CN106946468A - Resistive formation, contactor control device and preparation method thereof - Google Patents
Resistive formation, contactor control device and preparation method thereof Download PDFInfo
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- CN106946468A CN106946468A CN201710082003.8A CN201710082003A CN106946468A CN 106946468 A CN106946468 A CN 106946468A CN 201710082003 A CN201710082003 A CN 201710082003A CN 106946468 A CN106946468 A CN 106946468A
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- resistive formation
- control device
- contactor control
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
- C03C2217/23—Mixtures
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Chemical & Material Sciences (AREA)
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- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Position Input By Displaying (AREA)
Abstract
The present invention relates to a kind of resistive formation, contactor control device and preparation method thereof.The material of wherein described resistive formation is the mixture of antimony oxide and tin oxide, and the mass ratio of the antimony oxide and the tin oxide is 30~60:40~70.The application has found that resistive formation uses above-mentioned new material by experimental study once in a while, and its anti-static effect is good, strong anti-interference performance.There is preferable anti-static effect for contactor control device, and its touch-control sensitivity is high.In addition the light transmittance of resistive formation is good, and transmissivity >=99% has preferable display effect for contactor control device.Specifically, the surface resistance of the resistive formation is 1 × 107~1 × 108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
Description
Technical field
The present invention relates to display device technical field, more particularly to a kind of resistive formation, contactor control device and preparation method thereof.
Background technology
There is the paradox of a pair of long-standing problem researchers in the anti-interference high resistant technical research of In-cell touch panel,
I.e.：The resistance of resistive formation is bigger, and anti-static effect is got over unobvious；The resistance of resistive formation is smaller, and anti-static effect is better；But it is high
The resistance of resistance layer is too small, In-cell touch panel is interfered it is bigger, and then influence touch effect.So obtain to prevent quiet
Electric and anti-interference touch-screen is very difficult.Current settling mode is led on the polaroid on touch-control display layer outer surface
Cross coating technique and coat one layer of jamproof transparent functional film of antistatic, but the technology is currently in monopoly position, uses this
Processing method high cost, effect has much room for improvement.Country's correlation technique belongs to blank at present, it is therefore necessary to provide it is a kind of it is new both
Can antistatic and anti-interference contactor control device and preparation method thereof.
The content of the invention
Based on this, it is necessary to provide it is a kind of it is new can antistatic anti-interference resistive formation, contactor control device and its system again
Preparation Method.
A kind of resistive formation, the material of the resistive formation is antimony oxide and the mixture of tin oxide, three oxidation two
The mass ratio of antimony and the tin oxide is 30~60:40~70.
The application has found that resistive formation uses above-mentioned new material by experimental study once in a while, and its anti-static effect is good, anti-interference
Performance is strong.There is preferable anti-static effect for contactor control device, and its touch-control sensitivity is high.In addition the light transmittance of resistive formation
Good, transmissivity >=99% has preferable display effect for contactor control device.Specifically, the surface resistance of the resistive formation be 1 ×
107~1 × 108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
In wherein one embodiment, the mass ratio of the antimony oxide and the tin oxide is 38~45:55~62.
The preparation method of above-mentioned resistive formation, comprises the following steps：
Substrate is provided；Sputtering forms the resistive formation on the substrate；The target of the sputtering be antimony oxide and
The mixture of tin oxide.
The preparation method of above-mentioned resistive formation, the resistive formation of above-mentioned new material is obtained using above-mentioned target as sputter, its antistatic
Effect is good, strong anti-interference performance.There is preferable anti-static effect for contactor control device, and its touch-control sensitivity is high.In addition it is high
The light transmittance of resistance layer is good, transmissivity >=99%, has preferable display effect for contactor control device.
In wherein one embodiment, the sputtering on the substrate is the step of form the resistive formation：By low
The mode of warm plasma sputtering is by target as sputter to the surface of the substrate；The temperature of the low-temperature plasma sputtering is 35~45
DEG C, the vacuum of low-temperature plasma sputtering is 0.2~0.3Pa, the sputtering power of the low-temperature plasma sputtering for 1.2~
1.5KW。
In wherein one embodiment, the sputter gas of the low-temperature plasma sputtering includes oxygen and argon gas, wherein institute
The flow for stating oxygen is 24~30sccm, and the flow of the argon gas is 1150~1180sccm.
