CN106876288B - The eutectic of ceramic package is welded piece tool fixture system - Google Patents
The eutectic of ceramic package is welded piece tool fixture system Download PDFInfo
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- CN106876288B CN106876288B CN201710108198.9A CN201710108198A CN106876288B CN 106876288 B CN106876288 B CN 106876288B CN 201710108198 A CN201710108198 A CN 201710108198A CN 106876288 B CN106876288 B CN 106876288B
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- atmosphere
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- 230000005496 eutectics Effects 0.000 title claims abstract description 89
- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 12
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003466 welding Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 102100027199 Cell death-inducing p53-target protein 1 Human genes 0.000 description 2
- 101000914537 Homo sapiens Cell death-inducing p53-target protein 1 Proteins 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 210000001367 artery Anatomy 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- SEEZIOZEUUMJME-FOWTUZBSSA-N cannabigerolic acid Chemical compound CCCCCC1=CC(O)=C(C\C=C(/C)CCC=C(C)C)C(O)=C1C(O)=O SEEZIOZEUUMJME-FOWTUZBSSA-N 0.000 description 1
- SEEZIOZEUUMJME-UHFFFAOYSA-N cannabinerolic acid Natural products CCCCCC1=CC(O)=C(CC=C(C)CCC=C(C)C)C(O)=C1C(O)=O SEEZIOZEUUMJME-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
Abstract
It is welded piece tool fixture system the present invention relates to a kind of eutectic of ceramic package; it is characterized in that: including eutectic weldering atmosphere protection device and atmosphere protective cover; eutectic weldering atmosphere protection device is fixed on PULSE HEATING table top; atmosphere protection lid is mounted on right above eutectic weldering atmosphere protection device, and atmosphere protection lid and eutectic weldering atmosphere protection device pass through rotation and realize sealing cooperation；Multiple protective atmospheres, which have been reserved, on eutectic weldering atmosphere protection device is passed through mouth and vacuum hole; vacuum hole is corresponding with the vacuum hole reserved on PULSE HEATING plate; pass through vacuum suction thermally conductive substrate, placing ceramic shell on thermally conductive substrate in the position of the vacuum hole.It is the configuration of the present invention is simple, easy to operate, it can be realized high-volume, automation eutectic is welded piece production.
Description
Technical field
The present invention relates to a kind of eutectics of ceramic package to be welded piece tool fixture system, especially one kind as chip progress
Eutectic weldering attachment belongs to semiconductor packages system to tool fixture system needed for the automated production on dual-in-line ceramic shell
Make technical field.
Background technique
In semiconductor package process, as the size of device is smaller and smaller, power is increasing, the heat dissipation of chip is wanted
Ask higher and higher, the thermal conductivity of traditional conducting resinl is lower instead metal eutectic solder, thermal conductivity is high, bonding can
Good by property, but eutectic Welding is implemented compared with glue sticking complex process, the rate of batch production is slow, low efficiency.
The development of semiconductor equipment is high-volume, automation eutectic weldering production is possibly realized.Automation eutectic welding at present
Equipment is more and more, mainly realize heating to substrate, solder sheet automatic Picking, chip friction welding, ensure that altogether
Crystalline substance weldering product can be realized the welding of high-precision, low porosity, high reliability.And for the ceramic shell of semiconductor packages,
Requirement of the packing forms, structure snd size of different shells to equipment and jig making tool is all different, such as common ball array
Ceramic shell (CBGA), four side flat ceramic shells (CQFP), surrounding have the ceramic basal plane of lead ceramic shell (CLCC) can
It is come into full contact with heating the substrate for eutectic soldering equipment, heating plate can be heated and be cooled down to shell, realize eutectic Welding
Welding process；And for the ground of J-lead small size ceramic shell (CSOJ), dual-in-line ceramic shell (CDIP) ceramics
Substrate can not come into full contact with heating plate, and during carrying out eutectic weldering, the heat of heating plate can not be carried out with ceramic substrate
Effective conduction, leads to that eutectic welding can not be carried out.Special tool fixture system must be customized, is passed by means of other heat
It leads media implementation ceramic substrate and heating plate carries out efficient heat transfer, realize that the eutectic of these similar ceramic shell structures welds
It connects.
