CN106847730B - Wafer overturning and safety protection equipment and wafer cleaning method - Google Patents
Wafer overturning and safety protection equipment and wafer cleaning method Download PDFInfo
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- CN106847730B CN106847730B CN201710039040.0A CN201710039040A CN106847730B CN 106847730 B CN106847730 B CN 106847730B CN 201710039040 A CN201710039040 A CN 201710039040A CN 106847730 B CN106847730 B CN 106847730B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 230000000903 blocking effect Effects 0.000 claims abstract description 37
- 210000000078 claw Anatomy 0.000 claims description 25
- 238000005498 polishing Methods 0.000 claims description 7
- 230000007306 turnover Effects 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 6
- 238000005507 spraying Methods 0.000 abstract description 3
- 230000005484 gravity Effects 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer overturning and safety protecting device and a wafer cleaning method, wherein the device comprises: the water spraying device comprises a box body, a turnover chuck, a rotating shaft, a driving gear, a water retaining door, a water spraying pipe and a rack; a wafer inlet and a wafer outlet are formed in the side face of the box body; the turnover chuck is arranged in the box body; the rotating shaft is fixed on one side of the turnover chuck; the driving gear drives the rotating shaft to rotate; the water retaining door is arranged at the position of the wafer inlet and the wafer outlet of the box body; the water spray pipe is arranged at the top of the box body and is positioned above the turnover chuck; one end of the rack is connected with the water retaining door, and the driving gear is meshed with the rack. In the equipment, the wafer is movably connected with the turnover chuck by the gravity of the wafer, and the wafer is placed on the turnover chuck without a driving device, so that the equipment has a simple and reliable structure; the opening and closing of the water blocking door are automatically completed along with the overturning of the overturning chuck, and extra power driving and signal judgment are not needed; the overturning angle of the chuck and the falling prevention of the wafer are subjected to fool-proof safety design, and the reliability of the whole system is improved.
Description
Technical field
The invention belongs to cleaning equipments after CMP, and more particularly to a kind of overturning of wafer and safety features, and utilizing should
The method for cleaning wafer that equipment carries out.
Background technique
With the rapid development of ic manufacturing technology, integrated circuit fabrication process also becomes to become increasingly complex and essence
Carefully, the flatness requirement of crystal column surface is also increasingly stringenter.And widely applied method for semiconductor manufacturing will cause crystalline substance now
Round surface undulation is uneven, extremely disadvantageous to graphic making.For this reason, it may be necessary to be planarized (Planarization) to wafer
Processing, makes each layer flatness all with higher.
Currently, the most common flatening process be chemical mechanical grinding (Chemical Mechanical Polishing,
CMP).Chemical mechanical grinding is a kind of technical process of complexity, is planarized by the relative motion between wafer and grinding head
The surface of wafer.In chemical-mechanical grinding device, wafer is horizontal positioned, the wafer need after polishing during polishing
Want on-line cleaning.Wafer is vertical cleaning in current existing mainstream model.When cleaning, online manipulator is by wafer from polishing
Area is transported to cleaning area, needs to carry out wafer 90 degree of overturnings in cleaning area.There are two types of common wafer overturning modes, one is
It is realized by multi-joint manipulator, another kind is to carry out wafer overturning using overturning chuck.The shortcomings that multi-joint manipulator, is into
This height, occupied space are big.Device structure is complicated in traditional overturning chuck mode, claw it is on and off need cylinder or
Motor driven, water blocking door need cylinder to drive, and the state of overturning chuck must be judged when water blocking door is on and off, makes tumble card
When disk level, water blocking door is opened；When overturning chuck is vertical, water blocking door is closed.
Summary of the invention
The object of the present invention is to provide a kind of overturning of wafer and safety features and method for cleaning wafer.
The technical scheme to solve the above technical problems is that a kind of wafer overturning and safety features, packet
It includes:
It is imported and exported equipped with wafer the side of cabinet, the cabinet；
Overturning chuck, the overturning chuck are mounted in the cabinet；
Shaft, shaft are fixed on the side of the overturning chuck；
Gear is driven, the driving gear band moves the shaft rotation；
Water blocking door, the water blocking door are mounted on the wafer inlet and outlet position of the cabinet；
Sparge pipe, the sparge pipe are mounted on the top of the cabinet, positioned at the top of overturning chuck；
Rack gear, one end of the rack gear are connect with the water blocking door, and driving wheel and rack is meshed；
Overturning chuck have the first station and second station, the overturning chuck of the first station be in horizontality or with level
Face at the angle less than 5 degree, the overturning chuck of second station it is in a vertical state or with vertical plane at the angle less than 5 degree；It turns over
Turn chuck be located at the first station hour rack driving water blocking door make wafer inlet and outlet it is in the open state, overturning chuck is located at the second work
Position hour rack driving water blocking door is in close state wafer inlet and outlet.
