WO2021065591A1

WO2021065591A1 - Mold, flattening device, flattening method, and article manufacturing method

Info

Publication number: WO2021065591A1
Application number: PCT/JP2020/035676
Authority: WO
Inventors: 聡岩谷
Original assignee: キヤノン株式会社
Priority date: 2019-10-02
Filing date: 2020-09-23
Publication date: 2021-04-08
Also published as: JP7328109B2; JP2021061265A

Abstract

This mold is used for a flattening device for curing a composition in a state in which a planar section of the mold is brought into contact with the composition on a substrate, and is provided with a contact detecting sensor which detects that a target object has made contact with a surface on which the planar section is provided. Accordingly, the contact state between the substrate and the mold can be simply confirmed without providing a camera for checking the contact state.

Description

Molds, flattening devices, flattening methods and article manufacturing methods

The present invention relates to a mold, a flattening device, a flattening method, and a method for manufacturing an article.

With the increasing demand for miniaturization of semiconductor devices, in addition to conventional photolithography technology, microfabrication technology that molds and cures an uncured composition on a substrate to form a pattern of the composition on the substrate has been developed. Attention has been paid. Such a technique is called an imprint technique, and can form a fine pattern on the order of several nanometers on a substrate.

As one of the imprinting techniques, for example, there is a photocuring method. An imprinting device that employs a photocuring method molds a photocurable composition supplied to a shot region on a substrate with a mold, irradiates light to cure the composition, and molds the cured composition. By pulling them apart, a pattern is formed on the substrate.

Further, in recent years, a technique for flattening a composition on a substrate has been proposed (see Patent Document 1). The technique disclosed in Patent Document 1 aims to improve the accuracy of flattening by dropping a composition based on a step on a substrate and curing the composition in a state where the dropped composition is in contact with a flat surface of a mold. It is a thing.

In such a flattening device, if air bubbles or foreign substances are caught between the substrate and the mold, the desired flattening process cannot be performed. Therefore, a camera is provided on the upper side of the mold and the plate is placed on the substrate via the mold. The contact state between the composition and the mold is confirmed by using an image from a camera.

Japanese Patent Application Laid-Open No. 2011-528626

In the conventional flattening device, it is necessary to irradiate the composition with the light used for photocuring through a mold, and the illumination optical system for irradiating the light used for photocuring and the high speed for confirming the contact state. A complicated optical system was required in order to be compatible with the imaging optical system of a high-resolution camera.

Therefore, the present invention provides a configuration in which the contact state between the substrate and the mold can be easily confirmed without providing a camera for confirming the contact state between the mold and the composition.

The present invention has a mold holding portion for holding a mold having a flat surface portion, a substrate holding portion for holding a substrate, and a curing portion for curing a composition provided on the substrate. The mold used in a flattening apparatus for curing the composition in the cured portion with the flat portion in contact with the composition on the substrate, wherein the flat portion is provided and the composition is provided. It is characterized by having a surface on the side in contact with the substrate and a contact detection sensor for detecting that an object has come into contact with the surface.

It is a figure explaining the flattening process in a flattening apparatus. It is a figure explaining the flattening process in a flattening apparatus. It is a figure explaining the flattening process in a flattening apparatus. It is a figure explaining the flattening process in a flattening apparatus. It is a figure which shows the structure of the flattening system including a flattening apparatus. It is a figure explaining the structure of the flattening apparatus. It is a figure explaining the structure of the mold of a flattening apparatus, and the mold holding part. It is a figure explaining the electrode structure provided in the mold. It is a figure explaining the cross-sectional structure of the mold of the flattening apparatus which concerns on 1st Embodiment. This is an example of a signal waveform showing a change in the capacitance of the transparent electrode on the Y-axis side. This is an example of a signal waveform showing a change in the capacitance of the transparent electrode on the X-axis side. It is a figure explaining the contact state at the time of receiving the signal waveform of FIG. 7A and FIG. 7B. It is a flowchart which shows the flow of the flattening process of a flattening apparatus. It is a figure explaining the cross-sectional structure of the mold of the flattening apparatus which concerns on 2nd Embodiment. It is a figure which illustrates the manufacturing method of the article. It is a figure which illustrates the manufacturing method of the article. It is a figure which illustrates the manufacturing method of the article. It is a figure which illustrates the manufacturing method of the article. It is a figure which illustrates the manufacturing method of the article. It is a figure which illustrates the manufacturing method of the article.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, the same member is given the same reference number, and duplicate description is omitted.

(First Embodiment)
The flattening process is schematically shown in FIGS. 1A to 1D. The flattening treatment described in the present embodiment describes a treatment in which the composition is dropped onto the entire surface of the substrate and the composition is brought into contact with the mold to flatten the composition. The composition may be flattened by contacting the above composition with the mold.

First, as shown in FIG. 1A, the composition ML is arranged on the substrate 1 on which the base pattern W is formed (composition arrangement step). Specifically, the composition ML used as a flat material is dropped onto the substrate 1 held by the substrate holding unit 340, which will be described later, by the droplet supply unit DP such as a dispenser. Here, the distribution of the composition ML arranged by the droplet supply unit DP may be adjusted according to the shape of the base pattern W formed on the surface of the substrate 1.

Next, as shown in FIG. 1B, a mold SS (also referred to as a super straight) having a flat surface portion on the substrate 1 having the same size as that of the substrate 1 or a size larger than that of the substrate 1 is formed on the composition ML of the substrate 1. Contact with (contact process). As a result, the composition ML spreads and becomes a film.