A kind of contactor control device, including touch display substrate, rear polaroid, preceding polaroid, cover plate, backlight module and above-mentioned height
Resistance layer；The one side of the touch display substrate is sequentially provided with the resistive formation, the preceding polaroid and the cover plate, described to touch
The another side of control display base plate is sequentially provided with the rear polaroid and the backlight module.
Above-mentioned contactor control device, using the resistive formation of above-mentioned new material, the anti-static effect of the resistive formation is good, interference free performance
By force so that contactor control device has preferable anti-static effect, and its touch-control sensitivity is high.In addition the light transmittance of resistive formation is good, thoroughly
Rate >=99% is penetrated, there is preferable display effect for contactor control device.Specifically, the surface resistance of the resistive formation is 1 × 107~1
×108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
In wherein one embodiment, the thickness of the resistive formation is 20~100nm.
In wherein one embodiment, the touch display substrate includes two layers of electrically-conductive backing plate and is encapsulated in described two layers
Touch control display module between electrically-conductive backing plate.
A kind of preparation method of contactor control device, comprises the following steps：
Touch display substrate is provided；
Sputter to form above-mentioned resistive formation in the one side of the touch display substrate, the target of the sputtering is three oxidations two
The mixture of antimony and tin oxide；Polaroid and cover plate before being sequentially formed on the resistive formation, in the touch display substrate
Another side sequentially forms rear polaroid and backlight module, obtains the contactor control device.
Above-mentioned contactor control device, using the resistive formation of above-mentioned new material, the anti-static effect of the resistive formation is good, interference free performance
By force.Obtained contactor control device has preferable anti-static effect, and its touch-control sensitivity is high.In addition the light transmittance of resistive formation is good,
Transmissivity >=99%, has preferable display effect for contactor control device.Specifically, the surface resistance of the resistive formation is 1 × 107~
1×108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
In wherein one embodiment, the touch display substrate includes two layers of electrically-conductive backing plate and is encapsulated in described two layers
Touch control display module between electrically-conductive backing plate, the UV that two layers of electrically-conductive backing plate passes through two kinds of different viscosities close to the position at edge
Glue sticking, same position first passes through the larger UV glue stickings of viscosity, then passes through the less UV glue stickings of viscosity.
Brief description of the drawings
Fig. 1 is the structural representation of the contactor control device of an embodiment.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give presently preferred embodiments of the present invention.But, the present invention can be realized in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
The arbitrary and all combination of the Listed Items of pass.
Reference picture 1, the contactor control device 10 of an embodiment, including touch display substrate 11, resistive formation 12, rear polaroid 13,
Preceding polaroid 14, cover plate 15 and backlight module 16.
Specifically, touch display substrate 11 includes two layers of electrically-conductive backing plate 111 and is encapsulated between two layers of electrically-conductive backing plate 111
Touch control display module 113.Specifically in the present embodiment, touch display substrate 11 be TFT (Thin Film Transistor,
That is TFT) liquid crystal display substrate, wherein touch control display module 113 contains liquid crystal molecule and circuit.
Specifically, the periphery of two layers of electrically-conductive backing plate 111 by the UV glue of two kinds of different viscosities (be also known as light-sensitive emulsion, it is ultraviolet
Optic-solidified adhesive) adhering and sealing, same position first passes through the larger UV glue stickings of viscosity, then passes through the less UV glue stickings of viscosity.
During in order to prevent that touch display substrate 11 from cleaning water inlet and during in vacuum environment atm difference influence, it is necessary to
Ensure the adaptation encapsulated between two layers of electrically-conductive backing plate 111.
Due to the speed of the viscosity influence strike-through of UV glue, and then influence the adaptation and product between two electrically-conductive backing plates 111
Yield；Strike-through excess or strike-through deficiency can all cause the circuit of the touch control display module 113 encapsulated between two electrically-conductive backing plates 111
It is impaired.
