CN106851985A - A kind of hole-punching method of the ceramic chips based on LTCC techniques - Google Patents
A kind of hole-punching method of the ceramic chips based on LTCC techniques Download PDFInfo
- Publication number
- CN106851985A CN106851985A CN201611244203.0A CN201611244203A CN106851985A CN 106851985 A CN106851985 A CN 106851985A CN 201611244203 A CN201611244203 A CN 201611244203A CN 106851985 A CN106851985 A CN 106851985A
- Authority
- CN
- China
- Prior art keywords
- ceramic chips
- pont
- temperature
- hole
- punching method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The present invention proposes a kind of hole-punching method of the Du Pont's 951PT ceramic chips based on LTCC techniques, comprises the following steps：Step one, Du Pont's 951PT ceramic chips of pretreated non-dyestripping are placed in high-temperature cabinet bakee the regular hour at a predetermined temperature and carry out high-temperature process；Step 2, the Du Pont's 951PT ceramic chips after high-temperature process are placed under normal temperature environment hang, the Du Pont 951PT ceramic chips temperature after hanging is close to normal temperature；Step 3, will hang after the upset of Du Pont 951PT ceramic chips after be placed on the platform of punching apparatus and be punched out., completely can be punched through Du Pont's 951PT ceramic chips of non-dyestripping by hole-punching method of the invention, improve punching precision.
Description
Technical field
The present invention relates to LTCC technology fields, more particularly to a kind of Du Pont's 951PT ceramic chips based on LTCC techniques are rushed
Hole method.
Background technology
Green material meets ceramic circuit device in high temperature and the growing application demand of other extreme environments.LTCC
Operation is included in the operation such as punching, the via hole, conductor printing, lamination, sintering on green band, and LTCC combines high temperature co-firing
The advantage of ceramics and thick film technology, there is provided the interconnection package and substrate of high density, high reliability, excellent performance and low cost.
In LTCC operations, on Du Pont's 951PT greens during punching, if tearing the notacoria punching again on Du Pont's 951PT greens, influence punching
The precision in hole；If being punched out upward according to traditional green, it is impossible to be punched through Du Pont's 951PT greens completely, especially Du Pont
Notacoria after 951PT greens.
The content of the invention
The present invention is that ceramic chips punching cannot be punched through completely in solving the problems, such as LTCC operations, is proposed a kind of based on LTCC works
The hole-punching method of the ceramic chips of skill.
The technical proposal of the invention is realized in this way：
A kind of hole-punching method of the ceramic chips based on LTCC techniques, comprises the following steps：
Step one, Du Pont's 951PT ceramic chips of pretreated non-dyestripping are placed in the high-temperature cabinet of predetermined temperature bakee one
The fixed time carries out high-temperature process；
Step 2, the Du Pont's 951PT ceramic chips after high-temperature process are placed under normal temperature environment hang, the Du Pont after hanging
951PT ceramic chips temperature is close to normal temperature；
Step 3, will hang after the upset of Du Pont 951PT ceramic chips after be placed on the platform of punching apparatus and be punched out.
Preferably, temperature predetermined in the high-temperature cabinet is 115 DEG C ~ 125 DEG C.
Preferably, the regular hour is bakeed in the high-temperature cabinet for 17 ~ 23 minutes.
Preferably, in the step 2, the Du Pont's 951PT ceramic chips after high-temperature process are placed under normal temperature environment and are dried in the air
Put 3 ~ 5 hours.
Preferably, temperature predetermined in the high-temperature cabinet is 120 DEG C.
Preferably, the regular hour is bakeed in the high-temperature cabinet for 20 minutes.
Beneficial effects of the present invention are：The hole-punching method of the ceramic chips based on LTCC techniques of the invention, first will pretreatment
The Du Pont 951PT ceramic chips of non-dyestripping afterwards carry out high-temperature process, then hang, and finally overturn punching, by the Du Pont of non-dyestripping
It is punched through completely during 951PT ceramic chips punchings, improves punching precision.
Specific embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
Du Pont 951PT ceramic chips greens material thickness 114 um, notacoria thickness 50um.
