WO2024018742A1

WO2024018742A1 - Vacuum chamber and film formation apparatus

Info

Publication number: WO2024018742A1
Application number: PCT/JP2023/018595
Authority: WO
Inventors: 瑞穂白倉
Original assignee: キヤノントッキ株式会社
Priority date: 2022-07-21
Filing date: 2023-05-18
Publication date: 2024-01-25
Also published as: JP2024013863A

Abstract

This vacuum chamber is characterized by comprising: a chamber of which the inside can be decompressed; a reinforcement member 125 provided along the wall surface of the chamber; a fixture tool 127 for attaching the reinforcement member 125 to the wall surface; and a dust scattering prevention member 129 provided to the boundary between the chamber and the reinforcement member 125.

Description

Vacuum chamber and film forming equipment

The present invention relates to a vacuum chamber and a film forming apparatus.

Among film-forming apparatuses, there are known apparatuses that include a plurality of chambers that are configured to be able to reduce the internal pressure. For example, a manufacturing apparatus for an electronic device such as an organic EL display device includes a heating chamber where a substrate is pre-treated, a film-forming chamber where a film-forming process is performed on the substrate, and the like.

Since the above-mentioned chamber is used while being switched between a vacuum state and an atmospheric pressure state, the chamber repeatedly deforms due to the pressure difference between the vacuum state and the atmospheric pressure state. Therefore, reinforcing members such as ribs are sometimes provided on the wall surface of the chamber for the purpose of improving the strength of the chamber. Patent Document 1 discloses a configuration in which a reinforcing member is attached to the outer wall surface of the chamber with bolts for the purpose of improving the strength of the chamber whose interior can be switched between a vacuum state and an atmospheric pressure state.

International Publication No. 2009/078351

However, even with a configuration in which a reinforcing member is provided in the chamber, it is extremely difficult to completely suppress deformation of the chamber during operation of the film forming apparatus, and the chamber and the reinforcing member deform to some extent. At this time, the reinforcing member and the chamber rub against each other and both members are scraped, which may generate fine shavings. If the shavings are scattered by wind, etc., the shavings may enter the chamber and adhere to the substrate or the like in the chamber, causing problems such as manufacturing defects.

Therefore, an object of the present invention is to prevent the scattering of shavings in a vacuum chamber configured to be able to reduce the pressure inside and in which a reinforcing member is provided on the wall of the chamber.

The vacuum chamber of the present invention is
A chamber whose interior can be decompressed;
a reinforcing member provided along the wall surface of the chamber;
a fixture for attaching the reinforcing member to the wall surface;
A vacuum chamber comprising the reinforcing member and a dust scattering prevention member provided at a boundary between the chamber.

According to the present invention, it is possible to prevent shavings from scattering in a vacuum chamber that is configured to be able to reduce the pressure inside and in which a reinforcing member is provided on the wall surface of the chamber.

FIG. 1 is a schematic diagram showing a part of a film forming apparatus according to an example. FIG. 3 is a schematic diagram of a heating chamber according to an example. FIG. 7 is a schematic cross-sectional view showing the attachment structure of reinforcing members according to a comparative example and an example. It is a typical sectional view showing the attachment composition of the reinforcing member concerning a modification. FIG. 2 is a schematic configuration diagram of a film forming chamber according to an example. FIG. 2 is an explanatory diagram of an organic EL display device according to an example.

EMBODIMENT OF THE INVENTION Below, with reference to drawings, the form for carrying out this invention is illustratively described in detail based on an Example. However, the dimensions, materials, shapes, and relative arrangement of the components described in this embodiment should be changed as appropriate depending on the configuration of the device to which the invention is applied and various conditions. That is, the scope of the present invention is not intended to be limited to the following embodiments.

The present invention relates to a vacuum chamber configured to be able to reduce the pressure inside, and a film forming apparatus equipped with the vacuum chamber. The present invention can be applied, for example, to an apparatus that performs film formation by depositing various materials on the surface of a substrate. Any material such as glass, a film of a polymeric material, a silicon wafer, or metal can be selected as the material of the substrate, and the substrate may be, for example, a substrate in which a film of polyimide or the like is deposited on a glass substrate. . Furthermore, any material such as an organic material or a metallic material (metal, metal oxide, etc.) may be selected as the vapor deposition material. Specifically, the technology of the present invention is applicable to manufacturing equipment for organic electronic devices (eg, organic light emitting elements, thin film solar cells), optical members, and the like. Hereinafter, a case where the present invention is applied to an electronic device manufacturing apparatus will be described as an example, but the present invention is not limited to this and can be applied to various vacuum chambers and film forming apparatuses.

