CN106876536A - A kind of single multicolor luminous processing method of LEDs chip microminiaturization - Google Patents
A kind of single multicolor luminous processing method of LEDs chip microminiaturization Download PDFInfo
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- CN106876536A CN106876536A CN201710082982.7A CN201710082982A CN106876536A CN 106876536 A CN106876536 A CN 106876536A CN 201710082982 A CN201710082982 A CN 201710082982A CN 106876536 A CN106876536 A CN 106876536A
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- fluorescent glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
Abstract
The invention provides a kind of single multicolor luminous processing method of LEDs chip microminiaturization, it is characterised in that comprise the following steps：S1：Blue chip upper surface is divided into a-quadrant, B regions, three, C regions region, fluorescent glue A and photoresist first are coated on blue chip surface, B regions, C regions are exposed, a-quadrant is developed, the photoresist A of removal development part, removes the fluorescent glue A of exposure area；S2：Fluorescent glue B and photoresist are coated on blue chip surface, B exposures are developed, then removed photoresist；S3：In blue chip surface smear fluorescent glue C and photoresist, a-quadrant, B regions are exposed, C regions are developed, removed photoresist.This achievable microminiaturization, accomplishes that um is the zonule RGB monochrome light emissions region of unit, has met the requirement of the higher and higher liquid crystal panel of nowadays definition with chips.
Description
Technical field
The present invention relates to LED technology field, particularly a kind of single multicolor luminous processing method of LEDs chip microminiaturization.
Background technology
Invention reason, the demand of polychrome small-size chips is very high.In high-power illumination field, using multiple small chip strings simultaneously
It is very ripe also very extensive that the technology of connection has been used.Compared with single high-power chip, the chip cost of this technique is relatively low,
Overall thermal diffusivity also more preferably, light efficiency is higher, light decay is slower, can simultaneously reach high efficiency and high-power target, although have work
Sequence is more complicated, the more low secret worry of reliability, but is also difficult to shake its status.Secondly, in the field of display applications, RGB is more
Chip package is a technique for main flow, as the density of pixel is (i.e. resolution ratio is higher) higher, single pixel under unit area
Point size just must it is less and less, progressively towards " small spacing " and direction develop while, the color of R, G, B tri- to be used
The size of chip also must be less and less, thereby meets the high-resolution requirement of in the market.
The step of photoetching, mainly has：Pre-treatment, spin coating photoresist, front baking, exposure, development, post bake, the inspection several steps of figure
Suddenly.
Photoetching is generally divided into the photoetching technique with photon as light source, the photoetching technique with particle as light source and physical contact
Formula photoetching technique.In above-mentioned photoetching technique, the photoetching technique species based on photon is a lot, and its principle is when illumination is mapped to
When on photoresist, by illumination part occur degradation reaction and (positive glue) can be dissolved by the developing, or occur interlinkage reaction and
As insoluble matter (negative glue), the figure after positive glue development is consistent with figure on mask plate, bears the figure and mask plate after glue development
Upper complementation.
Conventional method is to utilize small R, G, B chip package, but the method existing defects are apparent.It is as follows in detail：
Small chip cannot accomplish microminiaturization, and conventional small Chip scale is also in 6-8mil or so；
Encapsulated using routing or upside-down mounting mode per chips, abnormal likelihood ratio is higher, how small chip is completed suitable
Die bond, it is more difficult to；How gold thread is accomplished fluently on the small pad of small chip, be also a problem.Easily there is routing exception；
Small chip connection in series-parallel encapsulation, increased the overall probability for exception occur；
Small chip die bond, bonding wire, it is necessary to every crawl the cost time it is long, to production capacity reduction clearly.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of single multicolor luminous processing method of LEDs chip microminiaturization,
It is comprised the following steps：
S1：Blue chip upper surface is divided into a-quadrant, B regions, three, C regions region, is first coated on blue chip surface
Fluorescent glue A and photoresist, are exposed to B regions, C regions, and a-quadrant is developed, the photoresist A of removal development part,
Remove the fluorescent glue A of exposure area；
S2：Fluorescent glue B and photoresist are coated on blue chip surface, B exposures are developed, a-quadrant, C regions are entered
Row exposure, removes the photoresist and exposure area fluorescent glue B of developing regional；
S3：In blue chip surface smear fluorescent glue C and photoresist, a-quadrant, B regions are exposed, C regions are entered
Row development, removes the photoresist and exposure area fluorescent glue C of developing regional；Finally obtain and obtain blue chip collocation fluorescent glue A, glimmering
Optical cement B, fluorescent glue C, the a-quadrant, B regions, C region surfaces are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
It is preferred that the photoresist A is the fluorescent glue for making chip glow, the photoresist B makes the glimmering of chip blue light-emitting
Optical cement, the photoresist C is the fluorescent glue for making chip green light.
The invention has the advantages that：
The achievable microminiaturization of the present invention, accomplishes the zonule RGB monochrome light emissions region in units of um, with chips
Meet the requirement of the nowadays higher and higher liquid crystal panel of definition；
Using large chip, upside-down mounting or CSP chips, less die bond, routing number of times, and difficulty；
Reduce because die bond, routing number of times, the abnormal strange rate for causing；
Small chip die bond, bonding wire crawl number of times are avoided, shortens processing time, lift production capacity.
Certainly, implement any product of the invention to it is not absolutely required to while reaching all the above advantage.
Brief description of the drawings
Fig. 1 is single multicolor luminous process flow schematic diagram of LEDs chip microminiaturization provided in an embodiment of the present invention.
