CN106914711B - A kind of stainless-steel vacuum container lead-free solder and its manufacturing method and method for welding - Google Patents
A kind of stainless-steel vacuum container lead-free solder and its manufacturing method and method for welding Download PDFInfo
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- CN106914711B CN106914711B CN201710237894.XA CN201710237894A CN106914711B CN 106914711 B CN106914711 B CN 106914711B CN 201710237894 A CN201710237894 A CN 201710237894A CN 106914711 B CN106914711 B CN 106914711B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses a kind of stainless-steel vacuum container lead-free solder and its manufacturing method and method for welding, the weight percent of lead-free solder is formed are as follows: silicon 5~8%;Zinc 5~8%;Aluminium 2~5%;Copper 1~5%;Surplus is bismuth.Its specific manufacturing step is as follows: raw material (1) being placed in melting in melting furnace after weighing proportionally, after waiting each components to melt completely, glass lead-free solder block is made after melting at high temperature;(2) obtained glass lead-free solder block is broken into particle;(3) by obtained particulate abrasive at glass powder;(4) obtained glass powder is poured into moulding machine heating extrusion forming, obtains stainless-steel vacuum container lead-free solder after cooling.The present invention be free of lead, will not influence human health, not can cause environmental pollution, be more in line with modernization health idea and environmental protection requirement, and can the coefficient of expansion well with stainless-steel vacuum container match, tack time is short, sealing effect is good.
Description
Technical field
The present invention relates to lead-free solder more particularly to a kind of stainless-steel vacuum container lead-free solder and its manufacturing method and
Method for welding.
Background technique
Vacuum brazing refers to that workpiece heating carries out in vacuum chamber, is mainly used for the product for requiring quality high and oxidizable
The welding of material.Vacuum Soldering Technology since the forties so far, it has also become a kind of extremely promising welding technique, and
Have been widely used for electronics industry, part, aircraft industry, atomic energy industry, air separation equipment, petrochemical equipment, work
Journey is mechanically.It is welded currently, Vacuum Soldering Technology generally requires in brazing process using tin-lead solder.
As Publication No. " CN104511698A ", publication date be on April 15th, 2015, it is entitled " slicker solder silver solder and its
The application for a patent for invention of preparation process " discloses a kind of slicker solder silver solder and its preparation process, " in solder alloy each chemistry at
The weight percent divided are as follows: tin 4.5-11%, silver-colored 0.8-2.65%, surplus is lead ", the preparation process of the slicker solder silver solder is
" dissolution furnace temperature is set in 650-670 DEG C, the desired amount of lead, tin and pb-ag alloy is sequentially added, is sufficiently stirred, then pour
It builds;The embryo ingot poured is passed through into thick cold rolling, then carries out finish rolling, then the band of finish rolling to required thickness is advised by required size
Lattice carry out punching press ".
The slicker solder silver solder obtained by technique made above can be common to vacuum brazing field, can preferably bond
In being brazed on substrate, preferable sealing effect is played.And this slicker solder silver solder is being applied to stainless-steel vacuum field of containers
When, although can also play certain bonding and sealing effect, its coefficient of expansion can not hold with stainless-steel vacuum well
Device matches, cause this slicker solder silver solder tack time when being brazed to stainless-steel vacuum container is short, sealing effect compared with
Difference, stainless-steel vacuum container in use for some time lose comparatively fast by its vacuum heat-preserving effect, is unable to satisfy the daily need of people
It asks.
In addition, because containing lead in the ingredient of this slicker solder silver solder, and lead itself has certain toxicity, when this slicker solder
Silver solder is applied in stainless-steel vacuum container when vacuumizing operation, it will stainless-steel vacuum container is polluted to a certain extent, it is right
Human body affects, and does not meet the health idea of people's modernization.
In addition, this leaded slicker solder silver solder and not environmentally, after stainless-steel vacuum container rejection is dropped, thereon
Slicker solder silver solder also easily causes a series of environmental problems.Especially the developed countries such as European Union, U.S. are based on to environmental protection
It needs, proposes the limit value requirement of lead content 100ppm, formed technical barrier.To solve the above-mentioned problems, industry at present
Interior, mainly Japanese enterprises start using silver-based, nickel based metal vacuum brazing material alternatively, and using high temperature vacuum brazing i.e. pricker
Weldering temperature is brazed in 950 degree to 1050 degree of vacuum brazing technique.But using silver-based, nickel based metal as vacuum brazing material
When its higher cost, energy consumption it is big, and production efficiency is low, can not meet the needs of market well.