(Example)
<Configuration of film forming apparatus>
FIG. 1 is a schematic diagram schematically showing a partial configuration of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 includes a storage chamber 11 in which a substrate 3 to be film-formed is accommodated, a heating chamber (preparation chamber) 12 for performing heat treatment on the substrate 3, and a film-forming process on the surface of the substrate 3 to be processed. A film forming chamber 13 is provided. The heating chamber 12 and the film forming chamber 13 are vacuum chambers configured to be able to reduce the pressure inside.
The substrate 3 is carried integrally with the substrate carrier 5 from the storage chamber 11 to the heating chamber 12 by a transfer means such as a transfer robot while being held by the substrate carrier 5 so that the surface to be processed of the substrate 3 faces vertically. The film is transported from the heating chamber 12 to the film forming chamber 13.

A plurality of unprocessed substrates 3 are stored in the storage chamber 11 while being held by the substrate carrier 5. The substrate carrier 5 is a mask-integrated carrier that holds the substrate 3 with the surface to be processed of the substrate 3 exposed. The substrate carrier 5 may be configured to be able to hold a plurality of substrates 3, or may be configured to be able to hold only one substrate.

The heating chamber 12 is equipped with heating means such as a heater, and heat treatment is performed for the purpose of increasing the adhesion of the thin film to the substrate 3 prior to the film forming process. Further, the heating chamber 12 is provided with an exhaust mechanism and configured to be able to adjust the pressure within the chamber. Since the inside of the storage chamber 11 is at atmospheric pressure, when the substrate 3 is transferred from the storage chamber 11 to the heating chamber 12 , the inside of the heating chamber 12 is brought to the atmospheric pressure according to the storage chamber 11 .

In the film forming chamber (evaporation device) 13, the evaporation material stored in the evaporation source is heated by the heater, evaporated, and deposited onto the substrate. The substrate 3 transported from the heating chamber 12 to the film forming chamber 13 is subjected to a film forming process, and then is carried out from the film forming chamber 13. The film forming process is performed with the inside of the film forming chamber 13 in a vacuum state, so when the substrate 3 is transferred from the heating chamber 12 to the film forming chamber 13, the insides of both chambers are brought into a vacuum state in advance. Note that a film forming apparatus is generally configured to have a plurality of film forming chambers so that thin films can be formed using different materials.

As described above, when the film forming apparatus 1 is in operation, the storage chamber 11 is basically at atmospheric pressure and the film forming chamber 13 is in a vacuum state. On the other hand, the heating chamber 12 is set to an atmospheric pressure state when the substrate 3 is carried in from the storage chamber 11, and is set to a vacuum state when the substrate 3 is carried out to the film forming chamber 13. As described above, since the heating chamber 12 is frequently put into an atmospheric pressure state and a vacuum state, loads due to changes in the internal pressure state act on the heating chamber 12 more frequently than other chambers.

In this embodiment, the configuration of an electronic device manufacturing apparatus has been described with reference to FIG. , the arrangement of these devices and chambers may be different. For example, the electronic device manufacturing apparatus may be a cluster type instead of an inline type. Furthermore, although the film forming chamber of the present invention is configured to form a thin film (material film) with a desired pattern by vacuum evaporation, the film forming chamber may also be configured to perform the film forming process using a sputtering device or a CVD (Chemical Vapor Deposition) device. .

<Configuration of heating chamber>
The detailed configuration of the heating chamber 12 according to this embodiment will be described with reference to FIGS. 2(a) and 2(b). FIG. 2(a) is a schematic diagram showing the appearance of the heating chamber 12 according to this embodiment, and shows a state in which the upper lid portion 123 is closed. FIG. 2(b) is a schematic diagram showing the appearance of the heating chamber 12 according to this embodiment, and shows a state in which the upper lid portion 123 is open.