Specific embodiment
The technical scheme in the present invention is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that institute
The embodiment of description is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention,
All other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, belongs to this hair
The scope of bright protection.
The embodiment of the invention provides the invention provides a kind of single multicolor luminous processing method of LEDs chip microminiaturization,
As shown in figure 1, it is comprised the following steps：
S1：Blue chip upper surface is divided into a-quadrant, B regions, three, C regions region, is first coated on blue chip surface
Fluorescent glue A and photoresist, are exposed to B regions, C regions, and a-quadrant is developed, the photoresist A of removal development part,
Remove the fluorescent glue A of exposure area；
S2：Fluorescent glue B and photoresist are coated on blue chip surface, B exposures are developed, a-quadrant, C regions are entered
Row exposure, removes the photoresist and exposure area fluorescent glue B of developing regional；
S3：In blue chip surface smear fluorescent glue C and photoresist, a-quadrant, B regions are exposed, C regions are entered
Row development, removes the photoresist and exposure area fluorescent glue C of developing regional；Finally obtain and obtain blue chip collocation fluorescent glue A, glimmering
Optical cement B, fluorescent glue C, the a-quadrant, B regions, C region surfaces are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
The photoresist A provided in an embodiment of the present invention is the fluorescent glue for making chip glow, and the photoresist B makes chip
The fluorescent glue of blue light-emitting, the photoresist C is the fluorescent glue for making chip green light.Photoresist A, photoresist B and photoresist C have
The fluorescent glue species of body can be adjusted as needed.
Single multicolor luminous processing method of LEDs chip microminiaturization that the present invention is provided can realize microminiaturization, be done with chips
It is the zonule RGB monochrome light emissions region of unit to um, has met wanting for the higher and higher liquid crystal panel of nowadays definition
Ask；
Using large chip, upside-down mounting or CSP chips, less die bond, routing number of times, and difficulty；
Reduce because die bond, routing number of times, the abnormal strange rate for causing；
Small chip die bond, bonding wire crawl number of times are avoided, shortens processing time, lift production capacity.
Present invention disclosed above preferred embodiment is only intended to help and illustrates the present invention.Preferred embodiment is not detailed
All of details is described, it is only described specific embodiment that the invention is not limited yet.Obviously, according to the content of this specification,
Can make many modifications and variations.This specification is chosen and specifically describes these embodiments, is to preferably explain the present invention
Principle and practical application so that skilled artisan can be best understood by and utilize the present invention.The present invention is only
Limited by claims and its four corner and equivalent.
Claims (2)
1. a kind of single multicolor luminous processing method of LEDs chip microminiaturization, it is characterised in that comprise the following steps：
S1：Blue chip upper surface is divided into a-quadrant, B regions, three, C regions region, first fluorescence is coated on blue chip surface
Glue A and photoresist, are exposed to B regions, C regions, and a-quadrant is developed, the photoresist A of removal development part, removal
The fluorescent glue A of exposure area；
S2：Fluorescent glue B and photoresist are coated on blue chip surface, B exposures are developed, a-quadrant, C regions are exposed
Light, removes the photoresist and exposure area fluorescent glue B of developing regional；
S3：In blue chip surface smear fluorescent glue C and photoresist, a-quadrant, B regions are exposed, C regions are shown
Shadow, removes the photoresist and exposure area fluorescent glue C of developing regional；Finally obtain and obtain blue chip collocation fluorescent glue A, fluorescent glue
B, fluorescent glue C, the a-quadrant, B regions, C region surfaces are respectively with fluorescent glue A, fluorescent glue B, fluorescent glue C.
2. the list LEDs multicolor luminous processing method of chip microminiaturization as claimed in claim 1, it is characterised in that the fluorescence
Glue A is the fluorescent glue for making chip glow, and the fluorescent glue B makes the fluorescent glue of chip blue light-emitting, and the fluorescent glue C is to make chip
The fluorescent glue of green light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082982.7A CN106876536B (en) | 2017-02-16 | 2017-02-16 | A kind of multicolor luminous processing method of list LED chip microminiaturization |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082982.7A CN106876536B (en) | 2017-02-16 | 2017-02-16 | A kind of multicolor luminous processing method of list LED chip microminiaturization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106876536A true CN106876536A (en) | 2017-06-20 |
| CN106876536B CN106876536B (en) | 2019-07-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019042965A1 (en) * | 2017-08-30 | 2019-03-07 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101123285B (en) * | 2006-08-09 | 2012-09-05 | 广东昭信光电科技有限公司 | Method for encapsulating LED with rotary glue and optical etching technology |
| CN103155186A (en) * | 2010-09-29 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Wavelength converted light emitting device |
| US20130256711A1 (en) * | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
-
2017
- 2017-02-16 CN CN201710082982.7A patent/CN106876536B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101123285B (en) * | 2006-08-09 | 2012-09-05 | 广东昭信光电科技有限公司 | Method for encapsulating LED with rotary glue and optical etching technology |
| CN103155186A (en) * | 2010-09-29 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | Wavelength converted light emitting device |
| US20130256711A1 (en) * | 2012-03-30 | 2013-10-03 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019042965A1 (en) * | 2017-08-30 | 2019-03-07 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component |
| JP2020532138A (en) * | 2017-08-30 | 2020-11-05 | オスラム オーエルイーディー ゲゼルシャフト ミット ベシュレンクテル ハフツングＯＳＲＡＭ ＯＬＥＤ ＧｍｂＨ | How to manufacture optoelectronic semiconductor devices and optoelectronic semiconductor devices |
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| CN106876536B (en) | 2019-07-26 |
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