Summary of the invention
The purpose of the present invention is overcoming the deficiencies in the prior art, the eutectic for providing a kind of ceramic package is welded piece
Tool fixture system, structure are simple and convenient to operate, can be realized high-volume, automation eutectic be welded piece production.
According to technical solution provided by the invention, a kind of eutectic of ceramic package is welded piece tool fixture system, special
Sign is: welding atmosphere protection device and atmosphere protective cover including eutectic, eutectic weldering atmosphere protection device is fixed on PULSE HEATING platform
On face, atmosphere protection lid is mounted on right above eutectic weldering atmosphere protection device, and atmosphere protection lid and eutectic weld atmosphere protection
Device realizes sealing cooperation by rotation；The eutectic weldering atmosphere protection device on reserved multiple protective atmospheres be passed through mouth and
Vacuum hole, vacuum hole is corresponding with the vacuum hole reserved on PULSE HEATING plate, passes through vacuum suction heat in the position of the vacuum hole
Conductive substrate, placing ceramic shell on thermally conductive substrate.
Further, stationary fixture is set in the two sides of the thermally conductive substrate, stationary fixture, which clamps, is placed on hot biography
Lead the ceramic shell on substrate.
Further, the stationary fixture is fixed by least two fixing screws.
Further, the stationary fixture includes fixing end and the clamping end for clamping ceramic shell, and fixing end passes through
Fixing screws are fixed on eutectic weldering atmosphere protection device.
Further, shop bolt is set in eutectic weldering atmosphere protection device upper surface, when atmosphere protection lid revolves
When going to eutectic weldering atmosphere protection device sealing cooperation, shop bolt stops atmosphere protection lid.
Further, the protective atmosphere be passed through mouth include the first protective atmosphere is passed through mouth, the second protective atmosphere is passed through mouth,
Third protective atmosphere is passed through mouth, the 4th protective atmosphere is passed through mouth, the 5th protective atmosphere is passed through mouth, the 6th protective atmosphere is passed through mouth,
7th protective atmosphere is passed through mouth and the 8th protective atmosphere is passed through mouth, the first protective atmosphere is passed through mouth, the second protective atmosphere is passed through mouth,
Third protective atmosphere is passed through mouth, the 4th protective atmosphere is passed through mouth, the 5th protective atmosphere is passed through mouth, the 6th protective atmosphere is passed through mouth,
7th protective atmosphere is passed through mouth and the 8th protective atmosphere is passed through mouth and connect with gas source.
Further, first protective atmosphere is passed through mouth and the second protective atmosphere is passed through mouth and is located at eutectic weldering atmosphere protection
The left side of device, third protective atmosphere is passed through mouth and the 4th protective atmosphere is passed through mouth and is located at the upper of eutectic weldering atmosphere protection device
Side, the 5th protective atmosphere is passed through mouth and the 6th protective atmosphere is passed through the right side that mouth is located at eutectic weldering atmosphere protection device, and the 7th protects
Shield atmosphere is passed through mouth and the 8th protective atmosphere is passed through the downside that mouth is located at eutectic weldering atmosphere protection device.
Further, groove is equipped on the thermally conductive substrate, which contacts with vacuum hole.
Further, the thermally conductive substrate uses ceramic material, the polished grinding process in surface.
Further, the stationary fixture uses stainless steel metal material.
The invention has the following advantages that the ceramic shell that the present invention solves partial encapsulation form was welded in automation eutectic
Cheng Zhong, the problem that ceramic substrate cannot directly be heated on hot plate, by the jig making tool system, by means of thermally conductive substrate
Heat transfer is carried out, thermally conductive substrate carries out that fixation is sucked by the vacuum on heating the substrate, and ceramic shell is placed in heat transfer
It on substrate, is then fixed using bilateral clamping fixture, inert gas or reproducibility gas is finally imported in atmosphere protection device
Body atmosphere, heating are increased to certain temperature and carry out eutectic welding, are welded piece convenient for automation, high-volume and highly reliable eutectic.
Detailed description of the invention
Fig. 1 is that eutectic of the present invention is welded the structural schematic diagram of piece tool fixture system.
Fig. 2 is the structural schematic diagram that the eutectic welds atmosphere protection device.
Fig. 3 is the structural schematic diagram of the atmosphere protection lid.
Fig. 4 is the structural schematic diagram of the heat transfer substrate.
