CN106926423A - A kind of plastic package press connecting rod lifting mechanism - Google Patents
A kind of plastic package press connecting rod lifting mechanism Download PDFInfo
- Publication number
- CN106926423A CN106926423A CN201710135995.6A CN201710135995A CN106926423A CN 106926423 A CN106926423 A CN 106926423A CN 201710135995 A CN201710135995 A CN 201710135995A CN 106926423 A CN106926423 A CN 106926423A
- Authority
- CN
- China
- Prior art keywords
- connecting rod
- synchronous pulley
- lifting mechanism
- decelerator
- ball screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001360 synchronised effect Effects 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/66—Mould opening, closing or clamping devices mechanical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The present invention relates to semiconductor plastic package apparatus field, and in particular to a kind of plastic package press connecting rod lifting mechanism, including column and the upper bolster that is located on the column, mould is provided with the upper bolster；Lower mould is installed in movable mold；Symmetrical be distributed in the movable mold is connecting rod, and one end of the connecting rod is connected with lifting seat；What is be connected with the lifting seat is ball screw, the big synchronous pulley of the other end of the ball screw is connected, the big synchronous pulley is connected by Timing Belt with small synchronous pulley, and the small synchronous pulley is arranged on decelerator, the decelerator and servomotor phase assembly connection.The present invention, by decelerator, big small synchronous pulley, ball screw, connecting rod lifting mechanism, so as to drive movable mold to move up and down, makes the mould between upper bolster and lifting seat be pressurized using servomotor, so as to play a part of envelope pressure.Whole mechanism is novel in design rationally, due to that will not be polluted to product using connecting rod lifting mechanism.
Description
Technical field
The present invention relates to semiconductor plastic package apparatus field, and in particular to a kind of plastic package press connecting rod lifting mechanism.
Background technology
Semiconductor plastic encapsulation press is for encapsulating the special equipment of IC chip and discrete device/be collection machinery, liquid
Pressure, the automatically controlled electronic product being integrated.Each valve member in hydraulic system is controlled to work to realize different hydraulic pressure by PLC
The switching of oil circuit, and flow and pressure are controlled by flow control valve and pressure-control valve, so as to realize matched moulds and injection
Action process and its speed, Stress control.Its groundwork work step mainly includes：Matched moulds rapid increase, matched moulds rise at a slow speed/close
Mould high pressure, matched moulds off-load, matched moulds descending at slow speed, matched moulds rapid decrease, injection F.F., injection slow-motion, injection return etc..Existing skill
The semiconductor plastic encapsulation press of art is most to use cylinder or hydraulic structure, and the purpose of the present invention is exactly to propose a kind of connecting rod lifting machine
Structure.
The content of the invention
It is an object of the invention to provide a kind of plastic package press connecting rod lifting mechanism.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of plastic package press connecting rod lifting mechanism, including column and the upper bolster that is located on the column, on the upper bolster
It is provided with mould；Lower mould is installed in movable mold；Symmetrical be distributed in the movable mold is connecting rod, the connecting rod
One end is connected with lifting seat；What is be connected with the lifting seat is ball screw, the big synchronous pulley of the other end of the ball screw
It is connected, the big synchronous pulley is connected by Timing Belt with small synchronous pulley, the small synchronous pulley is arranged on decelerator, institute
Decelerator is stated with servomotor phase assembly connection.
Compared with prior art, beneficial effects of the present invention are：
The present invention drives activity using servomotor by decelerator, big small synchronous pulley, ball screw, connecting rod lifting mechanism
Platen moves up and down, and the mould between upper bolster and lifting seat is pressurized, so as to play a part of envelope pressure.Whole mechanism's design is new
It is clever reasonable, due to that will not be polluted to product using connecting rod lifting mechanism.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Specific embodiment
Referring to shown in accompanying drawing 1, a kind of plastic package press connecting rod lifting mechanism, including column 1 and be located at upper on the column 1
Die holder 2, is provided with mould 3 on the upper bolster 2；Lower mould 4 is installed in movable mold 5；It is symmetrical to be distributed in the activity
On platen 5 is connecting rod 6, and one end of the connecting rod 6 is connected with lifting seat 7；What is be connected with the lifting seat 7 is ball screw 8,
The big synchronous pulley 9 of the other end of the ball screw 8 is connected, and the big synchronous pulley 9 passes through Timing Belt 10 and small synchronous pulley
11 are connected, and the small synchronous pulley 11 is arranged on decelerator 12, the decelerator 12 and the phase assembly connection of servomotor 13.
