CN106949858A - Utilize the device and method of the quick particle measurement high-speed cutting deformed area strain property of power - Google Patents
Utilize the device and method of the quick particle measurement high-speed cutting deformed area strain property of power Download PDFInfo
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- CN106949858A CN106949858A CN201710312447.6A CN201710312447A CN106949858A CN 106949858 A CN106949858 A CN 106949858A CN 201710312447 A CN201710312447 A CN 201710312447A CN 106949858 A CN106949858 A CN 106949858A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/06—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring the deformation in a solid
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Abstract
The invention discloses a kind of device and method of the quick particle measurement high-speed cutting deformed area strain property of utilization power, it solves the test problem deformed in high-speed cutting, material real-time deformation measurement of full field under contactless state can be realized, and measurement accuracy is high, metering system is simple and reliable, and its technical scheme is：Including the high-speed camera being arranged on bearing, high-speed camera is right against side surface of workpiece material and removes layer, to gather the image of workpiece cutting zone；Luminous colloid, is coated on side surface of workpiece and workpiece surface；Photo-translating system, photo-translating system is right against side surface of workpiece material and removes layer or be right against workpiece surface, gathers the optical signal of workpiece and is converted to electric signal；Ultraviolet lamp, ultraviolet lamp tilts set angle and is arranged at workpiece surface.
Description
Technical field
It is more particularly to a kind of to utilize the quick particle measurement high-speed cutting deformation of power the present invention relates to deformation test technical field
The device and method of area's strain property.
Background technology
High-speed cutting is the key technology in advanced manufacture field, and it is important that cutting speed raising there occurs Material Removal Mechanism
Change.In working angles, workpiece, which cuts off layer material and produced shearing slip by blade and rake face squeezing action, causes chip and
Finished surface is formed.Plastic strain during material cutting deformation is up to 2~10, and strain rate is up to 103~106s-1.Study high-speed cutting
The real-time deformation and failure behaviour of process material, have to improving high-speed cutting processing surface quality, machining accuracy and processing efficiency
Significance.
In the range of low strain dynamic rate, the dynamic realtime deformation of material can be carried out using mechanics machine combination digital camera
Capture.And for high-speed machining process, material rate of deformation height, deformed region are small to be caused to be difficult to the measurement of workpiece material real-time deformation
Difficulty is big, is badly in need of a kind of rationally effective method of testing of design and device, captures the dynamic deformation mistake of high-speed cutting workpiece material
Journey.
In summary, effective solution is still lacked for the test problem deformed in high-speed cutting in the prior art.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, become the invention provides one kind using the quick particle measurement high-speed cutting of power
The device of shape area strain property, coats the quick particle membrane of power, by gathering the quick grain of power in workpiece material deformation process in workpiece surface
The change of sub- film briliancy, using high sensitivity electrooptical device, telecommunications is converted into by optical signal (i.e. the quick particle membrane briliancy of power)
Number, the dynamic deformation process of real-time characterization material.The present invention can realize material real-time deformation measurement of full field under contactless state,
And measurement accuracy is high, metering system is simple and reliable, it is adaptable to the measurement and analysis of high-speed cutting MATERIALS ' DYNAMIC deformation.
Further, the present invention uses following technical proposals：
A kind of device of the quick particle measurement high-speed cutting deformed area strain property of utilization power, including the height being arranged on bearing
Fast video camera, high-speed camera is right against side surface of workpiece material and removes layer, to gather the image of workpiece cutting zone；
Luminous colloid, is coated on side surface of workpiece and workpiece surface；
Photo-translating system, photo-translating system is right against side surface of workpiece material and removes layer or be right against workpiece upper table
Face, gathers the optical signal of workpiece and is converted to electric signal；
Ultraviolet lamp, ultraviolet lamp tilts set angle and is arranged at workpiece surface.
The device of the present invention sets high-speed camera, can gather the image of workpiece cutting zone, ultraviolet lamp is radiated at
On the workpiece for coating luminous colloid, photo-translating system can gather the light intensity of workpiece, strong by cutting image and light
The contrast of degree, can obtain the data such as strain and deformation rate field that workpiece deforms in cutting, it is possible to achieve high-speed machining process
The non-contact measurement of middle material deformational behavior and in real time measurement.
