CN106898600B - 半导体模块 - Google Patents

半导体模块 Download PDF

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CN106898600B
CN106898600B CN201610926034.2A CN201610926034A CN106898600B CN 106898600 B CN106898600 B CN 106898600B CN 201610926034 A CN201610926034 A CN 201610926034A CN 106898600 B CN106898600 B CN 106898600B
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semiconductor module
semiconductor
circuit board
main
nut
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CN106898600A (zh
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堀元人
池田良成
仲村秀世
望月英司
西泽龙男
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Fuji Electric Co Ltd
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Abstract

本发明能够容易地将多个半导体模块彼此加以连接。半导体模块(100)具备：具有螺母收容部(131～133)的封装树脂(130)和配置于螺母收容部(131～133)中的螺母(143)，其中，主端子(125～127)从封装树脂(130)突出，绝缘电路板、半导体元件以及配线电路板被封装在封装树脂(130)中。进而，上述半导体模块(100)具有汇流条端子(140)，该汇流条端子140与从封装树脂130突出的主端子125～127电连接，并具有与螺母143相对的插入孔142。由此，仅通过利用连接汇流条将半导体模块(100)的汇流条端子(140)加以连接，便可容易地将两个半导体模块(100)进行连接。

Description

半导体模块
【技术领域】
本发明涉及半导体模块。
【背景技术】
半导体模块包含多个功率半导体元件，并被用作功率转换装置或者开关装置。例如半导体装置，包含IGBT(Insulated Gate Bipolar Transistor：绝缘栅双极型晶体管)、MOSFET(Metal Oxide Semiconductor Field Effect Transistor：金属-氧化物半导体场效应晶体管)等的半导体元件并列连接，能够作为开关装置发挥作用。
作为具体例，存在利用树脂将多个绝缘电路板加以封装而构成的半导体装置，其中，该绝缘电路板具有绝缘板和分别形成于该绝缘板的表面和背面上的铜箔，并且，在表面的铜箔上配置有半导体元件(例如参照专利文献1)。
通过将多个该半导体装置加以连接，能够得到更大的输出功率。
【现有技术文献】
【专利文献】
专利文献1：日本专利特开2009-60746号公报
【发明内容】
【发明所要解决的课题】
在如上所述将多个半导体模块进行连接时，希望能够更加容易地对半导体模块间进行连接。
本发明是鉴于上述问题而完成的，其目的在于提供一种能够容易地连接多个的半导体模块。
【解决问题的技术方案】
本发明的第1形态提供的半导体模块具有：绝缘电路板，其具有绝缘板和形成于所述绝缘板的表面上的金属板；半导体元件，其背面固定于所述金属板上，表面上具有主电极；配线电路板，其与所述半导体元件的所述主电极电连接；主端子，其经由所述配线电路板与所述主电极电连接；封装部件，其将所述绝缘电路板、所述半导体元件以及所述配线电路板封装，所述主端子从所述封装部件突出，并且，所述封装部件在所述主端子附近具有开口孔；螺母，其配置于所述开口孔中；以及接线端子，其与所述主端子电连接，并具有与所述螺母相对置的插入孔。
【发明效果】
根据本发明公开的技术，能够对半导体模块间进行连接，从而得到更大的输出功率。
【附图说明】
图1是表示第1实施方式的半导体模块的图。
图2是表示利用第1实施方式的半导体模块构成的电路构成的等效电路图。
图3是表示第1实施方式的半导体模块(具有汇流条端子)的图。
图4是表示将两个第1实施方式的半导体模块连接起来的情况的图。
图5是表示第2实施方式的半导体模块(具有汇流条端子)的图。
【具体实施方式】
以下，使用附图对实施方式进行说明。
此外，实施方式并非对权利要求书所涉及的发明的限定。另外，实施方式中所说明的特征的所有组合并非本发明的解决手段所必需的特征。
[第1实施方式]
使用图1和图2对第1实施方式的半导体模块进行说明。
图1是表示第1实施方式的半导体模块的图。
其中，图1中的(A)是半导体模块100的俯视图，图1中的(B)是图1的(A)中的点划线A-A处的半导体模块100的剖视图。
另外，图2是表示利用第1实施方式的半导体模块构成的电路构成的等效电路图。