The heating chamber 12 includes a main body (chamber main body) 121, an upper lid 123 that can be opened and closed with respect to the main body 121, and a rib member 125 provided along the upper surface of the upper lid 123. That is, the heating chamber 12 has a structure in which a rib member 125, which is a reinforcing member, is provided in a chamber formed by a main body part 121 and an upper lid part 123. Further, a gate valve 31 is provided between the heating chamber 12 and the storage chamber 11 and between the heating chamber 12 and the film forming chamber 13 to connect the heating chamber 12 and other chambers. Furthermore, the heating chamber 12 is supported from below by a base 33.

The gate valve 31 is composed of a disk (valve body) and a body (valve body). The gate valve 31 is provided around the communication port 121a of the main body portion 121, and opens and closes a passage through which the substrate 3 passes by movement of the disk. With the passage opened, the substrate 3 is carried in and out of the main body portion 121 through the communication port (entrance/exit) 121a of the heating chamber 12 by the transport means. The heating chamber 12 is configured to be switchable between a vacuum state and an atmospheric pressure state by adjusting the pressure inside the chamber with an exhaust mechanism (not shown) while the passage is closed.

The main body portion 121 has an opening 121b on the upper side, and an operator can insert his/her hand through the opening 121b to perform maintenance on the inside of the heating chamber 12, if necessary. Further, the upper lid part 123 is provided to be openable and closable with respect to the main body part 121, and the opening part 121b is closed by the upper lid part 123 when the substrate 3 is heated. When the upper lid part 123 is closed, the O-ring provided so as to surround the opening part 121b is crushed, and the airtightness of the heating chamber 12 is maintained. In this embodiment, the upper lid portion 123 is made of a relatively lightweight aluminum alloy in consideration of operability during opening and closing.

As mentioned above, since the heating chamber 12 is repeatedly switched between the atmospheric pressure state and the vacuum state, the upper lid portion 123 deforms due to changes in the internal pressure state. Therefore, a rib member 125 is provided in the heating chamber 12 as a reinforcing member to improve the strength of the upper lid portion 123. The rib member 125 is provided along a mounting surface 123a that corresponds to the upper surface of the upper lid part 123 when the upper lid part 123 is closed, and is located outside the heating chamber 12. When viewed from a direction perpendicular to the mounting surface 123a of the upper lid part 123, two rib members 125 extend vertically and two horizontally from one end of the upper lid part 123 to the other end.

The rib member 125 of this embodiment is made of stainless steel such as SUS in consideration of strength. In this way, when the upper lid part 123 and the rib member 125 are formed of different materials, it is difficult to connect the two members by welding. Therefore, in this embodiment, a plurality of bolts 127 are provided as fixtures for attaching the rib member 125 to the upper lid portion 123. The bolts 127 are inserted through the rib member 125 and the upper lid part 123 to attach the rib member 125 to the upper lid part 123. Note that the fitting for attaching the rib member 125 to the upper lid portion 123 is not limited to the above-mentioned screw parts, and various fittings can be used.

The upper lid part 123 is opened and closed with respect to the main body part 121 by rotating around a rotation axis extending parallel to the mounting surface 123a. In this embodiment, the upper lid part 123 is opened and closed by a cylinder 35 having a main body part 35a and a movable part 35b. The cylinder 35 is a cylinder mechanism whose stroke changes and expands and contracts as the movable part 35b moves straight ahead with respect to the main body part 35a, and the movable part 35b moves straight ahead in a substantially vertical direction.

The rib member 125 has an extension portion 125a extending outward from the upper lid portion 123 in a direction orthogonal to the rotational axis of the upper lid portion 123 when viewed from a direction perpendicular to the mounting surface 123a. The extension portion 125a is connected to the movable portion 35b, and as the movable portion 35b of the cylinder 35 moves, the upper lid portion 123 and the rib member 125 rotate integrally. With such a configuration, the reinforcing member also functions as a component of the opening/closing mechanism of the upper lid portion 123. Furthermore, since the rib member 125 serves as an opening/closing mechanism for the upper lid part 123, it is made of a material with higher strength than the upper lid part 123 so that the extension part 125a does not deform. Note that, in order to improve worker safety, a stopper such as a support may be further provided to prevent the upper lid portion 123 from closing unintentionally.

