CN106973484B - collective substrate, method for manufacturing substrate device, and method for manufacturing optical device - Google Patents
collective substrate, method for manufacturing substrate device, and method for manufacturing optical device Download PDFInfo
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- CN106973484B CN106973484B CN201610528463.4A CN201610528463A CN106973484B CN 106973484 B CN106973484 B CN 106973484B CN 201610528463 A CN201610528463 A CN 201610528463A CN 106973484 B CN106973484 B CN 106973484B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides an aggregate substrate in which, after being heated, the substrates are less likely to warp in the thickness direction than an aggregate substrate having a dummy substrate in which no holes are formed in the entire region of a portion overlapping with all the substrates in the short side direction of each substrate. The collective substrate of the present invention comprises: a substrate group including a plurality of long substrates arranged and connected in a short side direction; and a dummy substrate connected to an end portion of each substrate in the substrate group in the longitudinal direction, wherein a hole is formed in the entire region of a portion overlapping with all the substrates in the lateral direction when viewed from the longitudinal direction.
Description
Technical Field
The present invention relates to a collective substrate, a method for manufacturing a substrate device, and a method for manufacturing an optical device.
Background
Patent document 1 describes a printed wiring board having a mounting area where electronic components are mounted and a non-mounting area provided around the mounting area. Patent document 1 describes that the printed wiring board includes: a slot separating the mounting region and the non-mounting region; a coupling portion that couples the mounting region and the non-mounting region; and a slit provided along a portion of the groove where the coupling portion is provided.
Patent document 1: japanese patent laid-open No. 2008-053633
Further, as the collective substrate, there is known a structure having: a substrate group including a plurality of long substrates arranged and connected in a short side direction; and a dummy substrate connected to an end of each substrate in the substrate group in the longitudinal direction.
However, if the collective substrate is heated at the time of fixing the members, the thermal expansion of the substrates of the substrate group constituting the collective substrate in the longitudinal direction may be inhibited by the dummy substrates and may warp in the thickness direction of each substrate.
disclosure of Invention
the present invention provides an aggregate substrate in which each substrate is less likely to warp in the thickness direction after being heated than an aggregate substrate having a dummy substrate in which no hole is formed in the entire region of a portion overlapping with all substrates in the short side direction of each substrate.
The collective substrate according to claim 1 comprises: a substrate group including a plurality of long substrates arranged and connected in a short side direction; and a dummy substrate connected to an end portion of each substrate in the substrate group in the longitudinal direction, wherein a hole is formed in the entire region of a portion overlapping with all the substrates in the lateral direction when viewed from the longitudinal direction.
The collective substrate according to claim 2 is the collective substrate according to claim 1, wherein the holes are formed over an entire region of a portion overlapping the substrate group in the short side direction when viewed from the long side direction.
The collective substrate according to claim 3 is the collective substrate according to claim 1 or 2, wherein the hole is an elongated hole extending in the short side direction, and a distance between a surface of the elongated hole on the substrate group side and a surface of the reject substrate facing the substrate group is equal to or smaller than a plate thickness of the reject substrate.
The method of manufacturing a plate device according to claim 4 includes the steps of: the collective substrate according to any one of claims 1 to 3 is configured such that an adhesive is applied to a plurality of substrates included in the collective substrate, a component is disposed on each of the plurality of substrates to which the adhesive is applied, the adhesive is heated and cured, the component is fixed to the plurality of substrates, and the collective substrate to which the component is fixed is separated into the sacrificial substrate and the plurality of substrates to which the component is fixed.
In the method of manufacturing an optical device according to claim 5, the component is a plurality of elements that are aligned and fixed in the longitudinal direction of the substrate, and the optical component and the plurality of elements of the substrate device manufactured by the method according to claim 4 are opposed to each other, and the substrate device and the optical component are positioned in a housing.
ADVANTAGEOUS EFFECTS OF INVENTION
In the collective substrate according to claim 1, the substrates are less likely to warp in the thickness direction after being heated, as compared with a collective substrate including dummy substrates in which no holes are formed in the entire region of the portion overlapping with all the substrates in the short-side direction of each substrate when viewed from the longitudinal direction of each substrate.
In the assembled substrate described in claim 2, the substrates are less likely to warp in the plate thickness direction after being heated, compared to an assembled substrate including rejected substrates in which long holes are not continuously formed in portions extending from one end to the other end of the substrate group in the short-side direction of each substrate when viewed from each long-side direction.
The collective substrate described in claim 3 is less likely to warp in the plate thickness direction after being heated than when the hole is a long hole extending in the short side direction of the substrate, and the distance between the surface of the long hole on the substrate group side and the surface of the reject substrate facing the substrate group is greater than the plate thickness of the reject substrate.