Next, as shown in FIG. 1C, in a state where the mold SS is in contact with the composition ML on the substrate 1, energy for curing the composition ML is given to the composition ML from the cured portion IL, and the composition is prepared. The ML is cured (curing step). In the curing step, it is necessary that the flat surface portion of the mold SS is in contact with all the composition ML on the substrate, and the flat surface portion of the mold SS follows the surface shape of the substrate 1. As the curing energy used in the curing step, light such as ultraviolet rays emitted from the light source IL (light irradiation unit) can be used.

Details will be described later, but when light is used as the energy for curing, a material having photocurability is used for the composition ML, and the mold SS is provided with a material that transmits light from the light source, and the light source IL (curing) is provided. The composition ML is irradiated with the light from the part) through the mold SS to cure the composition ML.

Next, as shown in FIG. 1D, the mold SS is separated from the cured composition ML on the substrate 1 (separation step). As a result, a flattening film made of the cured composition ML remains on the substrate 1. That is, by using the mold SS, a flattening layer (flattening film) having a locally flattened surface can be formed by a cured product of the composition ML. In the flattening method as described above, the flattening layer can be collectively formed over the entire area of the substrate 1 by using the mold SS having an area covering the entire area of the plurality of shot regions of the substrate 1.

In the following description, the base pattern W on the substrate 1 will be omitted, but it is assumed that the base pattern W according to the manufacturing process is provided between the substrate 1 and the composition ML.

FIG. 2 shows the overall configuration of the flattening system 100 according to the present invention. In the present specification and drawings, the direction is indicated in the XYZ coordinate system with the vertical direction as the Z axis. The flattening system 100 includes one or more flattening devices (film forming devices) R. In the flattening apparatus R, a contact step of contacting the composition portion ML on the substrate 1 and the mold SS described with reference to FIGS. 1A to 1D, a curing step of curing the composition ML, and curing of the composition ML. A flattening process including a separation step of separating the object and the mold SS is performed.

The flattening system 100 of FIG. 2 is provided with a substrate transfer mechanism 204, a preparation station 220, a heat treatment unit 209, and a control unit 210. As the substrate transfer mechanism 204, for example, EFEM (Equipment Front End Module) can be used. By this substrate transfer mechanism 204, the substrate 1 can be moved (conveyed) between the substrate transfer container 203, the heat treatment unit 209, and the preparation station 220. As the substrate transport container 203, FOUP (Front-Opening Unified Pod) can be used. The substrate 1 stored in the substrate transfer container 203 is conveyed to the preparation station 220 by the substrate transfer mechanism 204.

The preparation station 220 is provided with an alignment mechanism 205 and a droplet supply unit (dispenser) DP. The droplet supply unit DP is arranged in the information of the alignment mechanism 205.

The alignment mechanism 205 measures the rotation of the substrate 1 transported from the substrate transport container 203 around the Z axis by the substrate transport mechanism 204, and adjusts the rotation of the substrate W around the Z axis to a target angle based on the result. .. The rotation of the substrate 1 around the Z axis can be measured, for example, by detecting a notch in the substrate 1. Further, the alignment mechanism 205 can measure the position of the substrate 1. Then, the alignment mechanism 205 can adjust the position of the substrate 1 based on the measurement result of the measured position of the substrate 1. The position of the transfer hand 202 when the substrate 1 is delivered from the alignment mechanism 205 to the transfer hand 202 of the substrate transfer mechanism 204 may be adjusted based on the measurement result of the position of the substrate 1. Further, the preparation station 220 may be provided with a function of adjusting the temperature of the substrate 1.

The droplet supply unit DP arranges the composition ML on the substrate 1. The droplet supply unit DP is connected to the circulation unit 211 that circulates the composition ML. The circulation unit 211 maintains the physical characteristics by adjusting the temperature of the composition ML and the like, and also maintains the wettability of the discharge surface of the droplet supply unit DP and keeps the internal pressure of the droplet supply unit DP constant. The composition ML is circulated in the water. The circulation path of the composition ML can be a path from the storage tank provided in the circulation section 211 to the storage tank through the discharge surface of the droplet supply section DP. Further, the droplet supply unit DP may be configured as a spin coater or a slit coater.

The substrate 1 is conveyed from the substrate transfer container 203 to the preparation station 220 by the substrate transfer mechanism 204. At the preparation station 220, in addition to the process for rotating the substrate 1 around the Z axis and adjusting the position, a process for arranging the composition ML on the substrate 1 is executed. In one example, with the position of the substrate 1 held by the alignment mechanism 205 fixed, the droplet supply unit DP ejects the composition ML while moving along the XY plane, whereby the composition ML is discharged onto the substrate 1. The composition ML can be placed in. In another example, the alignment mechanism 205 has a substrate transporting portion, and the substrate transporting portion transports the substrate 1 along the XY plane while ejecting the composition ML from the droplet supply portion DP onto the substrate 1. The composition ML can be placed in. Alternatively, the composition ML may be placed on the substrate 1 while the substrate 1 is conveyed along the XY plane by the substrate transport unit and the droplet supply unit DP is also moved along the XY plane. Alternatively, after the rotation and position of the substrate 1 around the Z axis are measured by the alignment mechanism 205, the transfer hand 202 of the substrate transfer mechanism 204 holds the substrate 1 and is composed by the droplet supply unit DP on the substrate 1. The object ML may be arranged.

The heat treatment unit 209 is used for baking treatment (heat treatment) of the substrate 1 and cooling treatment. The heat treatment unit 209 may be configured as a part of the flattening process R, or may be configured as a device different from the flattening device R.