Fig. 5-1 is the structural schematic diagram of the stationary fixture.
Fig. 5-2 is the top view of Fig. 5-1.
Description of symbols: 1- eutectic weldering atmosphere protection device, 2- atmosphere protection lid, 3- thermally conductive substrate, 4- are fixed
Fixture, the first protective atmosphere of 11- are passed through mouth, the second protective atmosphere of 12- is passed through mouth, 21- third protective atmosphere is passed through mouth, 22-
Four protective atmospheres are passed through mouth, the 5th protective atmosphere of 31- is passed through mouth, the 6th protective atmosphere of 32- is passed through mouth, the 7th protective atmosphere of 41-
It is passed through mouth, the 8th protective atmosphere of 42- is passed through mouth, 20- shop bolt, 27- vacuum hole, 33- groove.
Specific embodiment
Below with reference to specific attached drawing, the invention will be further described.
As shown in Figure 1, the eutectic of ceramic package of the present invention is welded, piece tool fixture system includes eutectic weldering atmosphere
Protective device 1 and atmosphere protective cover 2, eutectic weldering atmosphere protection device 1 are fixed on PULSE HEATING table top, atmosphere protection lid
2 are mounted on right above eutectic weldering atmosphere protection device 1, and atmosphere protection lid 1 and eutectic weldering atmosphere protection device 1 are real by rotation
Now sealing cooperation；The first protective atmosphere, which has been reserved, on eutectic weldering atmosphere protection device 1 is passed through mouth 11, the second protective atmosphere
It is passed through mouth 12, third protective atmosphere is passed through mouth 21, the 4th protective atmosphere is passed through mouth 22, the 5th protective atmosphere is passed through mouth the 31, the 6th
Protective atmosphere is passed through mouth 32, the 7th protective atmosphere is passed through mouth 41 and the 8th protective atmosphere is passed through mouth 42, and the first protective atmosphere is passed through
11, second protective atmosphere is passed through mouth 12 to mouth, third protective atmosphere is passed through mouth 21, the 4th protective atmosphere is passed through the protection of mouth the 22, the 5th
Atmosphere is passed through mouth 31, the 6th protective atmosphere is passed through mouth 32, the 7th protective atmosphere is passed through mouth 41 and the 8th protective atmosphere is passed through mouth 42
It is connect with gas source, to be passed through protective atmosphere.It is provided with vacuum hole 27 on eutectic weldering atmosphere protection device 1, the vacuum hole
27 is corresponding with the vacuum hole reserved on PULSE HEATING plate, passes through vacuum suction thermally conductive substrate 3 in the position of the vacuum hole 27,
Placing ceramic shell is used on thermally conductive substrate 3, by thermally conductive substrate 3, the temperature on PULSE HEATING plate can be transmitted to pottery
On ceramic shell.
Stationary fixture 4 is set in the two sides of the thermally conductive substrate 3, stationary fixture 4 is for fixed placement in heat transfer base
Ceramic shell on plate 3 guarantees that ceramic shell is not shifted when carrying out eutectic weldering.The stationary fixture 4 is solid by least two
To determine screw to be fixed, the position of the stationary fixture 4 on both sides can be determined by actually carrying out the ceramic shell size of eutectic welding,
It is consolidated with clamping as target.As shown in Fig. 5-1, Fig. 5-2, the stationary fixture 4 is including fixing end 43 and for clamping outside ceramics
The clamping end 44 of shell, fixing end 43 are fixed on eutectic by fixing screws and weld on atmosphere protection device 1.
The eutectic weldering 1 upper surface of atmosphere protection device be arranged shop bolt 20, when atmosphere protection lid 2 rotation to
When eutectic welds the sealing cooperation of atmosphere protection device 1, shop bolt 20 stops atmosphere protection lid 2, prevents atmosphere protection lid 2
It is rotated out the surface of eutectic weldering atmosphere protection device 1, guarantees the atmosphere protection in welding.
First protective atmosphere is passed through mouth 11 and the second protective atmosphere is passed through mouth 12 and is located at eutectic weldering atmosphere protection device 1
Left side, third protective atmosphere is passed through mouth 21 and the 4th protective atmosphere is passed through mouth 22 and is located at the upper of eutectic weldering atmosphere protection device 1
Side, the 5th protective atmosphere is passed through mouth 31 and the 6th protective atmosphere is passed through the right side that mouth 32 is located at eutectic weldering atmosphere protection device 1, the
Seven protective atmospheres are passed through mouth 41 and the 8th protective atmosphere is passed through the downside that mouth 42 is located at eutectic weldering atmosphere protection device 1.
