JPH09148688A - Solder-precoated wiring board - Google Patents

Solder-precoated wiring board

Info

Publication number
JPH09148688A
JPH09148688A JP30922495A JP30922495A JPH09148688A JP H09148688 A JPH09148688 A JP H09148688A JP 30922495 A JP30922495 A JP 30922495A JP 30922495 A JP30922495 A JP 30922495A JP H09148688 A JPH09148688 A JP H09148688A
Authority
JP
Japan
Prior art keywords
solder
lands
board
precoated
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30922495A
Other languages
Japanese (ja)
Inventor
Tomiyo Ema
富世 江間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP30922495A priority Critical patent/JPH09148688A/en
Publication of JPH09148688A publication Critical patent/JPH09148688A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent damage of solder precoating and generation of warp of a boad itself, when solder-precoated wiring boards are stacked for dealing, by arranging a plurality of dummy lands having an equivalent form to that of solder-precoated lands, on a waste board linked with the outer peripheral part of a mounting board. SOLUTION: A plurality of dummy lands 8 having equivalent thickness to that of solder-precoated lands 6 are arranged in symmetric positions on a waste board 4. When the solder-precoated boards 1 are stacked and dealed, the adjacent boards are put in the state that the board surfaces and solder-precoated lands 6 and the dummy lands 8 arranged around the lands 6 are pressed with an average pressure. It does not happen that, as in the conventional solder- precoated wiring board, the solder-precoated lands 6 are strongly scrubbed by the adjacent board, so that the lands 6 are scarcely damaged. A force warping the solder-precoated wiring board is not applied to the board, so that the board itself is not warped.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、移動体通信機器，
携帯型ＯＡツール，携帯型ビデオカメラ，その他一般的
電子機器に使用されるプリント配線基板、特にその製造
過程におけるランドへの半田プリコートが行われた段階
の半田プリコート配線基板に関する。TECHNICAL FIELD The present invention relates to a mobile communication device,
The present invention relates to a printed wiring board used for a portable OA tool, a portable video camera, and other general electronic devices, and more particularly to a solder precoated wiring board at a stage where a solder precoat is applied to a land in the manufacturing process.

【０００２】[0002]

【従来の技術】以下、従来の半田プリコート配線基板に
ついて図４を参照しつつ説明する。図４(a)は従来の半
田プリコート配線基板の平面図、図４(b)は図４(a)のＡ
−Ａ′線に沿う断面図である。各図において、１は半田
プリコート配線基板で、部品を実装する実装基板２と、
その外周部に切り溝３を介して設けられた捨て基板４か
ら構成される。５は実装基板２上に設けられた一般部品
用ランド、６は部品実装用ランドに半田プリコートされ
た半田プリコートランドであり、この半田プリコートは
安定したリフロー半田付けを行うための手段として行わ
れる。2. Description of the Related Art A conventional solder pre-coated wiring board will be described below with reference to FIG. 4 (a) is a plan view of a conventional solder pre-coated wiring board, and FIG. 4 (b) is a plan view of FIG. 4 (a).
It is sectional drawing which follows the -A 'line. In each drawing, 1 is a solder precoat wiring board, and a mounting board 2 on which components are mounted,
It is composed of a discarded substrate 4 provided on the outer peripheral portion thereof through a kerf 3. Reference numeral 5 is a general component land provided on the mounting substrate 2, and 6 is a solder precoating land which is solder precoated on the component mounting land. This solder precoating is performed as a means for performing stable reflow soldering.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、前記の
構成から明らかなように、半田プリコートランド６の厚
みは一般部品用ランド５の厚みより大きくなっているた
め、この半田プリコート配線基板１を重ねて梱包，運
送，その他の取り扱いを行う際、隣接する基板同士は基
板表面と半田プリコートランド６が相当の圧力で強く擦
られるような状態になるため、半田プリコートランド６
が傷つけられて半田の屑を発生させたり、また、この半
田プリコートランド６による凸部が原因となって図５
(a)に示すように半田プリコート配線基板１自体が反っ
てしまうという問題点があった。これを防ぐために、図
５(b)に示すように半田プリコート配線基板１を重ねる
ときに、その間に紙やプラスチックフィルム等のセパレ
ーター７を挾むことも考えられ、これにより半田プリコ
ートランド６が傷つけられることは防止できるが、前記
の半田プリコート配線基板の反りの問題は解決されな
い。However, as is apparent from the above structure, since the thickness of the solder precoat land 6 is larger than the thickness of the general component land 5, the solder precoat wiring board 1 is overlaid. During packaging, transportation, and other handling, the adjacent substrates are in such a state that the substrate surface and the solder precoat land 6 are strongly rubbed with a considerable pressure.
As a result, the solder pre-coat land 6 causes the solder scraps to be generated and the solder pre-coat land 6 causes protrusions.
As shown in (a), there is a problem that the solder pre-coated wiring board 1 itself warps. In order to prevent this, when the solder precoat wiring board 1 is piled up as shown in FIG. 5 (b), it may be possible to sandwich the separator 7 such as paper or plastic film between them, which may damage the solder precoat land 6. However, the problem of the warp of the solder pre-coated wiring board cannot be solved.