The method of manufacturing a substrate device according to claim 4 can manufacture a substrate device with less warpage in the thickness direction of the substrate, compared to the case where the substrate device is manufactured using a collective substrate including dummy substrates in which no holes are formed in the entire region of the portion overlapping with all the substrates in the short side direction of each substrate.
The method of manufacturing an optical device according to claim 5 can manufacture an optical device in which fluctuation in optical axes of a plurality of elements is suppressed, compared to a case where an optical device is manufactured using a collective substrate having a dummy substrate in which holes are not formed in the entire region of a portion overlapping with all substrates in the short side direction of each substrate.
Drawings
Fig. 1 is a perspective view showing a part of an exposure apparatus manufactured by a method of manufacturing an exposure apparatus according to an embodiment.
Fig. 2 is a sectional view of the exposure apparatus of the embodiment cut in a section perpendicular to the longitudinal direction of the exposure apparatus.
Fig. 3 is a plan view of the collective substrate according to the embodiment.
Fig. 4 is a plan view (partially enlarged) of a part of the collective substrate according to the embodiment.
Fig. 5 is a plan view of an aggregate substrate on which a plurality of LED arrays are fixed at the time of manufacturing the exposure apparatus according to the embodiment.
FIG. 6 is a plan view of the collective substrate according to comparative example 1.
Fig. 7 is a plan view (partially enlarged) of a part of a collective substrate according to a modification.
Description of the reference numerals
10 Exposure device
20 light-emitting substrate (an example of a substrate device)
30 lens array (an example of an optical component)
40 frame body
50-strip substrate (an example of substrate)
62 LED array (an example of a component and element)
64 driver (an example of a component)
70 collective substrate
80 substrate group
92 discard substrate
95A1 discarding the surface of the substrate opposite to the substrate group
Slot 98 (an example of a hole)
Surface of substrate group side in 98A long hole
X short side direction
Y long side direction
Detailed Description
Brief summary of the invention
next, an embodiment (embodiment) for carrying out the present invention will be described. First, the structure of the exposure apparatus 10 (see fig. 1 and 2) manufactured by the method of manufacturing the exposure apparatus 10 according to the embodiment will be described. Next, a method for manufacturing the exposure apparatus 10 according to the embodiment will be described. Next, the operation of the embodiment will be described. Note that, since the method of manufacturing the exposure apparatus 10 according to the embodiment includes the method of manufacturing the light-emitting substrate 20 using the collective substrate 70 (see fig. 3) according to the embodiment, the collective substrate 70, the light-emitting substrate 20, and the method of manufacturing the light-emitting substrate 20 will be described in the description of the method of manufacturing the exposure apparatus 10 according to the embodiment. Here, the exposure apparatus 10 is an example of an optical apparatus. The light-emitting substrate 20 is an example of a substrate device.
Structure of Exposure apparatus
As shown in fig. 2, the exposure device 10 has a function of irradiating light LB to a photosensitive drum PD constituting an image forming apparatus (not shown) to form a latent image. As shown in fig. 1 and 2, the exposure apparatus 10 includes a light-emitting substrate 20, a lens array 30, and a frame 40. Here, the lens array 30 is an example of an optical component. Note that, unless otherwise specified, the following description of the components of the exposure apparatus 10 refers to the components constituting the exposure apparatus 10.
< light-emitting substrate >
The light emitting substrate 20 has a function of irradiating the light LB in accordance with image data transmitted from a control unit (not shown) of the image forming apparatus. The light-emitting substrate 20 includes an elongated substrate 50, a driver 64, a connector (not shown), and a plurality of LED arrays 62 (see fig. 1 and 2). That is, the light emitting substrate 20 is the long substrate 50 in a state in which the driver 64, the connector, the plurality of LED arrays 62, and the like are fixed. Here, the LED array 62 is an example of a component and an element. The actuator 64 and connector are another example of components. The long substrate 50 is an example of a substrate.
On one surface (upper surface 52) of the long substrate 50, a long terminal 56 is formed extending from one end side to the other end side in the longitudinal direction of the long substrate 50. The long terminals 56 are fixed with a plurality of LED arrays 62 arranged in a staggered manner along the longitudinal direction of the long terminals 56. A pair of rectangular marks 58 are formed between one end in the longitudinal direction of the upper surface 52 and one end of the elongate terminal 56 adjacent to the one end. The reference numeral 58 is used as a reference for the arrangement of the plurality of LED arrays 62 in the step 2 described later. Terminals (not shown) for fixing the actuator 64, the connector (not shown), and the like are formed on the other surface (lower surface 54) of the long substrate 50. The driver 64 and the connector are fixed to the terminal.
