CN106887397A - Microscope carrier mechanism and semiconductor processing equipment - Google Patents
Microscope carrier mechanism and semiconductor processing equipment Download PDFInfo
- Publication number
- CN106887397A CN106887397A CN201510942586.8A CN201510942586A CN106887397A CN 106887397 A CN106887397 A CN 106887397A CN 201510942586 A CN201510942586 A CN 201510942586A CN 106887397 A CN106887397 A CN 106887397A
- Authority
- CN
- China
- Prior art keywords
- microscope carrier
- film trap
- download desk
- rotary shaft
- carrier mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Abstract
Microscope carrier mechanism and semiconductor processing equipment that the present invention is provided, it includes microscope carrier, download desk and rotary shaft, wherein, upper microscope carrier and download desk are superposed；The piece position groove of its thickness is provided through on upper microscope carrier, chip is located in the groove of piece position, and is carried by the upper surface of download desk；Also, on upper microscope carrier, and it is additionally provided with and takes film trap through the first of its thickness positioned at the edge of piece position groove；The upper surface of download desk is provided with second and takes film trap；Upper microscope carrier and download desk can be rotated against around rotary shaft, so that second takes film trap and take film trap with first and coincide or stagger completely.The microscope carrier mechanism that the present invention is provided, it can reduce the influence for taking film trap to the sedimentation rate of wafer edge, such that it is able to improve the uniformity of film thickness.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, in particular it relates to a kind of microscope carrier mechanism
And semiconductor processing equipment.
Background technology
Plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor
Deposition, hereinafter referred to as PECVD) equipment is the more universal one kind of semicon industry
Vacuum coating equipment, is widely used in SIO2, the deielectric-coating such as SiNx, SiON deposition.
In LED field, PECVD device is important filming equipment in chip technology, its
Generally utilize microscope carrier bearing wafer.Fig. 1 is the top view of existing microscope carrier.Refer to Fig. 1,
Microscope carrier 1 generally uses monolithic construction, and it includes multiple piece positions groove 2, is used to carry and fixes
Chip.And, in order to avoid operating personnel are carrying out picking and placeing piece operation scuffing chip, raising takes
Film releasing efficiency, in each piece position, the edge of groove 2 is additionally provided with and takes film trap 3, and this takes film trap 3
Depth of the depth more than piece position groove 2, when the film trap 3 that needs to ask for takes out chip, operator
Member can start chip using wand film trap 3 of asking for, such that it is able to more easily take out chip.
But, due to taking the depth of the depth more than piece position groove 2 of film trap 3, in technical process
In, taking film trap 3 can produce influence to the sedimentation rate of Waffer edge, so as to cause to be deposited on crystalline substance
Uneven film thickness on piece surface.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art, it is proposed that
A kind of microscope carrier mechanism and semiconductor processing equipment, it can reduce and takes film trap to wafer edge
The influence of sedimentation rate, such that it is able to improve the uniformity of film thickness.
A kind of microscope carrier mechanism is provided to realize the purpose of the present invention, for bearing wafer, bag
Microscope carrier, download desk and rotary shaft are included, wherein, the upper microscope carrier and download desk are superposed；
The piece position groove of its thickness is provided through on described on microscope carrier, the chip is located at described position
In groove, and carried by the upper surface of the download desk；Also, on described on microscope carrier, and position
It is additionally provided with the edge of described position groove and takes film trap through the first of its thickness；Under described
The upper surface of microscope carrier is provided with second and takes film trap；The upper microscope carrier and download desk can be around the rotations
Rotating shaft is rotated against, so that described second takes film trap and take film trap with described first and coincide or complete
It is completely wrong to open.
Preferably, the upper microscope carrier makes described second by just transferring relative to the download desk
Take film trap and take film trap with described first and coincide；The upper microscope carrier is by relative to the download desk
Invert and make described second to take film trap and take film trap with described first and stagger completely.
Preferably, the center position of microscope carrier is provided with central through hole, the rotation on described
Rotating shaft passes through the central through hole straight down, and is fixedly connected with the download desk；It is logical
Cross and rotate the upper microscope carrier, it is rotated against with the download desk.
Preferably, the center position in the download desk is provided with central through hole, the rotation
Rotating shaft passes through the central through hole straight up, and is fixedly connected with the upper microscope carrier；By rotation
Turn the rotary shaft, the upper microscope carrier is rotated against with the download desk.
Preferably, also including rotating driving device, for driving the rotary shaft to rotate.