The control unit 210 can control the flattening device R, the substrate transfer mechanism 204, the preparation station 220, and the heat treatment unit 209, that is, can control the entire flattening system 100. The control unit 210 is, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit) general-purpose program, or an abbreviation for ASIC. Alternatively, it is composed of a dedicated computer or a combination of all or a part thereof. Further, the control unit 210 functions as a processing unit that comprehensively controls each unit of the flattening system 100 including the flattening device R to perform the flattening process. A control unit may be provided in each flattening device R constituting the flattening system 100, and the control unit in the flattening device R may function as a processing unit that performs flattening processing.

The flattening device R executes the flattening process described with reference to FIGS. 1B to 1D. The composition arranging step shown in FIG. 1A may also be performed by providing the droplet supply unit DP in the flattening device R. When a plurality of flattening devices R are arranged in the flattening system 100, they may be arranged along the XY plane or may be stacked and arranged along the Z axis. Further, when a plurality of flattening devices R are arranged in the flattening system 100, they may be arranged along the XY plane or may be arranged in a stack along the Z axis. Further, in the present embodiment, an example in which the contact step, the curing step, and the separation step are continuously performed by the flattening device R will be described, but the device for executing the contact step, the device for executing the curing step, and the separation. It may be divided into devices for executing the process.

As the composition ML, a curable composition that cures when energy for curing is given can be used. Electromagnetic waves, heat, and the like can be used as the energy for curing. As the electromagnetic wave, for example, light such as infrared rays, visible light rays, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less can be used. The curable composition is a composition that is cured by irradiation with light or by heating. The photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like. The composition ML may be arranged on the substrate 1 in the form of droplets or islands or films formed by connecting a plurality of droplets by the droplet supply unit DP (liquid injection head). Good. As the viscosity (viscosity at 25 ° C.) of such a composition ML, for example, one having a viscosity of 1 mPa · s or more and 100 mPa · s or less can be used. Further, in the method using heat as energy for curing, the thermoplastic resin is heated to a temperature equal to or higher than the glass transition temperature, and the mold is pressed against the substrate through the resin in a state where the fluidity of the resin is increased to cool the resin. A flattening film can be formed by later separating the mold from the resin.

In the following embodiment, an example in which ultraviolet light is used as the curing energy and a photocurable material is used as the composition ML will be described.

The substrate 1 is typically a silicon wafer, but is not limited to this. The substrate 1 may be any of semiconductor device substrates such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, silicon nitride, quartz glass, ceramics, metal, resin, and the like. Can be selected for. As the substrate 1, a substrate may be used in which an adhesion layer is formed by surface treatment such as a silane coupling treatment, a silazane treatment, a film formation of an organic thin film, and the like, and the adhesion to the curable composition is improved. .. The substrate 1 is typically a circle having a diameter of 300 mm, but the substrate 1 is not limited to this.

As the mold SS, a mold made of a light-transmitting material is used in consideration of the light irradiation process. Specific examples of the material of the material constituting the mold SS include glass, quartz, PMMA (Polymethyl methylate), a phototransparent resin such as polycarbonate resin, a transparent metal vapor deposition film, a flexible film such as polydimethylsiloxane, and photocuring. A film, a metal film, or the like is preferable. The mold SS is preferably a circle having a diameter larger than 300 mm and smaller than 500 mm, but is not limited to this. The thickness of the mold SS is preferably 0.25 mm or more and less than 2 mm, but is not limited to this. Further, the above-mentioned substrate transfer mechanism 204 can also function as a mold transfer mechanism for transferring the mold SS to the flattening device R, and the transfer hand 202 of the substrate transfer mechanism 204 can be moved from the mold transfer container (not shown) to the mold SS. Is taken out, and the mold SS is transported to the flattening device R.

In the semiconductor forming step, the flattening layer forming (film forming) step shown in FIGS. 1A to 1D may be carried out a plurality of times on one substrate 1. In many semiconductor device manufacturing processes, high heat is applied to the substrate 1 in plasma etching, coating, cleaning, ion implantation, and the like. Even after the substrate 1 is once flattened, the composition ML may shrink or the strain may be released by the heat applied in the subsequent step, and the flatness of the substrate 1 may be lowered again. It is not efficient to flatten the substrate 1 every time the flatness of the substrate 1 decreases. Therefore, it may be advantageous to perform a heat cycle immediately after the formation of the flattening film to shrink the composition ML of the substrate 1 in advance, release the strain, and then promptly send it to a later step. The heat treatment unit 209 described above is useful for such applications. Further, the heat treatment unit 209 can be configured so that a plurality of substrates can be processed at one time. For example, the heat treatment unit 209 can stack the substrates 1 in the vertical direction at regular intervals and execute baking and cooling in a batch system in units of a fixed quantity. For example, the substrate 1 returned to the substrate transport mechanism 204 can be sent to the heat treatment unit 209, and baking and rapid cooling of about 250 to 400 degrees can be performed on the plurality of substrates 1.

Next, the configurations of the flattening device R and the type SS according to the present embodiment will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a view of the flattening device R as viewed from the side surface side (X-axis side). FIG. 4 is a diagram illustrating a configuration of a mold SS having electrodes constituting a contact detection sensor (also referred to as a touch sensor), a mold holding portion 302 for holding the mold SS, a head 301, and the like according to the present embodiment. It is a figure which looked at the head 301 from the lower side (the side which contacts a composition on a substrate).