Embodiment one：A kind of hole-punching method of the Du Pont's 951PT ceramic chips based on LTCC techniques, does not tear pretreated
Du Pont's 951PT ceramic chips of film are placed in 120 DEG C of high-temperature cabinet and bakee 20 minutes, then by the Du Pont 951PT after high-temperature process
Ceramic chips are hung 3 hours under being placed on normal temperature environment, and punching apparatus are placed on after the Du Pont 951PT ceramic chips upset after hanging
Platform on be punched out, i.e. the notacoria of Du Pont 951PT ceramic chips is punched out upward, and Du Pont's 951PT ceramic chips are rushed completely
Thoroughly.
Embodiment two：A kind of hole-punching method of the Du Pont's 951PT ceramic chips based on LTCC techniques, does not tear pretreated
Du Pont's 951PT ceramic chips of film are placed in 125 DEG C of high-temperature cabinet and bakee 17 minutes, then by the Du Pont 951PT after high-temperature process
Ceramic chips are hung 4 hours under being placed on normal temperature environment, and punching apparatus are placed on after the Du Pont 951PT ceramic chips upset after hanging
Platform on be punched out, i.e. the notacoria of Du Pont 951PT ceramic chips is punched out upward, and Du Pont's 951PT ceramic chips are rushed completely
Thoroughly.
Embodiment three：A kind of hole-punching method of the Du Pont's 951PT ceramic chips based on LTCC techniques, does not tear pretreated
Du Pont's 951PT ceramic chips of film are placed in 115 DEG C of high-temperature cabinet and bakee 23 minutes, then by the Du Pont 951PT after high-temperature process
Ceramic chips are hung 5 hours under being placed on normal temperature environment, and punching apparatus are placed on after the Du Pont 951PT ceramic chips upset after hanging
Platform on be punched out, i.e. the notacoria of Du Pont 951PT ceramic chips is punched out upward, and Du Pont's 951PT ceramic chips are rushed completely
Thoroughly.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (6)
1. a kind of hole-punching method of the ceramic chips based on LTCC techniques, it is characterised in that comprise the following steps：
Step one, Du Pont's 951PT ceramic chips of pretreated non-dyestripping are placed in the high-temperature cabinet of predetermined temperature bakee one
The fixed time carries out high-temperature process；
Step 2, the Du Pont's 951PT ceramic chips after high-temperature process are placed under normal temperature environment hang, the Du Pont after hanging
951PT ceramic chips temperature is close to normal temperature；
Step 3, will hang after the upset of Du Pont 951PT ceramic chips after be placed on the platform of punching apparatus and be punched out.
2. the hole-punching method of the ceramic chips based on LTCC techniques according to claim 1, it is characterised in that the high-temperature cabinet
In predetermined temperature be 115 DEG C ~ 125 DEG C.
3. the hole-punching method of the ceramic chips based on LTCC techniques according to claim 1, it is characterised in that the high-temperature cabinet
The middle baking regular hour is 17 ~ 23 minutes.
4. the hole-punching method of the ceramic chips based on LTCC techniques according to claim 1, it is characterised in that the step 2
In, the Du Pont's 951PT ceramic chips after high-temperature process are placed on and are hung under normal temperature environment 3 ~ 5 hours.
5. the hole-punching method of the ceramic chips based on LTCC techniques according to claim 2, it is characterised in that the high-temperature cabinet
In predetermined temperature be 120 DEG C.
