CN106918929A - The cell level liquid crystal assembly method of liquid crystal on silicon - Google Patents
The cell level liquid crystal assembly method of liquid crystal on silicon Download PDFInfo
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- CN106918929A CN106918929A CN201510993725.XA CN201510993725A CN106918929A CN 106918929 A CN106918929 A CN 106918929A CN 201510993725 A CN201510993725 A CN 201510993725A CN 106918929 A CN106918929 A CN 106918929A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
The present invention is the cell level liquid crystal assembly method on liquid crystal on silicon, first cutting silicon crystal circle and transparent conducting glass substrate are simultaneously cut separation, the silicon wafer (die) and transparent conducting glass chip for choosing gained after appropriate cutting again are respectively implanted different support plates, support plate is cleaned after each self-forming liquid crystal alignment layer thereon, two kinds of subsequent steps can be carried out thereafter：In method one, laminating silicon wafer and transparent conducting glass chip resolidification frame glue after coating frame glue, afterwards from the liquid crystal silicon-based component (cell) that sort out in the support plate is appropriate, sealed after vacuum injection liquid crystal, then brilliant and bonding wire post package is sticked, last exposed electrical connects transparent conducting glass；Or in method two, it is internal after coating frame glue to be electrically connected with transparent conducting glass, inject liquid crystal (ODF) laminating silicon wafer and transparent conducting glass chip afterwards, final curing frame glue and glutinous brilliant, bonding wire and encapsulation.
Description
【Technical field】
The present invention is the espespecially cell level liquid crystal assembly method of liquid crystal on silicon on liquid crystal assembly method.
【Background technology】
Fig. 1 is exposed electrical connection transparent conducting glass (ITO) of known technology and the liquid crystal assembly method flow diagram of vacuum injection liquid crystal.As shown in figure 1, liquid crystal assembly method is first, by substrate cleaning 101, frame glue 103 and fit 104 to be coated with after forming liquid crystal alignment layer 102 in known technology.Cutting silicon crystal circle and transparent conducting glass substrate and separation (cell singulation) 105 is cut afterwards, 107 are sealed after vacuum injection liquid crystal 106, then sticked brilliant 108, bonding wire 109 and encapsulation 110, last exposed electrical is connected electrically conducting transparent 111.Fig. 2 is another aspect of known technology, is the internal method for producing panel flow chart for being electrically connected with transparent conducting glass and dropping type injection liquid crystal (One Drop Fill, ODF).It is first by substrate cleaning 201, frame glue 203 is coated with after forming liquid crystal alignment layer 202, inside is electrically connected with dropping type injection liquid crystal (One Drop Fill after transparent conducting glass 204, ODF) 205 and fit 206, then cutting silicon crystal circle and transparent conducting glass substrate and separation 207 is cut, is finally sticked brilliant 208, bonding wire 209 and encapsulation 210.
But known technology fails to be applicable same processing procedure or identical device in six inch, eight inch and 12 inch wafer manufacturing process, oblique evaporation method (SiO is being usedx/SiO2When process) forming liquid crystal alignment layer, the wafer of more large scale specification is to need bigger vacuum deposition apparatus (vacuum deposition system), and thus increase the time for forming liquid crystal alignment layer；And when liquid crystal (ODF) is injected using dropping type, because the process status of each chip are not quite similar, more the silicon wafer process of large scale specification will more shape complexity；Furthermore, it is known that technology must be processed to full wafer wafer, fail to filter out good bare chip early in manufacturing process early stage side by side except of inferior quality chip carries out down-stream, so that manufacturing cost is significantly increased；In addition, weld pad (bond pad) is only capable of being located at the upper of one of two last line sliver region (scribe and break area) in known technology；More very, it is known that the process cycle cycle time of technology is excessively very long and thus delays the development time (development time)；The circuit board of LCD MODULE (LCM) cannot also be manufactured prior to liquid crystal assembling flow path.