< lens array >
The lens array 30 has a function of refracting the light LB irradiated from the plurality of LED arrays 62 and forming an image of the refracted light LB on the photosensitive drum PD. The lens array 30 is in the shape of a strip. As shown in fig. 2, the lens array 30 is disposed between the light-emitting substrate 20 and the photosensitive drum PD in a state where the exposure apparatus 10 is attached to the image forming apparatus main body (not shown).
< frame >
The frame 40 has a function of positioning the light-emitting substrate 20 and the lens array 30 so that the light-emitting substrate 20 and the lens array 30 face each other. The frame 40 is long. As shown in fig. 2, the frame 40 is formed with an elongated hole 42 that penetrates in the height direction (the direction intersecting the longitudinal direction and the short-side direction of the frame 40) and extends in the longitudinal direction.
The frame 40 positions the lens array 30 on the frame 40 by bringing both end surfaces of the lens array 30 in the short side direction into contact with the upper short side direction opposing surface of the hole 42. The frame 40 positions the light-emitting substrate 20 in the frame 40 by bringing both end surfaces in the short-side direction of the long substrate 50 constituting the light-emitting substrate 20 into contact with the lower short-side direction opposing surface of the hole 42.
The above description relates to the structure of the exposure apparatus 10.
Method for manufacturing Exposure apparatus
Next, a method of manufacturing the exposure apparatus 10 will be described with reference to the drawings. The method of manufacturing the exposure apparatus 10 includes the 1 st step, the 2 nd step, the 3 rd step, and the 4 th step described later. The above steps are performed in the order described above. Next, the structure of the collective substrate 70 (see fig. 3) used in each step will be described, and then each step will be described in brief, and each step will be described in detail. In the following description, arrow X, arrow Y, and arrow Z in the drawings are the longitudinal direction, the width direction, and the thickness direction of the long substrate 50, respectively, of the long substrate 50, respectively.
< collective substrate >
As shown in fig. 3, the collective substrate 70 includes a substrate group 80 and a reinforcing member 90.
[ substrate set ]
As shown in fig. 3, the substrate group 80 includes a plurality of long substrates 50 and a plurality of connecting pieces 82. Each of the long substrates 50 is a laminate of long substrates of an epoxy glass material (e.g., FR 4) on which a wiring pattern is formed. That is, as shown in fig. 3, the substrate group 80 is formed by connecting a plurality of long substrates 50 arranged in the short side direction. Each of the long substrates 50 is connected to the long substrates 50 adjacent in the short direction by a plurality of connecting pieces 82 arranged at predetermined positions in the long direction while forming a gap 84 with the long substrates 50 adjacent in the short direction. The substrate group 80 is long, and the longitudinal direction thereof is the longitudinal direction of each long substrate 50 (see fig. 3). The thickness of the plurality of connecting pieces 82 is equal to the thickness of the long substrate 50.
[ Reinforcement Member ]
the reinforcing member 90 has a function of reinforcing the strength of the substrate group 80. The reinforcing member 90 has a function of positioning the collective substrate 70 at the time of manufacturing the light-emitting substrate 20 and a function of serving as a holding portion of the collective substrate 70.
As shown in fig. 3, the reinforcing member 90 includes a sacrificial substrate 92 and a connecting piece 94. The dummy substrate 92 is a rectangular frame. The substrate group 80 is disposed inside the dummy substrate 92. The dummy substrate 92 is connected to the substrate group 80 (or the long substrate 50 constituting the substrate group 80) by a plurality of connecting pieces 94 while forming a gap 95 with the substrate group 80. Here, among the plurality of connection pieces 94, connection pieces 94 at both ends in the longitudinal direction of the substrate group 80 are set as connection pieces 94A, and connection pieces 94 at both ends in the short direction of the substrate group 80 are set as connection pieces 94B. That is, the dummy substrate 92 is connected to the longitudinal end of each long substrate 50 constituting the substrate group 80 by the connecting piece 94A. Each of the connection pieces 94A is disposed at both ends of each long substrate 50 in the longitudinal direction and at the center of each long substrate 50 in the short direction in a pair. Among the gaps 95 between the dummy substrate 92 and the substrate group 80, the gaps 95 at both ends of the substrate group 80 in the longitudinal direction are set as gaps 95A, and the gaps 95 at both ends of the substrate group 80 in the short direction are set as gaps 95B. The reinforcing member 90 (the dummy substrate 92) is elongated, and the longitudinal direction thereof is the longitudinal direction of each of the elongated substrates 50 and the substrate group 80 (see fig. 3). The thickness of the reinforcing member 90 (the sacrificial substrate 92 and the connecting piece 94) is equal to the thickness of the long substrate 50.