So interlocked using the UV glue of two kinds of different viscosities and used, the larger UV glue of viscosity can be made to ensure adhesive strength, glued
Less UV glue enhancing mobility is spent, so that it penetrates into the position that the larger UV glue of viscosity does not permeate, and then ensures encapsulation
Adaptation.So compare and use single UV glue, this method effectively reduces the usage amount of UV glue, and then reduces showing for strike-through
As so that the step of reducing follow-up removing glue to a certain extent.
It is furthermore preferred that the viscosity of the larger UV glue of the viscosity is 2000~3000cps, the less UV glue of viscosity
Viscosity is 800~1200cps.As being first bonded using a kind of viscosity for 2500cps UV glue penetrations, then it is with a kind of viscosity again
1000cps UV glue penetrations bonding, so can ensure sealing with filling chink.It is preferred that, the model pleasure of UV glue is safe
3493 or JS-125.
More specifically, the distance that UV glue is penetrated into electrically-conductive backing plate 111 is 5~8mm.More specifically, using injection point
UV glue, i.e., be expelled in the gap of two layers of electrically-conductive backing plate 111 by glue.More specifically, the injection pressure of the larger UV glue of the viscosity
Power is 0.5~0.6MPa, and the injection pressure of the less UC glue of viscosity is 0.3MPa.
More specifically, electrically-conductive backing plate 111 is electro-conductive glass.
Specifically in the present embodiment, the one side of touch display substrate 11 is sequentially provided with resistive formation 12, the and of preceding polaroid 14
Cover plate 15.Specifically, resistive formation 12 is formed in touch display substrate 11 on the surface of electro-conductive glass 111.
It is appreciated that in other embodiments, the one side of touch display substrate 11 is sequentially provided with preceding polaroid 14, high resistant
Layer 12 and cover plate 15.The preceding polaroid due to positioned at contactor control device 10 close to the position of cover plate 14, therefore be referred to as before polaroid.
And because touch display substrate 11 includes electrically-conductive backing plate 111, and generally require and voluntarily produce, therefore resistive formation 12 is deposited on led
The surface of electric substrate 111, is formed on preceding polaroid 14 compared to by resistive formation 12, can optimize producing line to a certain extent, carry
High production capacity.
Present invention also offers the resistive formation 12 of an embodiment.It is preferred that, the material of resistive formation 12 for antimony oxide and
The mixture of tin oxide.The mass ratio of antimony oxide and tin oxide is 30~60:40~70.
It is furthermore preferred that the mass ratio of antimony oxide and tin oxide is 38~45:55~62.
It is preferred that, the thickness of resistive formation 12 is 20~100nm.Specifically, the surface resistance of the resistive formation 12 is 1 × 107~1
×108Ω/cm2.Reflect the anti-static effect of high resistance film by surface resistance, surface resistance is bigger, and anti-static effect is poorer；Surface resistance
Smaller, anti-static effect is better.In addition transmissivity >=99% of resistive formation 12.
The surface resistance of the resistive formation 12 is relatively small, and its anti-static effect is fine.The resistive formation 12 is filled for touch-control simultaneously
The 10 anti-tampering performance tests of carry out are put, the obtained response time is 0.15~0.25s, illustrate that the sensitivity of its touch-control is high, prevent dry
Immunity can be good.As can be seen here, the anti-static effect of the resistive formation 12 is good, and anti-tampering performance is good.
The application has found that resistive formation 12 uses above-mentioned new material by experimental study once in a while, and its anti-static effect is good, resists dry
Immunity can be strong.There is preferable anti-static effect for contactor control device 10, and its touch-control sensitivity is high.Specifically, the resistive formation
12 surface resistance is 1 × 107~1 × 108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
In addition the light transmittance of resistive formation 12 is good, transmissivity >=99%, has preferable display effect for contactor control device 10.
Transmissivity refers to the ratio with forming the light transmittance before resistive formation 12 after substrate formation resistive formation 12 herein.