【０００４】本発明はこのような従来の問題点を解決す
るものであり、半田プリコート配線基板を重ねて取り扱
っても、半田プリコートを傷つけ難く、また基板自体が
反ることのない半田プリコート配線基板を提供するもの
である。The present invention solves such a conventional problem, and even when the solder precoated wiring boards are stacked and handled, the solder precoat is not easily damaged and the board itself does not warp. Is provided.

【０００５】[0005]

【課題を解決するための手段】本発明の半田プリコート
配線基板は、ランド上に半田プリコートされた実装基板
の外周部位、あるいはこれに連設した捨て基板に前記実
装基板と同等の半田プリコートされた複数のランドを設
けたものである。The solder pre-coated wiring board of the present invention has the same solder pre-coat as the above-mentioned mounting board on the outer peripheral part of the mounting board solder pre-coated on the land or on the waste board connected to this. A plurality of lands are provided.

【０００６】この本発明によれば、半田プリコート配線
基板を重ねて取り扱っても、半田プリコートは傷つき難
く、また基板自体が反ることもない。According to the present invention, even when the solder precoat wiring boards are handled in an overlapping manner, the solder precoat is not easily scratched and the board itself is not warped.

【０００７】[0007]

【発明の実施の形態】以下、本発明の各実施形態につい
て図面を参照しつつ説明する。図１はその第１の実施形
態を示すものであり、図１(a)は本実施形態における半
田プリコート配線基板の平面図、図１(b)は図１(a)のＢ
−Ｂ′線に沿う断面図である。なお、図面中、前記図
４，５に示したものと同一のものについては同一符号を
用いることとする。図１において、１は半田プリコート
配線基板で、部品を実装する実装基板２と、その外周部
に切り溝３を介して設けられた捨て基板４から構成され
る。５は実装基板２上に設けられた一般部品用ランド、
６は部品実装用ランドにプリコートされた半田プリコー
トランドであり、この半田プリコートは安定したリフロ
ー半田付けを行うための手段として行われる。８は前記
捨て基板４上の対称位置に複数個設けられたダミーラン
ドで前記半田プリコートランド６と同等の厚みを持ち、
また同等の半田プリコートにより形成されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. FIG. 1 (a) is a plan view of a solder pre-coated wiring board according to the present embodiment, and FIG. 1 (b) is a portion B of FIG.
It is a sectional view taken along the line -B '. In the drawings, the same components as those shown in FIGS. 4 and 5 are designated by the same reference numerals. In FIG. 1, reference numeral 1 denotes a solder precoat wiring board, which is composed of a mounting board 2 on which components are mounted, and a waste board 4 provided on an outer peripheral portion of the wiring board via a kerf 3. 5 is a land for general parts provided on the mounting substrate 2,
Reference numeral 6 denotes a solder precoat land which is precoated on the component mounting land, and this solder precoat is performed as a means for performing stable reflow soldering. A plurality of dummy lands 8 are provided at symmetrical positions on the waste substrate 4 and have the same thickness as the solder precoat land 6.
It is also formed by an equivalent solder precoat.