半导体模块100具备：将半导体元件104、114经由焊锡105a、115a搭载至绝缘电路板103上而构成的2组半导体电路、和在该2组半导体电路的上方构成通用的配线电路的配线电路板121。此外，半导体元件104、114与配线电路板121通过导电柱122、123电连接。另外，导电柱122、123与半导体元件104、114经由焊锡105b、115b电连接。上述这些半导体电路中，半导体元件104、114分别由IGBT、功率MOSFET或者FWD等的功率器件构成。此外，在图1中，一个绝缘电路板103中仅示出一个半导体元件104、114。实际上，在一个绝缘电路板103的表面侧的金属板102a上，分别配置有IGBT等的开关器件和FWD，且连接成如图2所示的等效电路那样。
此外，上述半导体元件104、114可以是形成于硅基板上的元件，也可以是形成于碳化硅基板上的元件。
绝缘电路板103具有由传热性良好的氧化铝等的陶瓷构成的绝缘板101，在绝缘板101的表面和背面上粘贴有构成导体层的金属板102a、102b。在表面侧的导体层(金属板102a)上，形成有用于将配置于导体层上的多个功率器件间连接起来的规定的电路图案。
如图2所示，在绝缘电路板103的金属板102a上，开关器件(以下仅称为“晶体管”)Q1与FWD(以下称为“二极管”)D1的反并联电路和晶体管Q2与二极管D2的反并联电路串联连接。
在此，配置于一个绝缘电路板103上的半导体元件(功率器件)只要等效地构成图2所示的晶体管与二极管的反并联电路即可。因此，晶体管和二极管中的任意一个或者两者也可以搭载多个额定相同的半导体元件。
在图1中，示出了在绝缘电路板103的金属板102a上，构成晶体管Q1的半导体元件104和在其背后构成二极管D1的半导体元件(未图示)沿前后方向配置的状态。同样地，在(另一个)绝缘电路板103的金属板102a上，构成晶体管Q2的半导体元件114和在其背后构成二极管D2的半导体元件前后排列。即，绝缘电路板103上的晶体管Q1和二极管D1、绝缘电路板103上的晶体管Q2和二极管D2，分别通过绝缘电路板103上的金属板102a和配线电路板121而被反并联连接。而且，由一对晶体管Q1、Q2和一对二极管D1、D2构成的2组反并联电路进一步经由配置于上面的配线电路板121和柱状的导电柱122、123而串联连接。
此外，在一个半导体元件104的下表面上形成有晶体管Q1的集电极电极，且经由金属板102a而与构成半导体模块100的外部输入用端子(集电极端子C1)的主端子127连接。形成于另一个半导体元件114的背面上的晶体管Q2的集电极电极也经由金属板102a而与构成外部输入用端子(集电极兼发射极端子C2/E1)的主端子125连接。另外，半导体元件104、114的表面上形成有发射极电极和栅极电极，分别经由导电柱122、123与配线电路板121连接。其中，半导体元件104(晶体管Q1)的发射极电极经由配线电路板121与主端子125连接，半导体元件114(晶体管Q2)的发射极电极经由配线电路板121与构成外部输入用端子(发射极端子E2)的主端子126连接。
如图1中的(A)所示，上述主端子125～127在相对于半导体模块100的中心线对称的位置处分别形成有3个，共计形成有18个。另外，半导体模块100还具有2个控制端子128和2个发射极信号端子129。控制端子128与配线电路板121连接，构成向半桥电路的晶体管Q1、Q2的栅极电极提供栅极控制信号的栅极端子G1、G2。另外，发射极信号端子129是辅助端子，构成用于输出对各晶体管的集电极-发射极间流过的电流进行测量的感测信号的检查端子C1Aux、E2Aux等。
半导体模块100的各构成要素通过例如由热固性树脂的环氧树脂材料构成的封装树脂130来进行模压、保护。其结果是，半导体模块100的外形被形成为俯视时整体呈矩形形状的长方体。18个主端子125～127、控制端子128以及发射极信号端子129的端部从半导体模块100的上表面突出。半导体模块100的底面上，各绝缘电路板103的底面侧的金属板102b分别配置在同一平面上。另外，在半导体模块100的上表面上，呈凸状地形成有收容螺母(后述)的螺母收容部131、132、133。
此外，在上述例子中，主端子125～127分别与集电极兼发射极端子C2/E1、发射极端子E2、集电极端子C1相对应，但并不限定于此。可以根据绝缘电路板103的金属板102a和配线电路板121的配线，使主端子125～127与集电极端子C1、集电极兼发射极端子C2/E1、发射极端子E2任意对应。
接着，使用图3对于在上述半导体模块100的主端子125～127上分别安装有汇流条端子(接线端子)140的情况进行说明。
图3是表示第1实施方式的半导体模块(具有汇流条端子)的图。
此外，图3中的(A)是安装有汇流条端子140的半导体模块100的俯视图。另外，图3中的(B)是图3的(A)中的点划线B-B处的半导体模块100的剖视图，图3中的(C)是图3的(A)中的点划线C-C处的半导体模块100的剖视图。
分别安装于半导体模块100的主端子125～127上的汇流条端子140呈平板状且呈矩形状，其长度方向的两端上分别设有阶梯部141，中央部处形成有插入孔142。
