CN106982516A - 一种应用于柔性电子的液态金属印刷方法 - Google Patents
一种应用于柔性电子的液态金属印刷方法 Download PDFInfo
- Publication number
- CN106982516A CN106982516A CN201710266399.1A CN201710266399A CN106982516A CN 106982516 A CN106982516 A CN 106982516A CN 201710266399 A CN201710266399 A CN 201710266399A CN 106982516 A CN106982516 A CN 106982516A
- Authority
- CN
- China
- Prior art keywords
- liquid metal
- printing process
- flexible electronic
- substrate
- microchannel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000007639 printing Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 230000008014 freezing Effects 0.000 claims abstract description 21
- 238000007710 freezing Methods 0.000 claims abstract description 21
- 230000008018 melting Effects 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims abstract description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 8
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 5
- 238000003851 corona treatment Methods 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000002572 peristaltic effect Effects 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 6
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229920005479 Lucite® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201710266399.1A CN106982516B (zh) | 2017-04-21 | 2017-04-21 | 一种应用于柔性电子的液态金属印刷方法 |
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CN201710266399.1A CN106982516B (zh) | 2017-04-21 | 2017-04-21 | 一种应用于柔性电子的液态金属印刷方法 |
Publications (2)
Publication Number | Publication Date |
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CN106982516A true CN106982516A (zh) | 2017-07-25 |
CN106982516B CN106982516B (zh) | 2019-04-30 |
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Family Applications (1)
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CN201710266399.1A Active CN106982516B (zh) | 2017-04-21 | 2017-04-21 | 一种应用于柔性电子的液态金属印刷方法 |
Country Status (1)
Country | Link |
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CN (1) | CN106982516B (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107887100A (zh) * | 2017-10-31 | 2018-04-06 | 深圳大学 | 一种柔性液态金属电感线圈及其制备方法与应用 |
CN107907146A (zh) * | 2017-10-31 | 2018-04-13 | 深圳大学 | 液态金属电极、接触传感器及手势识别手套的制备方法 |
CN108347828A (zh) * | 2018-01-12 | 2018-07-31 | 深圳大学 | 基于液态金属的导电混合物及其制备方法与应用 |
CN108428511A (zh) * | 2018-03-02 | 2018-08-21 | 华中科技大学 | 一种基于液态金属的柔性电子加工方法 |
CN108594686A (zh) * | 2018-05-28 | 2018-09-28 | 北京梦之墨科技有限公司 | 一种区块链网络控制系统及控制方法 |
CN108882526A (zh) * | 2018-05-31 | 2018-11-23 | 深圳大学 | 一种柔性可回收电路及其制作方法 |
CN109215889A (zh) * | 2018-09-19 | 2019-01-15 | 东南大学 | 一种利用磁场图案化液态金属的方法 |
CN110146200A (zh) * | 2018-02-11 | 2019-08-20 | 中国科学院宁波材料技术与工程研究所 | 液态金属基柔性结构单元的制备方法及应力传感器 |
CN110713166A (zh) * | 2018-07-13 | 2020-01-21 | 浙江清华柔性电子技术研究院 | 微流体器件及其制备方法、微流体系统 |
CN111256885A (zh) * | 2020-03-12 | 2020-06-09 | 中国科学技术大学 | 激光诱导液态金属转印电路、制备方法及柔性压力传感器 |
CN113387322A (zh) * | 2021-04-30 | 2021-09-14 | 中国科学院理化技术研究所 | 一种液态金属均匀微纳米薄膜的制备方法及其应用 |
CN113840471A (zh) * | 2020-06-23 | 2021-12-24 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种制备柔性电子的方法及柔性电子 |
CN114068072A (zh) * | 2021-11-30 | 2022-02-18 | 四川大学 | 一种可完全回收的自修复液态金属柔性电子材料及其制备方法和用途 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106182975A (zh) * | 2016-07-07 | 2016-12-07 | 清华大学 | 一种基于液态金属的人工耳蜗电极及其制备方法 |
-
2017
- 2017-04-21 CN CN201710266399.1A patent/CN106982516B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106182975A (zh) * | 2016-07-07 | 2016-12-07 | 清华大学 | 一种基于液态金属的人工耳蜗电极及其制备方法 |
Non-Patent Citations (2)
Title |
---|
ANDREW FASSLER,CARMEL MAJIDI: "3D structures of liquid-phase GaIn alloy embedded in PMDS with freeze casting", 《ROYAL SOCIETY OF CHEMISTRY》 * |
YONG-LAE PARK ET.AL.: "Hyperelastic pressure sensing with a liquid-embedded elastomer", 《JOURNAL OF MICROMECHANICS AND MICROENGINEERING》 * |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107907146A (zh) * | 2017-10-31 | 2018-04-13 | 深圳大学 | 液态金属电极、接触传感器及手势识别手套的制备方法 |
CN107887100A (zh) * | 2017-10-31 | 2018-04-06 | 深圳大学 | 一种柔性液态金属电感线圈及其制备方法与应用 |
CN108347828A (zh) * | 2018-01-12 | 2018-07-31 | 深圳大学 | 基于液态金属的导电混合物及其制备方法与应用 |
CN110146200A (zh) * | 2018-02-11 | 2019-08-20 | 中国科学院宁波材料技术与工程研究所 | 液态金属基柔性结构单元的制备方法及应力传感器 |
CN110146200B (zh) * | 2018-02-11 | 2021-09-07 | 中国科学院宁波材料技术与工程研究所 | 液态金属基柔性结构单元的制备方法及应力传感器 |
CN108428511A (zh) * | 2018-03-02 | 2018-08-21 | 华中科技大学 | 一种基于液态金属的柔性电子加工方法 |
