CN106876602B - A kind of flexible OLED display film encapsulation method - Google Patents
A kind of flexible OLED display film encapsulation method Download PDFInfo
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- CN106876602B CN106876602B CN201611195482.6A CN201611195482A CN106876602B CN 106876602 B CN106876602 B CN 106876602B CN 201611195482 A CN201611195482 A CN 201611195482A CN 106876602 B CN106876602 B CN 106876602B
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000005538 encapsulation Methods 0.000 title claims abstract description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 40
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000001301 oxygen Substances 0.000 claims abstract description 24
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 22
- 229920000052 poly(p-xylylene) Polymers 0.000 claims abstract description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 20
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 19
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000012495 reaction gas Substances 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 239000004033 plastic Substances 0.000 claims description 44
- 229920003023 plastic Polymers 0.000 claims description 44
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 22
- 238000000231 atomic layer deposition Methods 0.000 claims description 21
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 229910052593 corundum Inorganic materials 0.000 claims description 17
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 230000004888 barrier function Effects 0.000 claims description 13
- 229910052786 argon Inorganic materials 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 239000008367 deionised water Substances 0.000 claims description 7
- 229910021641 deionized water Inorganic materials 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000007654 immersion Methods 0.000 abstract description 4
- 238000005137 deposition process Methods 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract description 3
- 238000004643 material aging Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000007812 deficiency Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 44
- 239000010410 layer Substances 0.000 description 24
- 238000005516 engineering process Methods 0.000 description 14
- 239000011241 protective layer Substances 0.000 description 10
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000013047 polymeric layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of film encapsulation method of flexible OLED display, and for the method using trimethyl aluminium as organic silicon source, high pure ozone uses atom layer deposition process to prepare Al on substrate as reaction gas, high pure nitrogen as gas is removed2O3Compact medium film layer, is then coated with parylene layer, and polymeric membrane is aggregated by cured method.The present invention provides the above method and OLED device packaging protection layer is effectively overcome to be easily broken off in bending flexible display apparatus; so that water oxygen obstructing capacity is greatly reduced; influence display effect; the technological deficiency for possibly even causing OLED to fail; drier need not be added during providing the above method in the present invention; the encapsulating structure of preparation can effectively obstruct immersion of the water oxygen to display screen, prevent material aging, extend the OLED device service life.
Description
Technical field
The present invention relates to display technology fields, and in particular to a kind of film encapsulation method of flexible OLED display.
Background technology
Organic light emitting display is a kind of display screen for applying Organic Light Emitting Diode (OLED) as luminescent device, is compared
Present mainstream flat panel display Thin Film Transistor-LCD (TFT-LCD), organic light emitting display have high compare
The advantages that degree, wide viewing angle, low-power consumption, thinner volume, is expected to become the next-generation flat panel display after LCD, is current
Attract attention most one of technologies in flat panel display.OLED device is very sensitive to steam, oxygen, it is easy to decline
Subtract, effective encapsulation can prevent the immersion of steam and oxygen, prevent organic material aging, extend the OLED device service life.Largely
Scientific research personnel researches and develops around OLED the relevant technologies, and the encapsulation technology as one of OLED technology key technology also become grind
Study carefully one of hot spot.
Currently, flexibility OLED mainly has cover board encapsulation and two kinds of packaged types of thin-film package (TFE), cover board encapsulation to use pre-
Cover board processed is packaged, and mainly has a glass material and membrane material, the main adopter's single thin film of thin-film package or plural layers into
Row encapsulation.But since cap is mostly fragile material, repeatedly bending is also easy to produce crackle, and since the water oxygen of UV solidification glues hinders
It is less desirable every property, along with encapsulated device is thick and heavy, cannot meet it is modern it is light and handy to OLED device, can tortuosity want
It asks, therefore, finds the hot spot direction that suitable packaging method is still research.
Chinese invention patent application number 201410727845.0 discloses a kind of flexibility OLED substrates and flexibility OLED encapsulation
Method, the flexibility OLED substrates include：Polymeric layer, metal foil and insulating adhesive layer.Flexibility OLED substrates have good
Good flexibility and waterproof, oxygen permeability.Substrate is prepared and is combined together with encapsulation process by the invention, simplifies encapsulation work
Skill, and the stress generated between substrate when device bend will improve the reliability of packaging technology by entire devices share.
