CN106848583A - A kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna - Google Patents
A kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna Download PDFInfo
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- CN106848583A CN106848583A CN201710040645.1A CN201710040645A CN106848583A CN 106848583 A CN106848583 A CN 106848583A CN 201710040645 A CN201710040645 A CN 201710040645A CN 106848583 A CN106848583 A CN 106848583A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
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- Waveguide Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The present invention provides a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna, including common ground plate, the medium substrate being arranged on above common ground plate, two rectangular radiation patch for being symmetricly set on medium substrate upper surface, two coaxial feed ports, the medium substrate between two rectangular radiation patch is embedded in five three-dimensional metamaterial decoupling units arranged in column.The present invention is embedded in five three-dimensional metamaterials decoupling units to effectively reduce intercoupling between microstrip antenna array array element by the medium between microstrip antenna element, so as to improve the isolation of antenna array.
Description
Technical field
The present invention relates to a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna.
Background technology
There is gain higher and compared with highly directive due to array antenna, and transmission capacity and transmission matter can be improved
Amount.In recent years, antenna array is widely used in radio communication field.Meanwhile, with the development of wireless communication technology, user couple
The requirement of communication equipment integrated level is improved year by year, and the Miniaturization Research of array antenna also gets growing concern for.Antenna array
Isolation between array element can influence the performance of wireless communication system, the radiation efficiency or amplitude and the mistake of phase of such as antenna
By mistake.So, the research for antenna array is all restricted by bottlenecks such as mutual coupling existing between elements always, surface between microstrip antenna element
The generation of electric current materially increases the degree of coupling, the severe exacerbation characteristic of array antenna.Therefore, how small
Two secondary or multiple antennas are laid out in type mobile terminal device and realize being worked independently between each antenna, antenna is reduced as far as possible
One of influencing each other between array element, the key issue as antenna array research.As can be seen here, the research for being decoupled between array elements is right
It is significant in current and future communications industry development.
The method of microstrip antenna array uncoupling is a lot, and such as C.H.Park and H.W.Sun is in 2016 " H " shape conductive bridges for proposing
Structure.The current energy of coupling is transmitted on earth plate by loading this conductive bridge structure between two array elements, so as to significantly drop
Coupling between low two antenna.S.Farahani et al. in 2010 propose it is a kind of loaded between micro-strip array antenna array element it is small-sized
Electromagnetic bandgap structure, microstrip antenna more than ten dB of isolation increase in resonant frequency can be made by this structure, greatly improved
The performance of array antenna.S.Farsi et al. proposed a kind of simple micro-strip " u "-shaped structure in 2012, by array day
This element is loaded between linear array unit, isolation higher between the coupling between microstrip antenna can be absorbed to realize antenna.2016,
K.Wei et al. devises a kind of defect ground structure of serpentine, by etching three on the common ground plate between two bays
The groove of individual serpentine, can be cut off the couple current between floor, so as to reduce the coupling between two array elements and then improve isolation
Degree, emulation and experimental result all prove that two isolation between antennaes are lowered by about 40dB.Meta Materials refer to that some have naturally
The manual electromagnetic structure of the extraordinary physical property not available for material, by the structurally ordered design on key physical yardstick, just
The limitation of some apparent natural laws can be broken through, so as to obtain the meta-materials work(beyond the intrinsic common property of nature
Energy.It can show that dielectric constant and magnetic conductivity are wherein a certain to bear or being simultaneously negative in certain frequency range, and electromagnetic wave exists
The peculiar phenomenons such as some negative refraction can be showed when wherein propagating.The isolation appeared as between raising array antenna of Meta Materials
Degree provide a new method, such as 2016 R.Hafezifard et al. propose it is a kind of using Meta Materials reduction array day
The method of line coupling, spoke carves 6 × 2 beginning nesting ring elements of ellipse on the dielectric-slab between two antennas, effectively absorbs
Energy between two array elements, makes isolation be increased dramatically.G.Zhai et al. proposed a kind of using traditional mushroom in 2015
Mushroom shape metamaterial structure can be reached come the method for reducing coupling by loading isolation between this structure, array element between four antennas
To -40dB.
The content of the invention
The invention aims to provide a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna, antenna array
Be two cell arrays, using between array element load three-dimensional metamaterial structure method realize antenna array coupling reduce, reach raising every
From the target of degree.
