CN106941762A - A kind of preparation method of flexible PCB - Google Patents
A kind of preparation method of flexible PCB Download PDFInfo
- Publication number
- CN106941762A CN106941762A CN201710263065.9A CN201710263065A CN106941762A CN 106941762 A CN106941762 A CN 106941762A CN 201710263065 A CN201710263065 A CN 201710263065A CN 106941762 A CN106941762 A CN 106941762A
- Authority
- CN
- China
- Prior art keywords
- waste material
- product
- punched
- flexible pcb
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of preparation method of flexible PCB, including product；The product is made up of five-layer structure, and centre is that both sides are provided with copper foil layer above and below substrate layer, substrate layer, and copper foil layer outside is provided with protection film layer；The product outward flange is provided with 0.2mm waste material, and waste material is same with product is made up of five layers of identical structure；During punching, it is punched in two steps, the first step, waste material is punched and multiple spaced waste material support blocks are left, waste material support block is punched by second step；The preparation method of flexible PCB of the present invention is that ensure that punching strength, but it is effective warped because caused by waste material is too thin when avoiding punching, crimping weighs product wounded.
Description
Technical field
The present invention relates to a kind of preparation method of circuit board, waste material crimping can be prevented by refering in particular to one kind, scratch flexible PCB
Flexible PCB preparation method.
Background technology
At present, the product punching process during the flexible PCB in electronics industry makes, as shown in accompanying drawing 1-2, product is
Five-layer structure, including intermediate base material, base material both sides, which are provided with the outside of copper foil layer, copper foil layer, is equipped with diaphragm, and product outward flange
The wide waste materials of 0.2mm be then three-decker, copper foil layer is washed off in copper erosion process；When product is punched, waste material is three-layered node
Structure, support strength is inadequate, and waste material is too thin, and waste material caused by punching easily, which warps, weighs product wounded, so that influence circuit board conductive
Performance, the product qualified rate for making flexible PCB is relatively low.Therefore, we, which have developed one kind, can prevent waste material crimping, scratch
The preparation method of the flexible PCB of flexible PCB.
The content of the invention
The invention aims to overcome the deficiencies in the prior art and waste material crimping can be prevented by providing one kind, flexible electrical is scratched
The preparation method of the flexible PCB of road plate.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：A kind of preparation method of flexible PCB, including system
Product；The product is made up of five-layer structure, and centre is that both sides are provided with the outside of copper foil layer, copper foil layer above and below substrate layer, substrate layer
It is provided with protection film layer；The product outward flange is provided with waste material wide 0.2mm, and waste material is same with product by five layers of identical structure
Constitute；During punching, it is punched in two steps, the first step, waste material is punched and multiple spaced waste material support blocks, second are left
Step, waste material support block is punched.
Due to the utilization of above-mentioned technical proposal, the present invention has following advantages compared with prior art：
The preparation method of flexible PCB of the present invention, waste material is made up of five-layer structure, and punching is punched in two steps, and first
Step, waste material is punched and multiple waste material support blocks are left, waste material support block is punched by second step, that is, ensure that punching is strong
Degree, but it is effective warped because caused by waste material is too thin when avoiding punching, crimping weighs product wounded.
Brief description of the drawings
Technical solution of the present invention is described further below in conjunction with the accompanying drawings：
Accompanying drawing 1 is the front view of the flexible PCB with waste material of prior art；
Accompanying drawing 2 is the waste material section view of accompanying drawing 1；
Front view when accompanying drawing 3 is flexible circuit strip waste material of the present invention；
Accompanying drawing 4 is the waste material section view of accompanying drawing 3；
Wherein：1st, product；2nd, waste material；3rd, waste material support block；4th, substrate layer；5th, protection film layer；6th, copper foil layer.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.
Accompanying drawing 3-4 is the preparation method of flexible PCB of the present invention, including product 1；The product 1 is by five layers of knot
Structure is constituted, and centre is substrate layer 4, and substrate layer is provided with copper foil layer 6 in both sides about 4, and the outside of copper foil layer 6 is provided with protection film layer 5；
The outward flange of product 1 is equally made up of provided with waste material 2 wide 0.2mm, and waste material 2 with product 1 five layers of identical structure, herein not
Tire out again and state；During punching, it is punched in two steps, the first step, waste material 2 is punched and multiple spaced waste material support blocks 3 are left,
Second step, waste material support block 3 is punched.
