.
The upper end of the airway tube is provided with least two openings two provided with an opening one, the lower end of the sleeve, each
The opening two is connected with tracheae one, and each tracheae one is used to connect a sucker, and each opening two connects institute
State endoporus so that each tracheae one is connected with the opening one, the opening one connects negative pressure source, the tracheae one leads to
Cross the airway tube and coordinate a realization point gas with sleeve, the drive system connects the sleeve, drives the sleeve rotating, described
In sucker rotary course, the tracheae one and sleeve synchronous rotary, the position between each tracheae one relative to the sleeve are consolidated
Fixed, it is to avoid tracheae one is wound during rotating Vortex always, guarantee always can along the sucker of rotating Vortex
Negative pressure is persistently produced, negative pressure source quantity is reduced, reduces cost, is conducive to improving operating efficiency, continual rotation to different works
Position is picked and placeed, it is to avoid mechanical breakdown, simple in construction, easy to process.
It is further preferred that the opening one connects tracheae two by swivel joint.
I.e. described swivel joint one end connects the airway tube, other end connection tracheae two, during work, the swivel joint
One end that one end of connection tracheae two remained stationary as, connected the airway tube is rotated with the airway tube, it is to avoid the gas
Pipe two causes to reverse because of rotation, and influence negative pressure is formed.
It is further preferred that each tracheae one is connected with least one gas-distributing pipe, each gas-distributing pipe is connected with
Magnetic valve.
When provided with multiple suckers, each gas-distributing pipe is connected on a sucker, each gas-distributing pipe
Magnetic valve is connected with, the magnetic valve is connected with electric wire, and the electric wire is shunted by collector ring, it is to avoid occurred when rotated
Winding, is easy to control rotation to the sucker of different station to draw or put down the silicon chip.
It is preferred that, the distance between two neighboring described sucker is equal, and the angle that the sucker is rotated every time is identical.
Using aforesaid way, i.e., when described sucker is rotated to different station, each rotational angle is identical, is easy to system control
And station arrangement, often rotate once, being corresponded on each station has a sucker, thus can carry out simultaneously feeding, detection and
Blanking is operated, and improves operating efficiency.
In summary, by adopting the above-described technical solution, the beneficial effects of the invention are as follows：
1st, can be by the sucker to the silicon chip using a kind of surface defect detection apparatus of solar silicon wafers of the invention
The shooting that can be achieved to the silicon chip positive and negative only need to be once picked and placeed and rotate, using detection part it can be found that in the early stage
Naked eyes can not be observed, but easily lead to the crack defect of fragment in later process, and outward appearance is carried out to improve the silicon chip
The accuracy of size and Defect Detection, while without being that can detect by silicon chip progress turn-over, simplify the structure of grasping mechanism,
Operating process is short, efficiency high, easy to detect, reduces mechanical loss, reduces the frequency of exposure to silicon chip, it is to avoid outward appearance is caused to damage
Wound, improve presentation quality, reduce cost, when being configured with multiple suckers, every time rotate a silicon chip can be captured,
The action placed and shot, further improves operating efficiency, reduces mechanical loss, and the operating time is different needed for different suckers
When, each sucker independent operation is easy to control, while can according to the position adjustments of station sucker angle of rotation
Degree.
2nd, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, the feeding device and blanking device
In the rotary motion trace for being arranged in the sucker, the height of the sucker and the angle of rotation are adapted to, so that each sucker
Feeding and blanking are realized respectively when rotating to above the feeding device and blanking device station, using energy during multiple suckers
It is enough to realize feeding and blanking operation simultaneously, mechanical efficiency is improved, is easy to Mechanical course.
3rd, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, the control system controls the top
The silicon chip jacking to the position that the sucker is drawn is adapted to, is ensured that crawl link continues uninterruptedly, to improve work by ascending part part
Efficiency, it is to avoid can not draw the silicon chip when the sucker reaches upper discharge position；The air blowing part will be to be drawn described in
Silicon chip dispels separation, is easy to the sucker to draw, it is to avoid once draw the silicon chip of more than two.
4th, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, the part one of taking pictures is on described
Expect between device and blanking device, the silicon chip is easy to shoot the bottom surface of the silicon chip, the portion of taking pictures by the sucker suction
Part two is located at the surface of the transmission belt, is easy to shoot the top surface of the silicon chip.
5th, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, connect described by the tracheae one
Airway tube coordinates with sleeve realizes a point gas, in the sucker rotary course, the tracheae one and sleeve synchronous rotary, Mei Geqi
Position between pipe one relative to the sleeve is fixed, it is to avoid tracheae one is wound during rotating Vortex always, is protected
Barrier can continue to produce negative pressure always along the sucker of rotating Vortex, reduce negative pressure source quantity, reduce cost, be conducive to improving
Operating efficiency, continual rotation to different station is picked and placeed, it is to avoid mechanical breakdown, simple in construction, easy to process.