<Rib member mounting configuration>
With reference to FIGS. 3(a) and 3(b), details of the attachment structure of the rib member 125 to the upper lid portion 123 will be described. FIG. 3(a) is a schematic cross-sectional view showing the mounting structure of the rib member 125 of the comparative example, and FIG. 3(b) is a schematic cross-sectional view showing the mounting structure of the rib member 125 of the present example. .

As described above, in the heating chamber 12, since the pressure state inside the chamber changes repeatedly, the entire chamber including the upper lid portion 123 repeatedly deforms. At this time, in a configuration in which the rib member 125 and the upper lid part 123 are in direct contact, as in the comparative example shown in FIG. As a result of the scraping, fine granular scraping powder 51 may be generated. If the shavings 51 enter the heating chamber 12 when the upper lid portion 123 is opened and closed, problems such as the shavings 51 adhering to the substrate and production defects may occur. Therefore, in order to prevent the generation and scattering of the shavings 51, the inventors of the present invention came up with the idea of providing a dust scattering prevention member at the boundary between the rib member 125 and the upper lid part 123.

As shown in FIG. 3(b), in this embodiment, grease 129 is applied as a lubricant between the upper lid portion 123 and the rib member 125. By interposing the grease 129 between the upper lid part 123 and the rib member 125, the coefficient of friction between the upper lid part 123 and the rib member 125 is reduced, and the generation of shavings 51 is suppressed when both members come into sliding contact. Can be done. Further, even if the shavings 51 are generated, the shavings 51 are captured in the grease 129, so that the shavings 51 can be prevented from scattering to the outside.

As described above, according to this embodiment, even if a reinforcing member such as a rib member is provided on the wall surface of the chamber, generation of scraped powder can be suppressed and scattering can be prevented. Furthermore, it is possible to suppress the occurrence of problems such as manufacturing defects in the substrate and contamination of the device due to the scraped powder.

(Modified example)
Next, a modification of the present invention will be described with reference to FIGS. 4(a) and 4(b). FIG. 4(a) is a schematic cross-sectional view showing the mounting configuration of the rib member 125 according to the first modification. Modification 1 has a configuration in which a tape member 131 is further added as a dust scattering prevention member to the above-described embodiment. The tape member 131 is provided so as to cover the entire boundary between the rib member 125 and the upper lid part 123. With this configuration, it is possible to prevent the shavings 51 and the grease 129 itself from scattering outside the grease 129. That is, the dust scattering prevention member is not limited to one type, and a combination of multiple types may be provided in the vacuum chamber.

FIG. 4(b) is a schematic cross-sectional view showing the mounting configuration of the rib member 125 according to the second modification. Modification 2 has a configuration in which a liquid gasket 133 is provided in place of the grease 129 as a dust scattering prevention member in the above-described embodiment. The liquid gasket 133 is a silicone sealant provided so as to cover the entire boundary between the rib member 125 and the upper lid part 123. In the second modification, since there is no lubricant or the like interposed between the rib member 125 and the upper lid portion 123, the generation of scraped powder 51 is not suppressed. However, since the entire boundary portion is covered by the liquid gasket 133, the shavings 51 are trapped between the liquid gasket 133, the rib member 125, and the upper lid portion 123 without scattering to the outside. Furthermore, according to the second modification, scattering of the scraped powder 51 can be prevented without interposing a lubricant between the rib member 125 and the upper lid part 123.

Note that the configuration of the present invention is not limited to the above-described configuration, and various changes can be made without losing the sameness as the invention embodied in the above-described embodiments. For example, the vacuum chamber may have a structure in which only the tape member 131 is provided without the grease 129, or a structure in which the liquid gasket 133 is provided after applying the grease 129.

Further, although the above-described embodiments have a structure in which a reinforcing member is provided on the surface of the upper lid portion of the chamber, the present invention may also be applied to a structure in which a reinforcing member is provided on the outer wall surface or inner wall surface of the main body portion of the chamber. good. Further, in the above-described embodiments, an example in which the present invention is applied to a heating chamber has been described, but the present invention can also be applied to other vacuum chambers that constitute a film forming apparatus. For example, since the internal pressure state of a film forming chamber changes due to repeated operation and stop of the film forming apparatus, scattering of shavings can be prevented by applying the present invention to the film forming chamber.