主端子125～127的前端部安装于上述汇流条端子140的阶梯部141，并且，主端子125～127通过激光焊接、锡焊等与阶梯部141接合。此时，主端子125～127的前端部突出到未超过阶梯部141的高度范围，且与汇流条端子140的阶梯部141接合。即，主端子125～127的前端部并未从汇流条端子140的上表面突出。尤其是，阶梯部141的厚度优选在0.5mm～2mm的范围内。因此，在将半导体模块100加以层叠，另外在半导体模块100上配置物品等时，能够适当地进行层叠或配置。另外，汇流条端子140能够在阶梯部141处局部变形，因此，即使在对汇流条端子140施加拉力的情况下，也能够减小施加于主端子125～127上的拉力。
另外，在半导体模块100的封装树脂130上，在位于中心线(点划线B-B)上且各主端子125、126、127之间设有收容螺母143的螺母收容部131、132、133。如图所示，螺母收容部131、132、133从半导体模块100的封装树脂130的上表面突出，另外，内部形成有收容螺母143的开口孔131a、132a、133a。
另外，汇流条端子140的背面侧支撑在螺母收纳部131、132、133上。由此，能够使汇流条端子140浮起，从而能够容易地进行汇流条端子140的阶梯部141与主端子125～127的接合。
进而，由此对安装在主端子125、126、127上的汇流条端子140的插入孔142的位置与螺母收容部131、132、133的开口孔131a、132a、133a的位置进行对准。
接下来，使用图4对于将两个安装有上述汇流条端子140的半导体模块100进行连接的情况进行说明。
图4是表示将两个第1实施方式的半导体模块连接起来的情况的图。
此外，图4与图3中的(C)同样地表示利用连接汇流条连接的两个半导体模块100的剖视图。
另外，在图4中，将图中左侧的半导体模块100设为半导体模块100a，将图中右侧的半导体模块100设为半导体模块100b。但是，半导体模块100a、100b的构成与半导体模块100的构成相同。
在半导体模块100a(图中左侧)中，对连接汇流条200的连接孔201a、汇流条端子140的插入孔142以及收容于半导体模块100a内的螺母143的位置进行对准。进而，将螺栓203a插通在连接孔201a和插入孔142中，并使其嵌合在螺母143中。
另外，半导体模块100b(图中右侧)中同样地，对连接汇流条200的连接孔201b、汇流条端子140的插入孔142以及收容于半导体模块100b内的螺母143的位置进行对准。进而，将螺栓203b插通在连接孔201b和插入孔142中，并使其嵌合在螺母143中。
由此，能够通过连接汇流条200而将两个半导体模块100a、100b电连接。然后，通过在连接汇流条200的连接孔202中连接外部端子，从而能够进行相对于两个半导体模块100a、100b的输入、输出。
由此，上述半导体模块100、100a、100b具备：具有绝缘板101和形成于绝缘板101的表面上的金属板102a的绝缘电路板103；背面固定在金属板102a上，且表面上具有主电极的半导体元件104、114；与半导体元件104、114的主电极电连接的配线电路板121；以及经由配线电路板121与半导体元件104、114的主电极电连接的主端子125～127。另外，半导体模块100、100a、100b具备：具有螺母收容部131～133的封装树脂130和配置于螺母收容部131～133中的螺母143，其中，主端子125～127从封装树脂130突出，绝缘电路板103、半导体元件104、114以及配线电路板121被封装在封装树脂130中。进而，上述半导体模块100具有汇流条端子140，该汇流条端子140与从封装树脂130突出的主端子125～127电连接，并具有与螺母143相对的插入孔142。由此，仅通过利用连接汇流条200将半导体模块100、100a、100b的汇流条端子140加以连接，便可容易地对两个半导体模块100、100a、100b进行连接。
[第2实施方式]
在第2实施方式中，使用图5对配置于半导体模块100中的螺母的高度与第1实施方式不同的情况进行说明。
图5是表示第2实施方式的半导体模块(具有汇流条端子)的图。
此外，图5是相对于第2实施方式的半导体模块而相当于图3的点划线C-C处的剖面的图。
图5所示的第2实施方式的半导体模块100的结构与图1所示的第1实施方式的半导体模块100的结构相同。但是，螺母303的高度高于第1实施方式的螺母143的高度。
随着螺母303的高度增高，安装于图5的半导体模块100的主端子126上的汇流条端子300的中央部突出而形成于较高位置处，设置于该中央部处的插入孔302的位置与螺母303的位置进行对准。
由此，在第2实施方式的半导体模块100中，汇流条端子300中形成有插入孔302的中央部的高度也根据螺母303的高度发生变化，从而选择与螺母303的高度相符的汇流条端子。由此，即使在多个半导体模块100例如因为种类不同而高度不同的情况下，通过选择任意高度的螺母303和汇流条端子300，也可以高度整齐地进行电连接。
【符号说明】
100、100a、100b 半导体模块
101 绝缘板
102a、102b 金属板
103 绝缘电路板
104、114 半导体元件
105a、105b、115a、115b 焊锡
121 配线电路板
122、123 导电柱
125、126、127 主端子
128 控制端子
129 发射极信号端子
130 封装树脂
131、132、133 螺母收容部