Present invention wafer overturning as described above and safety features, further, the overturning chuck includes chuck sheet
Body, claw and top pillar；The side middle position of the chuck body is fixed with shaft, and claw and top pillar are fixed on the chuck sheet
The other side of body.
Present invention wafer overturning as described above and safety features, further, the quantity of the claw is two, support
Pawl is adjacent to be fixed in the chuck body；The quantity of the top pillar be two, top pillar it is adjacent be fixed on the chuck sheet
On body；The claw includes jacking part and blocking portion, and groove is formed between jacking part and blocking portion.
Present invention wafer overturning as described above and safety features, further, the driving gear includes mutually nibbling
The first gear and second gear of conjunction, the first gear are sector gear, and the first gear is connect with shaft, described second
Wheel and rack engagement.
The overturning of present invention wafer as described above and safety features, further, the equipment further include overturning limited block,
Horizontal limiting stud and vertical limit stud；Horizontal limiting stud and vertical limit stud interval are fixed on the one of overturning chuck
Side；Overturning limited block is fixed on cabinet, when overturning chuck is located at the first station, water on Horizontal limiting stud and overturning limited block
Plane contact, it is vertical to limit stud and overturning limited block left vertical face contact when overturning chuck is located at second station, it will with this
Overturning chuck is limited within the scope of 90 degree.
Present invention wafer overturning as described above and safety features, further, which further includes overturning-preventing pillar,
The overturning-preventing pillar is mounted in the cabinet, overturning-preventing pillar and tumble card in the case where overturning chuck is located at second station state
The top of disk is opposite.
The present invention also provides a kind of method for cleaning wafer, the method utilizes as above described in any item wafer overturnings and peace
Full guard equipment carries out, comprising the following steps:
Step 1, the wafer for the horizontality that polishing is completed is transported to wafer overturning and safety features, passes through wafer
Enter box house；
Step 2, wafer is placed on the overturning chuck of wafer overturning and safety features, wafer is in the first work
Position；
Step 3, gear band turn axis and overturning chuck rotation are driven, wafer is made to be in second station；Drive gear band dynamic
Rack gear is mobile, and water blocking door blocks wafer inlet and outlet；
Step 4, sparge pipe is sprayed water to wafer, is cleaned to the wafer after mechanical lapping.
Present invention method for cleaning wafer as described above, it is preferred that when overturning chuck is located at the first station, Horizontal limiting spiral shell
Column is contacted with overturning limited block upper horizontal plane, and when overturning chuck is located at second station, vertical limit stud and overturning limited block are left
The vertical face contact in side.
The beneficial effects of the present invention are:
Wafer is flexibly connected by the gravity realization of itself with overturning chuck, and wafer is placed on overturning chuck without driving dress
It sets, it is simple and reliable for structure；Wafer flip angle is arranged less than 90 degree, keeps wafer vertical without falling；The switch of water blocking door be along with
What the overturning of overturning chuck was automatically performed, judge without additional power drive and signal；For the flip angle and crystalline substance of chuck
Round overturning-preventing has carried out the safe design (being provided with overturning limited block and overturning-preventing pillar) of fool proof, improves whole system
Reliability.
Detailed description of the invention
By made detailed description in conjunction with the following drawings, above-mentioned and/or other aspects of the invention and advantage will become
It becomes apparent from and is easier to understand, these attached drawings are only schematical, are not intended to limit the present invention, in which:
Fig. 1 is the wafer overturning and safety features schematic diagram of an embodiment of the present invention；
Fig. 2 is the schematic elevation view of Fig. 1；
Fig. 3 is the right side schematic view of Fig. 1；
Fig. 4 is the schematic top plan view of Fig. 1；
Fig. 5 is the overturning chuck schematic diagram of an embodiment of the present invention；
Fig. 6 is the side schematic view of the overturning chuck of an embodiment of the present invention；
Fig. 7 is the claw schematic diagram of an embodiment of the present invention；
Fig. 8 is the schematic elevation view of Fig. 7；
Fig. 9 is the right side schematic view of Fig. 7；
Figure 10 is the overturning limited block schematic diagram of an embodiment of the present invention.
In attached drawing, parts list represented by the reference numerals are as follows:
1, cabinet, 2, water blocking door, 3, overturning chuck, 4, overturning limited block, 5, first gear, 6, second gear, 7, rack gear,
8, motor, 9, overturning-preventing pillar, 10, sparge pipe, 11, top pillar, 12, claw, 13, wafer, 14, jacking part, 15, blocking portion,
16, groove, 17, shaft, 18, wafer inlet and outlet, 19, Horizontal limiting stud, 20, limit stud vertically.
Specific embodiment
Hereinafter, wafer overturning and safety features and method for cleaning wafer of the invention are described with reference to the accompanying drawings
Embodiment.
