CN106978583B - Vacuum coating equipment and method for coating simple substance film - Google Patents

Vacuum coating equipment and method for coating simple substance film Download PDF

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CN106978583B
CN106978583B CN201610027810.5A CN201610027810A CN106978583B CN 106978583 B CN106978583 B CN 106978583B CN 201610027810 A CN201610027810 A CN 201610027810A CN 106978583 B CN106978583 B CN 106978583B
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substrate
plating
film
mask
simple substance
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CN106978583A (en
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于甄
解金库
高建聪
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Zhangjiagang Kangdexin Optronics Material Co Ltd
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Zhangjiagang Kangdexin Optronics Material Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The application provides vacuum coating equipment and a coating method of a simple substance film. This vacuum coating equipment is including the microscope carrier that is used for placing the substrate, and vacuum coating equipment still includes: at least one mask, each mask being provided on a surface of the stage on which the substrate is placed when the plating operation is performed, the mask being for masking a non-plating target area of the substrate and exposing a plating target area of the substrate. By applying the vacuum coating equipment, a protective film with the surface area larger than that of the simple substance film can be formed on the surface of the simple substance film, so that atmosphere can be prevented from entering the simple substance film, and the failure of the simple substance film is avoided.

Description

Vacuum coating equipment and method for coating simple substance film
Technical Field
The application relates to the technical field of materials, in particular to vacuum coating equipment and a coating method of a simple substance film.
Background
The active elementary substance film, especially the active metal elementary substance film such as Ca elementary substance film, Al elementary substance film and the like, is easy to generate chemical reaction after contacting with gas in the air, and other compounds are generated on the surface of the elementary substance film, so that impurities exist in the elementary substance film, and the performance of the elementary substance film is further influenced.
In order to avoid chemical reaction between the manufactured simple substance film and gas in the atmosphere, the manufactured simple substance film is usually placed in an environment of inert gas atmosphere to avoid contact between the simple substance film and the gas in the atmosphere, however, the vacuum box body is still contacted with the atmosphere and chemical reaction occurs in the process of inflation and simple substance film transfer, and a compound exists on the surface of the simple substance film to cause failure of the simple substance film.
The vacuum coating equipment in the prior art cannot directly form a protective layer capable of well protecting an easily oxidized active simple substance film.
Disclosure of Invention
The application aims to provide vacuum coating equipment and a coating method of a simple substance film, so as to solve the problem of film failure caused by the contact of the simple substance film and the outside in the prior art.
In order to achieve the above object, according to one aspect of the present application, there is provided a vacuum plating apparatus including a stage on which a substrate is placed, the vacuum plating apparatus further including at least one mask plate, each of the mask plates being provided on a surface of the stage on which the substrate is placed when a plating operation is performed, the mask plate being configured to mask a non-plating target area of the substrate and expose a plating target area of the substrate.
Further, the stage includes a first through hole for placing the substrate, and the mask includes a second through hole, and a projection of the second through hole on the substrate corresponds to the plating target area.
Further, the mask comprises a pivot, a mask body and a shift lever, one end of the pivot is fixedly connected with one end of the mask body, the other end of the pivot penetrates through the carrying platform and is connected with the shift lever, and the shift lever drives the mask body to rotate around the pivot.
Further, the vacuum coating apparatus includes a plurality of the masks, the plurality of the masks include a plurality of the pivots, and the plurality of the pivots are disposed around a geometric center of the stage.
Further, the included angle formed by the connecting line of any two adjacent pivot shafts and the geometric center is equal.
Further, the vacuum coating equipment further comprises a vacuum chamber, the carrying platform is arranged in the vacuum chamber, the geometric center is provided with a rotating shaft, and the rotating shaft drives the carrying platform to rotate.
Further, the vacuum coating equipment further comprises a first driving unit, the first driving unit is arranged at the top of the vacuum chamber and is positioned on one side, far away from the substrate, of the carrying platform, and the first driving unit comprises a pushing rod which pushes the shifting rod to rotate.
The vacuum coating equipment further comprises a second driving unit, wherein the second driving unit is arranged at the top of the vacuum chamber and is positioned on one side, away from the substrate, of the carrying platform, and the second driving unit is used for driving the carrying platform to rotate.
Further, the first through hole and the second through hole are both circular through holes, and the diameter of the first through hole is larger than that of the second through hole.