A pair of circular holes 96 penetrating the dummy substrate 92 are formed in 2 portions on one end side in the longitudinal direction of the dummy substrate 92 and on the opposite side of the substrate group 80 with a gap 95B therebetween with respect to both ends in the short direction of the substrate group 80. Further, a pair of circular holes 97 penetrating the dummy substrate 92 are formed in 2 portions on the other end side in the longitudinal direction of the dummy substrate 92, on the opposite side of the substrate group 80 with respect to the both ends in the short direction of the substrate group 80 with a gap 95B. The pair of circular holes 96 and the pair of circular holes 97 are used to position the aggregate substrate 70 in the 1 st step, the 2 nd step, and the 3 rd step, which will be described later.
Further, in the 2-place portion of the dummy substrate 92 connected to both ends of each long substrate 50 in the longitudinal direction, long holes 98 are formed along the short direction of each long substrate 50. Here, the long hole 98 is an example of a hole. The long hole 98 penetrates the sacrificial substrate 92. Further, the elongated holes 98 are formed over the entire area of the portion of the dummy substrate 92 that overlaps the substrate group 80 in the short side direction of each elongated substrate 50, when viewed from the long side direction of each elongated substrate 50. Therefore, the long holes 98 are formed continuously from one end to the other end of the substrate group 80 in the short side direction of each long substrate 50 in the dummy substrate 92.
Here, as shown in fig. 4, the surface of the long hole 98 on the side of the substrate group 80 is a surface 98A. The surface of the waste substrate 92 facing the substrate group 80 is referred to as a surface 95a 1. The distance D between the surface 98A and the surface 95a1 (the distance in the longitudinal direction of the substrate group 80) is equal to or less than the thickness of the long substrate 50, that is, equal to or less than the thickness of the dummy substrate 92. In the following description, the portion between the surface 98A and the surface 95a1 of the sacrificial substrate 92 will be referred to as a portion 92A. That is, distance D represents the width of portion 92A.
The above description relates to the structure of the collective substrate 70 of the embodiment.
< brief description of the respective steps >
The 1 st step is a step of fixing components such as the actuator 64 and the connector to terminals (not shown) on the lower surface 54 of the long substrate 50 constituting the aggregate substrate 70. The 2 nd step is a step of fixing the plurality of LED arrays 62 to the long terminals 56 on the upper surface 52 of the long substrate 50 constituting the aggregate substrate 70. The 3 rd step is a step of dividing an aggregate substrate 70 (hereinafter referred to as a mounting substrate 72, the mounting substrate 72 being referred to as fig. 5) to which components such as the driver 64, the connector, and the plurality of LED arrays 62 are fixed into a sacrificial substrate 92 and a plurality of light-emitting substrates 20. The 4 th step is a step of positioning the light-emitting substrate 20 and the lens array 30 in the frame 40. Further, if the 3 rd process is finished, the light emitting substrate 20 is manufactured. That is, the method in which the 1 st step, the 2 nd step, and the 3 rd step are performed in the above-described order represents a method for manufacturing the light-emitting substrate 20.
< detailed description of the respective steps >
[ step 1 ]
In the step 1, solder (cream solder) is printed (applied) by an application device (not shown) on the terminals (not shown) of the lower surface 54 of the long substrate 50 constituting the collective substrate 70, and components such as the driver 64 and the connector are arranged by an arrangement device (not shown) on the terminals on which the solder is printed. Here, solder is an example of the bonding agent. Then, in the step 1, the assembly substrate 70 and the solder are heated and melted in a reflow furnace (not shown) by a reflow apparatus (not shown), and the solder is hardened, thereby fixing the components such as the driver 64 and the connector to the assembly substrate 70 (reflow step). In this case, as an example, the temperature in the reflow furnace is heated to 240 to 270 ℃ (a temperature higher than the glass transition point Tg of the epoxy glass material), and then the temperature in the reflow furnace is gradually cooled, and if the temperature in the reflow furnace becomes normal temperature, the 1 st step is ended. The 1 st step is performed in a state where the collective substrate 70 is positioned by fitting positioning pins (not shown) of the respective devices (the coating device, the placement device, and the reflow device) into the pair of circular holes 96 and the pair of circular holes 97 of the collective substrate 70.