The another side of touch display substrate 11 is sequentially provided with rear polaroid 13 and backlight module 16.Specifically, rear polarisation
Piece 13 is formed in touch display substrate 11 on the surface of another electro-conductive glass 111.It is appreciated that the rear polaroid 13 due to
The position of cover plate 15 is located remotely from, therefore is referred to as rear polaroid.
It is preferred that, cover plate 15 is glass cover-plate.
Above-mentioned contactor control device 10, using the resistive formation 12 of above-mentioned new material, the anti-static effect of the resistive formation 12 is good, resists dry
Immunity can be strong.Obtained contactor control device 10 has preferable anti-static effect, and its touch-control sensitivity is high.In addition resistive formation 12
Light transmittance is good, transmissivity >=99%, has preferable display effect for contactor control device 10.Specifically, the face of the resistive formation 12
Resistance is 1 × 107~1 × 108Ω/cm2.The touch-control response time of contactor control device 10 is 0.15~0.25s.
Present invention also offers the preparation method of above-mentioned contactor control device, comprise the following steps.
Step S1：Touch display substrate is provided.
In the present embodiment, the substrate of resistive formation deposition is touch display substrate.It is appreciated that the substrate of resistive formation deposition
Not limited to this, can be such that resistive formation is deposited on other substrates as needed.
In wherein one embodiment, touch display substrate 11 includes two layers of electrically-conductive backing plate 111 and is encapsulated in two layers and leads
Touch control display module 113 between electric substrate 111.Step S1 includes the encapsulation step of touch display substrate 11：Touch-control is shown
Module 113 is packaged between two layers of electrically-conductive backing plate 111.
Specifically, the periphery of two layers of electrically-conductive backing plate 111 by the UV glue of two kinds of different viscosities (be also known as light-sensitive emulsion, it is ultraviolet
Optic-solidified adhesive) adhering and sealing, same position first passes through the larger UV glue stickings of viscosity, then passes through the less UV glue stickings of viscosity.
UV glue can solidify under the irradiation of UV light (ultraviolet light).Specifically, the curing schedule of UV glue is：Using UV light irradiations
To the side of electrically-conductive backing plate 111, while UV light direct beams are avoided to touch control display module 113, in order to avoid destroy touch control display module 113
In the structure such as liquid crystal molecule.More specifically, UV light vertical irradiation is on the side of electrically-conductive backing plate 111.More specifically, UV light
Intensity reaches 5000lux (lux), and the temperature of UV light irradiations is 80~90 DEG C, and the time of UV light irradiations is 25~30min.
More specifically, electrically-conductive backing plate 111 is put vertically when the curing schedule of UV glue uses the solidification of vertical method, i.e. UV glue
Put.It is appreciated that by the horizontal positioned of electrically-conductive backing plate 111 when can use the solidification of horizontal method, i.e. UV glue.Two kinds of curings
Selected according to different product.Horizontal solidification can conveniently handle the non-edging product in edge, but process is more, and high cost, production capacity is not high.
And vertical solidification method, can be cost-effective with batch cured article, without pasting heat-sensitive paper, production capacity is high, is applicable to large scale and leads
The production of electric substrate 111.
Touch display substrate 11 also includes removing glue step after encapsulating.Needed two layers of electrically-conductive backing plate 111 after UV adhesive curings
The unnecessary glue of periphery is removed.Specifically, the raised glue of periphery is removed using blade, keep the periphery of electrically-conductive backing plate 111
It is smooth and smooth.
Also include cleaning after the removing glue step of touch display substrate 11.There is cull absorption during dispensing in conduction
The surface of substrate 111, it is therefore desirable to cleaned to the cull on the surface of electrically-conductive backing plate 111 in touch display substrate 11, it is ensured that lead
The electric conductivity of electric substrate 111.Specifically, carrying out wiped clean to the cull on the surface of electrically-conductive backing plate 111 using acetone.
Also include cleaning treatment, drying process and electrostatic dissipation processing after the cleaning of touch display substrate 11.