The flattening device R is driven by a light source 304, a substrate chuck 340 (board holding portion), a substrate stage 305, a substrate drive mechanism 330, a head 301, and a plurality of mold drive mechanisms 308 and mold drive mechanisms 308 supported by the head 301. It has a mold holding portion 302. Further, the flattening device R is electrically connected to the mold SS, and the contact detection sensor of the mold SS transmitted via the wiring board 303 such as a flexible printed circuit board for transmitting an electric signal and the wiring board 303. A signal processing unit 307 for processing the electric signal of the above is provided. Further, a pressure control unit 306 for adjusting the pressure in the space region 300 provided between the mold and the mold holding unit 302 is also provided.

The mold SS is carried in by the transport hand 202 and held by the mold holding unit 302. The mold holding unit 302 can hold the mold SS by, for example, a vacuum suction force or an electrostatic suction force. The mold holding portion 302 can be provided, for example, with glass, ceramics, metal or resin, and more specifically, it can be made of quartz glass, sapphire, SiC ceramics, alumina ceramics, aluminum alloy or cordierite. The mold SS can be provided with a circular or quadrangular outer shape, and a flat surface portion is provided on the surface on the side in contact with the substrate 1. The flat surface portion has rigidity so as to come into contact with the composition ML on the substrate 1 and imitate the surface shape of the substrate 1. Further, when the mold holding portion 302 also has a portion arranged in the optical path of the light from the light source in consideration of the light irradiation process, the portion is made of a light-transmitting material. The portion is preferably a material having a transmittance of 60% or more with respect to the irradiated light.

Further, the mold holding portion 302 is configured so that a sealed space area 300 is formed between the mold holding portion 302 and the mold SS while holding the mold SS. By controlling the pressure in the space region 300 by the pressure control unit 306, the shape of the mold SS can be controlled. Specifically, when the mold SS starts contacting the composition ML of the substrate 1, the space region 300 is pressed to deform the mold SS so as to have a convex shape toward the substrate 1. As a result, contact with the composition ML can be started from the central portion of the mold SS, and then the adsorption by the mold holding portion 302 is released and the flat portion of the mold SS imitates the surface of the composition ML, whereby the mold SS is formed. The flat surface portion of the above can be brought into contact with the composition without bending. That is, it can be said that the normal state of the contact process is a state in which the contact region between the mold SS and the substrate 1 spreads radially from the central portion of the mold SS.

As shown in FIG. 4, the size of the mold holding portion 302 is provided so as to be larger than that of the mold SS, and the outer peripheral portion of the mold holding portion 302 is provided by being coupled to the head 301. The head 301 is provided with a plurality of mold drive mechanisms 308 for correcting the inclination of the mold SS around the Z axis. In the example shown in FIG. 4, three mold drive mechanisms 308 are evenly arranged at three locations of the head 301 at 120 degrees, and by driving the mold holding portion 302 in the Z-axis direction and the tilt direction, the mold SS It is possible to move in the Z-axis direction and correct the inclination. Further, the wiring board 303 for transmitting an electric signal from the mold SS is mounted on the head 301 and is connected to the external signal processing unit 307 via the head 301. The length of the flexible wiring board constituting the wiring board 303 can be appropriately adjusted so that the mold SS can be electrically connected even when the mold SS is released from the mold holding portion 302 and is in contact with the substrate 1. preferable. It is not always necessary to be electrically connected while the mold SS is released, and the electrical connection with the mold SS is released at the timing when the contact state by the contact detection sensor does not need to be known. You may.

Ultraviolet rays used as photocuring energy are emitted from a light source 304 provided inside the head 301, pass through a mold holding portion 302 and a mold SS provided with a material through which ultraviolet rays are transmitted, and irradiate the composition ML on the substrate 1. Will be done. Details will be described later, but in the present embodiment, by providing the contact detection sensor on the mold SS, a high-speed, high-resolution camera image formation for confirming the contact state between the mold SS and the substrate 1 as in the conventional case is performed. There is no need to provide an optical system. That is, in order to be compatible with the imaging optical system, it is not necessary to provide an illumination optical system that guides the light from the light source arranged away from the substrate to the substrate, so that the light source 304 is located at the opposite position of the substrate 1 (near the substrate). Can be provided in. As a result, it is possible to use an LED light source in which a plurality of LED elements that emit ultraviolet rays are arranged and provided as the light source 304. In the example of FIG. 3, the light source 304 is arranged inside the head 301, so that the light source 304 is arranged in the vicinity of the substrate 1.

The board drive mechanism 330 is provided so that the position of the board 1 can be adjusted by driving the board stage 305. Specifically, the board stage 305 is moved in the X-axis direction, the Y-axis direction, and Z. It is configured so that it can be driven in the axial direction. That is, the substrate drive mechanism 330 and the head 301 form a relative drive mechanism in which the relative positions of the substrate 1 and the mold SS are adjusted. That is, at least one of the substrate drive mechanism 330 and the head 301 is configured so that the relative position with respect to the Z-axis direction can be changed. As a result, the substrate 1 and the mold SS are brought into contact with each other in the contact step, and the cured composition ML and the mold SS on the substrate 1 are separated in the separation step. The relative position with respect to the Z-axis direction can be changed.

Further, the substrate drive mechanism 330 may be configured to drive the substrate stage 305 at a transfer position where the substrate 1 is delivered to and from the transfer hand 202 of the substrate transfer mechanism 204. Further, when the transfer hand 202 transfers the mold SS to the flattening device R, the substrate drive mechanism 330 drives the substrate stage 305 while holding the mold SS, so that the mold SS is transferred to the mold holding unit 302. It may be adsorbed.

Next, with reference to FIGS. 5 and 6, details of the type SS having electrodes constituting the contact detection sensor (also referred to as a touch sensor) according to the present embodiment will be described.