Summary of the invention
The present invention for tack time is short, sealing effect is poor existing for existing slicker solder silver solder, not environmentally the defects of, mention
For a kind of new stainless-steel vacuum container lead-free solder and its manufacturing method and method for welding.
In order to solve the above-mentioned technical problem, the invention is realized by the following technical scheme:
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5~8%;
Zinc 5~8%;
Aluminium 2~5%;
Copper 1~5%;
Surplus is bismuth.
According to above-mentioned raw materials according to specified weight percentage, and hold by stainless-steel vacuum made by certain processing technology
Device lead-free solder, can the coefficient of expansion well with stainless-steel vacuum container match, have that tack time is long, sealing effect
The strong advantage of fruit can guarantee the vacuum heat-preserving effect of stainless-steel vacuum container well, not only high production efficiency, at low cost,
And this stainless-steel vacuum container is free of lead with lead-free solder itself, also solves the leaded problem of ordinary solder, is more in line with
The health idea of modernization, is more advantageous to marketing.
Preferably, a kind of stainless-steel vacuum container lead-free solder described above, weight percent composition are as follows:
Silicon 5~6%;
Zinc 5~6%;
Aluminium 2~3%;
Copper 1~3%;
Surplus is bismuth.
According to above-mentioned raw materials according to specified weight percentage, and hold by stainless-steel vacuum made by certain processing technology
Device lead-free solder, various aspects of performance is all more excellent, more conducively marketing.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70~80 parts of bismuth oxide;
5~10 parts of silica;
5~10 parts of zinc oxide;
2~8 parts of aluminum oxide;
1~5 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weigh be placed on melting in melting furnace, after waiting each components to melt completely, under the conditions of 850 DEG C~950 DEG C of temperature melting 50~
70 minutes, glass lead-free solder block is made;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heated under the conditions of 750 DEG C~850 DEG C and be squeezed into
Type obtains stainless-steel vacuum container lead-free solder after cooling.
It can be by raw material bismuth oxide, silica, zinc oxide, aluminum oxide, oxidation by above each step
Copper carries out melting well, and finally obtains the lead-free solder that can be perfectly suitable for stainless-steel vacuum container, because of selection
Lead is free of in raw material, therefore manufacturing process is more environmentally-friendly, and cost of material selected by the present invention is relatively low, is relatively easy to obtain
It takes, to reduce the production cost.
Preferably, a kind of manufacturing method of stainless-steel vacuum container lead-free solder described above, each group
The weight ratio of part are as follows:
73~78 parts of bismuth oxide;
6~9 parts of silica;
6~9 parts of zinc oxide;
3~6 parts of aluminum oxide;
1~3 part of copper oxide.
According to above-mentioned raw materials according to specified weight component, and used by the stainless-steel vacuum container that corresponding manufacturing step obtains
Lead-free solder will have longer tack time, better seal effect.
Preferably, a kind of manufacturing method of stainless-steel vacuum container lead-free solder described above, each group
The weight ratio of part are as follows:
75 parts of bismuth oxide;
8 parts of silica;
8 parts of zinc oxide;
4 parts of aluminum oxide;
2 parts of copper oxide.
According to above-mentioned raw materials according to specified weight component, and used by the stainless-steel vacuum container that corresponding manufacturing step obtains
Lead-free solder will have longer tack time, better seal effect.
Preferably, a kind of manufacturing method of stainless-steel vacuum container lead-free solder described above, the step
(3) in, the granularity of glass powder is 140 mesh~160 mesh.
By obtained particulate abrasive at the glass powder of the above particle size range, heating extrusion forming after facilitating, no
Production efficiency is improved only, and ensure that the quality of product.
Preferably, a kind of manufacturing method of stainless-steel vacuum container lead-free solder described above, the step
(3) in, the lapping mode is to pass through ball mill grinding.
Ball mill is the key equipment that material is broken and then is crushed, continuous raw to the adaptable of material
Production capacity power is big, is easy to adjust the fineness of ground prod, can meet the requirement of large-scale industrial production, and structure is simple, firm, behaviour
Work is reliable, maintenance management is simple, running rate is high, leakproofness is strong, can carry out negative-pressure operation, can obtain product by ball mill grinding
The better glass powder of matter.
A kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, includes the following steps:
(1) rustless steel container to be processed is taken, the stainless-steel vacuum container that manufacture obtains is placed in not with lead-free solder
At the solder concave station for steel container anury indsole of becoming rusty;
(2) after so that the furnace temperature of vacuum drying oven is lower than 150 DEG C, the rustless steel container of step (1) is moved into vacuum drying oven, closes furnace
Door simultaneously starts to be evacuated, electrified regulation while pumping;
(3) the temperature heating 15min of vacuum drying oven is reached 350 DEG C, the vacuum degree of vacuum drying oven reaches 1.0 × 10 at this time-2Pa,
And keep the temperature 10min;
(4) the temperature heating 10min of vacuum drying oven is reached 450 DEG C, the vacuum degree of vacuum drying oven reaches 8.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(5) the temperature heating 10min of vacuum drying oven is reached 550 DEG C, the vacuum degree of vacuum drying oven reaches 7.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(6) the temperature heating 10min of vacuum drying oven is reached 610 DEG C, the vacuum degree of vacuum drying oven reaches 6.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(7) the temperature heating 10min of vacuum drying oven is reached 650 DEG C, the vacuum degree of vacuum drying oven reaches 5.0 × 10 at this time-3Pa,
Keep the temperature 180min;
(8) power-off cooling, the vacuum degree of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, to vacuum drying oven
After interior temperature is down to 150 DEG C, opens fire door and take out rustless steel container to get molding stainless-steel vacuum container is arrived.
The stainless-steel vacuum container that the present invention obtains can be brazed in not well with lead-free solder by above step
It becomes rusty on steel container, to finally obtain, heat insulation effect is good, stainless-steel vacuum container with long service life.
The invention has the following beneficial effects:
(1) lead is free of in ingredient of the invention, will not be polluted the manufacturing environment of stainless-steel vacuum container, be will not influence human body
Health not can cause environmental pollution, and be more in line with the requirement of modernization health idea and environmental protection.
(2) present invention can the coefficient of expansion well with stainless-steel vacuum container match, when vacuumizing operation with
The tack time of stainless-steel vacuum container is short, sealing effect is good, can better ensure that the heat insulation effect of stainless-steel vacuum container.
Specific embodiment
Present invention is further described in detail With reference to embodiment, but they are not to limit of the invention
System:
Embodiment 1
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 6.5%;
Zinc 6.5%;
Aluminium 3.5%;
Copper 3%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
5 parts of silica;
5 parts of zinc oxide;
2 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 50 minutes under the conditions of 850 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 750 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 2
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 8%;
Zinc 5%;
Aluminium 2%;
Copper 1%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
0 part of silica 1;
5 parts of zinc oxide;
2 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 50 minutes under the conditions of 950 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 750 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 3
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5%;
Zinc 8%;
Aluminium 2%;
Copper 1%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
5 parts of silica;
10 parts of zinc oxide;
2 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 70 minutes under the conditions of 850 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 750 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 4
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5%;
Zinc 5%;
Aluminium 5%;
Copper 1%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
5 parts of silica;
5 parts of zinc oxide;
8 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 50 minutes under the conditions of 850 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 850 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 5
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5%;
Zinc 5%;
Aluminium 2%;
Copper 5%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
5 parts of silica;
5 parts of zinc oxide;
2 parts of aluminum oxide;
5 parts of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 70 minutes under the conditions of 950 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 850 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 6
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5%;
Zinc 5%;
Aluminium 2%;
Copper 1%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
80 parts of bismuth oxide;
5 parts of silica;
5 parts of zinc oxide;
2 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 60 minutes under the conditions of 900 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 800 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 7
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 8%;
Zinc 8%;
Aluminium 5%;
Copper 5%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70 parts of bismuth oxide;
0 part of silica 1;
10 parts of zinc oxide;
8 parts of aluminum oxide;
5 parts of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 55 minutes under the conditions of 870 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 775 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 8
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5.5%;
Zinc 5.5%;
Aluminium 2.5%;
Copper 2%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
80 parts of bismuth oxide;
0 part of silica 1;
10 parts of zinc oxide;
8 parts of aluminum oxide;
5 parts of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 65 minutes under the conditions of 930 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 825 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 9
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 6%;
Zinc 6%;
Aluminium 3%;
Copper 3%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
75 parts of bismuth oxide;
8 parts of silica;
8 parts of zinc oxide;
4 parts of aluminum oxide;
2 parts of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 60 minutes under the conditions of 900 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 800 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 10
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5.7%;
Zinc 5.7%;
Aluminium 3.5%;
Copper 1.5%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
73 parts of bismuth oxide;
6 parts of silica;
6 parts of zinc oxide;
3 parts of aluminum oxide;
1 part of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 55 minutes under the conditions of 870 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 775 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 11
A kind of stainless-steel vacuum container lead-free solder, weight percent composition are as follows:
Silicon 5.9%;
Zinc 5.9%;
Aluminium 3.3%;
Copper 1.3%;
Surplus is bismuth.