6th, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, the gas is avoided using swivel joint
Pipe two causes to reverse because of rotation, and influence negative pressure is formed.
7th, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, the sucker is rotated to different station
When, each rotational angle is identical, is easy to system control and station to arrange, often rotates once, and being corresponded on each station has described
Sucker, therefore feeding, detection and blanking operation can be carried out simultaneously, improve operating efficiency.
8th, using a kind of surface defect detection apparatus of solar silicon wafers of the invention, it is slidably connected on the circular orbit
There is vertical connecting plate, the connecting plate is provided with chute, and the sucker bolt connection is with the chute, being easy to regulation described
The height of sucker, is convenient for changing the sucker, while being conducive to improving intensity, it is to avoid produce rock when rotated.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the surface defect detection apparatus of solar silicon wafers in the present invention.
Fig. 2 is a kind of structure top view of the surface defect detection apparatus of solar silicon wafers in the present invention.
Fig. 3 is the structural section figure for dividing pneumatic module in the present invention.
Marked in figure：1- suckers, 2- airway tubes, 3- sleeves, 31- endoporus, 4- tracheaes one, 51- jacking parts, 52- blows
Part, 6- swivel joints, 7- tracheaes two, 8- circular orbits, 9- transmission belts, 10- takes pictures part one, and 11- takes pictures part two, 12-
Silicon chip.
Embodiment
Below in conjunction with the accompanying drawings, the present invention is described in detail.
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
Embodiment 1
Such as Fig. 1-3, a kind of surface defect detection apparatus of solar silicon wafers of the present invention, comprising gripper components, circular rails
Road 8, detection part, point gas part, display unit, feeding device, blanking device, drive system and control system, the control
System controls the drive system to drive the gripper components, detection part, display unit, feeding device and blanking device, institute
State control system and include processing module, the gripper components include four suckers 1, and described point of pneumatic module includes airway tube 2 and set
Cylinder 3, the airway tube 2 be hollow structure copper pipe, the sleeve 3 be provided with endoporus 31, the lower end of the airway tube 2 with it is described interior
Hole 31 is connected, and the upper end of the airway tube 2 is provided with an opening one, and the opening one connects tracheae two by swivel joint 6
7, the tracheae 27 connects and slidably connects four pieces of vertical connecting plates on negative pressure source, the circular orbit 8, each suction
Disk 1 bolt connection, one connecting plate, even circumferential distribution of four suckers 1 along the circular orbit 8 is all described
Sucker 1 is located at same level, and the lower end of the sleeve 3 is provided with two openings two, and two openings two are arranged symmetrically, each
The opening two connects the endoporus 31, and each opening two is connected with a tracheae 1, and each tracheae 1 connects
Two gas-distributing pipes are connected to, each gas-distributing pipe connects and is connected with magnetic valve on a sucker 1, each gas-distributing pipe,
The feeding device includes jacking part 51, air blowing part 52 and photoelectric sensor, the position of the feeding device and blanking device
The rotary motion trace and rotational angle for being adapted to the sucker 1 are put, the jacking part 51 is located at the lower section of the sucker 1, is adapted to institute
The rotational angle of sucker 1 is stated, the air blowing part 52 is located at the both sides of jacking part 51, and its height is adapted to the sucker 1, institute
Blanking device is stated for transmission belt 9, the position of the transmission belt 9 is adapted to the height of the sucker 1, the detection part is included and taken pictures
Part 1 and part 2 11 of taking pictures, the part 1 of taking pictures are located between the feeding device and blanking device, described to clap
Be located at the lower section of the sucker 1 according to part 1, the position of the part 1 of taking pictures be adapted to the sucker 1 rotary motion trace and
Rotational angle, the part 2 11 of taking pictures is located at the surface of the transmission belt 9.
