CN106950799A - Photosensitive glue composition and its application in electrochemical treatments heat-sensitive CTP plate is exempted from - Google Patents
Photosensitive glue composition and its application in electrochemical treatments heat-sensitive CTP plate is exempted from Download PDFInfo
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- CN106950799A CN106950799A CN201710191993.9A CN201710191993A CN106950799A CN 106950799 A CN106950799 A CN 106950799A CN 201710191993 A CN201710191993 A CN 201710191993A CN 106950799 A CN106950799 A CN 106950799A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
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Abstract
The invention discloses a kind of photosensitive glue composition and its application in electrochemical treatments heat-sensitive CTP plate is exempted from, the photosensitive glue composition includes the following component calculated in parts by mass：35~50 parts of polyvinyl；10~30 parts of vinyl sulfonic acid ester polymer；10~20 parts of phenolic resin；3~5 parts of silicone resin；5~15 parts of infrared Absorption dyestuff；3~8 parts of other auxiliary agents；Wherein, the polyvinyl is N（4 acetyl oxygen phenyl）Maleimide, N, the copolymer of N dimethylformamides, hydroxy-ethyl acrylate, the hydroxyl value of the polyvinyl is 10~30mgKOH, and the vinyl sulfonic acid ester polymer is vinylbenzenesulfonic acid N-butyl, acrylic acid, the copolymer of EMA.The photosensitive glue composition, which is made to be directly coated at after coating fluid on the aluminium sheet without electrolysis and oxidation processes, prepares heat-sensitive CTP plate, and the thermosensitive CTP prepared can meet follow-up printing quality requirement, good hydrophilic property, good printing-force-resistence.
Description
Technical field
The present invention relates to CTP editions plate-making technology fields, in particular it relates to a kind of photosensitive glue composition and its exempt from
Application in electrochemical treatments heat-sensitive CTP plate.
Background technology
CTP (Computer to Plate) technology is a kind of digitlization directly plate-making occurred nineteen nineties
Technology, is the technology for being copied to graph text information on plate by laser platemaker by computer.CTP plates species is a lot, than
Relatively popularization include Silver Salt Diffusion Transfer CTP Plate material, UV-CTP edition, thermal CTP plate material, purple laser c TP etc., thermal CTP plate material is red
Outer laser scanning exposes the printing plate of direct imaging, heat-sensitive CTP plate, which has, to be easily controlled in bright room conditional operation, quality,
Publishing quality is stable, site reproducibility is good, resolving power is high the advantages of cleaned with site clear-cut margin, be currently it is most ripe, most
It is stable, the best CTP plate-making technologies of effect.
It is to be coated with one layer of photosensitive layer in aluminium plate primary surface that CTP editions most of.In order that aluminum substrate can have very well to photosensitive layer
Suction-operated, aluminium plate primary surface will pass through a series of surface treatments：The processes such as oil removing → neutralization → electrolysis → oxidation → sealing of hole.
Electrolysis and oxidation operation can be collectively referred to as electrochemical treatments process again, and it can obtain the Grains and oxide layer of the space of a whole page, so that
The CTP versions of preparation are in printing with good hydrophilicity and pressrun.However, the power consumption and consumption of electrolysis and oxidation operation
Water is very big, it is difficult to meet the demand of social enviroment protection energy-conservation now, and electrolysis and oxidation are time-consuming relatively long, greatly add life
Produce cost and the time of thermosensitive CTP.
The content of the invention
Based on this, the invention reside in the defect of prior art is overcome there is provided a kind of photosensitive glue composition, by the photoresists
Coating fluid prepared by composition can be directly coated at prepares heat-sensitive CTP plate, the temperature-sensitive without on electrolysis and oxidation processes aluminium sheet
CTP editions can meet follow-up printing quality requirement, good hydrophilic property, good printing-force-resistence.
Another object of the present invention is to provide a kind of heat-sensitive CTP plate.
Another object of the present invention is to provide the preparation method of the heat-sensitive CTP plate.
