CN106896312A - Observe pedestal and application method in the back side positioned in a kind of analysis for chip failure - Google Patents
Observe pedestal and application method in the back side positioned in a kind of analysis for chip failure Download PDFInfo
- Publication number
- CN106896312A CN106896312A CN201510963853.XA CN201510963853A CN106896312A CN 106896312 A CN106896312 A CN 106896312A CN 201510963853 A CN201510963853 A CN 201510963853A CN 106896312 A CN106896312 A CN 106896312A
- Authority
- CN
- China
- Prior art keywords
- back side
- analysis
- chip failure
- pinpoint
- sheet glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
Abstract
The invention provides one kind for pinpoint back side observation pedestal in chip failure analysis, it includes metallic support, the center of the metallic support is provided with centre bore, sheet glass is installed in the centre bore, two special markings for providing reference coordinate are additionally provided with the sheet glass, described two special markings are to be etched in or be pasted on the sheet glass, and its position is any position on the sheet glass of the back side observation pedestal and can be arranged to identical or different shape.Thus, in failure analysis analysis, can accurately be found in front position and recording exceptional point position when PEM/OBIRCH positions abnormity point using rear mode.The invention further relates to carry out pinpoint method in chip failure analysis using back side observation pedestal.
Description
Technical field
The present invention relates to a kind of back side observation pedestal, particularly in a kind of analysis for chip failure
Observe pedestal in the pinpoint back side.The invention further relates to observe pedestal in chip failure using the back side
Pinpoint method is carried out in analysis.
Background technology
In the art of semiconductor manufacturing, as IC processing procedures are to small size multi-model, lost in chip
In order to improve the degree of accuracy of failure analysis in effect (FA) analysis, using PEM (photo emission
Microscope, photon emission microscope)/OBIRCH (optical beam induced resistance
Change, optical beam induced change in impedance value test) carry out chip failure position position when, it is more and more
Ground carries out invalid position positioning using the back side (backside) positioning method.
But when being positioned to wafer using back side positioning method, it is impossible to directly using laser labelling
(laser marker) marks the position of detected abnormity point in wafer rear mark.Therefore, overleaf
Can only see compound crystal (poly) layer and the actively image of (active) layer.In order to position, can only refer to
Around pattern, or position location is inferred according to product layout, then at front (front side)
On be marked.There is no special pattern around when facing, or front metal tomographic image and compound crystal
When the layout difference of active layers is excessive, it is difficult to be accurately positioned, and is merely able to substantially determine invalid position,
This causes very burden to follow-up analysis work.
The content of the invention
The present inventor is in view of problem above, it is proposed that be accurately positioned in being analyzed for chip failure
The back side observation pedestal, it is combined with transfer algorithm, can accurately carry out the back side and front position
The conversion put, it is so bright thus, it is possible to accurately find the abnormity point for overleaf being positioned in wafer frontside
The aobvious speed for accelerating failure analysis, improves success rate and the degree of accuracy of analysis.
In order to realize foregoing invention purpose, the technical solution adopted in the present invention is as follows：
A specific embodiment of the invention, there is provided one kind is for essence in chip failure analysis
It is determined that the back side observation pedestal of position, it includes metallic support, and the center of the metallic support is provided with center
Hole, sheet glass is provided with the centre bore, is additionally provided with for providing base on the sheet glass
Two special markings of quasi coordinates.
Pinpoint dorsal view in the analysis for chip failure according to an embodiment of the invention
Pedestal is examined, wherein, described two special markings are to be etched in or be pasted on the sheet glass.
Pinpoint dorsal view in the analysis for chip failure according to an embodiment of the invention
Pedestal is examined, wherein, the position of the special marking is appointing on the sheet glass of the back side observation pedestal
What position.
Pinpoint dorsal view in the analysis for chip failure according to an embodiment of the invention
Pedestal is examined, wherein, the special marking is arranged to identical or different shape.
Pinpoint dorsal view in the analysis for chip failure according to an embodiment of the invention
Pedestal is examined, wherein, the metallic support is stainless steel.
Pinpoint dorsal view in the analysis for chip failure according to an embodiment of the invention
Pedestal is examined, wherein, the sheet glass is silicate glass or lucite.
An a kind of specific embodiment of the invention, there is provided localization method, it uses such as preceding
Being determined for pinpoint back side observation pedestal in chip failure analysis in described any one
Position, including following steps：
Step one：In chip failure analysis, PEM/OBIRCH positioning is positioned different using rear mode
Chang Dian, and record the position of two special marking and the position of abnormity point；
Step 2：180 degree upset clamps the clamper that pedestal is observed at the back side, records described two special
The coordinate of mark position；
Step 3：By mathematical computations, the corresponding position coordinates of the abnormity point is obtained；
Step 4：Moving lens carries out laser labelling to the position of the abnormity point.