The embodiment recorded herein is specific specific embodiment of the invention, for illustrating design of the invention,
Be it is explanatory and illustrative, should not be construed as the limitation to embodiment of the present invention and the scope of the invention.Except what is recorded herein
Outside embodiment, those skilled in the art can also based on the claim of this application book and specification disclosure of that using aobvious and
The other technical solutions being clear to, these technical solutions include using any obvious to making for the embodiment recorded herein
The technical solution of substitutions and modifications.
The attached drawing of this specification is schematic diagram, aids in illustrating design of the invention, it is schematically indicated the shape of each section
And its correlation.It note that for the ease of clearly showing the structure of each component of the embodiment of the present invention, between each attached drawing
Do not drawn according to identical ratio.Identical reference marker is for indicating identical part.
Fig. 1-4 shows the wafer overturning and safety features of an embodiment of the present invention comprising:
Cabinet 1, the side of the cabinet 1 are equipped with wafer inlet and outlet 18；In the embodiment show in figure 1, the cabinet
Shape is cubic, and the side corresponding to cabinet front view is equipped with wafer inlet and outlet 18；
Overturning chuck 3, the overturning chuck 3 are mounted in the cabinet 1；In the embodiment show in figure 1, overturning chuck
3 are in horizontality；
Shaft 17, shaft 17 are fixed on the side of the overturning chuck 3, and the effect of shaft is driving rotary chuck rotation；
Gear is driven, the driving gear band moves the shaft 17 and rotates；
Water blocking door 2, the wafer that the water blocking door 2 is mounted on the cabinet 1 import and export 18 positions；In a kind of specific embodiment
In, water blocking door is mounted on the cabinet by slideway, can be moved in slideway under the driving of rack gear；
Sparge pipe 10, the sparge pipe 10 is mounted on the top of the cabinet 1, positioned at the top of overturning chuck 3；In Fig. 1
In the embodiment shown, the quantity of sparge pipe is two, and the effect of sparge pipe is to rinse wafer；It is placed on overturning chuck 3
After wafer is transformed to vertical state by horizontality, cleaned by the cleaning solution that sparge pipe is sprayed；
Rack gear 7, one end of the rack gear 7 are connect with the water blocking door 2, and driving wheel and rack 7 is meshed；Such as Fig. 3 institute
In the embodiment shown, the setting of rack gear vertical direction, the lower movement in the vertical direction under the driving of driving gear；
Overturning chuck 3 has the first station and second station, and the overturning chuck 3 of the first station is in horizontality or and water
Plane at the angle less than 5 degree, the overturning chuck 3 of second station it is in a vertical state or with vertical plane at the angle less than 5 degree；
Overturning chuck 3, which is located at the first station hour rack 7 driving water blocking door 2, keeps wafer inlet and outlet 18 in the open state, and overturning chuck 3
Water blocking door 2 is driven to be in close state wafer inlet and outlet 18 in second station hour rack 7.
Using above equipment carry out method for cleaning wafer the following steps are included:
Step 1, the wafer for the horizontality that polishing is completed is transported to wafer overturning and safety features, passes through wafer
Enter box house；
Step 2, wafer is placed on the overturning chuck of wafer overturning and safety features, wafer is in the first work
Position；
Step 3, gear band turn axis and overturning chuck rotation are driven, wafer is made to be in second station；Drive gear band dynamic
Rack gear is mobile, and water blocking door blocks wafer inlet and outlet；
Step 4, sparge pipe is sprayed water to wafer, is cleaned to the wafer after mechanical lapping.
As shown in Figure 5 and Figure 6, the overturning chuck 3 includes chuck body, claw 12 and top pillar 11；The chuck body
Side middle position be fixed with shaft, claw 12 and top pillar 11 are fixed on the other side of the chuck body.
As shown in Figure 5 and Figure 6, the quantity of the claw 12 be two, claw 12 it is adjacent be fixed on the chuck body
On；The quantity of the top pillar 11 is two, and top pillar 11 is adjacent to be fixed in the chuck body；Such as Fig. 7, Fig. 8 and Fig. 9 institute
Show, the claw 12 includes jacking part 14 and blocking portion 15, and groove 16 is formed between jacking part 14 and blocking portion 15.Claw 12
The Position Design of wafer 13 is contacted into groove type, claw 12 can be skidded off to avoid wafer 13.
In an embodiment as illustrated in figure 3, the driving gear includes intermeshing first gear 5 and second gear 6,
The first gear 5 is sector gear, and the first gear 5 is connect with shaft 17, and the second gear 6 is engaged with rack gear 7.The
The motor 8 shown in FIG. 1 of one gear 5 is rotated by.