【０００８】このように構成することにより、半田プリ
コート配線基板１を重ねて取り扱った場合、隣接する基
板同士は、基板表面と半田プリコートランド６及びその
周辺に設けられたダミーランド８とが平均的な圧力で押
圧される状態になり、前記従来の半田プリコート配線基
板のように、半田プリコートランド６が隣接する基板に
強く擦られるようなことがないので傷つき難く、また半
田プリコート配線基板にもこれを反らせるような力が加
わらないので基板自体が反ることもない。With this structure, when the solder pre-coated wiring boards 1 are stacked and handled, the adjacent boards have an average surface of the board, the solder pre-coated land 6 and the dummy land 8 provided around the solder pre-coated land 6. Since the solder precoat land 6 is not pressed by the adjacent substrate unlike the conventional solder precoat wiring substrate, the solder precoat land 6 is not easily scratched. The substrate itself does not warp because no force that warps the substrate is applied.

【０００９】図２は本発明の第２の実施形態を示すもの
であり、図２(a)は本実施形態における半田プリコート
配線基板の平面図、図２(b)は図２(a)のＣ−Ｃ′線に沿
う断面図である。なお、図面中、前記図１に示したもの
と同一のものは同一符号を用いるものとする。図２にお
いて、１は半田プリコート配線基板で、部品を実装する
実装基板２と、その外周部に切り溝３を介して設けられ
た捨て基板４から構成されるが、この捨て基板４は必要
に応じて設けられるものであり、本実施形態においては
省略しても差し支えない。５は実装基板２上に設けられ
た一般部品用ランド、６は部品実装用ランドにプリコー
トされた半田プリコートランドであり、この半田プリコ
ートは安定したリフロー半田付けを行うための手段とし
て行われる。９は前記実装基板２の外周部位で回路パタ
ーン等が形成されない部位に複数個設けられたダミーラ
ンドで、前記半田プリコートランド６と同等の厚みを持
ち、また同等の半田プリコートにより形成されている。FIG. 2 shows a second embodiment of the present invention. FIG. 2 (a) is a plan view of a solder pre-coated wiring board in this embodiment, and FIG. 2 (b) is a plan view of FIG. 2 (a). It is sectional drawing which follows CC 'line. In the drawings, the same parts as those shown in FIG. 1 are designated by the same reference numerals. In FIG. 2, reference numeral 1 denotes a solder pre-coated wiring board, which is composed of a mounting board 2 on which components are mounted and a discard board 4 provided on the outer peripheral portion thereof through a kerf 3. The discard board 4 is necessary. It is provided accordingly, and may be omitted in the present embodiment. Reference numeral 5 is a general component land provided on the mounting substrate 2, and 6 is a solder precoat land precoated on the component mounting land. This solder precoat is performed as a means for performing stable reflow soldering. A plurality of dummy lands 9 are provided on the outer peripheral portion of the mounting substrate 2 where no circuit pattern or the like is formed. The dummy lands 9 have the same thickness as the solder precoat lands 6 and are formed by the same solder precoat.

【００１０】このように構成することにより、半田プリ
コート配線基板１を重ねて取り扱った場合、隣接する基
板同士は、基板表面と半田プリコートランド６及びその
周辺に設けられたダミーランド９とが平均的な圧力で押
圧される状態になり、前記従来の半田プリコート配線基
板のように、半田プリコートランド６が隣接する基板に
強く擦られるようなことがないので傷つき難く、また半
田プリコート配線基板にもこれを反らせるような力が加
わらないので基板自体が反ることもない。With this structure, when the solder pre-coated wiring boards 1 are stacked and handled, the adjacent boards have an average of the board surface, the solder pre-coated land 6 and the dummy land 9 provided around the solder pre-coated land 6. Since the solder precoat land 6 is not pressed by the adjacent substrate unlike the conventional solder precoat wiring substrate, the solder precoat land 6 is not easily scratched. The substrate itself does not warp because no force that warps the substrate is applied.

【００１１】図３は本発明の前記各実施形態において半
田プリコート配線基板１を重ねて梱包する場合の一例を
示すもので、各半田プリコート配線基板１の間に紙やプ
ラスチックフィルム等のセパレーター10を挾んだもので
ある。このようにすると半田プリコートランド６の表面
保護について更に効果があり、また基板の反りを防ぐ意
味でも効果的である。FIG. 3 shows an example in which the solder pre-coated wiring boards 1 are stacked and packed in each of the embodiments of the present invention. A separator 10 such as paper or a plastic film is provided between the solder pre-coated wiring boards 1. It is a sandwich. This is more effective in protecting the surface of the solder precoat land 6, and is also effective in preventing warpage of the substrate.