[ 2 nd step ]
In the 2 nd step, silver paste is printed (applied) on the long terminals 56 on the upper surface 52 of the long substrate 50 constituting the collective substrate 70 by an application device (not shown), and the plurality of LED arrays 62 are arranged in the long terminals 56 on which the silver paste is printed in a staggered manner in the longitudinal direction of the long terminals 56 by an arrangement device (not shown) (see fig. 5). Here, silver paste is an example of the bonding agent. Then, in the 2 nd step, the collective substrate 70 and the silver paste are heated in a heating furnace (not shown) by a heating device (not shown), and the silver paste is cured after being melted, thereby fixing the plurality of LED arrays 62 to the collective substrate 70. In this case, as an example, the temperature in the heating furnace is heated to 110 ℃, and then the temperature in the heating furnace is gradually cooled until the temperature in the heating furnace becomes normal temperature. Then, the collective substrate 70 is taken out of the heating furnace, and the bonding pads (not shown) of the long substrate 50 and the plurality of LED arrays 62 are wire-bonded by a wire bonding apparatus (not shown), and the 2 nd step is completed. The 2 nd step is performed in a state where the collective substrate 70 is positioned by fitting positioning pins (not shown) of the respective devices (coating device and heating device) into the pair of circular holes 96 and the pair of circular holes 97 of the collective substrate 70. In addition, the end of step 2 represents the manufacture of the mounting substrate 72.
[ 3 rd step ]
In the 3 rd step, all the connection pieces 94 and 82 are cut by a cutter (not shown). Then, if all the connection pieces 94 and 82 are cut by the dicing apparatus, the mounting substrate 70 is separated into a plurality of (10) light-emitting substrates 20 and 1 dummy substrate 92. As a result, 10 light-emitting substrates 20 are manufactured, and the 3 rd step is completed. The 3 rd step is performed in a state where the mounting substrate 72 is positioned by fitting positioning pins (not shown) of the dicing apparatus into the pair of circular holes 96 and the pair of circular holes 97 of the mounting substrate 72.
[ 4 th step ]
The 4 th step is a step of positioning the light emitting substrate 20 and the lens array 30 in the housing 40 with the lens array 30 and the plurality of LED arrays 62 facing each other (see fig. 1 and 2). The 4 th step is performed by an operator using a mounting tool (not shown) for mounting the light-emitting substrate 20 and the lens array 30 to the housing 40. Specifically, the operator applies an adhesive (not shown) to a plurality of places on the periphery of the upper opening of the elongated hole 42 of the frame 40, brings both end surfaces in the short-side direction of the lens array 30 into contact with the upper opposing surface in the short-side direction of the hole 42, and positions the lens array 30 on the frame 40 (see fig. 2). Further, the operator applies an adhesive (not shown) to a plurality of locations on the back surface of the long substrate 50, brings both end surfaces of the long substrate 50 in the short side direction into contact with the lower short side direction opposing surface of the hole 42, and positions the light-emitting substrate 20 on the housing 40 (see fig. 2). By the above operation, the 4 th step is ended. After the 4 th step, the exposure apparatus 10 is manufactured (see fig. 1 and 2).
the above description relates to a method for manufacturing the exposure apparatus 10.
Action
Next, the operation (1 st, 2 nd, and 3 rd operation) of the embodiment will be described by comparing the embodiment with a comparative embodiment (1 st, 2 nd, and 3 rd comparative embodiments) described below. In the following description, when a member or the like equivalent to that used in the embodiment is used in each comparative embodiment, the name of the member or the like is used as it is without illustration.
< action No. 1 >
The action of the 1 st action is that, when viewed from the longitudinal direction of each of the long substrates 50, the long holes 98 are formed in the entire region of the portion of the dummy substrate 92 that overlaps with all of the long substrates 50 in the lateral direction of each of the long substrates 50. The 1 st operation will be described in comparison with the 1 st comparative embodiment described below.
Unlike the aggregate substrate 70 (see fig. 3) of the embodiment, the aggregate substrate 70A (see fig. 6) of the 1 st comparative embodiment does not have the elongated hole 98. The collective substrate 70A of comparative example 1 has the same structure as the collective substrate 70 of the embodiment, except for the above points. Note that the method for manufacturing a light-emitting substrate (not shown) of the 1 st comparative example (the method for manufacturing an exposure apparatus (not shown) of the 1 st comparative example) is performed in the same steps as those in the embodiment except that the method is performed using the collective substrate 70A of the 1 st comparative example instead of the collective substrate 70 of the embodiment.
In the case of the 1 st comparison method, the dummy substrate 92 is positioned at the time of heating the collective substrate 70A in the 1 st step and the 2 nd step (at the time of heating the collective substrate 70A at the time of fixing the component). Therefore, in the case of the 1 st comparison method, the thermal expansion in the longitudinal direction of each long substrate 50 during the heating of the collective substrate 70A in the 1 st step and the 2 nd step is inhibited by the dummy substrate 92. As a result, the long substrates 50 (and the light-emitting substrates) of the 1 st comparative example are warped in the thickness direction. Accordingly, the exposure apparatus manufactured by the method of comparative example 1 causes the optical axes of the plurality of LED arrays 62 to fluctuate due to warpage in the thickness direction of the long substrate 50.
In contrast, in the aggregate substrate 70 of the embodiment, as shown in fig. 3, 4, and 5, the long holes 98 are formed in the entire region of the portion of the dummy substrate 92 that overlaps with all of the long substrates 50 in the short direction of each long substrate 50 when viewed from the long direction of each long substrate 50. Therefore, in the case of the embodiment, if the collective substrate 70 is heated in the 1 st step and the 2 nd step, the elongated holes 98 easily absorb the amount of expansion due to thermal expansion in the longitudinal direction of each elongated substrate 50 (the width of the elongated holes 98 in the longitudinal direction of the elongated substrate 50 is easily shortened in accordance with the amount of expansion).
Therefore, according to the collective substrate 70 of the embodiment, the long substrates 50 are less likely to warp in the thickness direction after the collective substrate 70 is heated, compared to a collective substrate having a dummy substrate in which no hole is formed in the entire region of the portion overlapping with all the long substrates 50 in the short side direction of each long substrate 50 when viewed from the long side direction of each long substrate 50. Accordingly, according to the method of manufacturing the light-emitting substrate 20 of the embodiment, the light-emitting substrate 20 having a small warpage in the thickness direction of the long substrate 50 can be manufactured. In addition, according to the method of manufacturing the exposure apparatus 10 of the embodiment, the fluctuation of the optical axes of the plurality of LED arrays 62 due to the warp in the plate thickness direction of the long substrate 50 is suppressed.
< action No. 2 >
The action of the 2 nd action is that, when viewed in the longitudinal direction of each long substrate 50, a long hole 98 is formed in the entire region of the portion of the dummy substrate 92 that overlaps the substrate group 80 in the lateral direction of each long substrate 50. The 2 nd operation will be described in comparison with the 2 nd comparative embodiment described below.
Unlike the case of the collective substrate 70B (see fig. 7) of the 2 nd comparative embodiment, the elongated hole 98B is formed in the entire region of the portion of the dummy substrate 92 that overlaps all of the elongated substrates 50 in the short side direction of each elongated substrate 50, as viewed in the longitudinal direction of each elongated substrate 50 (see fig. 3). In the case of the collective substrate 70B of the 2 nd comparative example, the connecting pieces 98C are disposed in the portions overlapping with all the gaps 84 in the short side direction of the long substrates 50 when viewed from the long side direction of the long substrates 50. Therefore, the elongated holes 98B of the 2 nd contrast system are not continuously formed in the portion of the sacrificial substrate 92 extending from one end to the other end of the substrate group 80 in the short side direction of each elongated substrate 50 when viewed from the longitudinal direction of each elongated substrate 50 (the connecting pieces 98C are disposed between the adjacent elongated holes 98B). The collective substrate 70B of comparative example 2 has the same structure as the collective substrate 70 of the embodiment, except for the above points. Note that the method for manufacturing a light-emitting substrate (not shown) according to the 2 nd comparative example (the method for manufacturing an exposure apparatus (not shown) according to the 2 nd comparative example) is performed in the same steps as those in the example, except that the method is performed using the collective substrate 70B according to the 2 nd comparative example instead of the collective substrate 70 according to the example. As shown in fig. 7, the collective substrate 70B of the 2 nd comparison mode is configured to obtain the 1 st action described above because the elongated holes 98B are formed in the entire region of the portion of the sacrificial substrate 92 that overlaps with all of the elongated substrates 50 in the short side direction of each of the elongated substrates 50. That is, the 2 nd comparative embodiment is an embodiment included in the technical scope of the present invention, and corresponds to a modification of the embodiment.