Further, the luminous colloid is mixed by the quick particle of power and epoxy resin with setting ratio.The quick particle of power
To send the special particle of luminous ray, the workpiece in working angles under the influence of stress, friction, fracture, supersonic oscillations etc.
Surface can light, and then ensure that photo-translating system can collect light intensity change of the workpiece in working angles.
Further, the ratio of the quick particle of the power and epoxy resin is 1:1.
Further, the photo-translating system includes acquisition system, and it gathers the optical signal of luminous colloid, and by launching
System is transmitted optical signal amplification to amplification system, and the optical signals collection system after amplification is collected and is transferred to electron-optical system
System, electron-optical system converts optical signals into electric signal output.
Further, the amplification system is made up of multiple electron back beams.
Further, the electron-optical system is made up of focusing electrode and deflecting electrode.
Further, the angle of the ultraviolet lamp and workpiece surface is in 45 °.Ensure in working angles middle-ultraviolet lamp lamp
Also workpiece surface can be irradiated to.
Further, the high-speed camera and photo-translating system are connected with control system.
Further, the spacing of the high-speed camera and workpiece be 200~400mm, the photo-translating system with
The spacing of workpiece is 10~30mm, and the spacing of the ultraviolet lamp and workpiece is 20~40mm.Set in this spacing range
High-speed camera, photo-translating system, the position of ultraviolet lamp, can preferably ensure that it meets work requirements.
A kind of measuring method of the device of the quick particle measurement high-speed cutting deformed area strain property of utilization power, including following step
Suddenly：
1：Luminous colloid is prepared, and luminous colloid is coated on side surface of workpiece and upper surface；
2：High-speed camera and photo-translating system are arranged at the position for facing side surface of workpiece material removal layer, it is purple
The light of outside line lamp is against workpiece surface；
3：Ultraviolet lamp is opened, high speed orthogonal cutting, the image of high-speed camera collection workpiece cutting, light are carried out to workpiece
The optical signal of power conversion system collection workpiece surface is simultaneously converted to electric signal；
4：Deformation of the workpiece in working angles is drawn by the image of cutting, obtained by the optical signal of workpiece surface
To light intensity change of the workpiece in working angles, and then obtain strain and the strain rate of side surface of workpiece；
5：Photo-translating system movement is arranged in just to workpiece surface, repeat step 3 is drawn by the image of cutting
Deformation of the workpiece in working angles, obtains light intensity of the workpiece in working angles by the optical signal of workpiece surface and becomes
Change, and then obtain strain and the strain rate of workpiece surface.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) present invention can realize the non-contact measurement of material deformational behavior and measurement in real time in high-speed machining process：
The quick particle of power coated by workpiece material surface, it is multiple without pasting foil gauge or connection dynamometer etc. to workpiece or tool surface
Miscellaneous operation, realizes the image to chip forming procedure material deformational behavior and real-time collection and the place of material flow stress data
Reason.
(2) strong applicability of the present invention, goes under a variety of processing modes the real-time measurement of material deformational behavior and non-
Contact type measurement.The including but not limited to processing mode such as turnery processing, Milling Process, planing operation.It can realize that ultrahigh speed adds
Material deformational behavior measurement during work.
(3) present invention can be realized to the observation of various dimensions and data capture in workpiece working angles.By changing photoelectricity
The position of converting system, can be from multi-view analysis chip formation mechenism.
Brief description of the drawings
The Figure of description for constituting the part of the application is used for providing further understanding of the present application, and the application's shows
Meaning property embodiment and its illustrate be used for explain the application, do not constitute the improper restriction to the application.
Fig. 1 is that the quick particle,colloid of power is coated in the cutting schematic diagram after workpiece material surface；
Fig. 2 arranges schematic diagram for the device of measurement material high-speed machining process knife bits contact zone strained situation；
Fig. 3 arranges schematic diagram for the device of measurement material high-speed machining process workpiece Free Surface strained situation；
In figure, 1, workpiece；2nd, chip；3rd, cutter；4th, ultraviolet lamp；5th, high-speed camera；6th, photo-translating system；7th, prop up
Seat；1. side surface of workpiece, 2. workpiece surface.