The electric circuit technology that constitutes the capacitive touch sensor is applied to the type SS of this embodiment. As the capacitance method of the touch sensor, there are a surface type capacitance method and a projection type capacitance method. The projection type capacitance method mainly has a difference in the driving method, such as a self-capacitance method and a mutual capacitance method. Are known, and these can be adopted. In the present embodiment, if only the contact start point needs to be known, the self-capacity method can be adopted, but if it is desired to confirm the contact boundary line for determining the contact state, a plurality of contacts can be used at the same time. It is preferable to use a mutual capacitance type touch sensor capable of detection. In the following description of the embodiment, an example in which a projection type capacitance type touch sensor is adopted for the type SS will be described.

FIG. 5 is a diagram for explaining the electrode configuration provided on the mold SS, and is a view seen from the surface side opposite to the surface in contact with the composition ML of the mold SS. The touch sensor unit of the type SS is arranged so that a plurality of X electrodes 520X1 to Xn (n = 2 or more) and a plurality of Y electrodes 510Y1 to Yn (n = 2 or more) intersect (orthogonally) with each other.

Each X electrode is composed of a transparent electrode 502a made of a plurality of rectangular transparent conductive materials and a wiring 502 made of a transparent conductive material connecting them, and each is electrically connected to a wiring board 303 by a wiring 504. ing. Similarly, each Y electrode is also composed of a transparent electrode 501a made of a plurality of rectangular transparent materials and a wiring 501 made of a transparent conductive material connecting them, and each is electrically connected to a wiring board 303 by a wiring 503. Has been done. The transparent electrode 502a of each X electrode and the transparent electrode 501a of each Y electrode are arranged so as not to overlap each other in the Z-axis direction. It is preferable that the

transparent electrodes

501a and 502a and the

wirings

501 and 502 are arranged in such a shape that there is as little gap as possible between them. Further, a transparent electrode or a dummy electrode containing the same conductive film as the transparent wiring may be provided in these gaps.

The transparent conductive material as used in the present embodiment is a conductive material through which ultraviolet rays emitted from the light source 304 are transmitted. Specifically, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide added with gallium, or graphene can be used. Further, these

wirings

501, 502 and

transparent electrodes

501a, 502a are formed by forming a film of the above-mentioned conductive material having translucency on a mold SS by a sputtering method or the like, and then various patterning techniques such as a photolithography method. Therefore, unnecessary portions can be removed to form the film.

FIG. 6 is a schematic view for explaining the cross-sectional structure of the mold, and shows an example in the case where three transparent electrodes are provided. The insulating layer 601 is laminated with the thin plate-shaped transparent substrate 600 constituting the mold SS as the lowermost layer. Further, a transparent electrode 501a and a wiring 501, a first patterning layer 602 having an insulating layer formed on the transparent electrode 501a and the wiring 501, and a second patterning layer 603 having an insulating layer formed on the transparent electrode 502a and the wiring 502. The contact detection sensor is configured by stacking the wires. The wiring 503 and the wiring 504 are provided so that their surfaces are exposed at the outer peripheral portion of the mold SS, and are electrically connected to the wiring board 303. The wiring 503 and the wiring 504 can also be provided with the same transparent conductive material as the transparent electrode 501a and the like. However, if it is not necessary to transmit ultraviolet rays, the

wirings

503 and 504 may be made of a metal material such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium. , An alloy material containing the metal material may be used.

When an object that can change the capacitance, such as the composition ML on the substrate 1, comes into contact with the surface of the type SS that comes into contact with the composition, the capacitance changes. Then, by detecting the amount of change as a contact signal in the signal processing unit 307, it is possible to detect in which part of the electrodes X1 to Xn and the electrodes Y1 to Yn of the type SS the contact has occurred. At this time, the region where the capacitance changes corresponds to the contact area of the composition ML, and in the region where the change in capacitance occurs by a predetermined value or more, the composition ML and the surface of the mold SS come into contact with each other. It can be determined that the area is in the area.

The detection situation when the composition ML on the substrate 1 comes into contact with the surface of the mold SS will be described with reference to FIGS. 7A to 7C. FIG. 7A is an example of a signal waveform showing a change in the capacitance of the Y electrode. FIG. 7B is an example of a signal waveform showing a change in the capacitance of the X electrode. 7A and 7B show waveforms when n = 1 to 15 are provided for each of the X electrode and the Y electrode. The horizontal axis is the number n of each electrode, and the vertical axis shows the change in the capacitance of each electrode. Each change in capacitance is transmitted to the signal processing unit 307. The signal processing unit 307 extracts the electrode number that maximizes the change in capacitance among the X electrodes and the electrode number that maximizes the change in the Y electrode, and the position corresponding to the intersecting portion is the contact center 701. It can be determined that there is.

FIG. 7C is a diagram illustrating a contact state when receiving the signal waveforms of FIGS. 7A and 7B, and is a waveform when contact is started from the contact center 701 and the mold SS and the substrate 1 are in contact with each other up to the contact boundary 702. An example is shown. The portion of the Y electrode n = 8 and the X electrode n = 8 corresponding to the contact center 701 has the largest change in capacitance, so that the change is the largest.

Further, since it can be said that the region where the change from the initial value by a predetermined value or more is the contact region, the boundary electrode number where the change from the initial value by a predetermined value or more occurs between the adjacent electrodes is the contact boundary 702. You can judge. In the examples of FIGS. 7A to 7C, it can be said that the X electrode n = 3, the X electrode n = 13, the Y electrode n = 3, and the Y electrode n = 13 detect the contact boundary 702. When the contact boundary 702 extends radially from the contact center 701 during the contact process of the mold SS, it can be determined that the contact process between the mold SS and the substrate 1 is proceeding normally.