In the case of the 2 nd comparative method, if the collective substrate 70B is heated in the 1 st step and the 2 nd step, the extension due to the thermal expansion in the longitudinal direction of each elongated substrate 50 can be inhibited by the connecting pieces 98C.
in contrast, in the aggregate substrate 70 of the embodiment, as shown in fig. 3, 4, and 5, the elongated holes 98B are formed in the entire regions of the portions of the sacrificial substrate 92 that overlap the substrate group 80 in the short side direction of each elongated substrate 50 when viewed from the longitudinal direction of each elongated substrate 50. That is, unlike the case of the 2 nd comparative example, the embodiment has long holes 98 continuously formed in the sacrificial substrate 92 from one end to the other end of the substrate group 80 in the short side direction of each long substrate 50 when viewed in the long side direction of each long substrate 50. Therefore, in the case of the embodiment, when the collective substrate 70 is heated in the 1 st step and the 2 nd step and the long substrates 50 are thermally expanded in the longitudinal direction, the extension of the long substrates 50 due to the thermal expansion in the longitudinal direction is less likely to be inhibited by the connecting piece 98C. That is, in the case of the embodiment, when the collective substrate 70 is heated in the 1 st step and the 2 nd step, each of the elongated substrates 50 is likely to thermally expand in the longitudinal direction, as compared with the case of the 2 nd comparative example.
Therefore, according to the collective substrate 70 of the embodiment, the long substrates 50 are less likely to warp in the plate thickness direction after the collective substrate 70 is heated, compared to a case where long holes are not continuously formed in portions of the dummy substrates 92 extending from one end to the other end of the substrate group 80 in the short side direction of the long substrates 50 when viewed from the long side direction of the long substrates 50.
< action No. 3 >
the action of the 3 rd action is such that the distance D (see fig. 4) between the surface 98A of the long hole 98 and the surface 95a1 of the dummy substrate 92 is equal to or less than the thickness of the dummy substrate 92. The operation 3 will be described in comparison with a 3 rd comparison mode (not shown) described below.
Unlike the aggregate substrate 70 (see fig. 3) of the embodiment, the aggregate substrate (not shown) of the 3 rd comparative embodiment has a distance D larger than the thickness of the sacrificial substrate 92. The collective substrate of comparative example 3 has the same structure as the collective substrate 70 of the embodiment, except for the above point. Note that the method for manufacturing a light-emitting substrate (not shown) of the 3 rd comparative system (the method for manufacturing an exposure apparatus (not shown) of the 3 rd comparative system) was performed in the same steps as those in the embodiment except that the method was performed using the collective substrate of the 3 rd comparative system instead of the collective substrate 70 of the embodiment. In the aggregate substrate of the 3 rd comparative example, the elongated holes 98 are formed in the entire region of the portion of the sacrificial substrate 92 that overlaps the substrate group 80 in the short side direction of each of the long substrates 50, and therefore, the above-described 1 st and 2 nd actions can be said to be achieved. That is, the 3 rd comparative embodiment is an embodiment included in the technical scope of the present invention, and corresponds to another modification of the embodiment.
In the case of the 3 rd comparative method, if the collective substrate is heated in the 1 st step and the 2 nd step, the extension due to the thermal expansion in the longitudinal direction of each of the long substrates 50 can be inhibited by the distance D being larger than the thickness of the dummy substrate 92.
In contrast, in the collective substrate 70 of the embodiment, the distance D (the width of the portion 92A) is equal to or less than the thickness of the dummy substrate 92. Therefore, in the case of the embodiment, when the collective substrate 70 is heated in the 1 st step and the 2 nd step and the long substrates 50 are thermally expanded in the longitudinal direction, the expansion of the long substrates 50 due to the thermal expansion in the longitudinal direction is less likely to be hindered by the width of the portion 92A. That is, in the case of the embodiment, when the collective substrate 70 is heated in the 1 st step and the 2 nd step, each of the elongated substrates 50 is likely to thermally expand in the longitudinal direction, as compared with the case of the 3 rd comparative example.
Therefore, according to the collective substrate 70 of the embodiment, the long substrates 50 are less likely to warp in the thickness direction after the collective substrate 70 is heated, as compared with the case where the distance D is larger than the thickness of the discard substrate 92.
The above description relates to the operation of the embodiment.
As described above, the present invention has been described by taking specific embodiments as examples, but the present invention is not limited to the embodiments. For example, the following embodiments are also included in the technical scope of the present invention.
in the description of the embodiment, the exposure apparatus 10 is assumed to be an example of an optical apparatus. However, the exposure apparatus 10 is an Image reading apparatus using a Contact Image Sensor (Contact Image Sensor) in a system in which a plurality of light emitting elements (LED arrays 62) constituting the light emitting substrate 20 are changed to, for example, light receiving elements (not shown). In this case, the light receiving element is another example of the member and the element, and the image reading apparatus is one example of the optical apparatus.
in the description of the embodiment, it is assumed that the long holes 98 as an example of the holes are formed at 2 portions of the sacrificial substrate 92 connected to both ends of the substrate group 80 in the longitudinal direction. However, the long hole 98 as an example of the hole may be formed at 1 in the above-described 2-place portion.