Specifically, the operation of the cleaning treatment is washed including carrying out Water spray, cleaning agent round brush successively, cleaning agent disc brush
Wash, the cleaning of Water spray, round brush water, Water spray and high-pressure spraying.More specifically, the cleaning agent is the limited public affairs of Tianjin promise nation science and technology
The NP-E200 type LCD liquid crystal environment-friendly cleaning agents of production are taken charge of, the mass concentration of cleaning agent is 5%.More specifically, the pressure of Water spray
Power is 1.0~2.2Kg/cm2, the pressure of high-pressure spraying is 1.5~3Kg/cm2。
Specifically, the drying process is heated-air drying.The electrostatic dissipation is processed as the processing of plasma rod electrostatic dissipation.
Quality inspection after the completion of cleaning step, specific to carry out water droplet angle detection, the angular range of water droplet angle detection is accurate less than 8 scales,
Cleaning is qualified.
Step S2：Sputtering forms resistive formation on touch display substrate, and the target of sputtering is antimony oxide and tin oxide
Mixture.
Present invention also offers the preparation method of the resistive formation of an embodiment, such as step S2.The preparation side of above-mentioned resistive formation
Method, the resistive formation of above-mentioned new material is obtained using above-mentioned target as sputter, and its anti-static effect is good, strong anti-interference performance.For touching
Control device has preferable anti-static effect, and its touch-control sensitivity is high.In addition the light transmittance of resistive formation is good, and transmissivity >=
99%, there is preferable display effect for contactor control device.
It is preferred that, the mass ratio of antimony oxide and tin oxide is 38~45:55~62.
In wherein one embodiment, the step of resistive formation is formed on touch display substrate is：Pass through low-temperature plasma
The mode of sputtering is by the surface of target as sputter to touch display substrate；Target is the mixture of antimony oxide and tin oxide, low temperature etc.
The temperature of ion sputtering is 35~45 DEG C, and the vacuum of low-temperature plasma sputtering is 0.2~0.3Pa, low-temperature plasma sputtering
Sputtering power is 1.2~1.5KW.Plasma radiofrequency is sputtered：Radio-frequency sputtering is to utilize the cation in rf (discharge) plasma
Target is bombarded, sputters target atom to be deposited on the technology of substrate surface.
The preparation method of above-mentioned resistive formation, is sputtered using low-temperature plasma, the discharge of green non-pollution thing, technique cleaning, letter
It is single, there are energy-saving and emission-reduction.Temperature compared to vacuum sputtering at 80~100 DEG C is sputtered, and this method spatter film forming speed is fast,
Sputter temperature is relatively low, it is to avoid high temperature, which causes liquid crystal molecule to break ring and UV glue and expanded with heat and contract with cold in vacuum high-temperature environment, causes glue pine
The problem of dynamic and then formation liquid crystal vacuum bubbles, the problem of vacuum high-temperature ambient influnence product is unstable is so avoided, is improved
Yield.In addition, this method sputter temperature is relatively low, energy consumption has been saved to a certain extent.
More specifically, the target sputtering of low-temperature plasma sputtering is away from for 6cm.Low-temperature plasma sputtering sputter rate be
18nm/min.Compared to DC sputtering, the sedimentation rate of this method is fast, and sputtering yield is high, and avoids that substrate heating is too fast to be led
The problem of film layer is damaged is caused, and then improves the uniformity and stability of resistive formation, it is adaptable to the production of large scale resistive formation.
It is preferred that, low-temperature plasma sputtering sputter gas be oxygen and argon gas, wherein the flow of oxygen be 24~
30sccm, the flow of argon gas is 1150~1180sccm.It is furthermore preferred that the purity of oxygen and argon gas is all higher than or is equal to
99.999%.Specifically, in the present embodiment, oxygen and argon gas are individually entered, air-flow is independent, rather than mixed gas, such as
This can preferably play the effect of oxygen and argon gas, and then obtain the higher resistive formation of transmissivity.