The object of the present invention is achieved like this：Including common ground plate, the medium base being arranged on above common ground plate
Plate, two rectangular radiation patch for being symmetricly set on medium substrate upper surface, two coaxial feed ports, in two rectangular radiations
Medium substrate between paster is embedded in five three-dimensional metamaterial decoupling units arranged in column.
Present invention additionally comprises such some architectural features：
1. three-dimensional metamaterial decoupling unit includes top patches, two bottom patch and for connecting top patches described in
With two grounding probes of bottom patch, the top patches are M-shapeds, and the bottom patch is by vertical edge long, centre
Horizontal sides and short vertical edge are sequentially connected the class L-type paster of composition, and two bottom patch are oppositely arranged, and top patches two
The end of individual short side is connected by grounding probe with the end of the short vertical edge of corresponding bottom patch.
2. the material of top patches, bottom patch and grounding probe is copper.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is embedded by the medium between microstrip antenna element
Enter five three-dimensional metamaterial decoupling units to effectively reduce intercoupling between microstrip antenna array array element, so as to improve antenna array
Isolation.Three-dimensional metamaterial simple structure compact conformation designed by the present invention, by novel three-dimensional metamaterial construction unit
Load in the middle of antenna array, and but made using plated circuit technique, easy to process, cost is relatively low, and can
Integrated design is realized with microwave circuit etc..
Three-dimensional metamaterial structure designed by the present invention can be loaded simply with microstrip antenna array, and effective change is presented
The exciting current of paster is coupled in electric port, reduces or eliminate the electric current for flowing through common ground plate, significantly reduces antenna
Minor level, while absorbing from the coupling energy between two antenna elements, reaches the effect of lower coupling and high-isolation, while
The bandwidth of operation and radiation characteristic of two antenna elements are not interfered with.
The present invention is fed using coaxial feed mode to two antenna elements, antenna is easy to Integrated design, and can be with
Realize balanced feeding.
A kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array of the invention, it is only necessary to by designing top and bottom
The length of paster, width, two height of Shorted post, three-dimensional metamaterial construction unit can apart from the parameter such as vertical range of paster
The uncoupling effect of different resonant frequencies is realized, the optimization time is greatlyd save.
Brief description of the drawings
Fig. 1 is the structural representation of overlook direction of the invention；
Fig. 2 is the structural representation in main view direction of the present invention；
Fig. 3 is the structural representation of three-dimensional metamaterial unit of the invention；
Fig. 4 is simulation result figure of the invention.
Specific embodiment
The present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
As depicted in figs. 1 and 2, the present invention includes being printed on the common ground plate 101 of medium substrate lower surface, is printed on Jie
The rectangular radiation patch 201 and 202 of matter upper surface of base plate, two coaxial feed ports 301 and 302, metamaterial structure unit top
Portion's paster 401, metamaterial structure unit bottom paster 402 and 403, two of connection metamaterial structure unit top and bottom are short
Road probe 501 and 502.
The medium substrate 601 is the FR4 media that dielectric constant is 4.4, in order to reduce design cost, medium substrate 601
Length and width be designed according to the Miniaturization Design and antenna pattern demand of antenna array, namely medium substrate use
Antenna miniaturization theory is designed.Rectangular radiation patch 201 and 202 and the following table of medium substrate 601 on medium substrate 601
The common ground plate 101 in face is to cover steel structure using copper product.
As shown in figure 1, a kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array of the invention, are printed on medium base
The rectangular radiation patch 201 and 202 of the upper surface of plate 601 passes through SMA using steel structure, two coaxial feed ports 301 and 302 are covered
Fed directly to rectangular radiation patch 201 and 202, the inner wire of SMA is directly connected with radiation patch 201 with 202, SMA's is outer
Conductor is connected with the common ground plate 101 of medium substrate lower surface.Designed three-dimensional metamaterial decoupling arrangements are by two rectangles
The symmetrical isolation of radiation patch 201 and 202 and both sides, just with the symmetric design for realizing directional diagram.
As shown in figure 1, a kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array of the invention, by by five three
Dimension metamaterial structure unit is embedded in the dielectric-slab between two microstrip antenna elements to reduce the coupling between two antenna array array elements
Close, and then improve the isolation between antenna array array element.Also miniaturization and low Section Design are realized, it can be processed using circuit board
Technique is processed.