In this embodiment, as shown in FIGS. 7A to 7C, an example in which the X electrode and the Y electrode are provided over almost the entire contact surface of the mold SS has been described. It may be sufficient to provide an electrode capable of discriminating the state of radially spreading from the region. That is, it is sufficient that a plurality of electrodes having different distances from the central portion are provided on a plurality of lines radially extending from the central portion of the mold SS, and contact detection can be performed at least at the position of the central portion and the positions of the plurality of electrodes.

Next, with reference to FIG. 8, the flattening process in the flattening apparatus R in the present embodiment will be described. FIG. 8 is a flowchart showing the flow of the flattening process of the flattening device. As described above, the flattening process is performed by the control unit 210 comprehensively controlling each unit of the flattening device R.

Before the process in step S1 is started, the control unit 210 performs a composition arranging step as shown in FIG. 1A. Specifically, in the preparation station 220, the composition ML as a flattening material is arranged by the droplet supply unit DP on the substrate 1 supported by the substrate support table WT of the alignment mechanism 205.

After that, in step S1, the control unit 210 carries the substrate 1 provided with the composition by the substrate transfer mechanism 204 into the flattening device R and places it on the substrate holding unit 340.

In step S2, the control unit 210 starts the mold contact process as the process of starting the contact process shown in FIG. 1B. Specifically, the control unit 210 lowers the head 301 so that the mold SS held by the mold holding unit 302 is lowered, and starts contact between the composition ML on the substrate 1 and the flat surface portion of the mold SS. To do. At that time, the mold SS is bent so as to have a downward convex shape by its own weight and the pressure control of the space region 300 by the pressure control unit 306. Therefore, the central portion of the mold SS first contacts the composition ML on the substrate W. Therefore, when the contact is normally started, the point 701 of the mold as shown in FIG. 7C becomes the contact start point, so that the change in capacitance of the X electrode n = 8 and the Y electrode n = 8 It is transmitted to the signal processing unit 307.

Next, in step S2, the control unit 210 determines whether the position of the contact start point is normal. Specifically, the control unit 210 determines whether the contact start points detected by the signal processing unit 307 are the X electrode n = 8 and the Y electrode n = 8. If it is determined in step S2 that the position is correct, the process proceeds to step S6, and if it is determined that the position is not correct, the process proceeds to step S4 to perform the adjustment process.

In step S4, the control unit 210 drives the three mold drive mechanisms 308 of the head 301 shown in FIG. 4 to adjust the tilt of the mold holding unit 302 so that the position of the contact start point is the correct position. Then, in step S5, the control unit 210 determines whether or not the position of the contact start point is normal based on the detection result in the signal processing unit 307. If it is determined to be normal in step S5, the process proceeds to step S6. On the other hand, if it is determined that it is not normal again in step S4, there is a possibility that air bubbles or foreign matter are generated between the substrate 1 and the mold SS, so the process proceeds to step S12 and is determined in advance. Performs predetermined error processing and ends the processing. As a specific example of the error processing, a processing in which the processing of the conveyed substrate is completed and the process shifts to the next substrate flattening processing, or a cleaning processing for cleaning the mold SS can be adopted. The cleaning means for performing such a cleaning process may be provided inside the flattening device R or outside the flattening device R.

In step S6, the control unit 210 causes the pressure control unit 306 to control the pressure in the space region 300, and continues the contact processing of the mold. At this time, if normal, after the start of contact between the composition ML and the mold SS, the mold SS (angle of the mold SS with respect to the plane parallel to the XY plane) at the boundary between the contact region and the non-contact region outside the contact region is maintained constant. However, the contact area expands. By expanding the contact region radially from the central portion of the mold SS in this way, the composition ML can be expanded in a film shape while maintaining the thickness of the composition ML constant.

In step S7, the control unit 210 determines whether the contact region is normally progressing in the contact process started in step S6. Specifically, the control unit 210 monitors the situation in which the contact boundary moves radially from the central portion to the outer edge by detecting the temporal change of the capacitance of each electrode in the signal processing unit 307 in real time. can do. Then, if it is determined in step S7 that the contact area is proceeding normally, the process proceeds to step S8, and if it is detected during monitoring that an abnormality such as not spreading radially occurs, the process proceeds to step S8. Proceed to step S12 to perform a predetermined error processing.

In step S8, the control unit 210 proceeds with the contact process started in step S6, the contact boundary reaches the vicinity of the outer edge of the substrate 1, the mold SS is released from being held by the mold holding unit 302, and the mold SS becomes the substrate 1. It is determined whether or not the composition of the above is placed on the ML. The process returns to step S6 until the contact process is completed, while the process proceeds to step S9 when it is determined that the contact process is completed. The mold contact process is completed is a state in which the mold SS is placed on the composition ML of the substrate 1, the mold SS adheres to the global unevenness of the substrate 1, and the film made of the composition ML is formed. , It becomes uniform over the entire area of the substrate 1 and forms a flattening film.

Next, in step S9, the control unit 210 irradiates the composition ML with light (ultraviolet rays) from the light source 304 shown in FIG. 1C via the mold holding unit and the mold SS to cure the photocurable composition ML. Perform a curing step (exposure step). The irradiation time of ultraviolet rays, which is the energy for curing, is several tens of seconds. Generally, the material used for the composition ML has high volatility, but the volatility from the composition ML in the contact step may affect the flatness of the film. Therefore, a situation in which the composition ML is supplied onto the substrate 1 and then the substrate 1 is kept on standby in the flattening apparatus R without being treated is not desirable because the volatilization of the composition ML becomes large. Therefore, it is desirable to quickly shift from the contact step to the curing step, and the region to be irradiated with the curing energy is set to the center in accordance with the operation in which the contact region expands from the central portion of the mold SS toward the outer edge in the contact step. It may be enlarged or moved from the portion toward the outer circumference.