Preferably, described position groove is one or more；Multiple described position grooves are around described
Rotary shaft is uniformly distributed；Described first take film trap quantity it is relative with the quantity of described position groove
Answer, and the two is set correspondingly；Described second takes the quantity of film trap and described first takes piece
The quantity of groove is corresponding, and the two is set correspondingly.
Used as another technical scheme, the present invention also provides a kind of semiconductor processing equipment, its
Including reaction chamber, microscope carrier mechanism is provided with the reaction chamber, to bearing wafer；
The microscope carrier mechanism employs the above-mentioned microscope carrier mechanism of present invention offer.
Preferably, also including top electrode assembly, the top electrode assembly includes uniform flow chamber and penetrates
Frequency power, wherein, the uniform flow chamber is arranged on the top of the reaction chamber, and described even
Stream is provided with air inlet at the top of chamber, to conveying reacting gas in the uniform flow chamber；Institute
The bottom for stating uniform flow chamber is provided with multiple gas outlets, and the multiple gas outlet is relative to the microscope carrier
The surface that mechanism is used for bearing wafer is uniformly distributed, and is used to the reacting gas in the uniform flow chamber
It is delivered in the reaction chamber；The radio-frequency power supply is electrically connected with the uniform flow chamber, is used to swash
Reacting gas in sending out reaction chamber described forms plasma.
Preferably, the semiconductor processing equipment includes plasma enhanced chemical vapor deposition
Equipment, for depositing SiO on the wafer2Film, SiNx films or SiON films.
The invention has the advantages that：
The microscope carrier mechanism that the present invention is provided, it uses split-type structural, i.e., by superposed
Upper microscope carrier and download desk are constituted, and chip is carried by the upper surface of download desk, and on upper microscope carrier
In the piece position groove of its thickness.Also, on upper microscope carrier, and positioned at the edge of piece position groove
It is additionally provided with and takes film trap through the first of its thickness, the upper surface of download desk is provided with second is taken
Film trap, is rotated against by making upper microscope carrier and download desk around rotary shaft, and second can be made to take piece
Groove takes film trap and coincides with first, and now operating personnel can take from first and be exposed in film trap
Second take film trap and take piece or film releasing operation；Or, second can be made to take film trap and first
Take film trap to stagger completely, now second take film trap and be hidden in microscope carrier bottom, such that it is able to subtract
The influence of the small sedimentation rate to wafer edge that takes film trap, and then film thickness can be improved
Uniformity.
The semiconductor processing equipment that the present invention is provided, it passes through using the above-mentioned of present invention offer
Microscope carrier mechanism, can reduce the influence for taking film trap to the sedimentation rate of wafer edge, so that can
To improve the uniformity of film thickness.
Brief description of the drawings
Fig. 1 is the top view of existing microscope carrier；
Fig. 2 is the top view of the upper microscope carrier of microscope carrier mechanism provided in an embodiment of the present invention；
Fig. 3 is the top view of the download desk of microscope carrier mechanism provided in an embodiment of the present invention；
Fig. 4 is that microscope carrier mechanism provided in an embodiment of the present invention is carrying out picking and placeing bowing when piece is operated
View；
Fig. 5 is top view of the microscope carrier mechanism provided in an embodiment of the present invention when technique is carried out；
And
Fig. 6 is the sectional view of semiconductor processing equipment provided in an embodiment of the present invention.
Specific embodiment
To make those skilled in the art more fully understand technical scheme, tie below
The microscope carrier mechanism and semiconductor processing equipment for closing accompanying drawing to provide the present invention are described in detail.
Also referring to Fig. 2-5, microscope carrier mechanism is used for bearing wafer, it include microscope carrier 11,
Download desk 21 and rotary shaft 31.Wherein, upper microscope carrier 11 and download desk 21 are superposed, and two
The shape of person is identical with external diameter.As shown in Fig. 2 three are provided with upper microscope carrier 11 running through
The piece position groove 12 of its thickness, and be uniformly distributed around its longitudinal center line.Chip is (in figure not
Show) it is located in the groove 12 of piece position, and carried by the upper surface of download desk 21.Also, upper
On microscope carrier 11, and be additionally provided with positioned at the edge of each piece position groove 12 through its thickness the
One takes film trap 13.