In order to achieve the above object, according to another aspect of the present application, there is provided a plating method of a thin film, which is performed using the above vacuum plating apparatus.
Further, the plating method comprises: step S1, transferring the mask plate to the lower part of the substrate to make the mask plate cover the non-plating target area of the substrate and expose the plating target area of the substrate; step S2, plating a simple substance film, and forming the simple substance film on the plating target area; step S3, moving the mask plate to make the mask plate not block the substrate; step S4, plating a protective film on the surface of the substrate, wherein the protective film covers the simple substance film, and the surface area of the protective film is larger than that of the simple substance film.
Further, the thickness of the protective film is within
Figure GDA0002388892920000021
In the meantime.
By applying the technical scheme, the vacuum coating equipment is provided with the mask, the mask is adjusted to cover the non-plating target area of the substrate and expose the plating target area of the substrate, so that the coating material can be plated on the plating target area of the substrate, the mask is adjusted to be not shielded by the mask completely, then the protective layer is plated, the protective layer covers the plating target area and the non-plating target area of the substrate, the area of the protective layer is larger than that of the simple substance film, the simple substance film is completely covered, the simple substance film is prevented from contacting with the external atmosphere, and the performance of the simple substance film is ensured.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:
fig. 1 is a schematic view showing a structure of a vacuum plating apparatus according to an exemplary embodiment of the present application;
FIG. 2 is a schematic structural view of a vacuum deposition apparatus according to an embodiment;
FIG. 3 is a schematic view showing a structure of a vacuum plating apparatus;
FIG. 4 is a schematic structural diagram of a substrate plated with a Ca elemental film according to an embodiment;
FIG. 5 shows SiO deposition on the Ca-deposited elemental thin film of FIG. 22A schematic structural diagram after protection of the film;
FIG. 6 is a schematic view showing the surfaces of the first and second films just after they are placed in the atmosphere;
FIG. 7 shows a schematic surface view after 30min of placing the first and second films in the atmosphere; and
fig. 8 shows a schematic surface view after 60min of placing the first and second films in the atmosphere.
Wherein the figures include the following reference numerals:
1. a stage; 2. a mask plate; 3. a vacuum chamber; 4. a first drive unit; 5. a second driving unit; 10. a first through hole; 11. a rotating shaft; 20. a second through hole; 21. a pivot; 22. a mask body; 23. a deflector rod; 41. a push rod; 01. a first film; 02. a second film; 03. a third film; 100. a Ca simple substance film; 200. SiO 22And (5) protecting the film.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
As described in the background art, the vacuum coating apparatus in the prior art cannot directly form a protective layer capable of effectively protecting an elemental film, and in order to solve the above technical problems, the present application provides a vacuum coating apparatus and a method for coating an elemental film.
In an exemplary embodiment of the present application, as shown in fig. 1, a vacuum coating apparatus is provided, which includes a stage 1 for placing a substrate, and the vacuum coating apparatus further includes: at least one mask 2, each of the masks 2 is disposed on the surface of the stage 1 on which the substrate is placed when performing a plating operation, and the mask is used to mask a non-plating target area of the substrate and expose a plating target area of the substrate, specifically, one mask may mask a non-plating area of one substrate and expose a plating area, or a combination of a plurality of masks may mask a non-plating area of one substrate and expose a plating area.
The vacuum coating equipment is provided with the mask 2, the mask 2 is adjusted to cover a non-coating target area of the substrate and expose a coating target area of the substrate, so that the coating material can be coated on the coating target area of the substrate, the mask 2 is adjusted to be not covered by the substrate, then the coating of the protective layer is carried out, the protective layer covers the coating target area and the non-coating target area of the substrate, the area of the protective layer is larger than that of the simple substance film, and the simple substance film is completely covered, so that the simple substance film is prevented from contacting with the external atmosphere, and the performance of the simple substance film is ensured.
In a preferred embodiment of the present application, as shown in fig. 1, the carrier 1 includes a first through hole 10 for placing a substrate, the first through hole 10 may be one or multiple, the mask 2 includes a second through hole 20, and a projection of the second through hole 20 on the substrate corresponds to the plating target area, so that only a position of one mask needs to be adjusted, the mask 2 can mask a non-plating target area of one substrate and expose the plating target area of the substrate, and the plating operation is more efficient.
