CN202749354U - Pressing apparatus and die bonder - Google Patents

Pressing apparatus and die bonder Download PDF

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Publication number
CN202749354U
CN202749354U CN 201220431901 CN201220431901U CN202749354U CN 202749354 U CN202749354 U CN 202749354U CN 201220431901 CN201220431901 CN 201220431901 CN 201220431901 U CN201220431901 U CN 201220431901U CN 202749354 U CN202749354 U CN 202749354U
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CN
China
Prior art keywords
plane
framework
arm
fit device
pressing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN 201220431901
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Chinese (zh)
Inventor
季伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Fujitsu Microelectronics Co Ltd
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Nantong Fujitsu Microelectronics Co Ltd
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Priority to CN 201220431901 priority Critical patent/CN202749354U/en
Application granted granted Critical
Publication of CN202749354U publication Critical patent/CN202749354U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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Abstract

The utility model provides a pressing apparatus and a die bonder. The pressing apparatus comprises a pressing member and a drive device driving the pressing member to move up and down, the pressing member is provided with a pressing plane arranged to be facing down, and a length direction of the pressing plane is consistent with a motion direction of a framework to be pressed. A scheme is provided with the pressing plane, the pressing plane will force the framework to fit with a track plane generation surface in work, a dispensing head and a bonding head of the die bonder are decreased, a differential between the decreased dispensing head and the bonding head and chip loading surfaces of various frameworks is constant, uniformity of each work of the dispensing head and the bonding head is relatively high, so property, quality, and stability of chip products are improved. Furthermore, when the work of the dispensing head and the bonding head is finished, the drive device will drive the pressing member to move upwards, the pressing plane is separated from the framework, non-resistance transmission of the framework is realized, so transmission precision of the framework and stability of transmission process are relatively high.