It is as follows with its technical scheme：
A kind of photosensitive glue composition, including the component calculated by weight as follows：
35~50 parts of polyvinyl；
10~30 parts of vinyl sulfonic acid ester polymer；
10~20 parts of phenolic resin；
3~5 parts of silicone resin；
5~15 parts of infrared Absorption dyestuff；
3~8 parts of other auxiliary agents；
Wherein, the polyvinyl is N-（4- acetyl oxygen phenyl）Maleimide, DMF, acrylic acid
The copolymer of hydroxyl ethyl ester, the hydroxyl value of the polyvinyl is 10~30mgKOH, and the vinyl sulfonic acid ester polymer is second
Alkenyl benzene sulfonic acid N-butyl, acrylic acid, the copolymer of EMA.
Usually require to carry out electrochemical treatments to aluminium base in CTP editions preparation process so that CTP editions have in printing
Hydrophilicity and pressrun, however, the power consumption and water consumption of electrolysis and oxidation operation are very big, it is difficult to meet society now
The demand of meeting environmental protection and energy saving.The present invention from the photosensitive layer of CTP editions by setting about, by the vinyl polymerization for selecting specific structure
Thing, vinyl sulfonic acid ester polymer, coordinate with phenolic resin, silicone resin etc., have developed and a kind of are applied to exempt from electrochemistry
The photosensitive glue composition of processing CTP editions.The present invention is with N-（4- acetyl oxygen phenyl）Maleimide, DMF,
Hydroxy-ethyl acrylate is reactant, and having prepared one kind has good alkali solubility and hydrophilic polyvinyl, wherein, N-
（4- acetyl oxygen phenyl）Maleimide, DMF segment have preferable alkali solubility, can make during exposure imaging
Polyvinyl is preferably dissolved, and on the one hand hydroxy-ethyl acrylate segment contains carboxylate structure, and interconvertibility is caused with acid
The presence of terminal hydroxy group make it that the ethylenic copolymer prepared has preferable hydrophily in matter, one side hydroxy-ethyl acrylate,
And make photosensitive glue composition that there is good pressrun；Vinyl sulfonic acid ester is in addition to alkali solubility, vinyl sulfonic acid polyisocyanate polyaddition
Acrylate in thing, the presence of EMA segment add the compatibility between each component, and acrylate is also
The interaction force between photosensitive glue composition and base material is added, the hydrophily of photoresists is also add；The siloxanes tree
Fat has preferable adhesiveness to aluminium base, so that photosensitive layer can be on secure adhesion and aluminium base.Sense of the present invention
Optical cement composition can be prepared into photosensitive layer and directly be coated on the only aluminium base through oil removal treatment, have good glue to aluminium base
Attached property, and the heat-sensitive CTP plate prepared has good hydrophilicity and pressrun, disclosure satisfy that subsequent ink printing
Quality requirements.
In wherein one embodiment, the hydroxyl value of the polyvinyl is 10~20mgKOH.
In wherein one embodiment, the polyvinyl is by DMF and N-（4- acetyl oxygen benzene
Base）Maleimide, hydroxy-ethyl acrylate in molar ratio 1:（1~5）：（0.1~0.5）Copolymerization is formed.
In wherein one embodiment, the molecular weight of the polyvinyl is 10000~20000.
In wherein one embodiment, the vinyl sulfonic acid ester polymer is by vinylbenzenesulfonic acid N-butyl and propylene
Acid, EMA in molar ratio 1：（0.5~1）：（2~4）Copolymerization is formed.
In wherein one embodiment, the vinyl sulfonic acid ester polymer molecular weight is 5000~10000.
In wherein one embodiment, described infrared Absorption dyestuff is containing cationic salts and anion salt structure
Cyanine dye.
In wherein one embodiment, other described auxiliary agents is in stabilizer, levelling agent, defoamer, surfactants
It is one or more.
A kind of heat-sensitive CTP plate, including aluminum substrate support and the photosensitive layer being coated on aluminum substrate support, it is described photosensitive
Layer is solidify to form through photosensitive coating fluid, and the photosensitive coating fluid includes the photosensitive glue composition.