【The content of the invention】
In view of this, the present invention provides a kind of cell level liquid crystal assembly method of liquid crystal on silicon, carrying and processing unit of the main element for chip in the present invention, the use of the wherein support plate is similar to fan-out-type Wafer level packaging (wafer level fan-out process), is one of important technical characteristic.The support plate has indivedual liquid crystal silicon-based component carrier sequences, must carry the chip of varying number, and ensures that each chip must carry out liquid crystal assembly program in accurate orientation.After the completion of liquid crystal assembly program each time, whole carriers will be cleaned to manufacture the liquid crystal silicon-based component of next batch.Can also have side support (arm) or rear side vacuum taphole (vacuum jack) support chip in section Example of the present invention, on support plate.
The cell level liquid crystal assembly method of one of which liquid crystal on silicon of the invention is comprised the following steps：First cutting silicon crystal circle and transparent conducting glass substrate are simultaneously cut separation, the silicon wafer (die) and transparent conducting glass chip for choosing gained after appropriate cutting again are respectively implanted different support plates, clean after each self-forming liquid crystal alignment layer thereon, then laminating silicon wafer and transparent conducting glass chip resolidification frame glue after frame glue are coated with, afterwards from the liquid crystal silicon-based component (cell) that sort out in the support plate is appropriate, sealed after vacuum injection liquid crystal, then brilliant and bonding wire post package is sticked, last exposed electrical connects transparent conducting glass.
Additionally, in disclosed herein another liquid crystal on silicon cell level liquid crystal assembly method in, comprise the following steps：First cutting silicon crystal circle and transparent conducting glass substrate are simultaneously cut separation, the silicon wafer and transparent conducting glass chip for choosing gained after appropriate cutting again are respectively implanted different support plates, support plate is cleaned after forming liquid crystal alignment layer respectively thereon, it is internal after coating frame glue to be electrically connected with transparent conducting glass, instill liquid crystal (ODF) laminating silicon wafer and transparent conducting glass chip afterwards, simultaneously glutinous brilliant, bonding wire and the encapsulation of final curing frame glue.
Assembling LCD MODULE using the method for the present invention can not be limited by wafer specifications size, and identical processing procedure and equipment can use oblique evaporation method (SiO simultaneously suitable for the wafer of six inch, eight inch and 12 inchx/SiO2Identical vacuum deposition apparatus (vacuum deposition system) can be used when process) forming liquid crystal alignment layer, also because the chip volume after cutting is much smaller than wafer, required vacuum chamber volume is smaller, forms the required time also phase shape reduction of liquid crystal alignment layer；And obtained final product in the manufacturing process last stage of the present invention early screening go out be adapted to manufacture liquid crystal cell chip, it is to avoid in bad chips manufacture processing and waste production cost and time；Again because the chip after each cutting subsequently manufactures situation and parameter is all consistent, will not occur because the manufacture state of each chip is totally different during dropping type injection liquid crystal (ODF) so that processing procedure becomes increasingly complex problem and occurs；In addition, if using this element level liquid crystal assembly method, weld pad is placed in either direction in four orientation of chip, and is not limited to only be placed in the upper of one of two last line sliver region (scribe and break area)；The present invention simultaneously must reduce process cycle cycle time and then Speeding up development time (development time)；The circuit board of LCD MODULE (LCM) can also be manufactured prior to liquid crystal assembling flow path.
After refering to schema and the implementation method of subsequent description, this technical field tool usually intellectual just can be appreciated that other objects of the present invention, and technological means of the invention and implementation aspect.
General introduction above is all exemplary in nature with ensuing detailed description, is to further illustrate claim of the invention.And other objects and advantages for the present invention, will be illustrated by follow-up explanation and diagram.
【Brief description of the drawings】
Fig. 1 connects the liquid crystal assembly method flow diagram of transparent conducting glass (ITO) and vacuum injection liquid crystal for the exposed electrical of prior art.
Fig. 2 is the method for producing panel flow chart that prior art is electrically connected with transparent conducting glass and dropping type injection liquid crystal (One Drop Fill, ODF) on inside.
Fig. 3 is the flow chart of the cell level liquid crystal assembly method first embodiment of liquid crystal on silicon of the invention.
