CN106876536B - A kind of multicolor luminous processing method of list LED chip microminiaturization - Google Patents
A kind of multicolor luminous processing method of list LED chip microminiaturization Download PDFInfo
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- CN106876536B CN106876536B CN201710082982.7A CN201710082982A CN106876536B CN 106876536 B CN106876536 B CN 106876536B CN 201710082982 A CN201710082982 A CN 201710082982A CN 106876536 B CN106876536 B CN 106876536B
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- fluorescent glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Abstract
The present invention provides a kind of multicolor luminous processing methods of single LED chip microminiaturization, it is characterized in that, the following steps are included: S1: blue chip upper surface is divided into a-quadrant, B area, three, the region C region, first fluorescent glue A and photoresist are coated on blue chip surface, B area, the region C are exposed, develop to a-quadrant, remove the photoresist A of developing section, removes the fluorescent glue A of exposure area；S2: coating fluorescent glue B and photoresist on blue chip surface, develops to B exposure, then removes photoresist；S3: fluorescent glue C and photoresist are smeared on blue chip surface, a-quadrant, B area are exposed, develops to the region C, removes photoresist.This achievable microminiaturization accomplishes that um is the zonule RGB monochrome light emission region of unit, has met the requirement of the higher and higher liquid crystal display panel of nowadays clarity with chips.
Description
Technical field
The present invention relates to LED technology fields, the especially a kind of multicolor luminous processing method of single LED chip microminiaturization.
Background technique
The demand of invention reason, polychrome small-size chips is very high.In high-power illumination field, simultaneously using multiple small chip strings
The technology of connection has used very mature also very extensive.It is compared with single high-power chip, the chip cost of this technique is lower,
Whole thermal diffusivity is also more preferable, light efficiency is higher, light decay is slower, can reach high efficiency and high-power target simultaneously, although there is work
Sequence is more complex, the more low secret worry of reliability, but is also difficult to shake its status.Secondly, in the field of display applications, RGB is more
Chip package is the technique of a mainstream, as the density of pixel is higher (i.e. resolution ratio is higher), single pixel under unit area
The size of point just must be smaller and smaller, progressively towards " small spacing " and direction develop while, tri- color of R, G, B that can use
The size of chip also must be smaller and smaller, meets high-resolution requirement in the market whereby.
The step of photoetching mainly has: pre-treatment, front baking, exposure, development, post bake, checks the several steps of figure at spin coating photoresist
Suddenly.
Photoetching is generally divided into using photon as the photoetching technique of light source, using particle as the photoetching technique of light source and physical contact
Formula photoetching technique.In above-mentioned photoetching technique, there are many photoetching technique type based on photon, and principle is when illumination is mapped to
When on photoresist, by illumination part occur degradation reaction and (positive photoresist) can be dissolved by the developing, or occur interlinkage reaction and
As insoluble matter (negtive photoresist), the figure after positive photoresist development is consistent with figure on mask plate, the figure and mask plate after negtive photoresist development
Upper complementation.
Conventional method is to utilize small R, G, B chip package, but this method existing defects are apparent.It is as follows in detail:
Small chip can not accomplish microminiaturization, and conventional small Chip scale is also in 6-8mil or so；
Every chips are encapsulated using routing or upside-down mounting mode, and abnormal probability is relatively high, and it is suitable how to complete small chip
Die bond, it is more difficult to；How gold thread and a problem accomplished fluently on the small pad of small chip.It is easy to appear routing exception；
Small chip encapsulates in series and parallel, increases the whole probability for exception occur；
Small chip die bond, bonding wire need every crawl to spend the time long, reduce clearly to production capacity.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of multicolor luminous processing method of single LED chip microminiaturization,
Itself the following steps are included:
S1: blue chip upper surface is divided into a-quadrant, B area, three, the region C region, is first coated on blue chip surface
Fluorescent glue A and photoresist are exposed B area, the region C, develop to a-quadrant, remove the photoresist A of developing section,
Remove the fluorescent glue A of exposure area；
S2: coating fluorescent glue B and photoresist on blue chip surface, to B exposure develop, to a-quadrant, the region C into
Row exposure, removes the photoresist and exposure area fluorescent glue B of developing regional；
S3: smearing fluorescent glue C and photoresist on blue chip surface, be exposed to a-quadrant, B area, to the region C into
Row development, removes the photoresist and exposure area fluorescent glue C of developing regional；Finally obtain to obtain blue chip collocation fluorescent glue A, glimmering
Optical cement B, fluorescent glue C, the a-quadrant, B area, C region surface are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
Preferably, the photoresist A is the fluorescent glue for making chip glow, the photoresist B makes the glimmering of chip blue light-emitting
Optical cement, the photoresist C are the fluorescent glue for making chip green light.