Embodiment
It is noted that described further below is all exemplary, it is intended to provide further instruction to the application.Unless another
Indicate, all technologies used herein and scientific terminology are with usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative
It is also intended to include plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " bag
Include " when, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
As background technology is introduced, there is the test problem deformed in high-speed cutting in the prior art, in order to solve
As above technical problem, present applicant proposes a kind of device of the quick particle measurement high-speed cutting deformed area strain property of utilization power.
In a kind of typical embodiment of the application, the quick particle measurement of power is utilized at a high speed there is provided one kind as shown in Figure 2
The device of cutting deformation area strain property, is for capture high speed orthogonal cutting process metal material real-time deformation and failure behaviour
Device.
The device includes the high-speed camera 5 being arranged on bearing 7, and high-speed camera 5 is right against the side material of workpiece 1 and gone
Except layer, to gather the image of workpiece cutting zone；
Luminous colloid, is coated on the side of workpiece 1 and the upper surface of workpiece 1；
Photo-translating system 6, photo-translating system 6 is right against the side material of workpiece 1 and removes layer or be right against on workpiece 1
Surface, gathers the optical signal of workpiece 1 and is converted to electric signal；
Ultraviolet lamp 4, ultraviolet lamp 4 tilts set angle and is arranged at the upper surface of workpiece 1.
Workpiece 1 is installed in high-speed processing machine tool, with ultraviolet lamp 4, high-speed digital photography machine 5, the structure of photo-translating system 6
Into measuring system.High-speed digital photography machine 5 is arranged on bearing 7, high-speed camera 5 and opto-electronic conversion system with photo-translating system 6
System 6 is just to workpiece, and the spacing of high-speed camera 5 and workpiece 1 is 200~400mm, and photo-translating system 6 and the spacing of workpiece 1 are
10~30mm, ultraviolet lamp 4 is 20~40mm with the spacing of workpiece 1.
Specifically, could be arranged to：Photo-translating system 6 is 20mm, the camera lens of high-speed camera 5 and work with the distance of workpiece
The distance of part is 300mm；Ultraviolet lamp 4 be arranged on workpiece front upper place, with photo-translating system 6 in 45 ° installation, ultraviolet lamp with
The angle of workpiece surface is in 45 °, and light just removes layer side to workpiece material, apart from workpiece 30mm.
Luminous colloid is mixed by the quick particle of power and epoxy resin with setting ratio.The ratio of the quick particle of power and epoxy resin
Example can be selected as 1:1.As shown in figure 1, the quick particle of power is ground to form into fine powder using mortar, according to 1：1 ratio is by itself and epoxy
Mixed with resin is stirred, and prepares luminous colloid, the colloid is coated uniformly on to the work of the material of workpiece 1 by screen printing technique
1. 2. and dried with workpiece surface part side.The thickness control of luminous colloid is in 1 μm.
The molecular formula of the quick particle of power is SrAl2O4:(Eu2+,Dy3+), in the influence such as stress, friction, fracture, supersonic oscillations
Under send the special particle of luminous ray.The quick particle of power is coated in power in workpiece material surface, collection workpiece material deformation process
The change of quick particle membrane briliancy, by highly sensitive electrooptical device, converts optical signals into electric signal, further data
Handle the dynamic deformation process of real-time characterization material.
Photo-translating system 6 is main by collecting window, emission system, amplification system, collection system, electron-optical system group
Into.By the equipment, by optical signal amplification and electric signal output is converted into.Acquisition system gathers the optical signal of luminous colloid,
And transmitted optical signal amplification by emission system to amplification system, the optical signals collection system after amplification is collected and is transferred to electricity
Sub- optical system, electron-optical system converts optical signals into electric signal output.
Amplification system is made up of multiple electron back beams, and reflector constitutes the dynode system of a synthesis.
Collection system is located near amplification system, and the electron stream after amplification is collected.
Electron-optical system is made up of focusing electrode and deflecting electrode, and to be focused processing to incident light, lifting turns
Change efficiency.
High-speed camera 5 and photo-translating system 6 are connected with control system.
High-speed camera 5 is connected computer progress image with photo-translating system 6 and graph curve is exported in real time.