The preparation method of the heat-sensitive CTP plate, comprises the following steps：
S1, sheet material processing：Aluminium base is surface-treated with alkaline solution, then washed, is dried；
S2, photosensitive coating fluid preparation：The photosensitive glue composition each component is well mixed, solvent is added, by photoresists group
Compound matches somebody with somebody the photosensitive coating fluid for turning into that viscosity is 50~70cp, and the solvent is ethyl acetate, acetone, glycol monoethyl ether, second
At least two in 2-ethoxyethanol；
S3, coating：By photosensitive coating solution on sheet material after treatment；
S4, drying：Dry sheet material.
In wherein one embodiment, the step S4 is：Points three sections dry to sheet material, 0~20 meter of the section that starts to walk with
120 DEG C are toasted 1~2 minute, and 20~40 meters of steady section is toasted 2~3 minutes with 180 DEG C, and 40~64 meters of dryer section is with 210 DEG C of bakings
3~4 minutes.
The beneficial effects of the present invention are：The present invention from the photosensitive layer of CTP editions by setting about, by selecting specific structure
Polyvinyl, vinyl sulfonic acid ester polymer, coordinate with phenolic resin, silicone resin etc., have developed a kind of be applicable
In the photosensitive glue composition for exempting from electrochemical treatments CTP editions, the photosensitive glue composition can be prepared into photosensitive layer and directly be coated on only
On aluminium base through oil removal treatment, and the heat-sensitive CTP plate prepared has good hydrophilicity and pressrun；The present invention
Aluminium base need not be electrolysed and be aoxidized during preparing heat-sensitive CTP plate, be saved greatly power consumption and water consumption, be accorded with
The demand of social enviroment protection energy-conservation now is closed, and significantly improves cost and the time of production thermosensitive CTP.
Embodiment
For the objects, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with embodiment, to this
Invention is described in further detail.It should be appreciated that embodiment described herein is only to explain this hair
It is bright, do not limit protection scope of the present invention.
The raw materials used producer of following examples is as follows：
Phenolic resin：2123 phenolic resin, Jinan great Hui Chemical Industry Science Co., Ltd；
Infrared Absorption dyestuff：Phthalocyanine dye, Mitsui Chemicals, Inc.；
Other are not specified to be ordinary commercial products.
Embodiment 1
Prepare polyvinyl A：DMF, benzoyl peroxide are mixed, is added to and is had agitator, returns
In flow tube, the there-necked flask of dropping funel, then 75 DEG C of 10~30min of reaction are added dropwise N- (4- acetyl oxygen phenyl) maleimide
React 5 hours, constantly prevented in course of reaction with acetone regulation viscosity under amine, hydroxy-ethyl acrylate, 1 hour completion of dropping, constant temperature
Only gel；Wherein described N, the consumption of dinethylformamide are 36.5g（0.5mol）, N, dinethylformamide and N-（4-
Acetyl oxygen phenyl）Maleimide, the mol ratio of hydroxy-ethyl acrylate are 1:2:0.2, the consumption of benzoyl peroxide is N, N-
Maintaining nitrogen purge in the 0.5% of dimethylformamide quality, course of reaction.After reaction terminates, cooling adds a large amount of methanol, mistake
Filter, dries, obtains beige solid.Gel permeation chromatography（GPC）It is 8200 to determine its molecule measuring number average molecular weight, is passed through
Pyridine acetic anhydride method determines its hydroxyl value for 18.6mgKOH.
Prepare polyvinyl B：By N, N- dimethylformamides, benzoyl peroxide mixing are added to and have stirring
In device, return duct, the there-necked flask of dropping funel, then 75 DEG C of 10~30min of reaction are added dropwise N- (4- acetyl oxygen phenyl) Malaysia
Reacted 5 hours under acid imide, hydroxy-ethyl acrylate, 1 hour completion of dropping, constant temperature, constantly adjust viscous with acetone in course of reaction
Degree prevents gel；Wherein described N, the consumption of dinethylformamide are 36.5g（0.5mol）, N, dinethylformamide and N-
（4- acetyl oxygen phenyl）Maleimide, the mol ratio of hydroxy-ethyl acrylate are 1:1:0.5, the consumption of benzoyl peroxide is N,
Maintaining nitrogen purge in the 0.5% of dinethylformamide quality, course of reaction.After reaction terminates, cooling adds a large amount of methanol, mistake
Filter, dries, obtains beige solid.It is 5300 that gel permeation chromatography, which determines its molecule measuring number average molecular weight, passes through pyridine
It is 28.8 that acetic anhydride method, which determines its hydroxyl value,.