The effect of argon gas is to become argon ion, argon ion bombardment target material surface, target under conditions of low-temperature plasma sputtering
Atom is escaped by collision from target material surface, and the target atom of effusion is sputtered atom, and sputtered atom deposits to be formed in substrate surface
Resistive formation.The effect of oxygen is oxidation target material surface and sputtered atom so that the resistive formation of formation has good translucency.Tool
Body, be above-mentioned flow velocity by controlling oxygen and argon gas, and then obtain transmissivity up to 99% resistive formation.
Specifically in the present embodiment, continuously splashed using two targets in the step of resistive formation is formed on touch display substrate
Penetrate, i.e., two groups cathode targets are sputtered side by side.
It is preferred that, the thickness of resistive formation is 20~100nm, it will be understood that the thickness of resistive formation can by low temperature etc. from
The time of son sputtering is controlled, and resistive formation is prepared so that the thickness of resistive formation is controllable using the present invention.Obtained resistive formation, its face
Resistance is 1 × 107~1 × 108Ω/cm2, its transmissivity >=99%.
Step S3：Polaroid and cover plate before being sequentially formed on resistive formation.
Step S4：Polaroid and backlight module after being sequentially formed in the another side of touch display substrate, obtain touch-control dress
Put.
It is appreciated that step S3~S4 is using conventional method in industry.It should be noted that above-mentioned contactor control device
Preparation method the step of be not limited to take said sequence, can also be adjusted as needed.
The preparation method of above-mentioned contactor control device, using the resistive formation of above-mentioned new material, the anti-static effect of the resistive formation is good,
Strong anti-interference performance.Obtained contactor control device has preferable anti-static effect, and its touch-control sensitivity is high.In addition resistive formation
Light transmittance is good, transmissivity >=99%, has preferable display effect for contactor control device.Specifically, the surface resistance of the resistive formation
For 1 × 107~1 × 108Ω/cm2.The touch-control response time of contactor control device is 0.15~0.25s.
It is specific embodiment below.
Embodiment 1
The contactor control device of embodiment 1 and its preparation method of resistive formation are as follows.
TFT liquid crystal display substrates are provided, comprised the following steps：
Encapsulate dispensing：Touch control display module is packaged between two layers of electrically-conductive backing plate, the periphery of two layers of electrically-conductive backing plate first exists
Injection pressure is the UV glue stickings that injection viscosity is 2500cps under 0.5MPa, and same position is again in the case where injection pressure is 0.3MPa
Injection viscosity is 1000cps UV glue stickings.
Solidification：The curing schedule of UV glue makes UV light vertical irradiation to the side of electrically-conductive backing plate using vertical method, keeps away simultaneously
Exempt from UV light direct beams to touch control display module.Wherein the intensity of UV light is 5000lux, and the temperature of UV light irradiations is 80 DEG C, UV illumination
The time penetrated is 25min.
Removing glue：The raised glue of periphery is removed using blade, keeps the periphery of electrically-conductive backing plate smooth and smooth.
Cleaning：Wiped clean is carried out to the cull on the surface of electrically-conductive backing plate using acetone.
Cleaning treatment, drying process and electrostatic dissipation processing are carried out successively, obtain TFT liquid crystal display substrates.The cleaning
The operation of processing including carrying out Water spray successively, cleaning agent round brush is washed, cleaning agent disc brush is washed, Water spray, round brush water are cleaned, water spray
Drench and high-pressure spraying.Wherein cleaning agent is the NP-E200 type LCD liquid crystal Environment protection cleanings that Tianjin Nuo Bang Science and Technology Ltd.s produce
Agent, the mass concentration of cleaning agent is 5%.The pressure of Water spray is 2.2Kg/cm2, the pressure of high-pressure spraying is 2Kg/cm2。
Sputter to form resistive formation on the electrically-conductive backing plate surface of TFT liquid crystal display substrates, specifically include step：Pass through low temperature etc.