A kind of operation principle of plastic package press connecting rod lifting mechanism of the present invention is：As shown in figure 1, connecting rod 6 is symmetrical
The two ends of movable mold 5 are connected to, what connecting rod 6 and lifting seat 7 were just constituted is connecting rod lifting mechanism.Servomotor 13 runs through
Decelerator 12 imparts power to small synchronous pulley 11, and small synchronous pulley 11 imparts power to big Timing Belt by Timing Belt 10
Wheel 9, the rotation of big synchronous pulley 9 drives the rotation of ball screw 8 being attached thereto, by the rotation of ball screw 8 drive with
Connected lifting seat 7 in moving up and down, the up and down motion of lifting seat 7 by connecting rod 6 realize upper bolster 2 and movable mold 5 it
Between upper mould 3 and lower mould 4 matched moulds and die sinking move, so as to realize being packaged the IC products in mould.
Claims (1)
1. a kind of plastic package press connecting rod lifting mechanism, including column（1）And it is located at the column（1）On upper bolster（2）, it is special
Levy and be：In the upper bolster（2）It is provided with mould（3）；Lower mould（4）It is installed to movable mold（5）On；It is symmetrical to be distributed in
The movable mold（5）On be connecting rod（6）, the connecting rod（6）One end and lifting seat（7）Connection；With the lifting seat（7）
Connected is ball screw（8）, the ball screw（8）The big synchronous pulley of the other end（9）It is connected, the big synchronous pulley
（9）By Timing Belt（10）With small synchronous pulley（11）It is connected, the small synchronous pulley（11）Installed in decelerator（12）On, institute
State decelerator（12）With servomotor（13）Phase assembly connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710135995.6A CN106926423A (en) | 2017-03-08 | 2017-03-08 | A kind of plastic package press connecting rod lifting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710135995.6A CN106926423A (en) | 2017-03-08 | 2017-03-08 | A kind of plastic package press connecting rod lifting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106926423A true CN106926423A (en) | 2017-07-07 |
Family
ID=59433287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710135995.6A Pending CN106926423A (en) | 2017-03-08 | 2017-03-08 | A kind of plastic package press connecting rod lifting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106926423A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937035A (en) * | 2021-10-15 | 2022-01-14 | 安徽耐科装备科技股份有限公司 | Pressure dynamic compensation plastic packaging press |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201353872Y (en) * | 2008-11-26 | 2009-12-02 | 北京化工大学 | Full-electric injection molding machine combined-drive mold-clamping mechanism |
| CN201450415U (en) * | 2009-07-09 | 2010-05-05 | 龙口中际电工机械有限公司 | Mould lifting driving mechanism |
| CN203472137U (en) * | 2013-09-16 | 2014-03-12 | 铜陵荣鑫机械有限公司 | Die assembly mechanism of electric servo press |
| CN206568508U (en) * | 2017-03-08 | 2017-10-20 | 安徽国晶微电子有限公司 | A kind of plastic package press connecting rod lifting mechanism |
-
2017
- 2017-03-08 CN CN201710135995.6A patent/CN106926423A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201353872Y (en) * | 2008-11-26 | 2009-12-02 | 北京化工大学 | Full-electric injection molding machine combined-drive mold-clamping mechanism |
| CN201450415U (en) * | 2009-07-09 | 2010-05-05 | 龙口中际电工机械有限公司 | Mould lifting driving mechanism |
| CN203472137U (en) * | 2013-09-16 | 2014-03-12 | 铜陵荣鑫机械有限公司 | Die assembly mechanism of electric servo press |
| CN206568508U (en) * | 2017-03-08 | 2017-10-20 | 安徽国晶微电子有限公司 | A kind of plastic package press connecting rod lifting mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937035A (en) * | 2021-10-15 | 2022-01-14 | 安徽耐科装备科技股份有限公司 | Pressure dynamic compensation plastic packaging press |
| CN113937035B (en) * | 2021-10-15 | 2022-08-26 | 安徽耐科装备科技股份有限公司 | Pressure dynamic compensation plastic packaging press |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170707 |
|
| WD01 | Invention patent application deemed withdrawn after publication |