But between each layer for using of the invention, especially between metal foil and insulating adhesive layer, there is no the bonding of chemical bond works
With, therefore after flexibility bending repeatedly, be easy splitting, cause its security risk big.
Chinese invention patent application number 201510700071.7 discloses a kind of encapsulating structure of flexible OLED devices.This is soft
Property OLED encapsulating structures, it is by flexible conductive substrate, functional organic electronic, complete to cover water oxygen encapsulated layer and flexible seal
Lid film composition.Wherein completely water oxygen encapsulated layer is using one or more kinds of potting resin glue and sealant to entirety
OLED carries out comprehensive liquid covering packaging technology, establishes one efficiently to the barrier of water and Oxygen permeation.But this method
The one or more kinds of potting resin glue and sealant used be chronically exposed to ultraviolet lighting or the environment that drenches with rain in when, resin
The case where just will appear aging, defencive function reduce.
Chinese invention patent application number 201610431035.X discloses a kind of flexible OLED devices and its packaging method.It should
Invention is equipped with the first barrier layer and the second barrier layer, is additionally provided with buffer layer, optimizes barrier film structures, specific good water oxygen
Barrier property, makes that flexible OLED display is more frivolous, bending performance is more preferable, and extend flexible OLED display uses the longevity
Life.However, the program is complicated for operation, cost improves, and the thickness of OLED device increases, and weight increases, and it is light to have lost it
The characteristics of.
In conclusion the method being packaged to flexible display apparatus in currently available technology is substantially similar, all it is
On flexible substrates complete OLED device cathode manufacture after, first make one layer to cover the protective layer of OLED device cathode,
Then protective filmy layer is then covered on protective layer again.Wherein, mainly protective layer plays encapsulation effect, prevents steam and oxygen
Immersion, and protecting film thereon is mainly used for that protective layer is prevented to be scratched.However, such protective layer is in bending Flexible Displays
It is easily broken off when device, so that water oxygen obstructing capacity is greatly reduced, influences display effect, in some instances it may even be possible to OLED be caused to lose
Effect.If protective organic film and inorganic dielectric film combination are packaged flexible OLED display part, it would be possible to be asked to be above-mentioned
The solution of topic provides a kind of effective approach.
Invention content
All it is basic in OLED device for essentially identical to the packaging method of flexible display apparatus in currently available technology
After structure is completed, one layer is first made to cover the protective layer of OLED device cathode, is then then covered on protective layer again
Protective filmy layer.Wherein, protective layer plays encapsulation effect, prevents the immersion of steam and oxygen, and protecting film thereon is mainly used for
Protective layer is prevented to be scratched.However, such protective layer is easily broken off in bending flexible display apparatus, so that water oxygen hinders
It is greatly reduced every ability, influences display effect, in some instances it may even be possible to OLED be caused to fail.The present invention proposes a kind of flexible OLED display
Film encapsulation method, the method using trimethyl aluminium as organic silicon source, high pure ozone is as reaction gas, high pure nitrogen
As gas is removed, atom layer deposition process is used to prepare Al on substrate2O3Compact medium film layer improves the table of plastic supporting base
Face situation is allowed to surface and reaches the smooth of atomic level, then in coating parylene layer, is aggregated by cured method
Polymeric membrane.The present invention prepares fine and close Al using technique for atomic layer deposition2O3Film improves the roughness on plastic supporting base surface,
The case where it is finer and close to be then coated with organic high molecular layer, avoids repeatedly bending cracking ensure that the barrier of steam and oxygen is made
With whole preparation process has good industrial foundation, reduces process costs, is being promoted protective while not destroyed
The advantage of OLED itself has very high industrial application value.