In order to control the rotation of the mask 2 more conveniently and improve the efficiency of the vacuum deposition apparatus, as shown in fig. 1 and fig. 2, the mask 2 preferably includes a pivot 21, a mask body 22 and a shift lever 23, one end of the pivot 21 is fixedly connected to one end of the mask body 22, the other end of the pivot 21 passes through the stage 1 and is connected to the shift lever 23, and the shift lever 23 drives the mask body 22 to rotate around the pivot 21.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the vacuum deposition apparatus includes a plurality of masks 2, the plurality of masks 2 correspondingly includes a plurality of pivots 21, and the plurality of pivots 21 are disposed around a geometric center of the stage 1. Preferably, when the vacuum coating apparatus includes a plurality of masks 2, the stage 1 includes a plurality of first through holes 10, and the number of the first through holes 10 is the same as the number of the masks 2.
In order to facilitate the adjustment of the position of the mask 2, it is preferable that any two adjacent pivots 21 form an equal angle with a line connecting the geometric centers of the stages 1.
In another embodiment of the present application, as shown in fig. 2, the vacuum coating apparatus further includes a vacuum chamber 3, the stage 1 is disposed in the vacuum chamber 3, the geometric center is provided with a rotation shaft 11, and the rotation shaft 11 drives the stage 1 to rotate. The carrying platform 1 is arranged in the vacuum chamber 3, so that the substrate is in a vacuum environment, the simple substance film plated on the surface of the substrate is not easily influenced by the outside atmosphere, and the performance of the simple substance film is ensured.
In another embodiment of the present application, as shown in fig. 3, the vacuum coating apparatus further includes a first driving unit 4, the first driving unit 4 is disposed on the top of the vacuum chamber 3 and located on a side of the carrier 1 away from the substrate, the first driving unit includes a pushing rod 41, the pushing rod 41 pushes the shifting rod 23 to a specific position, that is, the pushing rod 41 rotates through pushing the shifting rod 23, so as to rotate the mask 2 to the specific position. Thus, the rotation of the mask 2 can be controlled by controlling the first driving unit 4, so that the worker can adjust the position of the mask 2 more conveniently.
Preferably, the first driving unit 4 in this application is composed of an air cylinder and a pushing rod 41, and the air cylinder pushes the pushing rod 41 to move, so that the mask body 22 rotates around the pivot 21.
In order to control the rotation of the stage 1 more conveniently, as shown in fig. 3, the vacuum coating apparatus of the present application preferably further includes a second driving unit 5, wherein the second driving unit 5 is disposed on the top of the vacuum chamber 3 and is located on a side of the stage 1 away from the substrate, and the second driving unit 5 is connected to a rotation axis 11 at the geometric center of the stage 1 for driving the stage 1 to rotate. Preferably, the second driving unit 5 is composed of a motor, a conveyor belt and a magnetic fluid, the motor drives the conveyor belt to move, the conveyor belt drives the magnetic fluid to rotate, and the magnetic fluid drives the rotating shaft 11 to rotate.
In another embodiment of the present application, the first through hole 10 and the second through hole 20 are both circular through holes, and the diameter of the first through hole 10 is greater than the diameter of the second through hole 20.
In another exemplary embodiment of the present application, a method for plating a thin film is provided, which is performed by using a vacuum plating apparatus.
The plating method is implemented by adopting the vacuum plating equipment, and the protective film which can completely cover the simple substance film can be plated by adjusting the position of the mask in the vacuum plating equipment, so that the simple substance film is prevented from contacting with the external atmosphere, and the good performance of the simple substance film is ensured.
In another embodiment of the present application, the plating method includes: step S1, transferring the mask plate to the lower part of the substrate to make the mask plate cover the non-plating target area of the substrate and expose the plating target area of the substrate; step S2, plating a simple substance film, and forming the simple substance film in the plating target area; step S3, moving the mask to make the mask not block the substrate; and step S4, plating a protective film on the surface of the substrate, wherein the surface area of the plated protective film is larger than that of the simple substance film, and the simple substance film is completely covered, so that the simple substance film is prevented from contacting with the external atmosphere, and the good performance of the simple substance film is further ensured.
In order to further ensure that the protective film can effectively protect the simple substance film, the thickness of the protective film is within
Figure GDA0002388892920000051
In the meantime.