Fig. 4 is the flow chart of the cell level liquid crystal assembly method second embodiment of liquid crystal on silicon of the invention.
【Symbol description】
300：The cell level liquid crystal assembly method of liquid crystal on silicon
301：Cutting separating step
302：Selection chip inserts support plate step
303：Cleaning support plate step
304：Liquid crystal alignment layer step is set
305：Coating frame glue step
306：Laminating step
307：Solidification frame glue step
308：Liquid crystal silicon-based component step is chosen from support plate
309：Injection liquid crystal step
310：Sealing step
311：Glutinous crystalline substance step
312：Bonding wire step
313：Encapsulation step
314：Exposed electrical connects transparent conducting glass step
【Specific embodiment】
Hereinafter present invention will be explained by embodiment.However, embodiments of the invention and being not used to limit the present invention must any environment as described embodiments, using or mode can implement.Explanation accordingly, with respect to embodiment is only the explaination purpose of the present invention, and is not used to the directly limitation present invention.Need expositor, it is non-immediate related to the present invention or do not illustrated to be had been omitted from the step of field tool usually intellectual can be appreciated how implementation in following examples and diagram.And know this those skilled in the art and ought apprehensible be, disclosed herein liquid crystal assemble method, when can be applied to various different occasions.
Fig. 3 is refer to, it is the flow chart of a cell level liquid crystal assembly method wherein embodiment of liquid crystal on silicon of the invention, is comprised the following steps：First cutting silicon crystal circle and transparent conducting glass substrate are simultaneously cut separation 301, the silicon wafer (die) and transparent conducting glass chip for choosing gained after appropriate cutting again are respectively implanted different support plates 302, 303 form liquid crystal alignment layer 304 respectively thereon after clean support plate, laminating silicon wafer and transparent conducting glass chip 306 after coating frame glue 305, solidification frame glue 307 and from the suitable liquid crystal silicon-based component (cell) 308 of sort out in the support plate, 310 are sealed after vacuum injection liquid crystal 309, brilliant 311 and the post package 313 of bonding wire 312 are sticked afterwards, last exposed electrical connection transparent conducting glass 314.
Fig. 4 is refer to, this is the flow chart of cell level liquid crystal another embodiment of assembly method of liquid crystal on silicon of the invention, is comprised the following steps：First cutting silicon crystal circle and transparent conducting glass substrate are simultaneously cut separation 401, the silicon wafer (die) and transparent conducting glass chip for choosing gained after appropriate cutting again are respectively implanted different support plates 402, clean support plate 403 after thereon respectively formed liquid crystal alignment layer 404, it is internal after coating frame glue 405 to be electrically connected with transparent conducting glass 406, dropping type injection liquid crystal (One Drop Fill, ODF) fit after 407 silicon wafer and transparent conducting glass chip 408, final curing frame glue 409 and glutinous brilliant 410, bonding wire 411 and encapsulate 412.
In addition, the quality of LCD alignment is depended primarily on due to the quality of liquid crystal display, therefore the step of formation liquid crystal alignment layer of the invention can steam method (SiO using obliquex/SiO2Process), by silica (Silicon Dioxide, SiO in high vacuum chamber2) or silica (Silicon Monoxide, SiO) and silicon oxide compound (SiOx) etc. inorganic material from specific angle hot evaporation (thermal evaporation) on substrate to produce SiO long column shape bodies, by means of control SiO long column shape body angles of inclination and density reach LCD alignment arrangement purpose.The advantage of the method lifts orientation reliability for that can be precisely controlled LC tilt angle.
The step of formation liquid crystal alignment layer of the invention, can also use rubbing (PI process), high-speed roller rotation is carried out with flannelette, with contact forward mechanical friction be coated with pi glass surface, pi main chain is forward arranged because of extension and then arrange LCD alignment, the advantage of the method be the operating time it is extremely short and operate at normal temperatures, and with the characteristic of excellent volume production.