By it is provided by the present invention analyzed for chip failure in pinpoint back side observation pedestal with
Localization method is combined, and can realize the accurate conversion of the back side and front position, thus, it is possible to use
PEM/OBIRCH, when carrying out abnormal point location using back side positioning method, institute is accurately found in front
The position of positioning so that the locating speed and accuracy rate of wafer failure analysis are greatly improved.
Below, the specific embodiment in invention will be described in further detail with reference to accompanying drawing.
Brief description of the drawings
Fig. 1 is pinpoint back side observation pedestal signal in the analysis for chip failure of the invention
Figure；
Fig. 2 is to be entered using pinpoint back side observation pedestal in the analysis for chip failure of the invention
The flow chart of row positioning analysis.
Reference
1 metallic support；
2 sheet glass；
3 special markings.
Specific embodiment
As shown in figure 1, pinpoint back side observation pedestal in the analysis for chip failure of the invention
Including metallic support 1, centre bore is provided with the center of the metallic support 1, is provided with the centre bore
Sheet glass 2.Be etched for the triangle for providing reference coordinate and the two of rectangle on the sheet glass 2
Individual special marking 3, any one of the two special markings 3 can be set to mark point A, and will be another
One is set to mark point B.In addition, the special marking 3 can be etched good before analyzing, also may be used
Being pasted on sheet glass 2 when being analyzed temporarily.Observe the metal branch of pedestal in the back side
Frame 1 can be with some strength and can carry any metal material of certain load, by being carried
Wafer weight it is very small, therefore, its material is not particularly restricted, but in view of economy and
Intensity, it is preferably stainless steel.
The sheet glass 2 being arranged on the metallic support 1 of observation pedestal in the back side of the invention can be common
Silicate glass or lucite, as long as meeting preferable light transmittance, and are not particularly limited.
The special marking 3 being arranged on sheet glass 2 is not limited to triangle and rectangle shown in Fig. 1,
Can be any shape, such as circle, cross etc., two special markings 3 also without identical, but
In order to easily differentiate, analyze speed and accuracy are improved, preferably both are different shapes.
Hereinafter, the localization method that pedestal is observed using the back side of the invention is illustrated：
By the wafer of pending failure analysis be placed in it is of the invention analyzed for chip failure in it is accurate
On the sheet glass 2 of the back side observation pedestal of positioning, (the example of two special marking 3 is had been provided with the sheet glass 2
Such as above-mentioned mark point A and mark point B).In failure analysis, back side observation pedestal is held on
The clamper of PEM/OBIRCH, exception is detected by the back side station-keeping mode of PEM/OBIRCH
Point, the position coordinates of two special markings 3 and abnormity point is determined using special program.Using the back side
Station-keeping mode carries out position time platform and can automatically carry out left and right mirror image processing, in this way, when 180 degree is turned over
Turn after clamper, the position at positive position and the back side can correspond to completely, it is not necessary to extraly people
To carry out mirror image processing so that the position correspondence of front and back, it is to avoid artificially by front and back
Position carry out the corresponding mistake that negligence causes a little during to correspondence.Passing through
The back side station-keeping mode of PEM/OBIRCH is detected after abnormity point, record the abnormity point position and
The coordinate of the position of two special markings；
After the mathematical relationship between abnormity point and special marking is determined using corresponding program, upset
Observation pedestal, now due to mirror image processing has been carried out, it is possible to by this mathematical relationship,
Mathematical computations are carried out, abnormity point correspondence is obtained in positive position；
By moving lens to the abnormity point position, laser labelling is carried out, it is possible thereby to determine fail bit
Put, to carry out further failure analysis.
Embodiment described above only expresses embodiments of the present invention, and its description is more specific and detailed
Carefully, but can not therefore and be interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that right
For one of ordinary skill in the art, without departing from the inventive concept of the premise, can also do
Go out some deformations and improvement, these belong to protection scope of the present invention.Therefore, patent of the present invention
Protection domain should be determined by the appended claims.
Practicality in industry
Base is observed by by the pinpoint back side in the analysis for chip failure provided by the present invention
Seat is combined with corresponding localization method, can realize the accurate conversion of the back side and front position, thus, it is possible to
To enough PEM/OBIRCH methods used, when carrying out positioning analysis using back side positioning method, just
Accurately find positioned position in face so that the locating speed and accuracy rate of wafer failure analysis are obtained
Increase substantially.
Claims (7)
1. pedestal is observed at the pinpoint back side in a kind of analysis for chip failure, it is characterised in that
It includes metallic support, and the center of the metallic support is provided with centre bore, is installed in the centre bore
There is sheet glass, two special markings for providing reference coordinate are additionally provided with the sheet glass.
2. base is observed at the pinpoint back side in the analysis for chip failure according to claim 1
Seat, it is characterised in that described two special markings are to be etched in or be pasted on the sheet glass.