<Film forming chamber>
With reference to FIG. 5, the film forming process in the film forming chamber 13 will be described in more detail. In the film forming chamber 13, an evaporation source 7 is provided as a film forming source. The substrate 3 held by the substrate carrier 5 is positioned and supported within the film forming chamber 13 so that the surface to be processed faces downward. As a result, a film is formed on the substrate 3 held by the substrate carrier 5.

In this example, film formation (vapor deposition) is performed by vacuum evaporation. Specifically, the film-forming material is evaporated or sublimated from the evaporation source 7, and the film-forming material is vapor-deposited onto the substrate 3 to form a thin film on the substrate 3. Since the evaporation source 7 is a known technology, detailed explanation thereof will be omitted. For example, the evaporation source 7 can be configured with a container such as a crucible that houses the film forming material, a heating device that heats the container, and the like. Note that the film forming source is not limited to the evaporation source 7, and may be a sputtering cathode for forming a film by sputtering.

<Method for manufacturing electronic devices>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus according to this embodiment will be described. Hereinafter, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

First, the organic EL display device to be manufactured will be explained. FIG. 6(a) shows an overall view of the organic EL display device 700, and FIG. 6(b) shows a cross-sectional structure of one pixel.

As shown in FIG. 6(a), in the display area 701 of the organic EL display device 700, a plurality of pixels 702 each including a plurality of light emitting elements are arranged in a matrix. Although details will be explained later, each light emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel herein refers to the smallest unit that can display a desired color in the display area 701. In the case of the organic EL display device according to this embodiment, a pixel 702 is configured by a combination of a first light emitting element 702R, a second light emitting element 702G, and a third light emitting element 702B that emit light different from each other. The pixel 702 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element. There are no restrictions.

FIG. 6(b) is a schematic partial cross-sectional view taken along line BB in FIG. 6(a). The pixel 702 consists of a plurality of light emitting elements, and each light emitting element has a first electrode (anode) 704, a hole transport layer 705, one of the

light emitting layers

706R, 706G, and 706B, and an electron transport layer on a substrate 703. It has a layer 707 and a second electrode (cathode) 708. Among these, the hole transport layer 705, the

light emitting layers

706R, 706G, and 706B, and the electron transport layer 707 correspond to organic layers. Further, in this embodiment, the light-emitting layer 706R is an organic EL layer that emits red, the light-emitting layer 706G is an organic EL layer that emits green, and the light-emitting layer 706B is an organic EL layer that emits blue. The light-emitting

layers

706R, 706G, and 706B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue, respectively.

Furthermore, the first electrode 704 is formed separately for each light emitting element. The hole transport layer 705, the electron transport layer 707, and the second electrode 708 may be formed in common for the plurality of

light emitting elements

702R, 702G, and 702B, or may be formed for each light emitting element. Note that an insulating layer 709 is provided between the first electrodes 704 in order to prevent the first electrodes 704 and the second electrodes 708 from shorting due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 710 is provided to protect the organic EL element from moisture and oxygen.

Although the hole transport layer 705 and electron transport layer 707 are shown as one layer in FIG. 6(b), depending on the structure of the organic EL display element, they may be formed as multiple layers including a hole blocking layer and an electron blocking layer. may be formed. Further, between the first electrode 704 and the hole transport layer 705, a positive hole having an energy band structure that allows holes to be smoothly injected from the first electrode 704 to the hole transport layer 705 is provided. A hole injection layer can also be formed. Similarly, an electron injection layer can also be formed between the second electrode 708 and the electron transport layer 707.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate (mother glass) 703 on which a circuit (not shown) for driving an organic EL display device and a first electrode 704 are formed is prepared.

Acrylic resin is formed by spin coating on the substrate 703 on which the first electrode 704 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the part where the first electrode 704 is formed, and an insulating layer is formed. Form 709. This opening corresponds to the light emitting region where the light emitting element actually emits light.

A substrate 703 with a patterned insulating layer 709 is placed on a substrate carrier on which an adhesive member is arranged. The substrate 703 is held by the adhesive member. After being carried into a first organic material film forming apparatus and inverted, a hole transport layer 705 is formed as a common layer on the first electrode 704 in the display area. The hole transport layer 705 is formed by vacuum deposition. In reality, the hole transport layer 705 is formed to have a larger size than the display area 701, so a high-definition mask is not required.