The protective film in the present application may be any oxidation resistant film, preferably TiO is used2Film, ZnO film, Nb2O5Film, Ta2O5Film, TiN film, Al film, Ti film, ZrO film, Al film2O3Film or SiO2And (3) a membrane. However, the protective film is not limited to the above-described protective film, and a person skilled in the art can select an appropriate protective film according to the particular situation.
In another embodiment of the present application, between step S3 and step S4, the plating method further includes: and replacing the simple substance film material in the evaporation source in the vacuum coating equipment with the protective film material.
In order to make the technical solutions of the present application more clearly understood by those skilled in the art, the technical solutions of the present application will be described below with reference to examples and comparative examples.
Examples
The vacuum coating equipment shown in FIG. 3 is adopted for coating the film, and the specific coating process is as follows:
first, four substrates (not shown) are placed at the four first through holes of the stage 1 of the vacuum coating apparatus, and the positions of the substrates correspond to the positions of the mask 2 one by one. Then, each mask 2 is turned to the lower side of each substrate, and the plating target area of the substrate is exposed by the presence of the second through hole.
Next, a Ca simple substance film is plated, and a Ca simple substance film 100 is formed on a plating target region of the substrate corresponding to the second through hole of the mask, as shown in fig. 4.
Again, the mask 2 is moved so that the mask 2 does not block the substrate at all.
Finally, SiO is plated on the surface of the substrate2 Protective film 200, forming the final film, referred to as first film 01, SiO, FIG. 52The protective film 200 is covered with the Ca simple substance film 100, SiO2The surface area of the protective film 200 is larger than the surface area of the elemental Ca film 100.
Comparative example 1
The vacuum coating equipment without mask in the prior art is adopted to carry out the plating of Ca simple substance film and the SiO is plated on the surface2And a protective film forming a final film, referred to as a second film 02. The surface area of the protective film in the film is the same as that of the Ca simple substance film.
Comparative example 2
And (3) plating a Ca elementary substance film by using vacuum plating equipment without a mask in the prior art to form a third film 03.
The films formed by plating in the above examples and comparative examples were placed in the atmosphere, and the oxidation of the Ca simple substance film was observed with naked eyes.
As shown in fig. 6, it can be seen from the figure (in the figure, the middle dark part is the Ca simple substance film, and the protective film covers the Ca simple substance film), after the prepared film is placed in the atmosphere, the Ca simple substance film of the second film 02 and the third film 03 starts to change from opaque to translucent, that is, the second film 02 and the third film 03 start to be oxidized just after being placed in the atmosphere.
As shown in fig. 7, after 30min, it can be seen that the Ca simple substance films in the first film 01, the second film 02 and the third film 03 are oxidized, but all the Ca simple substance films in the third film 03 are oxidized, most of the Ca simple substance films in the second film 02 are oxidized, and only a small part of the Ca simple substance films in the first film 01 are oxidized.
As shown in fig. 8, after 60min, it can be seen that most of the Ca simple substance thin film in the second thin film 02 was almost completely oxidized, and only about half of the Ca simple substance thin film in the first thin film 01 was oxidized.
Therefore, the film obtained by the vacuum coating equipment and the coating method in the application can be coated, and the protective film can better protect the simple substance film and can relieve the oxidation speed of the simple substance film.
From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:
1) the vacuum coating equipment comprises a mask plate, the position of the mask plate is adjusted, the mask plate covers a non-plating target area of a substrate, the plating target area of the substrate is exposed, so that a coating material can be plated on the plating target area of the substrate, the position of the mask plate is adjusted to enable the mask plate not to shield the substrate completely, then the plating of a protective layer is carried out, the protective layer covers the plating target area and the non-plating target area of the substrate, the area of the protective layer is larger than that of a simple substance film, the simple substance film is completely covered, the simple substance film is prevented from being in contact with the external atmosphere, and the performance of the simple substance film is guaranteed.
2) The coating method is implemented by adopting the vacuum coating equipment, and the protective film capable of completely covering the simple substance film can be coated by adjusting the position of the mask in the vacuum coating equipment, so that the simple substance film is prevented from contacting with the external atmosphere, and the good performance of the simple substance film is ensured.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A vacuum coating apparatus comprising a stage (1) for placing a substrate, characterized in that the vacuum coating apparatus further comprises:
a plurality of masks (2), each mask (2) being provided on the surface of the stage (1) on which the substrate is placed when performing plating operation, the masks (2) being for masking a non-plating target area of the substrate and exposing a plating target area of the substrate,
the mask (2) comprises a pivot (21), a mask body (22) and a shifting lever (23), one end of the pivot (21) is fixedly connected with one end of the mask body (22), the other end of the pivot (21) penetrates through the carrier (1) to be connected with the shifting lever (23), the shifting lever (23) drives the mask body (22) to rotate by taking the pivot (21) as a center, the plurality of masks (2) correspondingly comprise the plurality of pivots (21), and the plurality of pivots (21) are arranged around the geometric center of the carrier (1).