The present invention provides a kind of film encapsulation method of flexible OLED display, and the method is used as using trimethyl aluminium to be had
Machine silicon source, for high pure ozone as reaction gas, high pure nitrogen prepares Al on substrate as gas is removed2O3Medium compact film,
It is then coated with parylene layer, is included the following steps：
（1）Plastic supporting base is cleaned, clean plastic supporting base is obtained；
（2）In the cleaning plastic supporting base, using 250-320 DEG C of underlayer temperature, under vacuum degree, using trimethyl aluminium
It is reaction gas as silicon source, high-purity ozone molecule, high pure nitrogen is to remove gas, passes through atomic layer deposition Al2O3Medium is fine and close
Film layer；
（3）Paraxylene dimer carries out 140-180 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, obtain the parylene film of even compact, as blocking steam and oxygen
Barrier.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
Preferably, the cleaning plastic supporting base includes the following steps：
It is cleaned by ultrasonic 10-15 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, plastic supporting base is dried under 40-50 DEG C of argon gas protection；
The argon gas is that purity is 99.9%, and the ambient pressure of argon gas is 100-1000Pa.
Preferably, the flow of the atomic layer deposition trimethyl aluminium is 10-20sccm, and the flow of high pure ozone is 20-
The flow of 50sccm, high pure nitrogen are 50-100sccm.
Preferably, the purity of the high pure ozone is 99.999%, and the purity of high pure nitrogen is 99.999%.
Preferably, it is 30-50 minutes in the time of the atomic layer deposition.
Preferably, the Al2O3The thickness of medium compact film is 10-50nm.
Preferably, the depositing temperature of the parylene film is 40-60 DEG C.
Preferably, the deposition thickness of the parylene film is 20-120nm.
A kind of the performance test results pair of the film encapsulation method and conventional packaging method of flexible OLED display of the present invention
Than as shown in table 1.
Table 1：
The present invention proposes a kind of film encapsulation method of flexible OLED display, compared with prior art, spy outstanding
Point and excellent effect are：
1, the present invention uses inorganic compact Al2O3Film is combined with organic polymer parylene film, this soft or hard combination
Compact texture have certain anti-pressure ability, avoid repeatedly bend cracking, ensure that the iris action of steam and oxygen, very
Efficiently solves bending fracture failure.
2, the present invention reduces Parylene contact ultraviolet light using the larger inorganic medium compact film covering of band gap
Probability, so that organic polymer is protected, more stablize.
3, present invention employs common atom layer deposition process, industrial foundation is strong, for display screen industry, equipment
It is of low cost extensively.
4, for the present invention using Parylene as organic protection layer, raw material sources are extensive.
Specific implementation mode
In the following, the present invention will be further described in detail by way of specific embodiments, but this should not be interpreted as to the present invention
Range be only limitted to example below.Without departing from the idea of the above method of the present invention, according to ordinary skill
The various replacements or change that knowledge and customary means are made, should be included in the scope of the present invention.
Embodiment 1
The present embodiment includes the following steps:
（1）It is cleaned by ultrasonic 10 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, is 99.9% in 40 DEG C of purity, the lower drying modeling of the argon gas protection that ambient pressure is 100Pa
Expect substrate, obtains clean plastic supporting base；
（2）In the cleaning plastic supporting base, using 250 DEG C of underlayer temperature, 10-2Under the background vacuum of Pa, use
Trimethyl aluminium is reaction gas as silicon source, high-purity ozone molecule, and high pure nitrogen is to remove gas, atomic layer deposition trimethyl aluminium
Flow be 10sccm, the flow of high pure ozone is 50sccm, and the flow of purity 99.999%, high pure nitrogen is 50sccm, pure
Degree is 99.999%, passes through atomic layer deposition Al2O3The time of medium compact film, atomic layer deposition is 30 minutes, and thickness is
50nm；
（3）Then paraxylene dimer carries out 140 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, and the depositing temperature for controlling parylene film is 40 DEG C, and it is 20nm to obtain thickness
The parylene film of even compact, the barrier as blocking steam and oxygen.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
By test, performance such as 2 institute of table tested after flexible OLED display is encapsulated by encapsulation technology in embodiment 1
Show.