As shown in Figures 2 and 3, according to antenna uncoupling theory and Meta Materials correlation theory, design meets to be reduced coupling, carries
The three-dimensional metamaterial decoupling arrangements unit of high-isolation, in order to reduce coupling, realizes miniaturization, three-dimensional metamaterial decoupling arrangements list
Meta structure uses three-dimensional structure, and by two Shorted posts 501 and 502 by top patches 401, bottom patch 402 and 403 is connected to one
Acting the coupling constituted between three-dimensional metamaterial decoupling unit, antenna array array element can be embedded in by designing three-dimensional metamaterial decoupling arrangements
The depth of medium substrate, effectively reduces the coupling of antenna array.And top patches 401, bottom patch 402 and 403 uses copper product,
Two Shorted posts 501 and 502 use copper post material.The length and width of top patches and bottom patch can enter according to its uncoupling frequency
Row design, to make that best decoupling effect is reached in the frequency range for being worked, two Shorted posts of three-dimensional metamaterial construction unit
Height and radius can be adjusted to meet necessary requirement.Meanwhile, designed three-dimensional metamaterial cell distance paster
Vertical range can be designed according to Practical Project demand, to meet antenna uncoupling demand.Additionally, by adjusting three-dimensional super material
Expect the size of construction unit, that is, adjust the length and width of top patches and bottom patch, the height and radius of Shorted post, apart from paster
The parameter such as vertical range realize the decoupling of different resonant frequencies.
As shown in figure 3, a kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array of the invention, three-dimensional using loading
Meta Materials realize uncoupling, and the three-dimensional metamaterial decoupling arrangements of loading are designed in different layers, can be by selecting suitable three
Dimension Meta Materials decoupling arrangements size, couples between reducing antenna array array element, improves isolation.
As shown in figure 4, a kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array of the invention, are selecting reasonable chi
After very little, the isolation between antenna array can be made to improve nearly 25dB.
To sum up, the invention discloses a kind of three-dimensional metamaterial decoupling arrangements for microstrip antenna array, the microstrip antenna array
The purpose that coupling is reduced is realized using the method for loading three-dimensional metamaterial, mainly five is loaded by between two array elements of antenna array
Individual three-dimensional metamaterial construction unit, reduces the effect of intercoupling between antenna array array element, obtains isolation higher.Mainly by printing
The common ground plate 101 in medium substrate lower surface is brushed, the rectangular radiation patch 201 and 202 of medium substrate upper surface is printed on,
Two coaxial feed ports 301 and 302, metamaterial structure unit top patches 401, metamaterial structure unit bottom paster 402
With 403, the composition of two grounding probes 501 and 502 of connection metamaterial structure unit top and bottom.Designed by the present invention three
Dimension Meta Materials decoupling arrangements, can effectively absorb the coupling energy between two array element, increase substantially the isolation between array antenna
Degree, meets the demand of array antenna high-isolation.
Claims (3)
1. a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna, including common ground plate, common ground is arranged on
Medium substrate above plate, two rectangular radiation patch, the two coaxial feed ports for being symmetricly set on medium substrate upper surface,
It is characterized in that：Medium substrate between two rectangular radiation patch is embedded in five three-dimensional metamaterials arranged in column and goes
Coupling unit.
2. a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna according to right wants 1, it is characterised in that：Institute
Stating three-dimensional metamaterial decoupling unit includes top patches, two bottom patch and for connecting top patches and bottom patch
Two grounding probes, the top patches are M-shapeds, and the bottom patch is by vertical edge long, by-level side and short perpendicular
Straight flange is sequentially connected the class L-type paster of composition, and two bottom patch are oppositely arranged, and top patches two ends of short side
Connected with the end of the short vertical edge of corresponding bottom patch by grounding probe.
3. a kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna according to right wants 1 or 2, its feature exists
In：The material of top patches, bottom patch and grounding probe is copper.