The ultraviolet crest of ultraviolet lamp 4 is 365nm, power 550W.
For from multi-view analysis chip forming procedure, as shown in figure 3, can by photo-translating system 6 just to the chip back side,
The strain and deformation rate field distribution at the chip back side can be obtained in real time.
When measuring operation using the device of the present invention, high-speed camera 5, ultraviolet lamp 4, opto-electronic conversion are opened successively
System 6, therewith on lathe carry out high-speed cutting operation, high-speed digital photography machine collection working angles in workpiece, chip and
Cutter and the deformation in chip contact face, by the light intensity for contrasting diverse location, you can obtain the strain of workpiece deformation
And deformation rate field.Light intensity change in the collection working angles of photo-translating system 6, and electric signal output is converted into computer
In, it can obtain the data such as strain and the strain rate of workpiece after treatment.
In another typical embodiment of the application the quick particle measurement high-speed cutting deformation of power is utilized there is provided one kind
The measuring method of the device of area's strain property, is comprised the following steps that：
The quick particle of power is ground to form into fine powder, luminous colloid is prepared, and luminous colloid is coated on side surface of workpiece and upper table
Face, and dry；
Test device main body is built, that is, builds photo-translating system and high-speed camera, it is ensured that photo-translating system and height
Fast video camera is parallel and is right against workpiece material removal layer, and the distance of photo-translating system and workpiece is 20mm.High-speed camera
The distance of camera lens and workpiece is 300mm.Ultraviolet lamp is installed in lathe, and light just removes layer and apart from workpiece to workpiece material
30mm.Ensure that high-speed camera and photo-translating system are arranged at the position for facing side surface of workpiece material removal layer, it is ultraviolet
The light of line lamp is against workpiece surface；
Ultraviolet lamp is opened, high speed orthogonal cutting, the image of high-speed camera collection workpiece cutting, photoelectricity are carried out to workpiece
The optical signal of converting system collection workpiece surface is simultaneously converted to electric signal；Real-time light intensity change letter is gathered by photo-translating system
Number, state is cut off by high-speed camera collection in real time；The frame per second of shooting process high speed digital camera be 10000~
80000fps, is strained and deformation rate field with ensureing to capture complete knife bits contact zone.
Deformation of the workpiece in working angles is drawn by the image of cutting, obtained by the optical signal of workpiece surface
Light intensity change of the workpiece in working angles, and then obtain strain and the deformation rate field in workpiece cutting deformation region；
For from multi-view analysis chip forming procedure, just to workpiece surface, i.e., photo-translating system movement is arranged in
Just to the workpiece chips back side, apart from workpiece apart from 30mm, other setting positions are constant.Repeat the above steps, pass through the figure of cutting
As drawing deformation of the workpiece in working angles, light of the workpiece in working angles is obtained by the optical signal of workpiece surface
Strong change, and then obtain strain and the deformation rate field of workpiece surface.
In order that the technical scheme of the application can clearly be understood by obtaining those skilled in the art, below with reference to tool
The embodiment of body describes the technical scheme of the application in detail.
Reference picture 1, high-speed cutting deformed area is carried out using speed lathe to the Titanium alloy Ti-6Al-4V for coating the quick particle of power
Strain/the strain rate in domain is measured in real time.Two surfaces of workpiece are coated into the quick particle of power first, workpiece is filled according to shown in Fig. 1
It is sandwiched in speed lathe.Reference picture 2, builds test device, and high-speed camera, photo-translating system are installed on into support system, will
Ultraviolet lamp is arranged in speed lathe.Fix the distance between three and workpiece.Observe high-speed camera image, it is ensured that work
Part-tool contact area is located in video camera figure amplitude range.
After measurement apparatus installation, high-speed dry cutting processing is carried out.Open high-speed camera, ultraviolet successively first
Lamp, photo-translating system, later on lathe are cut.Workpiece is observed in working angles and tool contact area ensures it in height
In speed digital video camera coverage.
Reference picture 3, photo-translating system is installed on inside lathe, just to workpiece Free Surface, apart from workpiece distance
30mm, other setting positions are constant.High-speed camera, ultraviolet lamp, photo-translating system are opened successively, and later on lathe enters
Row cutting.Workpiece is observed in working angles and tool contact area ensures it in high-speed digital photography machine coverage.