The mode of ion sputtering is by the surface of target as sputter to touch display substrate；Target is the mixture of antimony oxide and tin oxide, three
The mass ratio for aoxidizing two antimony and tin oxide is 38:62.The temperature of low-temperature plasma sputtering is 45 DEG C, and it is true that low-temperature plasma is sputtered
Reciprocal of duty cycle is 0.2Pa, and the sputtering power of low-temperature plasma sputtering is 1.5KW.The target sputtering of low-temperature plasma sputtering is away from for 6cm.It is low
The sputter rate of warm plasma sputtering is 18nm/min.The sputter gas of low-temperature plasma sputtering is oxygen and argon gas, wherein oxygen
The flow of gas is 24sccm, and the flow of argon gas is 1180sccm.The purity of oxygen and argon gas is all higher than or equal to 99.999%.
The thickness of the resistive formation arrived is 100nm, and surface resistance is 8 × 107Ω/cm2.Wherein the surface resistance of resistive formation is public using Mitsubishi
Department model MCP-HT800 high resistant analyzer test is obtained.
Polaroid and cover plate before being sequentially formed on resistive formation, sequentially form in the another side of touch display substrate and retrodeviate
Mating plate and backlight module, obtain contactor control device.
Embodiment 2
The preparation method of the contactor control device of embodiment 2 is substantially the same manner as Example 1, and difference is the preparation of resistive formation
Step：By the surface of target as sputter to touch display substrate by way of low-temperature plasma is sputtered；Target is antimony oxide and oxygen
The mass ratio of the mixture of change tin, antimony oxide and tin oxide is 45:55.The temperature of low-temperature plasma sputtering is 35 DEG C, low
The vacuum of warm plasma sputtering is 0.3Pa, and the sputtering power of low-temperature plasma sputtering is 1.2KW.Low-temperature plasma sputtering
Target sputtering is away from for 6cm.The sputter rate of low-temperature plasma sputtering is 18nm/min.The sputter gas of low-temperature plasma sputtering is oxygen
The flow of gas and argon gas, wherein oxygen is 30sccm, and the flow of argon gas is 1150sccm.The purity of oxygen and argon gas be all higher than or
Equal to 99.999%.The thickness of obtained resistive formation is 20nm, and surface resistance is 1 × 107Ω/cm2。
Embodiment 3
The preparation method of the contactor control device of embodiment 3 is substantially the same manner as Example 1, and difference is the preparation of resistive formation
Step：By the surface of target as sputter to touch display substrate by way of low-temperature plasma is sputtered；Target is antimony oxide and oxygen
The mass ratio of the mixture of change tin, antimony oxide and tin oxide is 40:60.The temperature of low-temperature plasma sputtering is 40 DEG C, low
The vacuum of warm plasma sputtering is 0.25Pa, and the sputtering power of low-temperature plasma sputtering is 1.4KW.Low-temperature plasma sputtering
Target sputtering is away from for 6cm.The sputter rate of low-temperature plasma sputtering is 18nm/min.The sputter gas of low-temperature plasma sputtering is oxygen
The flow of gas and argon gas, wherein oxygen is 28sccm, and the flow of argon gas is 1160sccm.The purity of oxygen and argon gas be all higher than or
Equal to 99.999%.The thickness of obtained resistive formation is 50nm, and surface resistance is 5 × 107Ω/cm2。
Embodiment 4
The preparation method of the contactor control device of embodiment 4 is substantially the same manner as Example 1, and difference is the preparation of resistive formation
The mass ratio of antimony oxide and tin oxide is 30 in step, its target:70.
Embodiment 5
The preparation method of the contactor control device of embodiment 5 is substantially the same manner as Example 1, and difference is the preparation of resistive formation
The mass ratio of antimony oxide and tin oxide is 60 in step, its target:40.
Embodiment 6
The preparation method of the contactor control device of embodiment 6 is substantially the same manner as Example 1, and difference is the preparation of resistive formation
The mass ratio of antimony oxide and tin oxide is 60 in step, its target:70.
The resistive formation that embodiment 1~6 is obtained tests its transmissivity using spectrometer, the resistive formation of embodiment 1~6 it is saturating
Penetrate rate >=99%.