As Figure 1 and Figure 4, groove 33 is equipped on the thermally conductive substrate 3, which contacts with vacuum hole 27, can
To increase the contact area of vacuum suction, guarantee that the fixation of thermally conductive substrate 3 unshifts.
The thermally conductive substrate 3 uses ceramic material, the polished grinding process in surface.The stationary fixture 4 is using stainless
Steel metal material.
The course of work of the invention: ceramic shell is placed on to the center of thermally conductive substrate 3, by having installed
Both sides stationary fixture 4 by ceramic shell fix stably, open atmosphere protection switch, close atmosphere protection lid 2, open arteries and veins
The heating schedule of warm table to be rushed, eutectic welding can be carried out and operated, the above operation can be carried out automatically controlling by eutectic soldering equipment,
It can be programmed into process control, whole process is full automatic working.The protective atmosphere generally uses nitrogen.
The shell that a variety of pin counts of CDIP8,14,16,20 or more can be covered at present is only needed according to different sizes
Various sizes of thermally conductive substrate shown in Fig. 3 is replaced, the installation site of bilateral clamping fixture shown in Fig. 4 is adjusted.
Therefore the modification of the size of the different thermally conductive substrate of this adjustment, additional and substitution should also be as not being interpreted as the scope of the invention with
It is interior.
The eutectic of the ceramic package of the present invention piece tool fixture system that is welded has the advantage that and can carry out atmosphere
Protection prevents and treats solder in welding process and is oxidized under the high temperature conditions；Solving dual-in-line ceramic shell can not be with heating base
The problem of plate is come into full contact with and can not carry out the welding of automatic eutectic；Overall process can be automated operation, improve automation
Productivity and eutectic are welded the production efficiency of piece.
The present invention can according to special shell mechanism, such as the design feature of dual-in-line ceramic package (CDIP) shell,
Using existing eutectic soldering equipment, realize that high-volume, automation eutectic are welded piece production.It is high that the present invention can adapt to different pins
The ceramic shell of degree and different in width carries out eutectic and is welded piece, and system can carry out nitrogen protection to welding position, avoid welding
Oxidation in the process can carry out heating heat by thermally conductive substrate, temperature needed for guaranteeing welding to ceramic shell；By double
Ceramic shell can be fixed in the control of side clamping fixture, and shell will not be subjected to displacement in eutectic weldering friction process.It should
Device may be used on the basis of automatic eutectic soldering equipment, simple and practical, is suitable for automation, produces in enormous quantities.
Claims (10)
- The piece tool fixture system 1. a kind of eutectic of ceramic package is welded, it is characterized in that: including that eutectic welds atmosphere protection device (1) it is fixed on PULSE HEATING table top with atmosphere protective cover (2), eutectic weldering atmosphere protection device (1), atmosphere protection lid (2) it is mounted on right above eutectic weldering atmosphere protection device (1), atmosphere protection lid (2) and eutectic weldering atmosphere protection device (1) are logical It crosses rotation and realizes sealing cooperation；Multiple protective atmospheres have been reserved in eutectic weldering atmosphere protection device (1) is passed through mouth and true Emptying aperture (27), vacuum hole (27) is corresponding with the vacuum hole reserved on PULSE HEATING plate, passes through in the position of the vacuum hole (27) Vacuum suction thermally conductive substrate (3), placing ceramic shell on thermally conductive substrate (3).
- The piece tool fixture system 2. the eutectic of ceramic package as described in claim 1 is welded, it is characterized in that: being passed in the heat Two sides setting stationary fixture (4) of substrate (3) is led, it is outer that stationary fixture (4) clamps the ceramics being placed on thermally conductive substrate (3) Shell.
- The piece tool fixture system 3. the eutectic of ceramic package as claimed in claim 2 is welded, it is characterized in that: the fixing clamp Tool (4) is fixed by least two fixing screws.