The step of formation liquid crystal alignment layer of the invention also applicable smooth orientation method (Photo-Alignment), the both alignment layers of the light orientation polymer containing tool photoreactive group are initially formed in liquid crystal layer lower section, irradiate both alignment layers to trigger optics anisotropy according to specific direction followed by ultraviolet light (UV), it is to trigger the main chain of light orientation polymer to be arranged on a predetermined direction, so that the both alignment layers of the optical orientation influence the LCD alignment in liquid crystal layer disposed thereon again.The light orientation polymer can be cycloolefin, and it is that backbone structure can be presented excellent photoreactivity, light regiospecific and orientation speed by cycloolefin, while preferably thermostability is presented, thus be suitable to as a smooth orientation polymer.Being not required to both alignment layers friction orientation (rubbing) processing procedure with light orientation method formation liquid crystal alignment layer has the advantages that thermostability and orientation stability.
Formation liquid crystal alignment layer step of the invention can also use ink jet printing method (Inkjet Printing process), and at least one layer of polymeric solution is coated with ink jet printing mode on substrate, form the liquid crystal alignment layer of a given thickness.Because ink jet printing method is to form both alignment layers using cordless, the flatness on effectively lifting liquid crystal orienting film surface makes picture show more homogeneous, and obtains sufficiently effective use material.There is optical contrast high it is necessary to prevent incident light in the light scattering and reflection on panel frame edge transparent conducting glass substrate surface.The generally addition of light absorbs photomask materials absorbs and prevents this light scattering and reflection at panel frame edge.Therefore, ink jet printing method may be utilized in fabricating the light shield for being located around panel frame edge transparent conducting glass substrate surface.Again because ink jet printing method must borrow software control by required figure and light blockage coating to substrate, therefore extra addition costliness light shield is not required to, reaches the purpose for reducing production cost.If additionally, there are more than two nozzles on relevant device board, required multiple different light blockage coating can be printed on substrate simultaneously, manufacturing time improve production efficiency is shortened whereby.
It is unavoidable to produce dust and particulate contaminants if only forming both alignment layers with rubbing (PI process), cleaning equipment need to be additionally purchased, and be only capable of processing single substrate every time, cause yield preferable not to the utmost；It is again oblique to steam method (SiOx/SiO2Process) must only be implemented on small-sized substrate (typically less than 10 English inch), the LCD alignment angle for being drawn is also limited to silica steam plating angle, in addition it is only capable of being machined in the substrate (generally no more than 6 substrates) of relatively small amount every time, it is impossible to carry out a large amount of batch process.
Therefore the present invention also can be to purify fill after the vacuum chamber inert gas in first placing a substrate in vacuum chamber using the method for another formation liquid crystal alignment layer, the multiple purifications of the vacuum chambers of weight and to-fill procedure are excluding the vapor in vacuum chamber.Furthermore, the inert gas can be preheated in advance, so that substrate purification with refill step in be heated, the both alignment layers are then formed directly on substrate by the vapour deposition process using such as silane material, or an intermediate layer for being attached to transparent conducting glass is formed, it is attached to it to allow other to be attached to the silane material of transparent conducting glass.Wherein silane material can be such as perfluoro capryl triethoxysilane, TMSDEA, octadecyltriethoxy silane and trichlorosilane.Furthermore, vapour deposition process also can form liquid crystal alignment layer with reference to plasma method in the present invention, not yet allowing in the vapour deposition process substrate to touch may be before the gas of contaminated surface, the plasma cleans step of substrate is provided, or plasma obtains assisted vapor deposition method and provides the material that liquid crystal alignment layer coating material and manufacture are applied, and stimulation chemical substance is produced, produce more active reaction with substrate.It is able to be easily achievable the purpose that batch makes multiple substrates using the method, and very thin organic lcd both alignment layers must be manufactured under the premise of high yield and low cost.
The people for knowing the technology of the present invention should be clearly understood that the present invention is not only restricted to out the details of the implementation method of explanation, it is so of the invention that to implement in other specific forms without deviating from base attribute of the invention, implementation method only illustrates rather than the limitation present invention, the present invention is with patent claim as foundation, rather than it is foundation to open explanation above, all deformations in the meaning and equivalency range of claim belong to the scope of the present invention.