Prepare polyvinyl C：By N, N- dimethylformamides, benzoyl peroxide mixing are added to and have stirring
In device, return duct, the there-necked flask of dropping funel, then 75 DEG C of 10~30min of reaction are added dropwise N- (4- acetyl oxygen phenyl) Malaysia
Reacted 8 hours under acid imide, hydroxy-ethyl acrylate, 1 hour completion of dropping, constant temperature, constantly adjust viscous with acetone in course of reaction
Degree prevents gel；Wherein, the N, the consumption of dinethylformamide are 36.5g（0.5mol）, N, dinethylformamide with
N-（4- acetyl oxygen phenyl）Maleimide, the mol ratio of hydroxy-ethyl acrylate are 1:5:0.1, the consumption of benzoyl peroxide is
Maintaining nitrogen purge in the 0.5% of N, N- dimethylformamide quality, course of reaction.After reaction terminates, cooling adds a large amount of first
Alcohol, is filtered, and is dried, is obtained beige solid.It is 18800 that gel permeation chromatography, which determines its molecule measuring number average molecular weight, is led to
It is 10.8 to cross pyridine acetic anhydride method and determine its hydroxyl value.
Embodiment 2
Prepare vinyl sulfonic acid ester polymer 1：By vinylbenzenesulfonic acid N-butyl, acrylic acid, EMA, peroxidating
Benzoyl is mixed, and is slowly dropped in the there-necked flask for having agitator, return duct, dropping funel, 70~75 DEG C of reaction 7h, reaction
During constantly with acetone regulation viscosity prevent gel；The consumption of wherein described vinylbenzenesulfonic acid N-butyl is 60g
（0.25mol）, vinylbenzenesulfonic acid N-butyl is 1 with the mol ratio of acrylic acid, EMA：3：0.3, benzoyl peroxide
The consumption of formyl is maintaining nitrogen purge in the 0.5% of vinylbenzenesulfonic acid N-butyl quality, course of reaction.It is cold after reaction terminates
But, a large amount of methanol are added, are filtered, dries, obtains buff white solid.Gel permeation chromatography determines its equal molecule of molecule measuring total
Measure as 7700.
Prepare vinyl sulfonic acid ester polymer 2：By vinylbenzenesulfonic acid N-butyl, acrylic acid, EMA, mistake
BP is mixed, and is slowly dropped in the there-necked flask for having agitator, return duct, dropping funel, 70~75 DEG C of reaction 8h,
Constantly gel is prevented in course of reaction with acetone regulation viscosity；The consumption of wherein described vinylbenzenesulfonic acid N-butyl is 60g
（0.25mol）, vinylbenzenesulfonic acid N-butyl is 1 with the mol ratio of acrylic acid, EMA：5：0.1, benzoyl peroxide
The consumption of formyl is maintaining nitrogen purge in the 0.5% of vinylbenzenesulfonic acid N-butyl quality, course of reaction.It is cold after reaction terminates
But, a large amount of methanol are added, are filtered, dries, obtains buff white solid.Gel permeation chromatography determines its equal molecule of molecule measuring total
Measure as 9600.