6. the hole-punching method of the ceramic chips based on LTCC techniques according to claim 3, it is characterised in that the high-temperature cabinet
The middle baking regular hour is 20 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244203.0A CN106851985A (en) | 2016-12-29 | 2016-12-29 | A kind of hole-punching method of the ceramic chips based on LTCC techniques |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244203.0A CN106851985A (en) | 2016-12-29 | 2016-12-29 | A kind of hole-punching method of the ceramic chips based on LTCC techniques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106851985A true CN106851985A (en) | 2017-06-13 |
Family
ID=59113114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611244203.0A Pending CN106851985A (en) | 2016-12-29 | 2016-12-29 | A kind of hole-punching method of the ceramic chips based on LTCC techniques |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106851985A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115383868A (en) * | 2022-08-24 | 2022-11-25 | 上海泽丰半导体科技有限公司 | LTCC (Low temperature Co-fired ceramic) green tape and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178051A (en) * | 1991-12-18 | 1993-01-12 | Hughes Aircraft Company | Magnetic punch die retention for HTCC/LTCC fabrication |
| EP0934910A2 (en) * | 1998-01-23 | 1999-08-11 | E.I. Dupont De Nemours And Company | Borate glass based ceramic tape |
| CN101811872A (en) * | 2010-03-24 | 2010-08-25 | 中国电子科技集团公司第二研究所 | Aligning platform used for processing green ceramic plates |
| CN103035611A (en) * | 2012-12-11 | 2013-04-10 | 青岛联盟电子仪器有限公司 | Low-temperature co-firing ceramic inductor |
-
2016
- 2016-12-29 CN CN201611244203.0A patent/CN106851985A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5178051A (en) * | 1991-12-18 | 1993-01-12 | Hughes Aircraft Company | Magnetic punch die retention for HTCC/LTCC fabrication |
| EP0934910A2 (en) * | 1998-01-23 | 1999-08-11 | E.I. Dupont De Nemours And Company | Borate glass based ceramic tape |
| CN101811872A (en) * | 2010-03-24 | 2010-08-25 | 中国电子科技集团公司第二研究所 | Aligning platform used for processing green ceramic plates |
| CN103035611A (en) * | 2012-12-11 | 2013-04-10 | 青岛联盟电子仪器有限公司 | Low-temperature co-firing ceramic inductor |
Non-Patent Citations (1)
| Title |
|---|
| 吕琴红，李俊: "低温共烧陶瓷(LTCC)工艺的研究", 《电子工业专用设备》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115383868A (en) * | 2022-08-24 | 2022-11-25 | 上海泽丰半导体科技有限公司 | LTCC (Low temperature Co-fired ceramic) green tape and manufacturing method thereof |
| CN115383868B (en) * | 2022-08-24 | 2024-05-10 | 上海泽丰半导体科技有限公司 | LTCC green ceramic tape and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103722807B (en) | High pressure aluminum-based copper-clad plate of a kind of high heat conduction and preparation method thereof | |
| WO2008091840A3 (en) | Stress free package and laminate-based isolator package | |
| WO2010045594A3 (en) | Flexible circuit assemblies without solder and methods for their manufacture | |
| SG11201907047SA (en) | Method for bonding at least three substrates | |
| WO2010081073A3 (en) | Passive electrical devices and methods of fabricating passive electrical devices | |
| CN102543899A (en) | Flexible encapsulating substrate and manufacturing method thereof | |
| CN106851985A (en) | A kind of hole-punching method of the ceramic chips based on LTCC techniques | |
| TW200741770A (en) | Production method of multilayer ceramic electronic device | |
| CN109454955B (en) | Packaging carrier tape base material and preparation method thereof | |
| CN105552017A (en) | Slide structure used for temporary bonding, and bonding and de-bonding method | |
| CN109401654B (en) | Packaging carrier tape base material, double-interface carrier tape and manufacturing method thereof | |
| CN105742195A (en) | Manufacturing method for etching buried hole-type surface sound filter chip packaging structure | |
| CN105897219A (en) | Wafer level surface acoustic filter chip packaging structure and manufacturing method thereof | |
| CN105153961A (en) | Production technology of polytetrafluoroethylene varnished cloth micro-porous adhesive tape | |
| CN105810597B (en) | The manufacturing method of round metal chip level buried via hole type surface sound filtering chip encapsulating structure | |
| WO2009018586A3 (en) | Electronic assemblies without solder and methods for their manufacture | |
| CN205800386U (en) | A kind of high stability paper-based copper-coated board | |
| CN102740598A (en) | Three-layer anti-fake label PCB plate and preparation process thereof | |
| CN108012467A (en) | The processing method and wiring board of rigid-flex combined board | |
| CN201976339U (en) | High-density laminated printed circuit board and explosion-proof structure thereof | |
| CN205609474U (en) | Metal disk buried via hole type surface sound filtering chip package structure | |
| CN105846038B (en) | The manufacturing method of round metal chip level etch pattern surface sound filtering chip encapsulating structure | |
| CN105307394B (en) | Key mounting method of PCB (printed Circuit Board), PCB with keys and smart card | |
| WO2014091010A3 (en) | Organic, electronic component and method for producing an organic, electronic component | |
| CN202949624U (en) | Multilayer circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170613 |
|
| WD01 | Invention patent application deemed withdrawn after publication |