CN106876285A - 一种芯片封装体及其方法、芯片、录像设备及电子设备 - Google Patents
一种芯片封装体及其方法、芯片、录像设备及电子设备 Download PDFInfo
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- CN106876285A CN106876285A CN201710028822.4A CN201710028822A CN106876285A CN 106876285 A CN106876285 A CN 106876285A CN 201710028822 A CN201710028822 A CN 201710028822A CN 106876285 A CN106876285 A CN 106876285A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000015654 memory Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dram (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710028822.4A CN106876285B (zh) | 2017-01-16 | 2017-01-16 | 一种芯片封装体及其方法、芯片、录像设备及电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710028822.4A CN106876285B (zh) | 2017-01-16 | 2017-01-16 | 一种芯片封装体及其方法、芯片、录像设备及电子设备 |
Publications (2)
Publication Number | Publication Date |
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CN106876285A true CN106876285A (zh) | 2017-06-20 |
CN106876285B CN106876285B (zh) | 2018-09-21 |
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CN201710028822.4A Active CN106876285B (zh) | 2017-01-16 | 2017-01-16 | 一种芯片封装体及其方法、芯片、录像设备及电子设备 |
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CN (1) | CN106876285B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108962301A (zh) * | 2018-05-24 | 2018-12-07 | 济南德欧雅安全技术有限公司 | 一种存储装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010040281A1 (en) * | 1998-11-12 | 2001-11-15 | Butler Douglas B. | Multi-chip memory apparatus and associated method |
CN102622330A (zh) * | 2012-02-24 | 2012-08-01 | 北京海尔集成电路设计有限公司 | 兼容不同dram的控制芯片及其方法 |
CN103123918A (zh) * | 2013-01-04 | 2013-05-29 | 天津大学 | 一种射频半导体器件 |
CN105845651A (zh) * | 2015-02-03 | 2016-08-10 | 瑞萨电子株式会社 | 半导体装置 |
-
2017
- 2017-01-16 CN CN201710028822.4A patent/CN106876285B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010040281A1 (en) * | 1998-11-12 | 2001-11-15 | Butler Douglas B. | Multi-chip memory apparatus and associated method |
CN102622330A (zh) * | 2012-02-24 | 2012-08-01 | 北京海尔集成电路设计有限公司 | 兼容不同dram的控制芯片及其方法 |
CN103123918A (zh) * | 2013-01-04 | 2013-05-29 | 天津大学 | 一种射频半导体器件 |
CN105845651A (zh) * | 2015-02-03 | 2016-08-10 | 瑞萨电子株式会社 | 半导体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108962301A (zh) * | 2018-05-24 | 2018-12-07 | 济南德欧雅安全技术有限公司 | 一种存储装置 |
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Publication number | Publication date |
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CN106876285B (zh) | 2018-09-21 |
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Effective date of registration: 20191211 Address after: Unit D88, floor 2, convention and Exhibition Center, No.1, Software Park Road, Tangjiawan Town, hi tech Zone, Zhuhai City, Guangdong Province Patentee after: Jianrong Integrated Circuit Technology (Zhuhai) Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Gao Xin Road No. 013 Fu technology building B block 5 layer 505 Co-patentee before: Jianrong Integrated Circuit Technology (Zhuhai) Co., Ltd. Patentee before: Jian Rong semiconductor (Shenzhen) Co., Ltd. Co-patentee before: ZHUHAI HUANGRONG INTEGRATED CIRCUIT TECHNOLOGY CO., LTD. |
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Effective date of registration: 20220125 Address after: Rooms 1306-1309, 13 / F, 19 science Avenue West, Hong Kong Science Park, Shatin, New Territories, China Patentee after: BUILDWIN INTERNATIONAL (ZHUHAI) LTD. Address before: Unit D88, 2 / F, convention and Exhibition Center, No.1 Software Park Road, Tangjiawan Town, hi tech Zone, Zhuhai, Guangdong 519000 Patentee before: BUILDWIN INTERNATIONAL (ZHUHAI) Ltd. |
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Effective date of registration: 20220323 Address after: Rooms 1306-1309, 13 / F, 19 science Avenue West, Hong Kong Science Park, Shatin, New Territories, China Patentee after: BUILDWIN INTERNATIONAL (ZHUHAI) LTD. Address before: 519015 3rd Floor, Stereo Science and Technology Building, 184 Bailian Road, Jida, Zhuhai City, Guangdong Province Patentee before: BUILDWIN INTERNATIONAL (ZHUHAI) Ltd. |