Prepare vinyl sulfonic acid ester polymer 3：By vinylbenzenesulfonic acid N-butyl, acrylic acid, EMA, mistake
BP is mixed, and is slowly dropped in the there-necked flask for having agitator, return duct, dropping funel, 70~75 DEG C of reaction 6h,
Constantly gel is prevented in course of reaction with acetone regulation viscosity；The consumption of wherein described vinylbenzenesulfonic acid N-butyl is 60g
（0.25mol）, vinylbenzenesulfonic acid N-butyl is 1 with the mol ratio of acrylic acid, EMA：1：0.5, benzoyl peroxide
The consumption of formyl is maintaining nitrogen purge in the 0.5% of vinylbenzenesulfonic acid N-butyl quality, course of reaction.It is cold after reaction terminates
But, a large amount of methanol are added, are filtered, dries, obtains buff white solid.Gel permeation chromatography determines its equal molecule of molecule measuring total
Measure as 5600.
Embodiment 3
Photosensitive glue composition each component is weighed by following proportioning：
40 parts of polyvinyl A；
1 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
In this implementation, prepare heat-sensitive CTP plate and used above-mentioned photosensitive glue composition, the heat-sensitive CTP plate preparation process is such as
Under：
S1, sheet material processing：Aluminium base is surface-treated with alkaline solution, then washed, is dried, the alkaline solution is 10%
Sodium hydroxide solution；
S2, photosensitive coating fluid preparation：Load weighted photoresists composition component is well mixed, solvent is added, by photoresists
Composition matches somebody with somebody the photosensitive coating fluid for turning into that viscosity is 50~70cp, and the solvent is ethyl acetate, the mixing of glycol monoethyl ether
Solution；
S3, coating：By photosensitive coating solution on sheet material after treatment；
S4, toasted using S types, 64 meters of overall length, 1000W electrothermal tubes 400, points three sections dry to sheet material, the section 0 that starts to walk~
20mu is toasted 1~2 minute with 120 DEG C, and 20~40 meters of steady section is toasted 2~3 minutes with 180 DEG C, and 40~64 meters of dryer section is with 210
DEG C baking 3~4 minutes.
Embodiment 4
Photosensitive glue composition each component is weighed by following proportioning：
35 parts of polyvinyl A；
1 30 parts of vinyl sulfonic acid ester polymer；
10 parts of phenolic resin；
5 parts of silicone resin；
5 parts of infrared Absorption dyestuff；
3 parts of other auxiliary agents；
Other described auxiliary agents are 1 part of stabilizer, 1 part of levelling agent, 0.5 part of defoamer, 0.5 part of surfactant.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 5
50 parts of polyvinyl A；
1 10 parts of vinyl sulfonic acid ester polymer；
20 parts of phenolic resin；
3 parts of silicone resin；
9 parts of infrared Absorption dyestuff；
8 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 2 parts of levelling agents, 1 part of defoamer, 3 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 6
40 parts of polyvinyl B；
1 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 7
40 parts of polyvinyl C；
1 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 8
Photosensitive glue composition each component is weighed by following proportioning：
40 parts of polyvinyl A；
2 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 9
Photosensitive glue composition each component is weighed by following proportioning：
40 parts of polyvinyl A；
3 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Embodiment 10
Photosensitive glue composition each component is weighed by following proportioning：
40 parts of polyvinyl A；
1 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, 2 parts of surfactants.
In this implementation, prepare heat-sensitive CTP plate and used above-mentioned photosensitive glue composition, the heat-sensitive CTP plate preparation process is such as
Under：
A kind of preparation method of heat-sensitive CTP plate, comprises the following steps：
S1, sheet material processing：Aluminium base is surface-treated with alkaline solution, then washed, is dried, the alkaline solution is 8%
Sodium hydroxide solution；
S2, photosensitive coating fluid preparation：The photosensitive glue composition each component is well mixed, and adds solvent, photoresists are combined
Thing matches somebody with somebody the photosensitive coating fluid for turning into that viscosity is 50~70cp, and the solvent is ethyl acetate, acetone, glycol monoethyl ether, second two
The mixed solution of alcohol list ether；
S3, coating：By photosensitive coating solution on sheet material after treatment；
S4, toasted using S types, 64 meters of overall length, 1000W electrothermal tubes 400, points three sections dry to sheet material, the section 0 that starts to walk~
20mu is toasted 1~2 minute with 120 DEG C, and 20~40 meters of steady section is toasted 2~3 minutes with 180 DEG C, and 40~64 meters of dryer section is with 210
DEG C baking 3~4 minutes.