CN108594686A (zh) * | 2018-05-28 | 2018-09-28 | 北京梦之墨科技有限公司 | 一种区块链网络控制系统及控制方法 |
CN108882526B (zh) * | 2018-05-31 | 2021-02-19 | 深圳大学 | 一种柔性可回收电路及其制作方法 |
CN108882526A (zh) * | 2018-05-31 | 2018-11-23 | 深圳大学 | 一种柔性可回收电路及其制作方法 |
CN110713166A (zh) * | 2018-07-13 | 2020-01-21 | 浙江清华柔性电子技术研究院 | 微流体器件及其制备方法、微流体系统 |
CN110713166B (zh) * | 2018-07-13 | 2020-09-01 | 浙江清华柔性电子技术研究院 | 微流体器件及其制备方法、微流体系统 |
CN109215889A (zh) * | 2018-09-19 | 2019-01-15 | 东南大学 | 一种利用磁场图案化液态金属的方法 |
CN111256885A (zh) * | 2020-03-12 | 2020-06-09 | 中国科学技术大学 | 激光诱导液态金属转印电路、制备方法及柔性压力传感器 |
CN113840471A (zh) * | 2020-06-23 | 2021-12-24 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种制备柔性电子的方法及柔性电子 |
CN113840471B (zh) * | 2020-06-23 | 2023-05-09 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | 一种制备柔性电子的方法及柔性电子 |
CN113387322A (zh) * | 2021-04-30 | 2021-09-14 | 中国科学院理化技术研究所 | 一种液态金属均匀微纳米薄膜的制备方法及其应用 |
CN114068072A (zh) * | 2021-11-30 | 2022-02-18 | 四川大学 | 一种可完全回收的自修复液态金属柔性电子材料及其制备方法和用途 |
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Application publication date: 20170725 Assignee: Zhongke Advanced Zhilian (Hangzhou) Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980021647 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221111 |
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Application publication date: 20170725 Assignee: Foshan Shunde Minfeng Metal Products Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024259 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221130 Application publication date: 20170725 Assignee: Shenzhen Huijin Ruishu Intelligent Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980023727 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221129 |
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Application publication date: 20170725 Assignee: Shenzhen Saite signboard design and production Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024801 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221206 Application publication date: 20170725 Assignee: Shuangyu Logo Design (Shenzhen) Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024843 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221206 Application publication date: 20170725 Assignee: Shenzhen Bangqi Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024743 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221207 Application publication date: 20170725 Assignee: Shenzhen Maiwo Innovation Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024758 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221207 Application publication date: 20170725 Assignee: Shenzhen Orange Product Logo Design Engineering Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024781 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221206 Application publication date: 20170725 Assignee: Shenzhen Sunny Advertising Logo Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024786 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221206 Application publication date: 20170725 Assignee: Shenzhen Huahong Testing Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980024778 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221206 |
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Application publication date: 20170725 Assignee: Shenzhen Jianuo Advertising Enterprise Service Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980026090 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221211 Application publication date: 20170725 Assignee: Shenzhen Mufei Technology Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980025033 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221208 Application publication date: 20170725 Assignee: Prester Fluid Technology (Shenzhen) Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980025514 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221209 Application publication date: 20170725 Assignee: Ruian Design (Shenzhen) Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980025029 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221208 |
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Application publication date: 20170725 Assignee: KINGQUE TECHNOLOGY (SHENZHEN) Co.,Ltd. Assignor: SHENZHEN University Contract record no.: X2022980026566 Denomination of invention: A Liquid Metal Printing Method for Flexible Electronics Granted publication date: 20190430 License type: Common License Record date: 20221212 |