In the description of the embodiment, the sacrificial substrate 92 is assumed to be a rectangular frame. However, if the dummy substrates 92 are disposed at both ends of the substrate group 80 in the longitudinal direction, they may not be disposed at one or both ends of the substrate group 80 in the lateral direction. The dummy substrate 92 may be disposed at least at one end of the substrate group 80 in the longitudinal direction.
In the description of the embodiment, it is assumed that the 2 nd step is performed after the 1 st step. However, if the 3 rd step and the subsequent steps are performed after the 1 st step and the 2 nd step, the order of performing the 1 st step and the 2 nd step may be reversed.
Claims (3)
1. An aggregate substrate, comprising:
A substrate group including a plurality of long substrates arranged and connected in a short side direction; and
A dummy substrate connected to an end of each substrate in the substrate group in the longitudinal direction, and having a hole formed in the entire region of a portion overlapping with all the substrates in the lateral direction when viewed in the longitudinal direction,
the hole is a long hole along the short side direction,
The distance between the surface of the long hole on the substrate group side and the surface of the reject substrate facing the substrate group is smaller than or equal to the thickness of the reject substrate.
2. A method for manufacturing a substrate device includes the steps of:
Applying a bonding agent to a plurality of the substrates included in the collective substrate according to claim 1,
Disposing components at each of the plurality of substrates to which the bonding agent is applied,
Heating and curing the bonding agent to fix the component to the plurality of substrates,
The collective substrate to which the components are fixed is divided into the reject substrate and the plurality of substrates to which the components are fixed.
3. A method of manufacturing an optical device, wherein,
The component is a plurality of elements that are,
The plurality of elements are arranged and fixed in the longitudinal direction of the substrate,
Positioning an optical component in a housing with respect to the plurality of elements of the substrate device manufactured by the method according to claim 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016004366A JP2017126638A (en) | 2016-01-13 | 2016-01-13 | Aggregate substrate, method of manufacturing substrate device, and method of manufacturing optical device |
| JP2016-004366 | 2016-01-13 |
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| Publication Number | Publication Date |
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| CN106973484A CN106973484A (en) | 2017-07-21 |
| CN106973484B true CN106973484B (en) | 2019-12-13 |
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| CN (1) | CN106973484B (en) |
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| DE102019207839A1 (en) | 2019-05-28 | 2020-12-03 | Heidelberger Druckmaschinen Ag | Paint consumption forecast |
| CN112069762B (en) * | 2020-09-17 | 2022-09-02 | 北京华大九天科技股份有限公司 | Method for determining direction of slotted hole based on cartoon shape |
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| CN201415301Y (en) * | 2009-05-15 | 2010-03-03 | 联创汽车电子有限公司 | Anti-deformation pass stove vehicle |
| CN102111953A (en) * | 2009-12-24 | 2011-06-29 | 北大方正集团有限公司 | Printed circuit board (PCB) and manufacturing method thereof |
| JP2011146411A (en) * | 2010-01-12 | 2011-07-28 | Fuji Xerox Co Ltd | Assembled printed-wiring board, printed-wiring board device, print head, and image-forming device |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0273685A (en) * | 1988-09-08 | 1990-03-13 | Fanuc Ltd | Printed board for surface mounting |
| JP2000228566A (en) * | 1999-02-04 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Aggregate printed-wiring board |
| JP2014107433A (en) * | 2012-11-28 | 2014-06-09 | Ibiden Co Ltd | Multiple piece forming substrate |
| JP6315773B2 (en) * | 2014-01-30 | 2018-04-25 | 日東電工株式会社 | Suspension board assembly sheet with circuit |
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- 2016-01-13 JP JP2016004366A patent/JP2017126638A/en active Pending
- 2016-07-06 CN CN201610528463.4A patent/CN106973484B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201415301Y (en) * | 2009-05-15 | 2010-03-03 | 联创汽车电子有限公司 | Anti-deformation pass stove vehicle |
| CN102111953A (en) * | 2009-12-24 | 2011-06-29 | 北大方正集团有限公司 | Printed circuit board (PCB) and manufacturing method thereof |
| JP2011146411A (en) * | 2010-01-12 | 2011-07-28 | Fuji Xerox Co Ltd | Assembled printed-wiring board, printed-wiring board device, print head, and image-forming device |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
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| CN106973484A (en) | 2017-07-21 |
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