As shown in figure 3, the upper surface of download desk 21 is provided with second takes film trap 22, pass through
Microscope carrier 11 and download desk 21 is rotated against around rotary shaft 31, second can be made to take piece
Groove 22 takes film trap 13 and coincides with first, as shown in figure 4, now operating personnel can be from
One takes second be exposed in film trap 13 takes film trap 22 carries out taking piece or film releasing operation.Or,
Second can be made to take film trap 22 and take film trap 13 with first stagger completely, now second film trap is taken
22 are hidden in microscope carrier 11 or bottom of wafer, and film trap is taken to chip side such that it is able to reduce
The influence of the sedimentation rate at edge, and then the uniformity of film thickness can be improved.
Preferably, upper microscope carrier 11 by relative to download desk 21 just then make second to take film trap
22 take film trap 13 with first coincides；Upper microscope carrier 11 by inverting relative to download desk 21 and
Make second to take film trap 22 and take film trap 13 with first to stagger completely.This rotation mode needs rotation
Angle it is smaller, efficiency is higher.It should be noted that so-called rotating forward refers to the phase of upper microscope carrier 11
Rotated along direction clockwise or counterclockwise around rotary shaft 31 for download desk 21, and inverted
It is in opposite direction with what is rotated forward.If that is, it is upper microscope carrier 11 relative to download desk 21 to rotate forward
Turn clockwise, then reversion is upper microscope carrier 11 relative to the rotate counterclockwise of download desk 21；Conversely,
If rotating forward is upper microscope carrier 11 relative to the rotate counterclockwise of download desk 21, reversion is upper microscope carrier
11 turn clockwise relative to download desk 21.
Certainly, in actual applications, upper microscope carrier 11 can also be used all the time relative to download desk
The mode of 21 forward or reverse realizes that second takes film trap 22 and take overlapping for film trap 13 with first
Stagger completely.It is readily appreciated that, when upper microscope carrier 11 is (suitable in one direction relative to download desk 21
Hour hands are counterclockwise) rotation specified angle when, second takes film trap 22 and first takes film trap 13
Overlap；When upper microscope carrier 11 continues to rotate a certain angle in the direction, second takes piece
Groove 22 takes film trap 13 and staggers completely with first.
In the present embodiment, the center position in upper microscope carrier 11 is provided with central through hole, i.e.
The axis of the central through hole overlaps with the longitudinal center line of upper microscope carrier 11.Rotary shaft 31 vertically to
Under through the central through hole, and be fixedly connected with download desk 21.In such a case, it is possible to
By the upper microscope carrier 11 of rotation, it is set to be rotated against with download desk 21.That is, upper microscope carrier
11 have relative rotary motion relative to rotary shaft 31, and download desk 21 is relative to rotary shaft
31 maintain static.
When needing pick and place piece operation, revolved around rotary shaft 31 by making upper microscope carrier 11
Turn, until second takes film trap 22 and take film trap 13 with first and coincide, i.e. second takes film trap
22 can take film trap 13 from first is exposed, during second takes position such as Fig. 4 of film trap 22
Shade shown in.Now operating personnel can take film trap 22 and take out chip using wand from second,
Or place a wafer into the groove 12 of piece position.Before technique is carried out, by making upper microscope carrier 11
(rotation that can be before or edge opposite with direction of rotation before is rotated around rotary shaft 31
Continue to rotate in direction), until second takes film trap 22 and takes film trap 13 with first and stagger completely, i.e.
Second takes film trap 22 is hidden in microscope carrier 11 or bottom of wafer, and second takes film trap 22
Position as shown in broken line in fig. 5, film trap 22 is taken to Waffer edge such that it is able to reduce second
The influence of the sedimentation rate at place, and then the uniformity of film thickness can be improved.
It should be noted that in actual applications, can also be in the center of download desk 21
Place is provided with central through hole, and rotary shaft 31 straight up through the central through hole, and with
Upper microscope carrier 11 is fixedly connected.In such a case, it is possible to pass through to rotate rotary shaft 31, make
Microscope carrier 11 is rotated against with download desk 21.That is, rotated by driving rotary shaft 31,
To drive upper microscope carrier 11 to be rotated relative to download desk 21, and download desk 21 is relative to rotary shaft
31 maintain static.Preferably, rotary shaft 31 can also be connected with rotating driving device,
Under the driving of rotating driving device, rotary shaft 31 drives upper microscope carrier 11 to rotate, such that it is able to reality
Now automatically control.
Also, it should be noted that in the present embodiment, rotary shaft 31 is located at upper microscope carrier 11
Center position, but the invention is not limited in this, in actual applications, rotary shaft 31
May be located on other optional positions of microscope carrier 11, i.e. rotary shaft 31 and upper microscope carrier 11
Longitudinal center line do not coincide, as long as having relative rotation between upper microscope carrier 11 and download desk 21
Transhipment is dynamic, and enables second to take film trap 22 and expose or hide.