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| CN201710040645.1A CN106848583B (en) | 2017-01-20 | 2017-01-20 | A kind of three-dimensional metamaterial decoupling arrangements for micro-strip array antenna |
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| CN106848583B CN106848583B (en) | 2019-09-27 |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785661A (en) * | 2017-10-18 | 2018-03-09 | 哈尔滨工程大学 | A kind of uncoupling array antenna based on double frequency Meta Materials |
| CN108281788A (en) * | 2018-01-22 | 2018-07-13 | 电子科技大学 | A kind of element microstrip array antenna reducing coupling |
| CN108847532A (en) * | 2018-05-25 | 2018-11-20 | 哈尔滨工程大学 | A kind of aerial array and its vertical isolation fence structure |
| CN108847533A (en) * | 2018-05-25 | 2018-11-20 | 哈尔滨工程大学 | A kind of decoupling structure between multi-input/output antenna |
| CN108923122A (en) * | 2018-06-27 | 2018-11-30 | 河南安伏众电子科技有限公司 | A kind of circularly polarization microstrip array antenna with high-isolation based on electrical resonator |
| CN108987947A (en) * | 2018-06-27 | 2018-12-11 | 广东通宇通讯股份有限公司 | A kind of 3D-MID technology array antenna |
| CN109904616A (en) * | 2019-03-04 | 2019-06-18 | 西安交通大学 | A kind of wireless high-definition video monitoring system based on glass decoration antenna |
| CN110165408A (en) * | 2019-05-10 | 2019-08-23 | 中国工程物理研究院电子工程研究所 | A kind of high-isolation Beidou array antenna based on electromagnetism Meta Materials |
| CN111355027A (en) * | 2020-03-11 | 2020-06-30 | 中天宽带技术有限公司 | Self-decoupling antenna array |
| CN111509402A (en) * | 2020-04-26 | 2020-08-07 | 成都新光微波工程有限责任公司 | Miniaturized broadband luneberg lens antenna feed source and multi-band feed source group |
| CN111527646A (en) * | 2017-12-28 | 2020-08-11 | 株式会社村田制作所 | Antenna array and antenna module |
| CN111600121A (en) * | 2020-05-12 | 2020-08-28 | 中天宽带技术有限公司 | Decoupling patch antenna array |
| CN111987458A (en) * | 2020-07-30 | 2020-11-24 | 南京理工大学 | Decoupling structure between adjacent rectangular patches in dual-frequency antenna array |
| CN112366456A (en) * | 2020-11-02 | 2021-02-12 | 合肥学院 | 5G communication is with ultra wide band antenna based on artifical electromagnetism metamaterial |
| CN112510367A (en) * | 2020-10-19 | 2021-03-16 | 西安朗普达通信科技有限公司 | Resonant decoupling chip |
| CN113437500A (en) * | 2021-06-03 | 2021-09-24 | 中国电子科技集团公司第三十八研究所 | Three-dimensional SRRs-based metamaterial microstrip antenna and manufacturing method thereof |
| CN113555686A (en) * | 2021-08-04 | 2021-10-26 | 南京航空航天大学 | Circular microstrip array antenna based on multiple decoupling methods |
| CN114142231A (en) * | 2021-12-30 | 2022-03-04 | 中国人民解放军空军工程大学 | Low-coupling low-profile broadband antenna |
| CN114498018A (en) * | 2022-03-04 | 2022-05-13 | 南通大学 | Low mutual coupling microstrip antenna |
| CN115832691A (en) * | 2022-12-19 | 2023-03-21 | 杭州电子科技大学 | Double-zero high-isolation dual-polarization through probe patch antenna |
| TWI800065B (en) * | 2021-10-29 | 2023-04-21 | 明泰科技股份有限公司 | Periodic Metal Array Structure |
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| CN102760941A (en) * | 2011-04-29 | 2012-10-31 | 深圳光启高等理工研究院 | Metamaterial radio frequency antenna with multiple layers of substrates and making method thereof |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107785661A (en) * | 2017-10-18 | 2018-03-09 | 哈尔滨工程大学 | A kind of uncoupling array antenna based on double frequency Meta Materials |