Comparative example 1
Prepare polyvinyl D：DMF, benzoyl peroxide are mixed, is added to and is had agitator, returns
In flow tube, the there-necked flask of dropping funel, 75 DEG C reaction 10~30min, then be added dropwise N- (4- acetyl oxygen phenyl) maleimide,
React 5 hours, constantly prevented in course of reaction with acetone regulation viscosity under methyl methacrylate, 1 hour completion of dropping, constant temperature
Gel；Wherein described N, the consumption of dinethylformamide are 36.5g（0.5mol）, N, dinethylformamide and N-（4- second
Acyl-oxygen phenyl）Maleimide, the mol ratio of hydroxy-ethyl acrylate are 1:2:0.2, the consumption of benzoyl peroxide is N, N- bis-
Maintaining nitrogen purge in the 0.5% of NMF quality, course of reaction.After reaction terminates, cooling adds a large amount of methanol, filters,
Dry, obtain beige solid.Gel permeation chromatography（GPC）It is 8900 to determine its molecule measuring number average molecular weight.
Photosensitive glue composition each component is weighed by following proportioning：
40 parts of polyvinyl D；
1 20 parts of vinyl sulfonic acid ester polymer；
15 parts of phenolic resin；
5 parts of silicone resin；
14.5 parts of infrared Absorption dyestuff；
5.5 parts of other auxiliary agents；
Other described auxiliary agents are 2 parts of stabilizers, 1.5 parts of levelling agents, part defoamer, 2 parts of surfactants.
The preparation method as described in embodiment 3 prepares heat-sensitive CTP plate.
Hydrophily test is carried out to heat-sensitive CTP plate prepared by embodiment 3~10 and comparative example 1, its test method results is shown in
Table 1, method of testing is as follows：Printing machine starts, observation ink separation situation, if clearly being separated less than 60s inks after starting, table
Bright hydrophily is excellent, if ink is clearly separated in 60s~120s, hydrophily is general；If could be separated more than 120s inks, parent
Aqueous difference.
The test of version instrument is surveyed with Ai Seli printing plates site survey is carried out to the UV-CTP versions of embodiment 3~10 and the preparation of comparative example 1
Examination, test result is shown in Table 1.
Table 1
| Detection project | Hydrophily | Pressrun | Site/% |
| Embodiment 3 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 4 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 5 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 6 | It is excellent | 160000 | 1~99.5 |
| Embodiment 7 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 8 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 9 | It is excellent | >170000 | 0.5~99.5 |
| Embodiment 10 | It is excellent | >170000 | 0.5~99.5 |
| Comparative example 1 | Typically | 120000 | 3~95 |
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield, is all considered to be the scope of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of photosensitive glue composition, it is characterised in that including the component calculated by weight as follows：
35~50 parts of polyvinyl；
10~30 parts of vinyl sulfonic acid ester polymer；
10~20 parts of phenolic resin；
3~5 parts of silicone resin；
5~15 parts of infrared Absorption dyestuff；
3~8 parts of other auxiliary agents；
Wherein, the polyvinyl is N-（4- acetyl oxygen phenyl）Maleimide, DMF, acrylic acid
The copolymer of hydroxyl ethyl ester, the hydroxyl value of the polyvinyl is 10~30mgKOH, and the vinyl sulfonic acid ester polymer is second
Alkenyl benzene sulfonic acid N-butyl, acrylic acid, the copolymer of EMA.
2. photosensitive glue composition according to claim 1, it is characterised in that the hydroxyl value of the polyvinyl is 10~
20mgKOH。
3. photosensitive glue composition according to claim 2, it is characterised in that the polyvinyl is by N, N- dimethyl methyls
Acid amides and N-（4- acetyl oxygen phenyl）Maleimide, hydroxy-ethyl acrylate in molar ratio 1:（1~5）：（0.1~0.5）Copolymerization
Form.