A kind of manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
78 parts of bismuth oxide;
9 parts of silica;
9 parts of zinc oxide;
6 parts of aluminum oxide;
3 parts of copper oxide;
Specific manufacturing step is as follows:
(1) prepare solder: by bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component press than
Example weighs and is placed on melting in melting furnace, and after waiting each components to melt completely, the melting 65 minutes under the conditions of 930 DEG C of temperature is made
Glass lead-free solder block;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 825 DEG C, it is cooling
Stainless-steel vacuum container lead-free solder is obtained afterwards.
Preferably, the lapping mode is to pass through ball mill grinding, the grain of glass powder in the step (3)
Degree is 140 mesh~160 mesh.
Embodiment 12
A kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, includes the following steps:
(1) take a rustless steel container to be processed, by embodiment 1 into embodiment 11 any embodiment manufacture it is stainless
Steel vacuum tank is placed at the solder concave station of rustless steel container anury indsole with lead-free solder;
(2) after so that the furnace temperature of vacuum drying oven is lower than 150 DEG C, the rustless steel container of step (1) is moved into vacuum drying oven, closes furnace
Door simultaneously starts to be evacuated, electrified regulation while pumping;
(3) the temperature heating 15min of vacuum drying oven is reached 350 DEG C, the vacuum degree of vacuum drying oven reaches 1.0 × 10 at this time-2Pa,
And keep the temperature 10min;
(4) the temperature heating 10min of vacuum drying oven is reached 450 DEG C, the vacuum degree of vacuum drying oven reaches 8.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(5) the temperature heating 10min of vacuum drying oven is reached 550 DEG C, the vacuum degree of vacuum drying oven reaches 7.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(6) the temperature heating 10min of vacuum drying oven is reached 610 DEG C, the vacuum degree of vacuum drying oven reaches 6.0 × 10 at this time-3Pa,
Keep the temperature 10min;
(7) the temperature heating 10min of vacuum drying oven is reached 650 DEG C, the vacuum degree of vacuum drying oven reaches 5.0 × 10 at this time-3Pa,
Keep the temperature 180min;
(8) power-off cooling, the vacuum degree of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, to vacuum drying oven
After interior temperature is down to 150 DEG C, opens fire door and take out rustless steel container to get molding stainless-steel vacuum container is arrived.
In short, the foregoing is merely presently preferred embodiments of the present invention, made by all ranges according to the present patent application patent
Deng variation and modification, it is all covered by the present invention.
Claims (7)
1. a kind of stainless-steel vacuum container lead-free solder, which is characterized in that its weight percent composition are as follows:
Silicon 5~8%;
Zinc 5~8%;
Aluminium 2~5%;
Copper 1~5%;
Surplus is bismuth;
The manufacturing method of stainless-steel vacuum container lead-free solder, the component including following weight ratio:
70~80 parts of bismuth oxide;
5~10 parts of silica;
5~10 parts of zinc oxide;
2~8 parts of aluminum oxide;
1~5 part of copper oxide;
Specific manufacturing step is as follows:
(1) it prepares solder: bismuth oxide, silica, zinc oxide, aluminum oxide, copper oxide each component is claimed in proportion
Amount is placed on melting in melting furnace, after waiting each components to melt completely, 50~70 points of melting under the conditions of 850 DEG C~950 DEG C of temperature
Glass lead-free solder block is made in clock;
(2) the glass lead-free solder block that step (1) obtains is broken into the particle that diameter is 4~6 mm in size;
(3) particulate abrasive for obtaining step (2) is at glass powder;
(4) glass powder that step (3) obtains is poured into moulding machine and heats extrusion forming under the conditions of 750 DEG C~850 DEG C, it is cold
But stainless-steel vacuum container lead-free solder is obtained afterwards.
2. a kind of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that: its weight percent
Composition are as follows:
Silicon 5~6%;
Zinc 5~6%;
Aluminium 2~3%;
Copper 1~3%;
Surplus is bismuth.
3. a kind of manufacturing method of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that: institute
The weight ratio for each component stated are as follows:
73~78 parts of bismuth oxide;
6~9 parts of silica;
6~9 parts of zinc oxide;
3~6 parts of aluminum oxide;
1~3 part of copper oxide.