Next, in step S10, the control unit 210 controls the three mold drive mechanisms 308 of the head 301 and the pressure control unit 306, and the mold holding unit 302 sucks and holds the mold SS again, as shown in FIG. 1D. , The mold SS is separated from the cured composition ML on the substrate 1. At this time, if the head 301 is simply raised in the vertical direction (Z-axis direction) to separate the mold SS from the composition ML, a large force of several hundred N (Newton) is required. When such a large force is applied to the mold SS and the substrate 1, the pattern of the substrate 1 may be damaged, the composition ML may be peeled off, the mold SS may be damaged, and the like. Therefore, first, a force of about several N is locally applied to the interface between the composition ML and the mold SS to form a separation start point between the composition ML and the mold SS, and the head 301 is further raised or tilted. , It is preferable to expand the separation region starting from the separation start point and complete the separation. As a result, the force required for separation can be reduced, and it is possible to prevent the pattern of the substrate 1 from being damaged, the composition ML from being peeled off, and the mold SS from being damaged. Even during this separation operation, the control unit 210 can monitor the contact state at the time of separation by detecting the time change of the capacitance of each electrode in real time in the signal processing unit 307.

In step S11, assuming that the flattening process by the flattening device R has been completed, the control unit 210 carries out the upper substrate 1 of the substrate holding unit 340 from the flattening device R by the substrate transfer mechanism 204, and carries out the substrate transfer container 203. Complete the process of returning to. If the substrate to be processed remains in the substrate transfer container 203, the processing from S1 is restarted.

In the example shown in the flowchart of FIG. 8, both the position of the contact start point and the contact state during the continuation of the mold contact process are determined using an example. , It is not necessary to perform both, and either one may be performed as appropriate.

Further, in the example of the contact processing of the present embodiment, the case where the mold SS is separated from the mold holding portion 302 has been described, but the contact processing may be performed while the mold SS is held by the mold holding portion 302. Good.

As described above, in the present embodiment, by providing the contact detection sensor on the mold SS, an imaging optical system of a high-speed and high-resolution camera for confirming the contact state between the mold SS and the composition ML is provided. No need. As a result, it is not necessary to provide a complicated optical system that balances the illumination optical system that irradiates the light used for photocuring and the imaging optical system of the high-speed, high-resolution camera for confirming the contact state. As described above, the configuration of the illumination optical system can be simplified. Further, according to the contact detection sensor of the present embodiment, the contact state between the substrate and the mold can be easily confirmed, so that it is possible to provide an advantageous technique for flattening the composition on the substrate. ..

(Second embodiment)
In this embodiment, an example of a cross-sectional structure of a type different from that of the first embodiment will be described. Since the other configurations are the same as those of the first embodiment, the description thereof will be omitted.

FIG. 9 is a schematic view for explaining the cross-sectional structure of the mold, and shows an example in the case where three transparent electrodes are provided as in FIG. The first insulating layer 601a, the conductive layer 801 and the second insulating layer 601b are laminated with the thin plate-shaped transparent substrate 600 constituting the mold SS as the lowermost layer. The conductive layer 801 is provided so that a voltage can be applied via a wiring board 303 or the like by wiring (not shown). The transparent conductive material that can be used for the conductive layer 801 is a conductive material that transmits ultraviolet rays emitted from the light source 304. Specifically, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide added with gallium, or graphene can be used. Further, a transparent electrode 501a and a wiring 501, a first patterning layer 602 having an insulating layer formed on the transparent electrode 501a and the wiring 501, and a second patterning layer 603 having an insulating layer formed on the transparent electrode 502a and the wiring 502. The contact detection sensor is configured by stacking the wires. The wiring 503 and the wiring 504 are provided so that their surfaces are exposed at the outer peripheral portion of the mold SS, and are electrically connected to the wiring board 303. The wiring 503 and the wiring 504 can also be provided with the same transparent conductive material as the transparent electrode 501a and the like. However, if it is not necessary to transmit ultraviolet rays, the

wirings

When the mold SS goes through the contact step of FIG. 1B and the separation step of FIG. 1D, the contact surface between the composition ML of the transparent substrate 600 and the mold SS is charged and attracts surrounding particles, which may cause defects in the flattening film. There is. Therefore, by providing the conductive layer 801 inside the mold SS when performing the contact step and the separation step, a voltage is applied to the conductive layer 801 to eliminate static electricity on the 600 surface of the transparent substrate so as not to attract surrounding particles. Can be controlled.

Even when a mold SS having such a cross-sectional structure is used, the contact state between the mold SS and the composition ML is confirmed by providing the mold SS with a contact detection sensor as in the first embodiment. Therefore, it is not necessary to provide an imaging optical system for a high-speed, high-resolution camera. As a result, it is not necessary to provide a complicated optical system that balances the illumination optical system that irradiates the light used for photocuring and the imaging optical system of the high-speed, high-resolution camera for confirming the contact state. As described above, the configuration of the illumination optical system can be simplified. Further, according to the contact detection sensor of the present embodiment, the contact state between the substrate and the mold can be easily confirmed, so that it is possible to provide an advantageous technique for flattening the composition on the substrate. ..