4. photosensitive glue composition according to claim 3, it is characterised in that the molecular weight of the polyvinyl is
10000~20000.
5. photosensitive glue composition according to claim 1, it is characterised in that the vinyl sulfonic acid ester polymer is by vinyl
Benzene sulfonic acid N-butyl and acrylic acid, EMA in molar ratio 1：（0.5~1）：（2~4）Copolymerization is formed.
6. photosensitive glue composition according to claim 5, it is characterised in that the vinyl sulfonic acid ester polymer molecular weight is
5000~10000.
7. a kind of heat-sensitive CTP plate, including aluminum substrate support and the photosensitive layer being coated on aluminum substrate support, its feature exist
In the photosensitive layer is solidify to form through photosensitive coating fluid, and the photosensitive coating fluid includes claim 1-6 any claims institute
State photosensitive glue composition.
8. the preparation method of heat-sensitive CTP plate described in claim 7, it is characterised in that comprise the following steps：
S1, sheet material processing：Aluminium base is surface-treated with alkaline solution, then washed, is dried；
S2, photosensitive coating fluid preparation：Photosensitive glue composition each component described in claim 1-6 any claims is mixed equal
It is even, solvent is added, photosensitive glue composition is made into the photosensitive coating fluid for being 50~70cp for viscosity, the solvent is acetic acid second
At least two in ester, acetone, glycol monoethyl ether, ethylene glycol monoethyl ether；
S3, coating：By photosensitive coating solution on sheet material after treatment；
S4, drying：Dry sheet material.
9. preparation method described in claim 8, it is characterised in that the step S4 is：Divide three sections to dry sheet material, start to walk
0~20 meter of section is toasted 1~2 minute with 120 DEG C, and 20~40 meters of steady section is toasted 2~3 minutes with 180 DEG C, 40~64 meters of dryer section
Toasted 3~4 minutes with 210 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710191993.9A CN106950799B (en) | 2017-03-28 | 2017-03-28 | Photosensitive emulsion composition and application thereof in electrochemical-free treatment of thermosensitive CTP (computer to plate) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710191993.9A CN106950799B (en) | 2017-03-28 | 2017-03-28 | Photosensitive emulsion composition and application thereof in electrochemical-free treatment of thermosensitive CTP (computer to plate) |
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| Publication Number | Publication Date |
|---|---|
| CN106950799A true CN106950799A (en) | 2017-07-14 |
| CN106950799B CN106950799B (en) | 2020-10-30 |
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| CN201710191993.9A Active CN106950799B (en) | 2017-03-28 | 2017-03-28 | Photosensitive emulsion composition and application thereof in electrochemical-free treatment of thermosensitive CTP (computer to plate) |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004170597A (en) * | 2002-11-19 | 2004-06-17 | Toyobo Co Ltd | Photosensitive printing original plate |
| CN101770170A (en) * | 2008-12-30 | 2010-07-07 | 乐凯集团第二胶片厂 | Photosensitive composition suitable for heat-sensitive positive computer to plate (CTP) and lithographic plate containing same |
| CN102311694A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | Rinsing-free CTP (cytidine triphosphate) coating fluid and preparation method thereof |
| CN103881025A (en) * | 2012-12-21 | 2014-06-25 | 乐凯华光印刷科技有限公司 | Anti-solvent vinyl polymer with multilayer structure, synthetic method thereof and applications thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004170597A (en) * | 2002-11-19 | 2004-06-17 | Toyobo Co Ltd | Photosensitive printing original plate |
| CN101770170A (en) * | 2008-12-30 | 2010-07-07 | 乐凯集团第二胶片厂 | Photosensitive composition suitable for heat-sensitive positive computer to plate (CTP) and lithographic plate containing same |
| CN102311694A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | Rinsing-free CTP (cytidine triphosphate) coating fluid and preparation method thereof |
| CN103881025A (en) * | 2012-12-21 | 2014-06-25 | 乐凯华光印刷科技有限公司 | Anti-solvent vinyl polymer with multilayer structure, synthetic method thereof and applications thereof |
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