Description

Press fit device and die bond machine
Technical field
The utility model relates to the chip encapsulation technology field, relates in particular to a kind of press fit device and die bond machine.
Background technology
The die bond machine is the employed equipment of load processing procedure in the semiconductor die package process.In when work, the Band clamp of walking of die bond machine drives the framework that carries chip and transmits at orbit plane, makes each chip successively by selecting glue position and load position, to put accordingly glue and welding operation.
Because reduce needs and the pressure of cost in the semiconductor die package process, then the framework of buckling deformation still is used in three dimensions always.Can fit with orbit plane in order to make framework, to carry out a glue and welding, as shown in Figure 1, present way is, a pressure arm 1 is set, and an end of pressure arm 1 overhangs, the other end is hinged on the die bond machine body, at the hinged roller 2 of the projecting end of pressure arm 1, make pressure arm 1 have the power that presses down by spring, this power is applied on the framework 3 by roller 2 always, forces framework 3 and orbit plane to be fitted.Adopt this kind mode, owing to being the mode of line contact, can't make the framework 3 of warpage become smooth, in addition, the deflection of the buckling deformation of each framework 3 also is not quite similar, plane difference with the slide glass face of different frames 3 after the Glue dripping head that so just has a die bond machine descends from soldering tip is each is different, causes the distance of the chip 4 of placing on the slide glass face of each descend rear and different frames 3 of Glue dripping head and soldering tip different, thereby has reduced the quality of chip product of production and the stability of quality.In addition, because roller applies a pressure to framework always, then increased the resistance that framework transmits, along with the increase of this resistance, the transmission precision of framework and the stability of transport process descend thereupon.
The utility model content
Provide hereinafter about brief overview of the present utility model, in order to basic comprehension about some aspect of the present utility model is provided.Should be appreciated that this general introduction is not about exhaustive general introduction of the present utility model.It is not that intention is determined key of the present utility model or pith, neither be intended to limit scope of the present utility model.Its purpose only is that the form of simplifying provides some concept, with this as the in greater detail preorder of discussing after a while.
The utility model provides a kind of press fit device and die bond machine, in order to the quality that promotes chip product, stability and the transmission precision of chip product production process middle frame and the stability of transport process of quality.
A kind of press fit device that the utility model provides, comprise press member and drive the drive unit that described press member moves up and down, described press member has the plane of exerting pressure that arranges down, and the length direction on the described plane of exerting pressure is consistent with the direction of motion of framework to be exerted pressure.
A kind of die bond machine that the utility model provides in addition, comprise die bond machine body, have be used to the orbit plane that transmits framework to be exerted pressure on the described die bond machine body, be fixedly connected with above-mentioned press fit device on the described die bond machine body, the plane of exerting pressure of described press fit device is positioned at the top of orbit plane.
The press fit device that the utility model provides and die bond machine, owing to having the plane of exerting pressure, when work, the plane of exerting pressure forces framework and orbit plane generation face to be fitted, after the Glue dripping head of die bond machine and soldering tip are descended and the plane difference of the slide glass face of different frames constant, then the uniformity of Glue dripping head and each task of soldering tip is higher, has therefore promoted the quality of chip product, the stability of quality.In addition, after Glue dripping head and soldering tip work were finished, drive unit drove the press member parts and moves upward, and makes exert pressure plane and framework apart, and this moment, the framework non-resistance transmitted, so the stability of the transmission precision of framework and transport process is higher.
Description of drawings
With reference to below in conjunction with the explanation of accompanying drawing to the utility model embodiment, can understand more easily above and other purpose of the present utility model, characteristics and advantage.Parts in the accompanying drawing are just in order to illustrate principle of the present utility model.In the accompanying drawings, same or similar technical characterictic or parts will adopt same or similar Reference numeral to represent.
Fig. 1 is the working state figure of press fit device in the prior art;
The working state figure of the press fit device that Fig. 2 provides for the utility model embodiment.
Description of reference numerals:
Pressure arm-1; Roller-2; Framework-3;
Chip-4; Linear actuator-5; Linking arm-6;
Press member-7; Transition arm-8; Compression arm-9;
Framework-10.
Embodiment
Embodiment of the present utility model is described with reference to the accompanying drawings.The element of describing in an accompanying drawing of the present utility model or a kind of execution mode and feature can combine with element and the feature shown in one or more other accompanying drawing or the execution mode.Should be noted that for purpose clearly, omitted in accompanying drawing and the explanation and the utility model expression and description irrelevant, parts known to persons of ordinary skill in the art and processing.
The working state figure of the press fit device that Fig. 2 provides for the utility model embodiment.As shown in Figure 2, the press fit device that the utility model embodiment provides, comprise press member 7 and drive the drive unit that described press member 7 moves up and down, press member has the plane of exerting pressure that arranges down, and the length direction on the plane of exerting pressure is consistent with the direction of motion of framework 10 to be exerted pressure.
The press fit device of such scheme, owing to having the plane of exerting pressure, when work, the plane of exerting pressure forces framework 10 and orbit plane generation face to be fitted, after the Glue dripping head of die bond machine and soldering tip are descended and the plane difference of the slide glass face of different frames 10 constant, then the uniformity of Glue dripping head and each task of soldering tip is higher, has therefore promoted the quality of chip product, the stability of quality.In addition, after Glue dripping head and soldering tip work were finished, drive unit drove the press member parts and moves upward, and the plane of exerting pressure is separated with framework 10, framework 10 this moment non-resistance under the drive of walking Band clamp transmits, so the stability of the transmission precision of framework 10 and transport process is higher.
Particularly, based on above-described embodiment, the drive unit that drives 7 times upper motions of press member can be linear actuator 5.It can be straight up and down motion that linear actuator 5 drives moving up and down of press member 7, also can be tiltedly upper motion under tiltedly.
Particularly, based on above-described embodiment, the piston rod of linear actuator 5 arranges straight up, and linear actuator 5 driving press member are straight up and down moved like this.The piston rod of linear actuator 5 can be finished the control that press member 7 is moved up and down by the stroke of less, has improved motion control efficient.
Particularly, based on above-described embodiment, linear actuator 5 can be selected any in pneumatic cylinder, hydraulic cylinder and the electric pushrod.As a kind of optimal way, adopt the pneumatic cylinder with spring in the present embodiment, adopt the pneumatic cylinder with spring can be after stopping the pneumatic cylinder air feed, under the effect of spring force, the pushing piston bar is upwards flexible, and then 7 risings of drive press member also finally separate with framework 10.The pneumatic cylinder that employing has spring is beneficial to the reduction power consumption on the one hand, is easy on the other hand control.
Particularly, based on above-described embodiment, press member 7 is for cranking arm, and this is cranked arm and comprises compression arm 9, transition arm 8 and linking arm 6.Linking arm 6 is positioned at the top of compression arm 9, and linking arm 6 is connected by transition arm 8 with compression arm 9, and linking arm 6 is fixedly connected with drive unit, and the plane of exerting pressure is positioned at the lower surface of compression arm 9.Wherein, crank arm and can adopt forging, the processing modes such as casting are made compression arm 9, transition arm 8 and are connected cranking arm that one connects with linking arm.Linking arm 6 can adopt the modes such as bolt or pin joint with the mode that is fixedly connected with of drive unit.When selecting pneumatic cylinder such as but not limited to drive unit, can adopt the modes such as bolt, pin or flat key that linking arm 6 is connected with the piston rod of pneumatic cylinder.
Further, the utility model also provides a kind of die bond machine, this die bond machine comprises die bond machine body, have be used to the orbit plane that transmits framework to be exerted pressure on the die bond machine body, be fixedly connected with the press fit device of above-described embodiment on the die bond machine body, the plane of exerting pressure of press fit device is positioned at the top of orbit plane.Wherein, the structure of press fit device and effect thereof repeat no more referring to above-described embodiment herein.
In the practical application, select pneumatic cylinder to describe as example take drive unit.During work, by from the transmission lines plate of this die bond machine body transfer system, taking out and walk the synchronous signal of Band clamp, and as the signal of the electromagnetically operated valve that drives the motion of control pneumatic cylinder, control the flexible of pneumatic cylinder piston rod.At first pneumatic cylinder drives press member 7 risings, making exerts pressure has certain distance between plane and the orbit plane, walking Band clamp carries framework 10 and transmits along orbit plane, when framework 10 is sent to when selecting glue position or load position, pneumatic cylinder drives press member 7 and descends, the planar pressing framework 10 of exerting pressure, force framework 10 and orbit plane to be fitted, this die bond machine carries out selecting glue operation or load operation afterwards, pneumatic cylinder drove the press member rising after operation was finished, framework 10 continues to be walked Band clamp and is carrying and transmit, and enters next duty cycle.
It should be noted that at last: above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although with reference to previous embodiment the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.