【００１２】[0012]

【発明の効果】以上のように本発明によれば、捨て基板
または実装基板外周部位に半田プリコートランドと同等
の複数のダミーランドを設けたことにより、半田プリコ
ート配線基板を重ねて取り扱う場合における半田プリコ
ートランドの損傷を防ぎ、併せて基板自体の反りも防ぐ
ことができるという有利な効果が得られる。As described above, according to the present invention, a plurality of dummy lands equivalent to the solder precoat lands are provided on the outer peripheral portion of the discarded board or the mounting board, so that the solder precoat wiring boards can be handled in a stacked manner. The advantageous effect that the damage of the precoat land can be prevented and the warp of the substrate itself can also be prevented is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の半田プリコート配線基板の第１実施形
態を示す平面図及び断面図である。FIG. 1 is a plan view and a cross-sectional view showing a first embodiment of a solder pre-coated wiring board of the present invention.

【図２】本発明の半田プリコート配線基板の第２実施形
態を示す平面図及び断面図である。2A and 2B are a plan view and a sectional view showing a second embodiment of a solder pre-coated wiring board of the present invention.

【図３】本発明の半田プリコート配線基板を重ねて梱包
する場合の一例を示す側面図である。FIG. 3 is a side view showing an example of a case where the solder pre-coated wiring boards of the present invention are stacked and packed.

【図４】従来の半田プリコート配線基板の一例を示す平
面図及び断面図である。FIG. 4 is a plan view and a cross-sectional view showing an example of a conventional solder precoat wiring board.

【図５】従来の半田プリコート配線基板を重ねて取り扱
った場合の問題点を説明するための側面図である。FIG. 5 is a side view for explaining problems when the conventional solder pre-coated wiring boards are handled in an overlapping manner.

【符号の説明】[Explanation of symbols]

１…半田プリコート配線基板、 ２…実装基板、 ３…
切り溝、 ４…捨て基板、 ５…一般部品用ランド、
６…半田プリコートランド、 ７，10…セパレーター、
８，９…ダミーランド。1 ... Solder pre-coated wiring board, 2 ... Mounting board, 3 ...
Cut groove, 4 ... Waste board, 5 ... Land for general parts,
6 ... Solder pre-coat land, 7, 10 ... Separator,
8, 9 ... Dummy land.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 半田プリコートランドを備えた実装基板
の外周部に連設された捨て基板に、前記半田プリコート
ランドと同等の形状を有する複数のダミーランドを設け
たことを特徴とする半田プリコート配線基板。1. A solder precoat wiring, wherein a plurality of dummy lands having the same shape as the solder precoat lands are provided on a waste substrate continuously provided on an outer peripheral portion of a mounting board having the solder precoat lands. substrate. 【請求項２】 半田プリコートランドを備えた実装基板
の外周部位に、前記半田プリコートランドと同等の形状
を有する複数のダミーランドを設けたことを特徴とする
半田プリコート配線基板。2. A solder precoat wiring board, wherein a plurality of dummy lands having the same shape as the solder precoat lands are provided on an outer peripheral portion of a mounting board having the solder precoat lands.
JP30922495A 1995-11-28 1995-11-28 Solder-precoated wiring board Pending JPH09148688A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30922495A JPH09148688A (en) 1995-11-28 1995-11-28 Solder-precoated wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30922495A JPH09148688A (en) 1995-11-28 1995-11-28 Solder-precoated wiring board

Publications (1)

Publication Number Publication Date
JPH09148688A true JPH09148688A (en) 1997-06-06

Family

ID=17990434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30922495A Pending JPH09148688A (en) 1995-11-28 1995-11-28 Solder-precoated wiring board

Country Status (1)

Country Link
JP (1) JPH09148688A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106941762A (en) * 2017-04-20 2017-07-11 苏州市华扬电子股份有限公司 A kind of preparation method of flexible PCB

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106941762A (en) * 2017-04-20 2017-07-11 苏州市华扬电子股份有限公司 A kind of preparation method of flexible PCB

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