WO2011043580A3 - 플라스틱 전극필름 제조방법 - Google Patents

플라스틱 전극필름 제조방법 Download PDF

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Publication number
WO2011043580A3
WO2011043580A3 PCT/KR2010/006807 KR2010006807W WO2011043580A3 WO 2011043580 A3 WO2011043580 A3 WO 2011043580A3 KR 2010006807 W KR2010006807 W KR 2010006807W WO 2011043580 A3 WO2011043580 A3 WO 2011043580A3
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
film
fabricating
plastic
engraved
Prior art date
Application number
PCT/KR2010/006807
Other languages
English (en)
French (fr)
Other versions
WO2011043580A2 (ko
Inventor
황춘섭
김정식
Original Assignee
주식회사 엔엔피
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엔엔피 filed Critical 주식회사 엔엔피
Publication of WO2011043580A2 publication Critical patent/WO2011043580A2/ko
Publication of WO2011043580A3 publication Critical patent/WO2011043580A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

본 발명은 미세패턴이 형성된 금형을 이용하여 전기가 통하는 플라스틱 전극필름을 제조하는 방법을 개시한다. 본 발명의 기판이 되는 플라스틱 필름은 미세패턴이 형성된 롤러금형으로 음각패턴을 형성하거나 수십미터 길이의 미세패턴이 형성된 평판금형에 액체상태의 플라스틱 필름을 코팅·성형하여 음각패턴을 형성한 후 그 각인부에 도전성 물질을 충전하고, 각인부 외 부분의 도전성 물질을 제거한 후, 다시 내식성과 전기저항을 부여하기 위해 도금 또는 ITO코팅을 하여 전극회로가 필름에 매립된 형태의 플라스틱 전극필름을 제조하는 방법을 제공한다.
PCT/KR2010/006807 2009-10-07 2010-10-05 플라스틱 전극필름 제조방법 WO2011043580A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0095104 2009-10-07
KR1020090095104A KR100957487B1 (ko) 2009-10-07 2009-10-07 플라스틱 전극필름 제조방법

Publications (2)

Publication Number Publication Date
WO2011043580A2 WO2011043580A2 (ko) 2011-04-14
WO2011043580A3 true WO2011043580A3 (ko) 2011-09-09

Family

ID=42281633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/006807 WO2011043580A2 (ko) 2009-10-07 2010-10-05 플라스틱 전극필름 제조방법

Country Status (2)

Country Link
KR (1) KR100957487B1 (ko)
WO (1) WO2011043580A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130037967A (ko) * 2011-10-07 2013-04-17 성낙훈 투명 도전체판 및 이의 제조방법
US20140248423A1 (en) * 2013-03-04 2014-09-04 Uni-Pixel Displays, Inc. Method of roll to roll printing of fine lines and features with an inverse patterning process
KR101605244B1 (ko) * 2014-04-23 2016-03-21 (주)유민에쓰티 누설 감지 장치
KR101892169B1 (ko) * 2016-10-26 2018-08-29 (주)프로템 플렉시블 필름 제조장치 및 그 방법
CN113271720B (zh) * 2020-02-17 2022-08-26 北京梦之墨科技有限公司 一种印刷机及印刷方法
CN112811386A (zh) * 2020-12-30 2021-05-18 哈尔滨工业大学（深圳） 3d微电极的制备方法
WO2023073209A1 (en) * 2021-10-29 2023-05-04 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Stamping surface profile in design layer and using patterned electroplating protection structure for defining electroplating structure on seed layer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04231972A (ja) * 1990-12-28 1992-08-20 Dainippon Printing Co Ltd フィルム電極
JP2006147701A (ja) * 2004-11-17 2006-06-08 Shinko Electric Ind Co Ltd 配線基板の製造方法
KR20090031642A (ko) * 2007-09-19 2009-03-27 이형곤 연마 이방성도전필름과 이를 위한 도전박막, 입자, 쉬트 및제조방법
KR20090076380A (ko) * 2008-01-08 2009-07-13 성낙훈 미세 회로가 형성된 필름 기판 및 그 제조방법
KR20090099435A (ko) * 2008-03-17 2009-09-22 황춘섭 전극 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04231972A (ja) * 1990-12-28 1992-08-20 Dainippon Printing Co Ltd フィルム電極
JP2006147701A (ja) * 2004-11-17 2006-06-08 Shinko Electric Ind Co Ltd 配線基板の製造方法
KR20090031642A (ko) * 2007-09-19 2009-03-27 이형곤 연마 이방성도전필름과 이를 위한 도전박막, 입자, 쉬트 및제조방법
KR20090076380A (ko) * 2008-01-08 2009-07-13 성낙훈 미세 회로가 형성된 필름 기판 및 그 제조방법
KR20090099435A (ko) * 2008-03-17 2009-09-22 황춘섭 전극 제조방법

Also Published As

Publication number Publication date
KR100957487B1 (ko) 2010-05-14
WO2011043580A2 (ko) 2011-04-14

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