Explanation is needed further exist for, in the present embodiment, piece position groove is three, but this
Invention is not limited thereto, and in actual applications, piece position groove can also be one, two or four
More than individual, and more than two position grooves are uniformly distributed around rotary shaft.Also, first takes piece
The quantity of groove is corresponding with the quantity of piece position groove, and the two is set correspondingly；Second takes piece
The quantity of groove is corresponding with the quantity that first takes film trap, and the two is set correspondingly.
Used as another technical scheme, Fig. 6 is semiconductor machining provided in an embodiment of the present invention
The sectional view of equipment.Refer to Fig. 6, semiconductor processing equipment includes reaction chamber 100 and upper
Electrode assemblie.Wherein, microscope carrier mechanism 101 is provided with the reaction chamber 100, is used to hold
Chip 102 is carried, the microscope carrier mechanism 101 employs above-mentioned microscope carrier machine provided in an embodiment of the present invention
Structure.
Top electrode assembly includes uniform flow chamber 103 and radio-frequency power supply 104, wherein, uniform flow chamber 103
The top of reaction chamber 100 is arranged on, and the top in the uniform flow chamber 103 is provided with air inlet
105, to conveying reacting gas in uniform flow chamber 103.Set in the bottom in uniform flow chamber 103
There are multiple gas outlets 106, multiple gas outlets 106 are used to carry crystalline substance relative to microscope carrier mechanism 101
The surface of piece 102 is uniformly distributed, and is used to equably convey the reacting gas in uniform flow chamber 103
To reaction chamber 100.Radio-frequency power supply 104 is electrically connected with uniform flow chamber 103, is used to excite instead
Generation after answering the reacting gas formation plasma in chamber 100, reacting gas to decompose
The surface that thing deposits to chip 102 forms film.
In actual applications, above-mentioned semiconductor processing equipment can be with using plasma enhancingization
Vapor deposition apparatus are learned, for depositing SiO on a wafer 1022Film, SiNx films or
SiON films etc..
Semiconductor processing equipment provided in an embodiment of the present invention, it passes through to implement using the present invention
The above-mentioned microscope carrier mechanism that example is provided, can reduce the sedimentation rate that takes film trap to wafer edge
Influence, such that it is able to improve the uniformity of film thickness.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and
The illustrative embodiments of use, but the invention is not limited in this.For in the art
For those of ordinary skill, without departing from the spirit and substance in the present invention, can do
Go out all variations and modifications, these variations and modifications are also considered as protection scope of the present invention.
Claims (9)
1. a kind of microscope carrier mechanism, for bearing wafer, it is characterised in that including upper microscope carrier,
Download desk and rotary shaft, wherein,
The upper microscope carrier and download desk are superposed；It is provided through on microscope carrier on described
The piece position groove of thickness, the chip is located in described position groove, and by the upper table of the download desk
Face carries；Also, on described on microscope carrier, and also set up positioned at the edge of described position groove
Have and take film trap through the first of its thickness；
The upper surface of the download desk is provided with second and takes film trap；
The upper microscope carrier and download desk can be rotated against around the rotary shaft, so that described
Two take film trap takes film trap and coincides or stagger completely with described first.
2. microscope carrier mechanism according to claim 1, it is characterised in that the upper microscope carrier
By relative to the download desk just transferring to make described second to take film trap film trap is taken with described first
Coincide；The upper microscope carrier makes described second to take film trap by being inverted relative to the download desk
Film trap is taken with described first to stagger completely.
3. microscope carrier mechanism according to claim 1, it is characterised in that uploaded described
The center position of platform is provided with central through hole, and the rotary shaft passes through the center straight down
Through hole, and be fixedly connected with the download desk；
By rotating the upper microscope carrier, it is set to be rotated against with the download desk.
4. microscope carrier mechanism according to claim 1, it is characterised in that in the download
The center position of platform is provided with central through hole, and the rotary shaft passes through the center straight up
Through hole, and be fixedly connected with the upper microscope carrier；
By rotating the rotary shaft, the upper microscope carrier is set to be rotated against with the download desk.
5. microscope carrier mechanism according to claim 4, it is characterised in that also including rotation
Drive device, for driving the rotary shaft to rotate.
6. the microscope carrier mechanism according to claim 1-5 any one, it is characterised in that
Described position groove is one or more；
Multiple described position grooves are uniformly distributed around the rotary shaft；
Described first take film trap quantity it is corresponding with the quantity of described position groove, and the two one
One is arranged in correspondence with；Described second take film trap quantity it is relative with the quantity that described first takes film trap
Answer, and the two is set correspondingly.