Embodiment 2
The present embodiment includes the following steps:
（1）It is cleaned by ultrasonic 10 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, is 99.9% in 45 DEG C of purity, the lower drying modeling of the argon gas protection that ambient pressure is 300Pa
Expect substrate, obtains clean plastic supporting base；
（2）In the cleaning plastic supporting base, using 280 DEG C of underlayer temperature, 10-2Under the background vacuum of Pa, use
Trimethyl aluminium is reaction gas as silicon source, high-purity ozone molecule, and high pure nitrogen is to remove gas, atomic layer deposition trimethyl aluminium
Flow be 12sccm, the flow of high pure ozone is 40sccm, and the flow of purity 99.999%, high pure nitrogen is 60sccm, pure
Degree is 99.999%, passes through atomic layer deposition Al2O3The time of medium compact film, atomic layer deposition is 30 minutes, and thickness is
10nm；
（3）Then paraxylene dimer carries out 150 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, and the depositing temperature for controlling parylene film is 50 DEG C, and it is 40nm to obtain thickness
The parylene film of even compact, the barrier as blocking steam and oxygen.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
By test, performance such as 2 institute of table tested after flexible OLED display is encapsulated by encapsulation technology in embodiment 2
Show.
Embodiment 3
The present embodiment includes the following steps:
（1）It is cleaned by ultrasonic 12 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, is 99.9% in 45 DEG C of purity, the lower drying modeling of the argon gas protection that ambient pressure is 300Pa
Expect substrate, obtains clean plastic supporting base；
（2）In the cleaning plastic supporting base, using 290 DEG C of underlayer temperature, 10-3Under the background vacuum of Pa, use
Trimethyl aluminium is reaction gas as silicon source, high-purity ozone molecule, and high pure nitrogen is to remove gas, atomic layer deposition trimethyl aluminium
Flow be 15sccm, the flow of high pure ozone is 30sccm, and the flow of purity 99.999%, high pure nitrogen is 70sccm, pure
Degree is 99.999%, passes through atomic layer deposition Al2O3The time of medium compact film, atomic layer deposition is 50 minutes, and thickness is
30nm；
（3）Then paraxylene dimer carries out 150 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, and the depositing temperature for controlling parylene film is 45 DEG C, and it is 35nm to obtain thickness
The parylene film of even compact, the barrier as blocking steam and oxygen.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
By test, performance such as 2 institute of table tested after flexible OLED display is encapsulated by encapsulation technology in embodiment 3
Show.
Embodiment 4
The present embodiment includes the following steps:
（1）It is cleaned by ultrasonic 15 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, is 99.9% in 50 DEG C of purity, the lower drying modeling of the argon gas protection that ambient pressure is 500Pa
Expect substrate, obtains clean plastic supporting base；
（2）In the cleaning plastic supporting base, using 290 DEG C of underlayer temperature, 10-3Under the background vacuum of Pa, use
Trimethyl aluminium is reaction gas as silicon source, high-purity ozone molecule, and high pure nitrogen is to remove gas, atomic layer deposition trimethyl aluminium
Flow be 20ccm, the flow of high pure ozone is 20sccm, and the flow of purity 99.999%, high pure nitrogen is 80sccm, pure
Degree is 99.999%, passes through atomic layer deposition Al2O3The time of medium compact film, atomic layer deposition is 30 minutes, and thickness is
20nm；
（3）Then paraxylene dimer carries out 180 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, and the depositing temperature for controlling parylene film is 50 DEG C, and it is 80nm to obtain thickness
The parylene film of even compact, the barrier as blocking steam and oxygen.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
By test, performance such as 2 institute of table tested after flexible OLED display is encapsulated by encapsulation technology in embodiment 4
Show.