3. base is observed at the pinpoint back side in the analysis for chip failure according to claim 1
Seat, it is characterised in that the position of the special marking is on the sheet glass of the back side observation pedestal
Any position.
4. base is observed at the pinpoint back side in the analysis for chip failure according to claim 1
Seat, it is characterised in that the special marking is arranged to identical or different shape.
5. base is observed at the pinpoint back side in the analysis for chip failure according to claim 1
Seat, it is characterised in that the metallic support is stainless steel.
6. base is observed at the pinpoint back side in the analysis for chip failure according to claim 1
Seat, it is characterised in that the sheet glass is silicate glass or lucite.
7. a kind of localization method, it is characterised in that the use any one of usage right requirement 1-6
Pinpoint back side observation pedestal is positioned in chip failure analysis, including following step
Suddenly：
Step one：In chip failure analysis, PEM/OBIRCH positioning is positioned different using rear mode
Chang Dian, and record the position of two special marking and the position of abnormity point；
Step 2：180 degree upset clamps the clamper that pedestal is observed at the back side, records described two special
The coordinate of mark position；
Step 3：By mathematical computations, the corresponding position coordinates of the abnormity point is obtained；
Step 4：Moving lens carries out laser labelling to the position of the abnormity point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963853.XA CN106896312B (en) | 2015-12-21 | 2015-12-21 | A kind of overleaf observing pedestal and application method for being positioned in chip failure analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963853.XA CN106896312B (en) | 2015-12-21 | 2015-12-21 | A kind of overleaf observing pedestal and application method for being positioned in chip failure analysis |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106896312A true CN106896312A (en) | 2017-06-27 |
| CN106896312B CN106896312B (en) | 2019-07-12 |
Family
ID=59190662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510963853.XA Active CN106896312B (en) | 2015-12-21 | 2015-12-21 | A kind of overleaf observing pedestal and application method for being positioned in chip failure analysis |
Country Status (1)
| Country | Link |
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| CN (1) | CN106896312B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305848A (en) * | 2018-01-12 | 2018-07-20 | 昆山成功环保科技有限公司 | A kind of wafer automatic station-keeping system and the loading machine including it |
| CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
| CN113804624A (en) * | 2021-09-18 | 2021-12-17 | 温州佳易仪器有限公司 | Device and method for quickly fixing standard sample |
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| CN1877292A (en) * | 2005-06-10 | 2006-12-13 | 联华电子股份有限公司 | Defect detection method |
| CN101086553A (en) * | 2006-06-08 | 2007-12-12 | 中芯国际集成电路制造(上海)有限公司 | Light emission microscope opposite side sample fixer |
| CN103422070A (en) * | 2012-05-16 | 2013-12-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | PECVD device, carrier board visual identification system and method |
| CN203434131U (en) * | 2013-07-29 | 2014-02-12 | 中芯国际集成电路制造(北京)有限公司 | Chip positioning module |
| CN104037106A (en) * | 2014-06-09 | 2014-09-10 | 上海华力微电子有限公司 | Method for semiconductor chip failure analysis |
-
2015
- 2015-12-21 CN CN201510963853.XA patent/CN106896312B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1877292A (en) * | 2005-06-10 | 2006-12-13 | 联华电子股份有限公司 | Defect detection method |
| CN101086553A (en) * | 2006-06-08 | 2007-12-12 | 中芯国际集成电路制造(上海)有限公司 | Light emission microscope opposite side sample fixer |
| CN103422070A (en) * | 2012-05-16 | 2013-12-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | PECVD device, carrier board visual identification system and method |
| CN203434131U (en) * | 2013-07-29 | 2014-02-12 | 中芯国际集成电路制造(北京)有限公司 | Chip positioning module |
| CN104037106A (en) * | 2014-06-09 | 2014-09-10 | 上海华力微电子有限公司 | Method for semiconductor chip failure analysis |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108305848A (en) * | 2018-01-12 | 2018-07-20 | 昆山成功环保科技有限公司 | A kind of wafer automatic station-keeping system and the loading machine including it |
| CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
| CN113804624A (en) * | 2021-09-18 | 2021-12-17 | 温州佳易仪器有限公司 | Device and method for quickly fixing standard sample |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106896312B (en) | 2019-07-12 |
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| CP03 | Change of name, title or address |
Address after: No. 333, Xinghua Street, Suzhou Industrial Park, Suzhou Area, China (Jiangsu) Pilot Free Trade Zone, Suzhou, Jiangsu 215123 Patentee after: Warship chip manufacturing (Suzhou) Limited by Share Ltd. Address before: 215025 No. 333 Hua Hua Street, Suzhou Industrial Park, Jiangsu, Suzhou Patentee before: HE JIAN TECHNOLOGY (SUZHOU) Co.,Ltd. |
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