- The piece tool fixture system 4. the eutectic of ceramic package as claimed in claim 2 is welded, it is characterized in that: the fixing clamp Tool (4) includes fixing end (43) and the clamping end for clamping ceramic shell, and fixing end (43) is fixed on altogether by fixing screws In crystalline substance weldering atmosphere protection device (1).
- The piece tool fixture system 5. the eutectic of ceramic package as claimed in claim 1 or 2 is welded, it is characterized in that: described Eutectic welds atmosphere protection device (1) upper surface setting shop bolt (20), when atmosphere protection lid (2) rotation welds gas to eutectic When atmosphere protective device (1) sealing cooperation, shop bolt (20) stops atmosphere protection lid (2).
- The piece tool fixture system 6. the eutectic of ceramic package as claimed in claim 1 or 2 is welded, it is characterized in that: the guarantor It includes that the first protective atmosphere is passed through mouth (11), the second protective atmosphere is passed through mouth (12), third protective atmosphere is logical that shield atmosphere, which is passed through mouth, Entrance (21), the 4th protective atmosphere are passed through mouth (22), the 5th protective atmosphere is passed through mouth (31), the 6th protective atmosphere is passed through mouth (32), the 7th protective atmosphere is passed through mouth (41) and the 8th protective atmosphere is passed through mouth (42), and the first protective atmosphere is passed through mouth (11), Two protective atmospheres are passed through mouth (12), third protective atmosphere is passed through mouth (21), the 4th protective atmosphere is passed through mouth (22), the 5th protection gas Atmosphere is passed through mouth (31), the 6th protective atmosphere is passed through mouth (32), the 7th protective atmosphere is passed through mouth (41) and the 8th protective atmosphere is passed through Mouth (42) is connect with gas source.
- The piece tool fixture system 7. the eutectic of ceramic package as claimed in claim 6 is welded, it is characterized in that: described first protects Shield atmosphere is passed through mouth (11) and the second protective atmosphere is passed through the left side that mouth (12) is located at eutectic weldering atmosphere protection device (1), third Protective atmosphere is passed through mouth (21) and the 4th protective atmosphere is passed through the upside that mouth (22) is located at eutectic weldering atmosphere protection device (1), the Five protective atmospheres are passed through mouth (31) and the 6th protective atmosphere is passed through the right side that mouth (32) is located at eutectic weldering atmosphere protection device (1), 7th protective atmosphere is passed through mouth (41) and the 8th protective atmosphere is passed through mouth (42) and is located under eutectic weldering atmosphere protection device (1) Side.
- The piece tool fixture system 8. the eutectic of ceramic package as claimed in claim 1 or 2 is welded, it is characterized in that: described Thermally conductive substrate (3) is equipped with groove (33), which contacts with vacuum hole (27).
- The piece tool fixture system 9. the eutectic of ceramic package as claimed in claim 1 or 2 is welded, it is characterized in that: the heat Conductive substrate (3) uses ceramic material, the polished grinding process in surface.
- The piece tool fixture system 10. the eutectic of ceramic package as claimed in claim 2 is welded, it is characterized in that: the fixation Fixture (4) uses stainless steel metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710108198.9A CN106876288B (en) | 2017-02-27 | 2017-02-27 | The eutectic of ceramic package is welded piece tool fixture system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710108198.9A CN106876288B (en) | 2017-02-27 | 2017-02-27 | The eutectic of ceramic package is welded piece tool fixture system |
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| CN106876288A CN106876288A (en) | 2017-06-20 |
| CN106876288B true CN106876288B (en) | 2019-04-12 |
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| CN110634788A (en) * | 2019-10-08 | 2019-12-31 | 重庆电子工程职业学院 | Chip mounting carrier and mounting method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
| CN204954097U (en) * | 2015-09-23 | 2016-01-13 | 广州硅能照明有限公司 | Vacuum reaction force welding set |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090102149A (en) * | 2008-03-25 | 2009-09-30 | (주)티.에스정밀 | Heater block for wire bonder |
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2017
- 2017-02-27 CN CN201710108198.9A patent/CN106876288B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522348A (en) * | 2012-01-05 | 2012-06-27 | 上海共晶电子科技有限公司 | Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip |
| CN204954097U (en) * | 2015-09-23 | 2016-01-13 | 广州硅能照明有限公司 | Vacuum reaction force welding set |
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| CN106876288A (en) | 2017-06-20 |
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