| US11283191B2 (en) | 2017-12-28 | 2022-03-22 | Murata Manufacturing Co., Ltd. | Antenna array and antenna module |
| CN111527646A (en) * | 2017-12-28 | 2020-08-11 | 株式会社村田制作所 | Antenna array and antenna module |
| CN108281788A (en) * | 2018-01-22 | 2018-07-13 | 电子科技大学 | A kind of element microstrip array antenna reducing coupling |
| CN108847532A (en) * | 2018-05-25 | 2018-11-20 | 哈尔滨工程大学 | A kind of aerial array and its vertical isolation fence structure |
| CN108847533A (en) * | 2018-05-25 | 2018-11-20 | 哈尔滨工程大学 | A kind of decoupling structure between multi-input/output antenna |
| CN108923122A (en) * | 2018-06-27 | 2018-11-30 | 河南安伏众电子科技有限公司 | A kind of circularly polarization microstrip array antenna with high-isolation based on electrical resonator |
| CN108987947A (en) * | 2018-06-27 | 2018-12-11 | 广东通宇通讯股份有限公司 | A kind of 3D-MID technology array antenna |
| CN108987947B (en) * | 2018-06-27 | 2024-04-16 | 广东通宇通讯股份有限公司 | 3D-MID technology array antenna |
| CN108923122B (en) * | 2018-06-27 | 2020-05-22 | 河南安伏众电子科技有限公司 | Circularly polarized microstrip array antenna with high isolation degree based on electric resonator |
| CN109904616A (en) * | 2019-03-04 | 2019-06-18 | 西安交通大学 | A kind of wireless high-definition video monitoring system based on glass decoration antenna |
| CN110165408A (en) * | 2019-05-10 | 2019-08-23 | 中国工程物理研究院电子工程研究所 | A kind of high-isolation Beidou array antenna based on electromagnetism Meta Materials |
| CN111355027A (en) * | 2020-03-11 | 2020-06-30 | 中天宽带技术有限公司 | Self-decoupling antenna array |
| CN111355027B (en) * | 2020-03-11 | 2022-10-21 | 中天宽带技术有限公司 | Self-decoupling antenna array |
| CN111509402A (en) * | 2020-04-26 | 2020-08-07 | 成都新光微波工程有限责任公司 | Miniaturized broadband luneberg lens antenna feed source and multi-band feed source group |
| CN111600121B (en) * | 2020-05-12 | 2022-03-01 | 中天宽带技术有限公司 | Decoupling patch antenna array |
| CN111600121A (en) * | 2020-05-12 | 2020-08-28 | 中天宽带技术有限公司 | Decoupling patch antenna array |
| CN111987458A (en) * | 2020-07-30 | 2020-11-24 | 南京理工大学 | Decoupling structure between adjacent rectangular patches in dual-frequency antenna array |
| CN112510367A (en) * | 2020-10-19 | 2021-03-16 | 西安朗普达通信科技有限公司 | Resonant decoupling chip |
| CN112510367B (en) * | 2020-10-19 | 2023-05-30 | 西安朗普达通信科技有限公司 | Resonant decoupling chip |
| CN112366456A (en) * | 2020-11-02 | 2021-02-12 | 合肥学院 | 5G communication is with ultra wide band antenna based on artifical electromagnetism metamaterial |
| CN113437500A (en) * | 2021-06-03 | 2021-09-24 | 中国电子科技集团公司第三十八研究所 | Three-dimensional SRRs-based metamaterial microstrip antenna and manufacturing method thereof |
| CN113555686A (en) * | 2021-08-04 | 2021-10-26 | 南京航空航天大学 | Circular microstrip array antenna based on multiple decoupling methods |
| TWI800065B (en) * | 2021-10-29 | 2023-04-21 | 明泰科技股份有限公司 | Periodic Metal Array Structure |
| US11777205B2 (en) | 2021-10-29 | 2023-10-03 | Alpha Networks Inc. | Periodic metal array structure |
| CN114142231A (en) * | 2021-12-30 | 2022-03-04 | 中国人民解放军空军工程大学 | Low-coupling low-profile broadband antenna |
| CN114498018A (en) * | 2022-03-04 | 2022-05-13 | 南通大学 | Low mutual coupling microstrip antenna |
| CN115832691A (en) * | 2022-12-19 | 2023-03-21 | 杭州电子科技大学 | Double-zero high-isolation dual-polarization through probe patch antenna |
| CN115832691B (en) * | 2022-12-19 | 2023-07-04 | 杭州电子科技大学 | Double-zero high-isolation dual-polarization straight-through probe patch antenna |
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