Claims (15)
1. a kind of cell level liquid crystal assembly method of liquid crystal on silicon, comprises the following steps：
First cutting silicon crystal circle and transparent conducting glass substrate；
Selection chip is placed into support plate；
Clean support plate；
Form liquid crystal alignment layer；
Coating frame glue and chip solidify afterwards frame glue of fitting；
Liquid crystal silicon-based component is chosen from support plate；
Sealed after injection liquid crystal；
Glutinous brilliant and bonding wire post package；And
Exposed electrical connects transparent conducting glass.
2. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 1, its feature
It is that the formation liquid crystal alignment layer step can be used rubbing or oblique evaporation method or light orientation method
Or ink jet printing method.
3. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 1, its feature
It is that the formation liquid crystal alignment layer step can purify the vacuum chamber to place a substrate in a vacuum chamber
Afterwards liquid crystal alignment layer is deposited using vapour deposition process.
4. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 3, its feature
It is that this is heavy using plasma asistance vapour deposition process using vapour deposition process deposition both alignment layers
The long-pending liquid crystal alignment layer.
5. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 2, it is special
Levy and be, ink jet printing method may be utilized in fabricating and be located around panel frame edge transparent conducting glass substrate table
The light shield in face.
6. a kind of cell level liquid crystal assembly method of liquid crystal on silicon, comprises the following steps：
First cutting silicon crystal circle and transparent conducting glass substrate；
At least one longitudinal direction perforation is set in silicon substrate and is placed into conductive materials；
Selection chip is placed into support plate；
Clean support plate；
Form liquid crystal alignment layer；
Coating frame glue and chip solidify afterwards frame glue of fitting；
Liquid crystal silicon-based component is chosen from support plate；
Sealed after injection liquid crystal；
Glutinous brilliant and encapsulation；And
Exposed electrical connects transparent conducting glass.
7. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 6, its feature
It is that the formation liquid crystal alignment layer step can be used rubbing or oblique evaporation method or light orientation method
Or ink jet printing method.
8. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 6, its feature
It is that the formation liquid crystal alignment layer step can purify the vacuum chamber to place a substrate in a vacuum chamber
Afterwards liquid crystal alignment layer is deposited using vapour deposition process.
9. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 8, its feature
It is that this is heavy using plasma asistance vapour deposition process using vapour deposition process deposition both alignment layers
The long-pending liquid crystal alignment layer.
10. the cell level liquid crystal assembly method of liquid crystal on silicon according to claim 7, its
It is characterised by, ink jet printing method may be utilized in fabricating and be located around panel frame edge transparent conducting glass substrate
The light shield on surface.
A kind of cell level liquid crystal assembly method of 11. cell level liquid crystal on silicon, comprises the following steps：
First cutting silicon crystal circle and transparent conducting glass substrate；
Selection chip is placed into support plate；
Clean support plate；
Form liquid crystal alignment layer；
Coating frame glue；
Inside is electrically connected with transparent conducting glass；
Injection liquid crystal；
Laminating chip solidify afterwards frame glue；And
Glutinous brilliant and bonding wire post package.
The cell level liquid crystal assembly method of 12. liquid crystal on silicon according to claim 11, it is special
Levy and be, the formation liquid crystal alignment layer step can be used rubbing or oblique evaporation method or light orientation
Method or ink jet printing method.
The cell level liquid crystal assembly method of 13. liquid crystal on silicon according to claim 11, its
It is characterised by, the formation liquid crystal alignment layer step can purify this true to place a substrate in a vacuum chamber
After empty room liquid crystal alignment layer is deposited using vapour deposition process.
The cell level liquid crystal assembly method of 14. liquid crystal on silicon according to claim 13, its
It is characterised by, this is using plasma asistance vapour deposition using vapour deposition process deposition both alignment layers
Method deposits the liquid crystal alignment layer.
The cell level liquid crystal assembly method of 15. liquid crystal on silicon according to claim 12,
Characterized in that, ink jet printing method may be utilized in fabricating is located around panel frame edge transparent conducting glass base
The light shield of plate surface.
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