Due to the utilization of above-mentioned technical proposal, the present invention has following advantages compared with prior art：
The preparation method of flexible PCB of the present invention, waste material is made up of five-layer structure, and punching is punched in two steps, and first
Step, waste material is punched and multiple waste material support blocks are left, waste material support block is punched by second step, that is, ensure that punching is strong
Degree, but it is effective warped because caused by waste material is too thin when avoiding punching, crimping weighs product wounded.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and be carried out, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all cover within the scope of the present invention.
Claims (1)
1. a kind of preparation method of flexible PCB, including product；The product is made up of five-layer structure, and centre is substrate layer,
Both sides are provided with the outside of copper foil layer, copper foil layer and are provided with protection film layer above and below substrate layer；The product outward flange is wide provided with 0.2mm
Waste material, it is characterised in that：And waste material is same with product is made up of five layers of identical structure；During punching, it is punched in two steps：First
Step, waste material is punched and multiple spaced waste material support blocks are left, waste material support block is punched by second step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710263065.9A CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106941762A true CN106941762A (en) | 2017-07-11 |
| CN106941762B CN106941762B (en) | 2020-07-07 |
Family
ID=59464689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710263065.9A Active CN106941762B (en) | 2017-04-20 | 2017-04-20 | Manufacturing method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106941762B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250900A (en) * | 1995-03-07 | 1996-09-27 | Matsushita Electric Ind Co Ltd | Multiple board and unit board by use of mulitple board and assembly method for unit board |
| JPH09148688A (en) * | 1995-11-28 | 1997-06-06 | Matsushita Electric Ind Co Ltd | Solder-precoated wiring board |
| CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
| JP2010225828A (en) * | 2009-03-24 | 2010-10-07 | Canon Inc | Printed wiring board |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
| CN105828528A (en) * | 2016-05-31 | 2016-08-03 | 广东欧珀移动通信有限公司 | Jointed board for circuit boards, circuit board and mobile terminal |
-
2017
- 2017-04-20 CN CN201710263065.9A patent/CN106941762B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250900A (en) * | 1995-03-07 | 1996-09-27 | Matsushita Electric Ind Co Ltd | Multiple board and unit board by use of mulitple board and assembly method for unit board |
| JPH09148688A (en) * | 1995-11-28 | 1997-06-06 | Matsushita Electric Ind Co Ltd | Solder-precoated wiring board |
| CN1756455A (en) * | 2004-09-30 | 2006-04-05 | 日本梅克特隆株式会社 | Flexible substrate |
| JP2010225828A (en) * | 2009-03-24 | 2010-10-07 | Canon Inc | Printed wiring board |
| CN101938883A (en) * | 2010-08-26 | 2011-01-05 | 厦门弘信电子科技有限公司 | Single-side double contact flexible circuit board and making method thereof |
| CN102752963A (en) * | 2011-04-21 | 2012-10-24 | 日本梅克特隆株式会社 | Unit circuit board replacing method for integrated substrate and integrated substrate |
| CN102427660A (en) * | 2011-11-04 | 2012-04-25 | 景旺电子（深圳）有限公司 | FPC (Flexible Printed Circuit board) production method and FPC device |
| CN103635023A (en) * | 2012-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit boards |
| CN103517563A (en) * | 2013-10-16 | 2014-01-15 | 镇江华印电路板有限公司 | Flexible printed circuit board reinforcement steel piece pasting method |
| CN105451467A (en) * | 2015-12-14 | 2016-03-30 | 东莞生益电子有限公司 | Profile fabrication method for PCB |
| CN105828528A (en) * | 2016-05-31 | 2016-08-03 | 广东欧珀移动通信有限公司 | Jointed board for circuit boards, circuit board and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106941762B (en) | 2020-07-07 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20171225 Address after: Wuzhong District Wuzhong road in Suzhou city of Jiangsu province 215104 No. 1083 Stonelake glorious city building 75 room 503 Applicant after: Jiang Mina Address before: 215164 Suzhou City, Jiangsu, Xiangcheng District Huangqiao Street Wood Lane Village Applicant before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180511 Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Applicant after: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. Address before: 215104 503 room, 75 Stone Lake Hua Town, 1083 Wuzhong Road, Wuzhong District, Suzhou, Jiangsu. Applicant before: Jiang Mina |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |