CN106914711A - A kind of stainless-steel vacuum container lead-free solder and its manufacture method and method for welding - Google Patents
A kind of stainless-steel vacuum container lead-free solder and its manufacture method and method for welding Download PDFInfo
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- CN106914711A CN106914711A CN201710237894.XA CN201710237894A CN106914711A CN 106914711 A CN106914711 A CN 106914711A CN 201710237894 A CN201710237894 A CN 201710237894A CN 106914711 A CN106914711 A CN 106914711A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Thermally Insulated Containers For Foods (AREA)
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Abstract
The invention discloses a kind of stainless-steel vacuum container lead-free solder and its manufacture method and method for welding, the percentage by weight composition of lead-free solder is：Silicon 5~8%；Zinc 5~8%；Aluminium 2~5%；Copper 1~5%；Balance of bismuth.Its specific manufacturing step is as follows：（1）Melting in melting furnace is placed in after raw material is weighed in proportion, after waiting each component to melt completely, glass lead-free solder block is obtained after melting at high temperature；（2）The glass lead-free solder block that will be obtained is broken into particle；（3）The particulate abrasive that will be obtained is into glass powder；（4）The glass powder that will be obtained pours into moulding machine heating extrusion forming, and stainless-steel vacuum container lead-free solder is obtained after cooling.The present invention is not leaded, does not interfere with health, and environment will not be polluted, and more conforms to modernize the requirement of health idea and environmental protection, and can well with the matched expansion coefficient of stainless-steel vacuum container, tack time is short, good sealing effect.
Description
Technical field
The present invention relates to lead-free solder, more particularly to a kind of stainless-steel vacuum container lead-free solder and its manufacture method and
Method for welding.
Background technology
Vacuum brazing, refers to that workpiece heat is carried out in vacuum chamber, is mainly used in requirement quality product high and oxidizable
The welding of material.Vacuum Soldering Technology since the forties so far, it has also become a kind of extremely rising solder technology, and
Have been widely used for electron trade, part, aircraft industry, atomic energy industry, air separation equipment, petrochemical equipment, work
Journey is mechanically.At present, Vacuum Soldering Technology is generally required in brazing process and welded using tin-lead solder.
As Publication No. " CN104511698A ", publication date be on April 15th, 2015, it is entitled " slicker solder silver solder and its
The application for a patent for invention of preparation technology " discloses a kind of slicker solder silver solder and its preparation technology, its " in solder alloy it is each chemistry into
Point percentage by weight be：Tin 4.5-11%, silver-colored 0.8-2.65%, balance of lead ", the preparation technology of the slicker solder silver solder is
" dissolving furnace temperature is set in 650-670 DEG C, the desired amount of lead, tin and pb-ag alloy is sequentially added, is sufficiently stirred for, then poured
Build；The embryo ingot that will be poured passes through thick cold rolling, then carries out finish rolling, and then the band of finish rolling to required thickness is advised by required size
Lattice carry out punching press ".
The slicker solder silver solder obtained by technique made above can be common to vacuum brazing field, can preferably bond
In being brazed on base material, preferable sealing effectiveness is played.And this slicker solder silver solder is being applied to stainless-steel vacuum field of containers
When, although certain bonding and sealing effectiveness can be also played, but its coefficient of expansion cannot hold with stainless-steel vacuum well
Device matches, cause that this slicker solder silver solder tack time when soldering is carried out to stainless-steel vacuum container is short, sealing effectiveness compared with
Difference, its vacuum heat-preserving effect loses very fast to stainless-steel vacuum container in use for some time, it is impossible to meet the daily need of people
Ask.
In addition, because containing lead in the composition of this slicker solder silver solder, and lead has certain toxicity in itself, when this slicker solder
Silver solder is applied in stainless-steel vacuum container when vacuumizing operation, it will pollute stainless-steel vacuum container to a certain extent, right
Human body affects, and does not meet the health idea of people's modernization.
Additionally, this leaded slicker solder silver solder and not environmentally, after stainless-steel vacuum container rejection is dropped, thereon
Slicker solder silver solder also easily causes a series of environmental problems.Especially the developed country such as European Union, U.S. is based on to environmental protection
Need, it is proposed that the limit value requirement of lead content 100ppm, formed technology barriers.In order to solve the above problems, current industry
Interior, mainly Japanese enterprises start using silver-based, nickel based metal vacuum brazing material alternatively, simultaneously using high temperature vacuum brazing i.e. pricker
Weldering temperature carries out soldering in 950 degree to 1050 degree of vacuum brazing technique.But using silver-based, nickel based metal as vacuum brazing material
When its is relatively costly, energy resource consumption big, and low production efficiency can not well meet the demand in market.
The content of the invention
The present invention for tack time that existing slicker solder silver solder is present it is short, sealing effectiveness is poor, the defect such as not environmentally, carry
For a kind of new stainless-steel vacuum container lead-free solder and its manufacture method and method for welding.
In order to solve the above-mentioned technical problem, the present invention is achieved through the following technical solutions：
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5~8%；
Zinc 5~8%；
Aluminium 2~5%；
Copper 1~5%；
Balance of bismuth.
According to above-mentioned raw materials according to specified weight percentage, and hold by the stainless-steel vacuum made by certain processing technology
Device lead-free solder, can well with the matched expansion coefficient of stainless-steel vacuum container, with tack time it is long, sealing effect
Really strong advantage, can well ensure the vacuum heat-preserving effect of stainless-steel vacuum container, and not only production efficiency is high, low cost,
And this stainless-steel vacuum container lead-free solder is not leaded in itself, also solves the leaded problem of ordinary solder, more conforms to
The health idea of modernization, is more beneficial for marketing.
Preferably, a kind of stainless-steel vacuum container lead-free solder described above, its percentage by weight composition is：
Silicon 5~6%；
Zinc 5~6%；
Aluminium 2~3%；
Copper 1~3%；
Balance of bismuth.
According to above-mentioned raw materials according to specified weight percentage, and hold by the stainless-steel vacuum made by certain processing technology
Device lead-free solder, various aspects of performance is all more excellent, more conducively marketing.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70~80 parts of bismuth oxide；
5~10 parts of silica；
5~10 parts of zinc oxide；
2~8 parts of alundum (Al2O3)；
1~5 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, 50~70 points of the melting under 850 DEG C~950 DEG C temperature conditionss
Clock, is obtained glass lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and heats extrusion forming under the conditions of 750 DEG C~850 DEG C, cold
But stainless-steel vacuum container lead-free solder is obtained afterwards.
Each step can be by raw material bismuth oxide, silica, zinc oxide, alundum (Al2O3), oxidation more than
Copper carries out melting well, and finally gives the lead-free solder that can be perfectly suitable for stainless-steel vacuum container, because what is selected
It is not leaded in raw material, therefore manufacturing process is more environmentally-friendly, and cost of material selected by the present invention is relatively low, is relatively easy to obtain
Take, so as to reduce cost of manufacture.
Preferably, a kind of manufacture method of stainless-steel vacuum container lead-free solder described above, described each group
Part weight ratio be：
73~78 parts of bismuth oxide；
6~9 parts of silica；
6~9 parts of zinc oxide；
3~6 parts of alundum (Al2O3)；
1~3 part of cupric oxide.
According to above-mentioned raw materials according to specified weight component, and the stainless-steel vacuum container obtained by corresponding manufacturing step is used
Lead-free solder, by with longer tack time, better seal effect.
Preferably, a kind of manufacture method of stainless-steel vacuum container lead-free solder described above, described each group
Part weight ratio be：
75 parts of bismuth oxide；
8 parts of silica；
8 parts of zinc oxide；
4 parts of alundum (Al2O3)；
2 parts of cupric oxide.
According to above-mentioned raw materials according to specified weight component, and the stainless-steel vacuum container obtained by corresponding manufacturing step is used
Lead-free solder, by with longer tack time, better seal effect.
Preferably, a kind of manufacture method of stainless-steel vacuum container lead-free solder described above, described step
（3）In, the granularity of glass powder is 140 mesh~160 mesh.
The particulate abrasive that will be obtained into above particle size range glass powder, the heating extrusion forming after contributing to, no
Production efficiency is improve only, and ensure that the quality of product.
Preferably, a kind of manufacture method of stainless-steel vacuum container lead-free solder described above, described step
（3）In, described lapping mode is by ball mill grinding.
Ball mill is after material is broken, then the key equipment crushed, its strong adaptability to material, continuous raw
Production capacity power is big, it is easy to adjust the fineness of ground prod, can meet the requirement of large-scale industrial production, and simple structure, firm, behaviour
Make reliability, maintenance management is simple, running rate is high, sealing is strong, can carry out negative-pressure operation, and product can be obtained by ball mill grinding
The more preferable glass powder of matter.
A kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, comprises the following steps：
（1）A rustless steel container to be processed is taken, the stainless-steel vacuum container lead-free solder for obtaining will be manufactured and be positioned over stainless steel
At the solder concave station of container anury midsole；
（2）After making the furnace temperature of vacuum drying oven less than 150 DEG C, by step（1）Rustless steel container move into vacuum drying oven in, close fire door simultaneously
Start pumping, electrified regulation while pumping；
（3）The temperature intensification 15min of vacuum drying oven is reached 350 DEG C, now the vacuum of vacuum drying oven reaches 1.0 × 10-2Pa, and
Insulation 10min；
（4）The temperature intensification 10min of vacuum drying oven is reached 450 DEG C, now the vacuum of vacuum drying oven reaches 8.0 × 10-3Pa, protects
Warm 10min；
（5）The temperature intensification 10min of vacuum drying oven is reached 550 DEG C, now the vacuum of vacuum drying oven reaches 7.0 × 10-3Pa, protects
Warm 10min；
（6）The temperature intensification 10min of vacuum drying oven is reached 610 DEG C, now the vacuum of vacuum drying oven reaches 6.0 × 10-3Pa, protects
Warm 10min；
（7）The temperature intensification 10min of vacuum drying oven is reached 650 DEG C, now the vacuum of vacuum drying oven reaches 5.0 × 10-3Pa, protects
Warm 180min；
（8）Power-off cooling, the vacuum of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, treats temperature in vacuum drying oven
After degree is down to 150 DEG C, opens fire door and take out rustless steel container, that is, the stainless-steel vacuum container being molded.
The stainless-steel vacuum container lead-free solder that can be obtained the present invention by above step is brazed in not well
On rust steel container, so as to finally give the stainless-steel vacuum container of high insulating effect, long service life.
The present invention has the advantages that：
（1）It is not leaded in composition of the invention, the manufacturing environment of stainless-steel vacuum container will not be polluted, do not interfere with human body and be good for
Health, will not pollute to environment, more conform to modernize the requirement of health idea and environmental protection.
（2）The present invention can well with the matched expansion coefficient of stainless-steel vacuum container, when operation is vacuumized with
The tack time of stainless-steel vacuum container is short, good sealing effect, can better ensure that the heat insulation effect of stainless-steel vacuum container.
Specific embodiment
The present invention is described in further detail with reference to specific embodiment, but they are not to limit of the invention
System：
Embodiment 1
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 6.5%；
Zinc 6.5%；
Aluminium 3.5%；
Copper 3%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
5 parts of silica；
5 parts of zinc oxide；
2 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 50 minutes under 850 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 750 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 2
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 8%；
Zinc 5%；
Aluminium 2%；
Copper 1%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
0 part of silica 1；
5 parts of zinc oxide；
2 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 50 minutes under 950 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 750 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 3
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5%；
Zinc 8%；
Aluminium 2%；
Copper 1%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
5 parts of silica；
10 parts of zinc oxide；
2 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 70 minutes under 850 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 750 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 4
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5%；
Zinc 5%；
Aluminium 5%；
Copper 1%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
5 parts of silica；
5 parts of zinc oxide；
8 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 50 minutes under 850 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 850 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 5
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5%；
Zinc 5%；
Aluminium 2%；
Copper 5%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
5 parts of silica；
5 parts of zinc oxide；
2 parts of alundum (Al2O3)；
5 parts of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 70 minutes under 950 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 850 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 6
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5%；
Zinc 5%；
Aluminium 2%；
Copper 1%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
80 parts of bismuth oxide；
5 parts of silica；
5 parts of zinc oxide；
2 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 60 minutes under 900 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 800 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 7
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 8%；
Zinc 8%；
Aluminium 5%；
Copper 5%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
70 parts of bismuth oxide；
0 part of silica 1；
10 parts of zinc oxide；
8 parts of alundum (Al2O3)；
5 parts of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 55 minutes under 870 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 775 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 8
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5.5%；
Zinc 5.5%；
Aluminium 2.5%；
Copper 2%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
80 parts of bismuth oxide；
0 part of silica 1；
10 parts of zinc oxide；
8 parts of alundum (Al2O3)；
5 parts of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 65 minutes under 930 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 825 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 9
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 6%；
Zinc 6%；
Aluminium 3%；
Copper 3%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
75 parts of bismuth oxide；
8 parts of silica；
8 parts of zinc oxide；
4 parts of alundum (Al2O3)；
2 parts of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 60 minutes under 900 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 800 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 10
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5.7%；
Zinc 5.7%；
Aluminium 3.5%；
Copper 1.5%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
73 parts of bismuth oxide；
6 parts of silica；
6 parts of zinc oxide；
3 parts of alundum (Al2O3)；
1 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 55 minutes under 870 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 775 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 11
A kind of stainless-steel vacuum container lead-free solder, its percentage by weight constitutes and is：
Silicon 5.9%；
Zinc 5.9%；
Aluminium 3.3%；
Copper 1.3%；
Balance of bismuth.
A kind of manufacture method of stainless-steel vacuum container lead-free solder, including following weight than component：
78 parts of bismuth oxide；
9 parts of silica；
9 parts of zinc oxide；
6 parts of alundum (Al2O3)；
3 parts of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, melting 65 minutes under 930 DEG C of temperature conditionss are obtained glass
Lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and extrusion forming is heated under the conditions of 825 DEG C, after cooling i.e.
Obtain stainless-steel vacuum container lead-free solder.
Preferably, described step（3）In, described lapping mode is by ball mill grinding, the grain of glass powder
It is 140 mesh~160 mesh to spend.
Embodiment 12
A kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, comprises the following steps：
（1）A rustless steel container to be processed is taken, the stainless steel that any embodiment manufacture in embodiment 1 to embodiment 11 is obtained is true
Empty container lead-free solder is positioned at the solder concave station of rustless steel container anury midsole；
（2）After making the furnace temperature of vacuum drying oven less than 150 DEG C, by step（1）Rustless steel container move into vacuum drying oven in, close fire door simultaneously
Start pumping, electrified regulation while pumping；
（3）The temperature intensification 15min of vacuum drying oven is reached 350 DEG C, now the vacuum of vacuum drying oven reaches 1.0 × 10-2Pa, and
Insulation 10min；
（4）The temperature intensification 10min of vacuum drying oven is reached 450 DEG C, now the vacuum of vacuum drying oven reaches 8.0 × 10-3Pa, protects
Warm 10min；
（5）The temperature intensification 10min of vacuum drying oven is reached 550 DEG C, now the vacuum of vacuum drying oven reaches 7.0 × 10-3Pa, protects
Warm 10min；
（6）The temperature intensification 10min of vacuum drying oven is reached 610 DEG C, now the vacuum of vacuum drying oven reaches 6.0 × 10-3Pa, protects
Warm 10min；
（7）The temperature intensification 10min of vacuum drying oven is reached 650 DEG C, now the vacuum of vacuum drying oven reaches 5.0 × 10-3Pa, protects
Warm 180min；
（8）Power-off cooling, the vacuum of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, treats temperature in vacuum drying oven
After degree is down to 150 DEG C, opens fire door and take out rustless steel container, that is, the stainless-steel vacuum container being molded.
In a word, presently preferred embodiments of the present invention is the foregoing is only, it is equal that all scopes according to the present patent application patent are made
Deng change and modification, should all belong to covering scope of the invention.
Claims (8)
1. a kind of stainless-steel vacuum container lead-free solder, it is characterised in that its percentage by weight composition is：
Silicon 5~8%；
Zinc 5~8%；
Aluminium 2~5%；
Copper 1~5%；
Balance of bismuth.
2. a kind of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that：Its percentage by weight
Constitute and be：
Silicon 5~6%；
Zinc 5~6%；
Aluminium 2~3%；
Copper 1~3%；
Balance of bismuth.
3. the manufacture method of a kind of stainless-steel vacuum container lead-free solder according to claim 1, it is characterised in that：Bag
Include following weight than component：
70~80 parts of bismuth oxide；
5~10 parts of silica；
5~10 parts of zinc oxide；
2~8 parts of alundum (Al2O3)；
1~5 part of cupric oxide；
Specific manufacturing step is as follows：
（1）Prepare solder：Bismuth oxide, silica, zinc oxide, alundum (Al2O3), cupric oxide each component are claimed in proportion
Melting in melting furnace is placed in after amount, after waiting each component to melt completely, 50~70 points of the melting under 850 DEG C~950 DEG C temperature conditionss
Clock, is obtained glass lead-free solder block；
（2）By step（1）The glass lead-free solder block for obtaining is broken into the particle of a diameter of 4~6 mm in size；
（3）By step（2）The particulate abrasive for obtaining is into glass powder；
（4）By step（3）The glass powder for obtaining pours into moulding machine and heats extrusion forming under the conditions of 750 DEG C~850 DEG C, cold
But stainless-steel vacuum container lead-free solder is obtained afterwards.
4. the manufacture method of a kind of stainless-steel vacuum container lead-free solder according to claim 3, it is characterised in that：Institute
The weight ratio of each component stated is：
73~78 parts of bismuth oxide；
6~9 parts of silica；
6~9 parts of zinc oxide；
3~6 parts of alundum (Al2O3)；
1~3 part of cupric oxide.
5. the manufacture method of a kind of stainless-steel vacuum container lead-free solder according to claim 4, it is characterised in that：Institute
The weight ratio of each component stated is：
75 parts of bismuth oxide；
8 parts of silica；
8 parts of zinc oxide；
4 parts of alundum (Al2O3)；
2 parts of cupric oxide.
6. the manufacture method of a kind of stainless-steel vacuum container lead-free solder according to claim 3, it is characterised in that：Institute
The step of stating（3）In, the granularity of glass powder is 140 mesh~160 mesh.
7. the manufacture method of a kind of stainless-steel vacuum container lead-free solder according to claim 3, it is characterised in that：Institute
The step of stating（3）In, described lapping mode is by ball mill grinding.
8. a kind of vacuum brazing method of stainless-steel vacuum container lead-free solder, it is characterised in that：Comprise the following steps：
（1）A rustless steel container to be processed is taken, the stainless-steel vacuum container lead-free solder that will be obtained according to claim 3 manufacture
It is positioned at the solder concave station of rustless steel container anury midsole；
（2）After making the furnace temperature of vacuum drying oven less than 150 DEG C, by step（1）Rustless steel container move into vacuum drying oven in, close fire door simultaneously
Start pumping, electrified regulation while pumping；
（3）The temperature intensification 15min of vacuum drying oven is reached 350 DEG C, now the vacuum of vacuum drying oven reaches 1.0 × 10-2Pa, and protect
Warm 10min；
（4）The temperature intensification 10min of vacuum drying oven is reached 450 DEG C, now the vacuum of vacuum drying oven reaches 8.0 × 10-3Pa, insulation
10min；
（5）The temperature intensification 10min of vacuum drying oven is reached 550 DEG C, now the vacuum of vacuum drying oven reaches 7.0 × 10-3Pa, insulation
10min；
（6）The temperature intensification 10min of vacuum drying oven is reached 610 DEG C, now the vacuum of vacuum drying oven reaches 6.0 × 10-3Pa, insulation
10min；
（7）The temperature intensification 10min of vacuum drying oven is reached 650 DEG C, now the vacuum of vacuum drying oven reaches 5.0 × 10-3Pa, insulation
180min；
（8）Power-off cooling, the vacuum of vacuum drying oven is up to 5.0 × 10 when temperature is down to 200 DEG C-4Pa, treats temperature in vacuum drying oven
After degree is down to 150 DEG C, opens fire door and take out rustless steel container, that is, the stainless-steel vacuum container being molded.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125503A (en) * | 2019-05-29 | 2019-08-16 | 杭州哈尔斯实业有限公司 | A kind of fixed structure and its fixing means of stainless steel cool-bag liner aluminium foil |
| CN114012308A (en) * | 2021-11-05 | 2022-02-08 | 南京恩瑞科技有限公司 | Low-temperature lead-free vacuum solder and preparation method thereof |
| CN114905183A (en) * | 2022-05-11 | 2022-08-16 | 湘潭大学 | Bi-Ag-Zn lead-free solder and preparation method and application thereof |
| CN116833620A (en) * | 2023-08-29 | 2023-10-03 | 长春理工大学 | Bi-containing solder and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002097145A1 (en) * | 2001-05-28 | 2002-12-05 | Honeywell International Inc. | Compositions, methods and devices for high temperature lead-free solder |
| US20060210790A1 (en) * | 2003-11-28 | 2006-09-21 | Yuma Horio | Thermoelectric module and solder therefor |
| CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
| CN102010127A (en) * | 2009-09-07 | 2011-04-13 | 上海歌灵新材料科技有限公司 | Lead-free solder glass |
| CN103561902A (en) * | 2011-03-08 | 2014-02-05 | 住友金属矿山株式会社 | Pb-free solder paste |
| CN104640668A (en) * | 2012-07-26 | 2015-05-20 | 住友金属矿山股份有限公司 | Solder alloy |
| CN105418131A (en) * | 2015-12-30 | 2016-03-23 | 哈尔滨工业大学 | Alumina ceramic low temperature brazing connection method |
-
2017
- 2017-04-13 CN CN201710237894.XA patent/CN106914711B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002097145A1 (en) * | 2001-05-28 | 2002-12-05 | Honeywell International Inc. | Compositions, methods and devices for high temperature lead-free solder |
| US20060210790A1 (en) * | 2003-11-28 | 2006-09-21 | Yuma Horio | Thermoelectric module and solder therefor |
| CN101456674A (en) * | 2009-01-04 | 2009-06-17 | 武汉理工大学 | Rare-earth doped leadless and low-melting point sealing glass and its preparation method |
| CN102010127A (en) * | 2009-09-07 | 2011-04-13 | 上海歌灵新材料科技有限公司 | Lead-free solder glass |
| CN103561902A (en) * | 2011-03-08 | 2014-02-05 | 住友金属矿山株式会社 | Pb-free solder paste |
| US20140041760A1 (en) * | 2011-03-08 | 2014-02-13 | Sumitomo Metal Mining Co., Ltd. | Pb-FREE SOLDER PASTE |
| CN104640668A (en) * | 2012-07-26 | 2015-05-20 | 住友金属矿山股份有限公司 | Solder alloy |
| CN105418131A (en) * | 2015-12-30 | 2016-03-23 | 哈尔滨工业大学 | Alumina ceramic low temperature brazing connection method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110125503A (en) * | 2019-05-29 | 2019-08-16 | 杭州哈尔斯实业有限公司 | A kind of fixed structure and its fixing means of stainless steel cool-bag liner aluminium foil |
| CN114012308A (en) * | 2021-11-05 | 2022-02-08 | 南京恩瑞科技有限公司 | Low-temperature lead-free vacuum solder and preparation method thereof |
| CN114905183A (en) * | 2022-05-11 | 2022-08-16 | 湘潭大学 | Bi-Ag-Zn lead-free solder and preparation method and application thereof |
| CN114905183B (en) * | 2022-05-11 | 2024-04-09 | 湘潭大学 | Bi-Ag-Zn lead-free solder and preparation method and application thereof |
| CN116833620A (en) * | 2023-08-29 | 2023-10-03 | 长春理工大学 | Bi-containing solder and preparation method and application thereof |
| CN116833620B (en) * | 2023-08-29 | 2023-12-01 | 长春理工大学 | Bi-containing solder and preparation method and application thereof |
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