2. The vacuum plating apparatus according to claim 1, wherein the stage (1) includes a first through hole (10) for placing the substrate, and the mask (2) includes a second through hole (20), and a projection of the second through hole (20) on the substrate corresponds to the plating target area.
3. The vacuum plating apparatus according to claim 2, wherein any two adjacent pivot shafts (21) form an equal angle with a line connecting the geometric centers.
4. Vacuum coating apparatus according to claim 2, characterized in that the vacuum coating apparatus further comprises a vacuum chamber (3), the carrier (1) is arranged in the vacuum chamber (3), the geometric center is provided with a rotation axis (11), and the rotation axis (11) drives the carrier (1) to rotate.
5. The vacuum coating apparatus according to claim 4, further comprising a first driving unit (4), wherein the first driving unit (4) is arranged on the top of the vacuum chamber (3) and is located on the side of the carrying platform (1) far away from the substrate, and the first driving unit (4) comprises a pushing rod (41), and the pushing rod (41) pushes the shifting lever (23) to rotate.
6. The vacuum coating apparatus according to claim 5, further comprising a second driving unit (5), wherein the second driving unit (5) is arranged on the top of the vacuum chamber (3) and is located on the side of the stage (1) away from the substrate, and the second driving unit (5) is used for driving the stage (1) to rotate.
7. The vacuum plating apparatus according to any one of claims 2 to 6, wherein the first through-hole (10) and the second through-hole (20) are both circular through-holes, and the diameter of the first through-hole (10) is larger than the diameter of the second through-hole (20).
8. A method for plating a thin film, characterized in that the plating method is carried out using the vacuum plating apparatus according to any one of claims 1 to 7.
9. The plating method according to claim 8, comprising:
step S1, transferring a mask plate below the substrate to make the mask plate cover the non-plating target area of the substrate and expose the plating target area of the substrate;
step S2, plating an elemental film, and forming the elemental film in the plating target area;
step S3, moving the mask plate to make the mask plate not block the substrate; and
step S4, plating a protective film on the surface of the substrate, wherein the protective film covers the simple substance film, and the surface area of the protective film is larger than that of the simple substance film.
10. The plating method according to claim 9, wherein the thickness of the protective film is within the range
Figure FDA0002388892910000021
In the meantime.
CN201610027810.5A 2016-01-15 2016-01-15 Vacuum coating equipment and method for coating simple substance film Active CN106978583B (en)

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CN111809145B (en) * 2020-06-29 2023-07-18 昆山国显光电有限公司 Vapor deposition device

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Publication number Priority date Publication date Assignee Title
JP2003073823A (en) * 2001-08-28 2003-03-12 Nec Kansai Ltd Method and apparatus for sputtering
CN1487777A (en) * 2002-08-30 2004-04-07 �����ɷ� Method for forming protection film coating electronic elements and electronic instrument with protection film
JP2005002388A (en) * 2003-06-11 2005-01-06 Jeol Ltd Vacuum deposition apparatus
CN2915882Y (en) * 2006-05-30 2007-06-27 南昌大学 Rotary mask device for vacuum coating
CN102119237A (en) * 2008-09-19 2011-07-06 株式会社爱发科 Method for forming protective film on plasma display panel bases, and device for forming said protective film

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003073823A (en) * 2001-08-28 2003-03-12 Nec Kansai Ltd Method and apparatus for sputtering
CN1487777A (en) * 2002-08-30 2004-04-07 �����ɷ� Method for forming protection film coating electronic elements and electronic instrument with protection film
JP2005002388A (en) * 2003-06-11 2005-01-06 Jeol Ltd Vacuum deposition apparatus
CN2915882Y (en) * 2006-05-30 2007-06-27 南昌大学 Rotary mask device for vacuum coating
CN102119237A (en) * 2008-09-19 2011-07-06 株式会社爱发科 Method for forming protective film on plasma display panel bases, and device for forming said protective film

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