7. a kind of semiconductor processing equipment, it includes reaction chamber, in the reaction chamber
Microscope carrier mechanism is provided with, to bearing wafer；Characterized in that, the microscope carrier mechanism is using power
Profit requires the microscope carrier mechanism described in 1-6 any one.
8. semiconductor processing equipment according to claim 7, it is characterised in that also wrap
Top electrode assembly is included, the top electrode assembly includes uniform flow chamber and radio-frequency power supply, wherein,
The uniform flow chamber is arranged on the top of the reaction chamber, and on the top in the uniform flow chamber
Portion is provided with air inlet, to conveying reacting gas in the uniform flow chamber；In the uniform flow chamber
Bottom be provided with multiple gas outlets, the multiple gas outlet is used for relative to the microscope carrier mechanism
The surface of bearing wafer is uniformly distributed, and is used to for the reacting gas in the uniform flow chamber to be delivered to institute
State in reaction chamber；
The radio-frequency power supply is electrically connected with the uniform flow chamber, is used to excite in the reaction chamber
Reacting gas formed plasma.
9. semiconductor processing equipment according to claim 7, it is characterised in that described
Semiconductor processing equipment includes plasma enhanced chemical vapor deposition equipment, in the crystalline substance
SiO is deposited on piece2Film, SiNx films or SiON films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942586.8A CN106887397B (en) | 2015-12-16 | 2015-12-16 | Microscope carrier mechanism and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942586.8A CN106887397B (en) | 2015-12-16 | 2015-12-16 | Microscope carrier mechanism and semiconductor processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106887397A true CN106887397A (en) | 2017-06-23 |
| CN106887397B CN106887397B (en) | 2019-04-23 |
Family
ID=59174765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510942586.8A Active CN106887397B (en) | 2015-12-16 | 2015-12-16 | Microscope carrier mechanism and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106887397B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205600A (en) * | 2019-07-04 | 2019-09-06 | 浙江大学昆山创新中心 | A kind of high temperature resistant dual purpose crystalline substance control instrument |
| CN113871341A (en) * | 2021-09-27 | 2021-12-31 | 材料科学姑苏实验室 | Plug pin for jacking and taking wafer and jacking and taking device |
| CN113871341B (en) * | 2021-09-27 | 2024-04-30 | 材料科学姑苏实验室 | Bolt for jacking wafer and jacking device |
Citations (4)
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|---|---|---|---|---|
| JPH0254766A (en) * | 1988-08-19 | 1990-02-23 | Matsushita Electric Ind Co Ltd | Thin film-forming equipment |
| JPH03121743A (en) * | 1989-10-06 | 1991-05-23 | Kyushu Electron Metal Co Ltd | Work transfer device and work fitting/locating jig for working machine |
| CN203999905U (en) * | 2014-06-20 | 2014-12-10 | 中晟光电设备（上海）有限公司 | Semiconductor processing equipment and pallet thereof |
| CN104821266A (en) * | 2015-05-07 | 2015-08-05 | 合肥彩虹蓝光科技有限公司 | Microscope stage |
-
2015
- 2015-12-16 CN CN201510942586.8A patent/CN106887397B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0254766A (en) * | 1988-08-19 | 1990-02-23 | Matsushita Electric Ind Co Ltd | Thin film-forming equipment |
| JPH03121743A (en) * | 1989-10-06 | 1991-05-23 | Kyushu Electron Metal Co Ltd | Work transfer device and work fitting/locating jig for working machine |
| CN203999905U (en) * | 2014-06-20 | 2014-12-10 | 中晟光电设备（上海）有限公司 | Semiconductor processing equipment and pallet thereof |
| CN104821266A (en) * | 2015-05-07 | 2015-08-05 | 合肥彩虹蓝光科技有限公司 | Microscope stage |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205600A (en) * | 2019-07-04 | 2019-09-06 | 浙江大学昆山创新中心 | A kind of high temperature resistant dual purpose crystalline substance control instrument |
| CN113871341A (en) * | 2021-09-27 | 2021-12-31 | 材料科学姑苏实验室 | Plug pin for jacking and taking wafer and jacking and taking device |
| CN113871341B (en) * | 2021-09-27 | 2024-04-30 | 材料科学姑苏实验室 | Bolt for jacking wafer and jacking device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106887397B (en) | 2019-04-23 |
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Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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