The contactor control device of embodiment 1~6 is tested into its interference free performance using ZDS4054 oscillograph testers.Specific behaviour
As：The power supply of test fixture is opened, after nib is had good positioning, into the testing touch screen program in hardware testing, and with 20g's
Power is added in handwriting pen point point touching screen to obtain the response time of contactor control device.Note：Justified with handwritten stroke, straight line when,
As the picture of screen display should streak track with writing pencil, position also must be identical.The response time that embodiment 1~6 is obtained
It is qualified in 0.15~0.25s.Illustrate that its response time is short, the sensitivity of touch-control is high, good in anti-interference performance.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of resistive formation, it is characterised in that the material of the resistive formation is the mixture of antimony oxide and tin oxide, described
The mass ratio of antimony oxide and the tin oxide is 30~60:40~70.
2. resistive formation as claimed in claim 1, it is characterised in that the mass ratio of the antimony oxide and the tin oxide is
38~45:55~62.
3. the preparation method of resistive formation as claimed in claim 1 or 2, it is characterised in that comprise the following steps：
Substrate is provided；Sputtering forms the resistive formation on the substrate；The target of the sputtering is antimony oxide and oxidation
The mixture of tin.
4. the preparation method of resistive formation as claimed in claim 3, it is characterised in that the sputtering on the substrate forms institute
The step of stating resistive formation be：By target as sputter to the surface of the substrate by way of low-temperature plasma is sputtered；The low temperature
The temperature of plasma sputtering is 35~45 DEG C, and the vacuum of the low-temperature plasma sputtering is 0.2~0.3Pa, the low temperature etc.
The sputtering power of ion sputtering is 1.2~1.5KW.
5. the preparation method of resistive formation as claimed in claim 4, it is characterised in that the sputtering gas of the low-temperature plasma sputtering
Body includes oxygen and argon gas, wherein the flow of the oxygen is 24~30sccm, the flow of the argon gas for 1150~
1180sccm。
6. a kind of contactor control device, it is characterised in that including touch display substrate, rear polaroid, preceding polaroid, cover plate, backlight mould
Resistive formation described in group and any one of claim 1~2；The one side of the touch display substrate is sequentially provided with the high resistant
Layer, the preceding polaroid and the cover plate, the another side of the touch display substrate is sequentially provided with the rear polaroid and institute
State backlight module.
7. contactor control device as claimed in claim 6, it is characterised in that the thickness of the resistive formation is 20~100nm.
8. contactor control device as claimed in claim 6, it is characterised in that the touch display substrate include two layers of electrically-conductive backing plate with
And it is encapsulated in the touch control display module between two layers of electrically-conductive backing plate.
9. a kind of preparation method of contactor control device, it is characterised in that comprise the following steps：
Touch display substrate is provided；
The resistive formation to be formed as described in any one of claim 1~2 is sputtered in the one side of the touch display substrate, it is described to splash
The target penetrated is the mixture of antimony oxide and tin oxide；Polaroid and cover plate before being sequentially formed on the resistive formation,
The another side of the touch display substrate sequentially forms rear polaroid and backlight module, obtains the contactor control device.
10. the preparation method of contactor control device as claimed in claim 9, it is characterised in that the touch display substrate includes two
Layer electrically-conductive backing plate and the touch control display module being encapsulated between two layers of electrically-conductive backing plate, two layers of electrically-conductive backing plate is close to side
The position of edge is by the UV glue stickings of two kinds of different viscosities, and same position first passes through the larger UV glue stickings of viscosity, then by viscous
Spend less UV glue stickings.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109935386A (en) * | 2017-12-15 | 2019-06-25 | 南昌欧菲光学技术有限公司 | High resistance film and composite membrane and its electronic device comprising the high resistance film |
| CN109935387A (en) * | 2017-12-15 | 2019-06-25 | 南昌欧菲光学技术有限公司 | High resistance film and composite membrane and its electronic device comprising the high resistance film |
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| CN105970167A (en) * | 2016-05-23 | 2016-09-28 | 深圳市众诚达应用材料科技有限公司 | Antimony-doped tin oxide (ATO) film for touch screen and preparation method of ATO film |
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