Next, the substrate 703 on which up to the hole transport layer 705 has been formed is carried into a second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 706R that emits red light is formed on a portion of the substrate 703 where an element that emits red light is to be arranged.

Similar to the formation of the light-emitting layer 706R, a light-emitting layer 706G that emits green light is formed by a third organic material film-forming device, and a light-emitting layer 706B that emits blue light is further formed by a fourth organic material film-forming device. . After the formation of the

light emitting layers

706R, 706G, and 706B is completed, the electron transport layer 707 is formed over the entire display area 701 using a fifth film formation apparatus. The electron transport layer 707 is formed as a layer common to the three color

light emitting layers

706R, 706G, and 706B.

A second electrode 708 is formed by moving the substrate on which the electron transport layer 707 has been formed using a metal vapor deposition material film forming apparatus.

Thereafter, the film is moved to a plasma CVD apparatus and a protective layer 710 is formed, thereby completing the film forming process on the substrate 703. After inversion, the adhesive member is peeled off from the substrate 703 to separate the substrate 703 from the substrate carrier. Thereafter, the organic EL display device 700 is completed through cutting.

If the substrate 703 on which the insulating layer 709 has been patterned is exposed to an atmosphere containing moisture or oxygen from the time the substrate 703 on which the insulating layer 709 has been patterned is carried into the film forming apparatus until the film forming of the protective layer 710 is completed, the light emitting layer made of the organic EL material may There is a risk of deterioration due to moisture and oxygen. Therefore, in this embodiment, substrates are carried in and out between film forming apparatuses under a vacuum atmosphere or an inert gas atmosphere.

12... Heating chamber (vacuum chamber), 125... Rib member (reinforcing member), 127... Bolt (mounting tool), 129... Grease (dust scattering prevention member)

Claims

A chamber whose interior can be decompressed;
a reinforcing member provided along the wall surface of the chamber;
a fixture for attaching the reinforcing member to the wall surface;
A vacuum chamber comprising the reinforcing member and a dust scattering prevention member provided at a boundary between the chamber.
The vacuum chamber according to claim 1, wherein the reinforcing member is a rib member extending along the wall surface.
The vacuum chamber according to claim 2, wherein the fixture is a screw component that is inserted through the rib member and the wall surface.
The vacuum chamber according to claim 1, wherein the dust scattering prevention member is a lubricant interposed between the reinforcing member and the chamber.
The vacuum chamber according to claim 4, wherein the lubricant is grease.
The vacuum chamber according to claim 1, wherein the dust scattering prevention member is a liquid gasket that covers a boundary between the reinforcing member and the chamber.
The vacuum chamber according to claim 1, wherein the dust scattering prevention member is a tape member that covers a boundary between the reinforcing member and the chamber.
The chamber includes a lid that closes an opening of the chamber body and is configured to be openable and closable with respect to the chamber body,
The vacuum chamber according to claim 1, wherein the wall surface is a surface of the lid.
further comprising a cylinder mechanism connected to the lid,
9. The vacuum chamber according to claim 8, wherein the lid portion rotates relative to the chamber body to open and close due to fluctuations in the stroke of the cylinder mechanism.
The reinforcing member has an extension extending outward from the chamber when viewed from a direction perpendicular to the wall surface to which the reinforcing member is attached,
The vacuum chamber according to claim 9, wherein the cylinder mechanism is connected to the lid part via the extension part of the reinforcing member.
A chamber whose interior can be decompressed;
a reinforcing member provided along the wall surface of the chamber;
a fixture for attaching the reinforcing member to the wall surface;
A vacuum chamber comprising: a lubricant applied to a contact portion of the reinforcing member and the chamber.
The vacuum chamber according to claim 11, further comprising a tape member that covers a contact portion between the reinforcing member and the chamber.
a storage chamber for accommodating the board;
a heating chamber that performs heat treatment on the substrate carried in from the storage chamber;
a film forming chamber that performs a film forming process on a substrate brought in from the heating chamber;
A film forming apparatus comprising:
A film forming apparatus characterized in that the heating chamber is a vacuum chamber according to any one of claims 1 to 12.