(Manufacturing of goods by flattening device)
The article can be manufactured by using the flattening device R as described above in the present embodiment. Such an article manufacturing method includes a film forming step of forming a film (flattening film) made of a cured product of the composition on a substrate using a flattening device R, and the substrate having undergone the film forming step. It is possible to manufacture an article from the substrate which has undergone the processing step, which includes a processing step of performing the well-known processing treatment. Other well-known processing steps include etching, resist stripping, dicing, bonding, packaging and the like.

The flattening device R is configured as an imprint device that forms a pattern made of a cured product of the composition ML on the substrate 1 (for example, one region or a plurality of shot regions of the substrate 1 or the entire shot region of the substrate 1). You may. The mold SS used in the imprinting apparatus has a pattern region in which a pattern to be transferred to the substrate W is arranged, and an alignment mark.

Further, as shown in FIG. 1D by the flattening device R, a pattern of the cured product of the composition may be formed on the substrate W whose surface is flattened by using the imprinting device. Hereinafter, a method of forming a pattern of a cured product on a substrate using an imprinting apparatus will be described.

The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching, ion implantation, or the like in the substrate processing process.

10A to 10F show a method of manufacturing an article in which a pattern is formed on a substrate by an imprinting device, the substrate on which the pattern is formed is processed, and an article is produced from the processed substrate. First, as shown in FIG. 10A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and then an imprint material is imprinted on the surface of the work material 2z by an inkjet method or the like. 3z is given. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 10B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 10C, the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 10D, when the mold 4z and the substrate 1z are separated from each other after the imprint material 3z is cured, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 10E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z that has no cured product or remains thin is removed to form a groove 5z. As shown in FIG. 10F, when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

The present invention is not limited to the above embodiment, and various modifications and modifications can be made without departing from the spirit and scope of the present invention. Therefore, the following claims are attached in order to publicize the scope of the present invention.

This application claims priority based on Japanese Patent Application No. 2019-182450 submitted on October 2, 2019, and all the contents thereof are incorporated herein by reference.

Claims

A mold holding portion for holding a mold having a flat surface portion, a substrate holding portion for holding a substrate, and a curing portion for curing a composition provided on the substrate are provided, and the flat surface portion of the mold is described. The mold used in a flattening apparatus that cures the composition at the cured portion in contact with the composition on the substrate.
A surface on the side where the flat surface portion is provided and in contact with the substrate on which the composition is provided,
A contact detection sensor that detects that an object has come into contact with the surface,
A mold characterized by having.
The composition is made of a photocurable material and is made of a photocurable material.
The cured portion of the flattening device is a light-irradiated portion that cures the composition by irradiating light through the mold.
The mold according to claim 1, wherein the contact detection sensor is composed of a transparent electrode made of a material through which light emitted from the light irradiation unit is transmitted.
The type according to claim 1 or 2, wherein the contact detection sensor detects the contact of the object with the surface by changing the capacitance when the object comes into contact with the object.
The type according to any one of claims 1 to 3, wherein the contact detection sensor can detect a plurality of contacts with an object.
The claim is characterized in that the contact detection sensor can detect at least the position of the central portion of the mold and a plurality of positions on a line extending radially from the position of the central portion at different distances from the central portion. The type according to any one of Items 1 to 4.
A mold holding portion for holding a mold having a surface on a side in contact with a substrate on which a flat surface portion is provided and a composition is provided, and a contact detection sensor for detecting that an object has come into contact with the surface.
The board holding part that holds the board and
A cured portion for curing the composition provided on the substrate, and a cured portion.
It has a control unit that controls the composition to be cured by the cured portion in a state where the flat portion of the mold is in contact with the composition on the substrate.
The control unit is a flattening device that detects contact between the flat surface portion of the mold and the composition in response to a signal from the contact detection sensor.
6. The control unit is characterized in that, in response to a signal from the contact detection sensor, at least one of a contact start point and a contact state between the flat surface portion of the mold and the composition is correct. The flattening device according to.
The seventh aspect of claim 7, wherein the control unit controls so that the composition is not cured by the cured unit when there is an abnormality in at least one of the contact starting point and the contact state. Flattening device.
The composition is made of a photocurable material and is made of a photocurable material.
The flattening apparatus according to any one of claims 6 to 8, wherein the cured portion is a light-irradiated portion that cures the composition by irradiating light through the mold.
The contact detection sensor of the type is composed of a transparent electrode made of a conductive material through which light from the light irradiation unit is transmitted.
The flattening apparatus according to claim 9, wherein the light irradiation unit exposes the composition of the substrate via the mold.
A step of flattening a substrate using the flattening apparatus according to any one of claims 6 to 10 and a step of processing the flattened substrate in the step are included.
A method for producing an article, which comprises producing the article from the processed substrate.
A mold holding portion for holding a mold having a flat surface portion and a surface on the side in contact with the substrate on which the composition is provided, and a contact detection sensor for detecting that an object has come into contact with the surface, and a substrate are held. A method for flattening a flattening apparatus, which comprises a substrate holding portion to be formed and a curing portion for curing a composition provided on the substrate.
A detection step of detecting contact between the flat surface portion of the mold and the composition in response to a signal from the contact detection sensor.
A flattening method comprising performing a control step of controlling the cured portion for curing the composition according to the result of the detection step.
In the control step, it is determined whether at least one of the contact start point and the contact state between the flat surface portion of the mold and the composition is correct in response to the signal from the contact detection sensor.
The flattening method according to claim 12, wherein when at least one of the contact start point and the contact state is determined to be incorrect, the composition is controlled so as not to be cured.