Claims (6)

1. press fit device, it is characterized in that, comprise press member and drive the drive unit that described press member moves up and down, described press member has the plane of exerting pressure that arranges down, and the length direction on the described plane of exerting pressure is consistent with the direction of motion of framework to be exerted pressure.
2. press fit device according to claim 1 is characterized in that, described drive unit is linear actuator.
3. press fit device according to claim 2 is characterized in that, the piston rod of described linear actuator arranges straight up.
4. press fit device according to claim 2 is characterized in that, described linear actuator is pneumatic cylinder, hydraulic cylinder or electric pushrod.
5. arbitrary described press fit device according to claim 1-4, it is characterized in that, described press member is for cranking arm, described cranking arm comprises compression arm, transition arm and linking arm, described linking arm is positioned at the top of described compression arm, described linking arm is connected by described transition arm with described compression arm, and described linking arm is fixedly connected with described drive unit, and the described plane of exerting pressure is positioned at the lower surface of described compression arm.
6. die bond machine, comprise die bond machine body, have be used to the orbit plane that transmits framework to be exerted pressure on the described die bond machine body, it is characterized in that, be fixedly connected with just like claim 1-5 arbitrary described press fit device on the described die bond machine body, the plane of exerting pressure of described press fit device is positioned at the top of orbit plane.
CN 201220431901 2012-08-28 2012-08-28 Pressing apparatus and die bonder Withdrawn - After Issue CN202749354U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220431901 CN202749354U (en) 2012-08-28 2012-08-28 Pressing apparatus and die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220431901 CN202749354U (en) 2012-08-28 2012-08-28 Pressing apparatus and die bonder

Publications (1)

Publication Number Publication Date
CN202749354U true CN202749354U (en) 2013-02-20

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CN 201220431901 Withdrawn - After Issue CN202749354U (en) 2012-08-28 2012-08-28 Pressing apparatus and die bonder

Country Status (1)

Country Link
CN (1) CN202749354U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632996A (en) * 2012-08-28 2014-03-12 南通富士通微电子股份有限公司 Stitching device and die bonder
CN105759861A (en) * 2014-12-18 2016-07-13 齐鲁工业大学 Motion control method of LED chip waxing robot

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103632996A (en) * 2012-08-28 2014-03-12 南通富士通微电子股份有限公司 Stitching device and die bonder
CN103632996B (en) * 2012-08-28 2016-07-06 南通富士通微电子股份有限公司 Press fit device and bonder
CN105759861A (en) * 2014-12-18 2016-07-13 齐鲁工业大学 Motion control method of LED chip waxing robot

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C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20130220

Effective date of abandoning: 20160706

C25 Abandonment of patent right or utility model to avoid double patenting