Embodiment 5
The present embodiment includes the following steps:
（1）It is cleaned by ultrasonic 10 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rushed with deionized water
It washes, the salt on removal plastic supporting base surface, is 99.9% in 50 DEG C of purity, the lower drying of the argon gas protection that ambient pressure is 1000Pa
Plastic supporting base obtains clean plastic supporting base；
（2）In the cleaning plastic supporting base, using 320 DEG C of underlayer temperature, 10-3Under the background vacuum of Pa, use
Trimethyl aluminium is reaction gas as silicon source, high-purity ozone molecule, and high pure nitrogen is to remove gas, atomic layer deposition trimethyl aluminium
Flow be 10ccm, the flow of high pure ozone is 10sccm, and the flow of purity 99.999%, high pure nitrogen is 100sccm, pure
Degree is 99.999%, passes through atomic layer deposition Al2O3The time of medium compact film, atomic layer deposition is 50 minutes, and thickness is
50nm；
（3）Then paraxylene dimer carries out 180 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium
Compact film surface condensation simultaneously polymerize rapidly, and the depositing temperature for controlling parylene film is 60 DEG C, and it is 120nm to obtain thickness
The parylene film of even compact, the barrier as blocking steam and oxygen.
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device
Part encapsulates.
By test, performance such as 2 institute of table tested after flexible OLED display is encapsulated by encapsulation technology in embodiment 5
Show.
Table 2
Claims (6)
1. a kind of film encapsulation method of flexible OLED display, which is characterized in that the method is used as using trimethyl aluminium to be had
Machine silicon source, for high pure ozone as reaction gas, high pure nitrogen prepares Al on substrate as gas is removed2O3Medium compact film,
It is then coated with parylene layer, is included the following steps：
（1）Plastic supporting base is cleaned, clean plastic supporting base is obtained；
The cleaning plastic supporting base includes the following steps：
It is cleaned by ultrasonic 10-15 minutes in ethanol solution, then the grease on removal plastic supporting base surface is rinsed with deionized water,
The salt for removing plastic supporting base surface dries plastic supporting base under 40-50 DEG C of argon gas protection；
The argon gas is that purity is 99.9%, and the ambient pressure of argon gas is 100-1000Pa；
（2）In the cleaning plastic supporting base, using 250-320 DEG C of underlayer temperature, under vacuum degree, using trimethyl aluminium conduct
Silicon source, high-purity ozone molecule are reaction gas, and high pure nitrogen is to remove gas, passes through atomic layer deposition Al2O3Medium dense film
Layer；The flow of the atomic layer deposition trimethyl aluminium is 10-20sccm, and the flow of high pure ozone is 20-50sccm, high pure nitrogen
Flow be 50-100sccm；
（3）Paraxylene dimer carries out 140-180 DEG C of Pintsch process and generates diradical dimethylbenzene, then in Al2O3Medium is fine and close
Film surface condenses and polymerize rapidly, obtains the parylene film of even compact, the barrier as blocking steam and oxygen；
（4）By plastic supporting base paste on the metal cathode layer of OLED, after compression, PMMA is around coated, completes device envelope
Dress.
2. a kind of film encapsulation method of flexible OLED display according to claim 1, which is characterized in that described high-purity
Smelly oxygen purity is 99.999%, and the purity of high pure nitrogen is 99.999%.
3. a kind of film encapsulation method of flexible OLED display according to claim 1, which is characterized in that in the original
The time of sublayer deposition is 30-50 minutes.
4. a kind of film encapsulation method of flexible OLED display according to claim 1, which is characterized in that the Al2O3
The thickness of medium compact film is 10-50nm.
5. a kind of film encapsulation method of flexible OLED display according to claim 1, which is characterized in that described poly- pair
The depositing temperature of dimethylbenzene film is 40-60 DEG C.
6. a kind of film encapsulation method of flexible OLED display according to claim 1, which is characterized in that described poly- pair
The deposition thickness of dimethylbenzene film is 20-120nm.
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| CN201611195482.6A CN106876602B (en) | 2016-12-22 | 2016-12-22 | A kind of flexible OLED display film encapsulation method |
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| CN108735914A (en) * | 2018-05-30 | 2018-11-02 | 深圳市华星光电半导体显示技术有限公司 | OLED display encapsulating structure |
| CN109103230B (en) * | 2018-08-27 | 2022-02-08 | 武汉天马微电子有限公司 | OLED display panel, manufacturing method of OLED display panel and display device |
| CN110010767A (en) * | 2019-03-26 | 2019-07-12 | 华中科技大学鄂州工业技术研究院 | The film encapsulation method of perovskite solar battery and corresponding battery device |
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