4. a kind of manufacturing method of stainless-steel vacuum container lead-free solder according to claim 3, it is characterised in that: institute
The weight ratio for each component stated are as follows:
75 parts of bismuth oxide;
8 parts of silica;
8 parts of zinc oxide;
4 parts of aluminum oxide;
2 parts of copper oxide.
5. a kind of manufacturing method of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that: institute
In the step of stating (3), the granularity of glass powder is 140 mesh~160 mesh.
6. a kind of manufacturing method of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that: institute
In the step of stating (3), the lapping mode is to pass through ball mill grinding.
7. a kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, characterized by the following steps:
(1) rustless steel container to be processed is taken, the stainless-steel vacuum container lead-free solder that will be manufactured according to claim 1
It is placed at the solder concave station of rustless steel container anury indsole;
(2) after so that the furnace temperature of vacuum drying oven is lower than 150 DEG C, the rustless steel container of step (1) is moved into vacuum drying oven, closes fire door simultaneously
Start to be evacuated, electrified regulation while pumping;
(3) the temperature heating 15min of vacuum drying oven is reached 350 DEG C, the vacuum degree of vacuum drying oven reaches 1.0 × 10 at this time-2Pa, and protect
Warm 10min;
(4) the temperature heating 10min of vacuum drying oven is reached 450 DEG C, the vacuum degree of vacuum drying oven reaches 8.0 × 10 at this time-3Pa, heat preservation
10min;
(5) the temperature heating 10min of vacuum drying oven is reached 550 DEG C, the vacuum degree of vacuum drying oven reaches 7.0 × 10 at this time-3Pa, heat preservation
10min;
(6) the temperature heating 10min of vacuum drying oven is reached 610 DEG C, the vacuum degree of vacuum drying oven reaches 6.0 × 10 at this time-3Pa, heat preservation
10min;
(7) the temperature heating 10min of vacuum drying oven is reached 650 DEG C, the vacuum degree of vacuum drying oven reaches 5.0 × 10 at this time-3Pa, heat preservation
180min;
(8) power-off cooling, the vacuum degree of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, to warm in vacuum drying oven
After degree is down to 150 DEG C, opens fire door and take out rustless steel container to get molding stainless-steel vacuum container is arrived.
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CN114012308B (en) * | 2021-11-05 | 2023-04-25 | 南京恩瑞科技有限公司 | Low-temperature lead-free vacuum solder and preparation method thereof |
CN114905183B (en) * | 2022-05-11 | 2024-04-09 | 湘潭大学 | Bi-Ag-Zn lead-free solder and preparation method and application thereof |
CN116833620B (en) * | 2023-08-29 | 2023-12-01 | 长春理工大学 | Bi-containing solder and preparation method and application thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002097145A1 (en) * | 2001-05-28 | 2002-12-05 | Honeywell International Inc. | Compositions, methods and devices for high temperature lead-free solder |
CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
CN102010127A (en) * | 2009-09-07 | 2011-04-13 | 上海歌灵新材料科技有限公司 | Lead-free solder glass |
CN103561902A (en) * | 2011-03-08 | 2014-02-05 | 住友金属矿山株式会社 | Pb-free solder paste |
CN104640668A (en) * | 2012-07-26 | 2015-05-20 | 住友金属矿山股份有限公司 | Solder alloy |
CN105418131A (en) * | 2015-12-30 | 2016-03-23 | 哈尔滨工业大学 | Alumina ceramic low temperature brazing connection method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4401754B2 (en) * | 2003-11-28 | 2010-01-20 | 清仁 石田 | Method for manufacturing thermoelectric conversion module |
-
2017
- 2017-04-13 CN CN201710237894.XA patent/CN106914711B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002097145A1 (en) * | 2001-05-28 | 2002-12-05 | Honeywell International Inc. | Compositions, methods and devices for high temperature lead-free solder |
CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
CN102010127A (en) * | 2009-09-07 | 2011-04-13 | 上海歌灵新材料科技有限公司 | Lead-free solder glass |
CN103561902A (en) * | 2011-03-08 | 2014-02-05 | 住友金属矿山株式会社 | Pb-free solder paste |
CN104640668A (en) * | 2012-07-26 | 2015-05-20 | 住友金属矿山股份有限公司 | Solder alloy |
CN105418131A (en) * | 2015-12-30 | 2016-03-23 | 哈尔滨工业大学 | Alumina ceramic low temperature brazing connection method |
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