After image and light intensity data collection are finished, the data being output in computer are further processed.To cut
Preceding intensity image is sample, using intensity image as target, the working angles image of contrast processing high-speed camera collection.Pass through
The different light intensities of corresponding region in contrast sample's image and target image, you can determine the deflection of workpiece.Opto-electronic conversion
The electric signal output that light intensity changes is that can obtain the strain of workpiece deformed region and answer into computer, after treatment by system
The data such as variability.
The preferred embodiment of the application is the foregoing is only, the application is not limited to, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of device of the quick particle measurement high-speed cutting deformed area strain property of utilization power, it is characterized in that, including it is arranged at branch
High-speed camera on seat, high-speed camera is right against side surface of workpiece material and removes layer, to gather the image of workpiece cutting zone；
Luminous colloid, is coated on side surface of workpiece and workpiece surface；
Photo-translating system, photo-translating system is right against side surface of workpiece material and removes layer or be right against workpiece surface, adopts
Collect the optical signal of workpiece and be converted to electric signal；
Ultraviolet lamp, ultraviolet lamp tilts set angle and is arranged at workpiece surface.
2. device as claimed in claim 1, it is characterized in that, the luminous colloid is by the quick particle of power and epoxy resin to set ratio
Example is mixed.
3. device as claimed in claim 2, it is characterized in that, the ratio of the quick particle of power and epoxy resin is 1:1.
4. device as claimed in claim 1, it is characterized in that, the photo-translating system includes acquisition system, and it gathers luminous
The optical signal of colloid, and transmitted optical signal amplification by emission system to amplification system, the optical signals collection system after amplification
Collect and be transferred to electron-optical system, electron-optical system converts optical signals into electric signal output.
5. device as claimed in claim 4, it is characterized in that, the amplification system is made up of multiple electron back beams.
6. device as claimed in claim 4, it is characterized in that, the electron-optical system is by focusing electrode and deflecting electrode group
Into.
7. device as claimed in claim 1, it is characterized in that, the angle of the ultraviolet lamp and workpiece surface is in 45 °.
8. device as claimed in claim 1, it is characterized in that, the high-speed camera and photo-translating system are and control system
Connection.
9. device as claimed in claim 1, it is characterized in that, the spacing of the high-speed camera and workpiece is 200~400mm,
The photo-translating system and the spacing of workpiece are 10~30mm, and the spacing of the ultraviolet lamp and workpiece is 20~40mm.
10. the measuring method of the device as described in claim any one of 1-9, it is characterized in that, comprise the following steps：
1：Luminous colloid is prepared, and luminous colloid is coated on side surface of workpiece and upper surface；
2：High-speed camera and photo-translating system are arranged at the position for facing side surface of workpiece material removal layer, ultraviolet
The light of lamp is against workpiece surface；
3：Ultraviolet lamp is opened, high speed orthogonal cutting is carried out to workpiece, the image of high-speed camera collection workpiece cutting, photoelectricity turns
Change the optical signal of system acquisition workpiece surface and be converted to electric signal；
4：Deformation of the workpiece in working angles is drawn by the image of cutting, work is obtained by the optical signal of workpiece surface
Light intensity change of the part in working angles, and then obtain strain and the strain rate of side surface of workpiece；
5：Photo-translating system movement is arranged in just to workpiece surface, repeat step 3 draws workpiece by the image of cutting
Deformation in working angles, obtains light intensity of the workpiece in working angles by the optical signal of workpiece surface and changes, enter
And obtain strain and the strain rate of workpiece surface.
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|---|---|---|---|
| CN201710312447.6A CN106949858B (en) | 2017-05-05 | 2017-05-05 | Utilize the device and method of power quick particle measurement high-speed cutting deformed area strain property |
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| CN109176590A (en) * | 2018-10-18 | 2019-01-11 | 山东大学 | A kind of flexible finger tip, device and method with the sliding feel perception of pressure |
| CN114683081A (en) * | 2022-04-25 | 2022-07-01 | 山东大学 | Workpiece low-damage deformation control system based on multi-source perception of cutting process |
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| CN106949858B (en) | 2019-09-10 |
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