The invention has the following advantages:
Microminiaturization can be achieved in the present invention, accomplishes the zonule RGB monochrome light emission region as unit of um with chips, with
Meet the requirement of the nowadays higher and higher liquid crystal display panel of clarity；
Using large chip, upside-down mounting or CSP chip, lower the number and difficulty of die bond, routing；
Reduce because of die bond, routing number, caused by exception probability；
Small chip die bond, bonding wire crawl number are avoided, shortens processing time, promotes production capacity.
Certainly, it implements any of the products of the present invention and does not necessarily require achieving all the advantages described above at the same time.
Detailed description of the invention
Fig. 1 is the multicolor luminous processing method flow diagram of single LED chip microminiaturization provided in an embodiment of the present invention.
Specific embodiment
The technical solution in the present invention is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that institute
The embodiment of description is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
All other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
The embodiment of the invention provides the present invention provides a kind of single multicolor luminous processing method of LED chip microminiaturization,
As shown in Figure 1, itself the following steps are included:
S1: blue chip upper surface is divided into a-quadrant, B area, three, the region C region, is first coated on blue chip surface
Fluorescent glue A and photoresist are exposed B area, the region C, develop to a-quadrant, remove the photoresist A of developing section,
Remove the fluorescent glue A of exposure area；
S2: coating fluorescent glue B and photoresist on blue chip surface, to B exposure develop, to a-quadrant, the region C into
Row exposure, removes the photoresist and exposure area fluorescent glue B of developing regional；
S3: smearing fluorescent glue C and photoresist on blue chip surface, be exposed to a-quadrant, B area, to the region C into
Row development, removes the photoresist and exposure area fluorescent glue C of developing regional；Finally obtain to obtain blue chip collocation fluorescent glue A, glimmering
Optical cement B, fluorescent glue C, the a-quadrant, B area, C region surface are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
The photoresist A provided in an embodiment of the present invention is the fluorescent glue for making chip glow, and the photoresist B makes chip
The fluorescent glue of blue light-emitting, the photoresist C are the fluorescent glue for making chip green light.Photoresist A, photoresist B and photoresist C tool
The fluorescent glue type of body, which can according to need, to be adjusted.
The list multicolor luminous processing method of LED chip microminiaturization provided by the invention can realize microminiaturization, do with chips
It is the zonule RGB monochrome light emission region of unit to um, is wanted with meeting the nowadays higher and higher liquid crystal display panel of clarity
It asks；
Using large chip, upside-down mounting or CSP chip, the number and difficulty of die bond, routing are reduced；
Reduce because of die bond, routing number, caused by exception probability；
Small chip die bond, bonding wire crawl number are avoided, shortens processing time, promotes production capacity.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (2)
1. a kind of multicolor luminous processing method of list LED chip microminiaturization, which comprises the following steps:
S1: blue chip upper surface is divided into a-quadrant, B area, three, the region C region, first coats fluorescence on blue chip surface
Glue A and photoresist are exposed B area, the region C, develop to a-quadrant, remove the photoresist A of developing section, removal
The fluorescent glue A of exposure area；
S2: coating fluorescent glue B and photoresist on blue chip surface, develops to B exposure, exposes to a-quadrant, the region C
Light removes the photoresist and exposure area fluorescent glue B of developing regional；
S3: fluorescent glue C and photoresist are smeared on blue chip surface, a-quadrant, B area are exposed, the region C is shown
Shadow removes the photoresist and exposure area fluorescent glue C of developing regional；It finally obtains to obtain blue chip collocation fluorescent glue A, fluorescent glue
B, fluorescent glue C, the a-quadrant, B area, C region surface are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
2. the multicolor luminous processing method of list LED chip microminiaturization as described in claim 1, which is characterized in that the fluorescence
Glue A is the fluorescent glue for making chip glow, and the fluorescent glue B makes the fluorescent glue of chip blue light-emitting, and the fluorescent glue C is to make chip
The fluorescent glue of green light.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082982.7A CN106876536B (en) | 2017-02-16 | 2017-02-16 | A kind of multicolor luminous processing method of list LED chip microminiaturization |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082982.7A CN106876536B (en) | 2017-02-16 | 2017-02-16 | A kind of multicolor luminous processing method of list LED chip microminiaturization |
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| Publication Number | Publication Date |
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| CN106876536A CN106876536A (en) | 2017-06-20 |
| CN106876536B true CN106876536B (en) | 2019-07-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102017119872A1 (en) * | 2017-08-30 | 2019-02-28 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component |
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| CN101123285B (en) * | 2006-08-09 | 2012-09-05 | 广东昭信光电科技有限公司 | Method for encapsulating LED with rotary glue and optical etching technology |
| WO2012042452A2 (en) * | 2010-09-29 | 2012-04-05 | Koninklijke Philips Electronics N.V. | Wavelength converted light emitting device |
| US9735198B2 (en) * | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
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