Claims (5)

1.一种半导体模块，其具有：
绝缘电路板，其具有绝缘板和形成于所述绝缘板的表面上的金属板，
半导体元件，其背面固定于所述金属板上，表面上具有主电极，
配线电路板，其与所述绝缘电路板相对配置，且与所述半导体元件的所述主电极电连接，
多个主端子，其经由所述配线电路板与所述主电极电连接，且形成在相对于俯视时沿半导体模块的长边方向通过所述半导体模块的中心部的中心线对称的位置处，
封装部件，其将所述绝缘电路板、所述半导体元件以及所述配线电路板封装，所述多个主端子从所述封装部件突出，并且，所述封装部件在夹着所述中心线的所述多个主端子之间具有开口孔，
螺母，其配置于所述开口孔中，以及
接线端子，其为平板状，且与所述螺母相对配置，在其主面上具有与所述螺母相对的插入孔，在夹着所述中心线的两端分别设置有阶梯部，将所述多个主端子与所述阶梯部电连接，以使得所述多个主端子的前端部不会从所述主面突出。
2.如权利要求1所述的半导体模块，其中，
所述封装部件在与所述开口孔对应的位置处设有凸部，
所述接线端子被支撑于所述凸部上。
3.如权利要求1所述的半导体模块，其中，
所述螺母的位置与所述插入孔的位置对准。
4.如权利要求1所述的半导体模块，其中，
所述接线端子构成为包含所述插入孔在内的所述主面从上方突出，且所述多个主端子的前端部突出到未超过所述阶梯部的高度范围。
5.如权利要求1所述的半导体模块，其中，
所述接线端子的形成有所述插入孔的位置处的高度根据所述螺母的高度而变化。
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