The control system controls the drive system to drive all suckers 1 to rotate in the counterclockwise direction, Mei Gesuo
State sucker 1 and rotate 90 ° respectively every time, when the sucker 1 is turned at the feeding device, the control system is according to described
The signal of photoelectric sensor controls the drive system to drive the jacking part 51 by the jacking of silicon chip 12 to the height being adapted to, institute
State air blowing part 52 to dispel the silicon chip at top, the control system controls the magnetic valve of the corresponding sucker 1
Open, the sucker 1 draws the silicon chip 12, all suckers 1 continue to rotate 90 ° in the counterclockwise direction respectively simultaneously, this
When the sucker 1 at the feeding device continue to draw the silicon chip 12, the control system controls the drivetrain
The dynamic all suckers 1 of regiment commander continue 90 ° of rotate counterclockwises to it is described take pictures one 10 position of part when, the part 1 of taking pictures
The bottom surface of the silicon chip 12 is shot, after shooting is finished, the drive system drives all suckers 1 to continue rotate counterclockwise
90 ° control the closed electromagnetic valve of the corresponding sucker 1 to the transmission belt 9, the control system, and the silicon chip 12 is put
It is placed in transmission belt 9, now while being drawn and photographing operation, the silicon at the feeding device and at part 1 of taking pictures
Piece 12 is moved in transmission belt 9, when the silicon chip 12 is located at the coverage of the part 2 11 of taking pictures, the part of taking pictures
2 11 shoot the top surface of the silicon chip 12, and the processing module is to the shooting part 1 and shoots in the shooting of part 2 11
Appearance is handled, and result images in the display unit, with the presentation quality of this positive and negative for detecting the silicon chip 12, adopts
With the present apparatus can by 1 pair of the sucker silicon chip 12 once pick and place and rotate i.e. can be achieved to the silicon chip 12 just,
The shooting of reverse side, the testing result images in the display unit, to carry out apparent size and flaw to the silicon chip 12
Progress detect, while avoid gripper components decline, rise and iterative motion, without the silicon chip 12 is turned over
Face, simplifies the structure of grasping mechanism, and operating process is short, and efficiency high is easy to detect, reduces mechanical loss, it is to avoid silicon chip product volume
External loss, improves presentation quality, reduces cost, when being configured with multiple suckers, and rotating can be carried out every time to a silicon chip
Crawl, the action placed and shot, further improve operating efficiency, reduce mechanical loss.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of surface defect detection apparatus of solar silicon wafers, it is characterised in that including：
Gripper components, comprising at least one sucker (1), all suckers (1) are generally aligned in the same plane；
Circular orbit (8), all suckers (1) are slidably connected on the circular orbit (8)；
Detection part, comprising part one (10) and the part two (11) of taking pictures of taking pictures, the part one (10) of taking pictures is inhaled located at described
The lower section of disk (1), the position of the part one (10) of taking pictures is adapted to the rotary motion trace of the sucker (1), the part one of taking pictures
(10) it is used for the bottom surface for shooting silicon chip (12), the part two (11) of taking pictures is used for the top surface for shooting the silicon chip (12)；
Drive system, drives the gripper components and detection part；
Control system, controls the drive system.
2. the surface defect detection apparatus of a kind of solar silicon wafers according to claim 1, it is characterised in that also comprising aobvious
Show part.
3. the surface defect detection apparatus of a kind of solar silicon wafers according to claim 1, it is characterised in that also comprising upper
Expect device and blanking device, the position of the feeding device and blanking device is adapted to the rotary motion trace of the sucker (1), so that often
The individual sucker (1) realizes feeding and blanking respectively when rotating to above the feeding device and blanking device station.
4. a kind of surface defect detection apparatus of solar silicon wafers according to claim 3, it is characterised in that the feeding
Device includes jacking part (51) and air blowing part (52).
5. the surface defect detection apparatus of a kind of solar silicon wafers according to claim 3, it is characterised in that described to take pictures
Part one (10) is located between the feeding device and blanking device, and the blanking device is transmission belt (9), the transmission belt
(9) height is adapted to the sucker (1).
6. a kind of surface defect detection apparatus of solar silicon wafers according to claim 5, it is characterised in that the bat
It is located at the surface of the transmission belt (9) according to part two (11).
7. according to a kind of surface defect detection apparatus of any described solar silicon wafers of claim 1-6, it is characterised in that institute
State and slidably connect vertical connecting plate on circular orbit (8), one connecting plate of each sucker (1) bolt connection.
8. according to a kind of surface defect detection apparatus of any described solar silicon wafers of claim 1-6, it is characterised in that also
Comprising a point of pneumatic module, described point of pneumatic module includes airway tube (2) and sleeve (3), and the airway tube (2) is hollow structure,
The sleeve (3) is provided with endoporus (31), and the lower end of the airway tube (2) is connected with the endoporus (31), the airway tube (2)
Upper end provided with an opening one, the lower end of the sleeve (3) is provided with least two openings two, and each opening two is connected
The endoporus (31), each opening two is connected with tracheae one (4), and the tracheae one (4) connects the sucker (1), described
Described point of pneumatic module rotation of drive system driving.
9. a kind of surface defect detection apparatus of solar silicon wafers according to claim 8, it is characterised in that the opening
One connects tracheae two (7) by swivel joint (6).
10. according to a kind of surface defect detection apparatus of any described solar silicon wafers of claim 1-6, it is characterised in that
The distance between the two neighboring sucker (1) is equal, and the angle that the sucker (1) rotates every time is identical.
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| CN201710400023.5A CN106992128A (en) | 2017-05-31 | 2017-05-31 | A kind of surface defect detection apparatus of solar silicon wafers |
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| CN112529357A (en) * | 2020-11-03 | 2021-03-19 | 特劢丝软件科技(上海)有限公司 | Silicon wafer grading method, system, electronic device and computer readable storage medium |
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