In an embodiment as illustrated in figure 3, which further includes overturning limited block 4, Horizontal limiting stud 19 and vertical limit
Position stud 20；Horizontal limiting stud and vertical limit stud interval are fixed on the side of overturning chuck, in reality as shown in Figure 10
It applies in example, Horizontal limiting stud and the vertical side opposite with claw for limiting stud interval and being fixed on overturning chuck；Overturning limit
Position block 4 is fixed on 1 on cabinet, horizontal on Horizontal limiting stud 19 and overturning limited block 4 when overturning chuck 3 is located at the first station
Face contact, it is vertical to limit stud 20 and overturning 4 left vertical face contact of limited block when overturning chuck 3 is located at second station, with this
Overturning chuck 3 is limited within the scope of 90 degree.The rotation of overturning chuck 3 is limited within the scope of 90 degree by overturning limited block 4, is avoided
Flip angle is out of control.
Shown in as shown in Figure 1, Figure 3 and Figure 4 in embodiment, which further includes overturning-preventing pillar 9, the overturning-preventing pillar
9 are mounted in the cabinet 1, the top of overturning-preventing pillar 9 and overturning chuck 3 in the case where overturning chuck 3 is located at second station state
Relatively.When 3 flip angle of overturning chuck is more than 90 degree, wafer 13 has the possibility toppled over, and overturning-preventing branch 9, which is used to protect, surprisingly inclines
Wafer 13 after.
Two top pillars 11 and two claws 12 are fixed in the side of the overturning chuck 3, overturning chuck 3 in horizontality,
Wafer 13 is placed on two top pillars 11 and two claws 12.Overturning chuck 3 is overturn under the driving of motor 8, after overturning
Two top pillars 11 are upper, and two claws 12 are under；The flip angle of the overturning chuck 3 is controlled at 89 degree, so that 13 quilt of wafer
Two claws 12 are held, and are leaned against on two top pillars 11.The flip angle of overturning chuck 3 can be to avoid wafer 13 outward for 89 degree
Topple over；Two claws 12 contact the Position Design of wafer 13 at groove, for limiting movement of the wafer 13 after overturning；Overturning
The function of chuck 3 is that wafer 13 is become plumbness from horizontality.
It is turn 90 degrees for example, motor 8 drives overturning chuck 3 to turn over, drives sector gear 5 to be rotated by 90 ° counterclockwise, sector
Wheel 5 is rotated by 90 ° counterclockwise drives Knucle-gear 6 to rotate clockwise 90 degree, and it is upward that Knucle-gear 6 rotates clockwise 90 degree of band carry-over bars 7
Movement, rack gear 7, which moves upwards, drives water blocking door 2 to move upwards, and water blocking door 2 moves upwards the wafer inlet and outlet 18 for blocking cabinet 1；
The effect of water blocking door 2 is to block wafer inlet and outlet 18, the water spluttering for preventing the sparge pipe 10 installed in cabinet 1 from spraying.
Each technical characteristic of above-mentioned disclosure is not limited to disclosed and other feature combination, and those skilled in the art are also
Can carry out other combinations between each technical characteristic according to the purpose of invention, be subject to realize the present invention purpose.
Claims (7)
1. a kind of wafer overturning and safety features characterized by comprising
It is imported and exported equipped with wafer the side of cabinet, the cabinet；
Overturning chuck, the overturning chuck are mounted in the cabinet；
Shaft, shaft are fixed on the side of the overturning chuck；
Gear is driven, the driving gear band moves the shaft rotation；
Water blocking door, the water blocking door are mounted on the wafer inlet and outlet position of the cabinet；
Sparge pipe, the sparge pipe are mounted on the top of the cabinet, positioned at the top of overturning chuck；
Rack gear, one end of the rack gear are connect with the water blocking door, and driving wheel and rack is meshed；
Overturning chuck have the first station and second station, the overturning chuck of the first station be in horizontality or with horizontal plane at
The overturning chuck of angle less than 5 degree, second station it is in a vertical state or with vertical plane at the angle less than 5 degree；Tumble card
Disk, which is located at the first station hour rack driving water blocking door, keeps wafer inlet and outlet in the open state, when overturning chuck is located at second station
Rack drives water blocking door is in close state wafer inlet and outlet；
Further include overturning limited block, Horizontal limiting stud and limits stud vertically；Between Horizontal limiting stud and vertical limit stud
Every the side for being fixed on overturning chuck；Overturning limited block is fixed on cabinet, when overturning chuck is located at the first station, Horizontal limiting
Stud is contacted with overturning limited block upper horizontal plane, vertical to limit stud and overturning limited block when overturning chuck is located at second station
Left vertical face contact.
2. wafer overturning according to claim 1 and safety features, which is characterized in that the overturning chuck includes card
Disk ontology, claw and top pillar；The side middle position of the chuck body is fixed with shaft, and claw and top pillar are fixed on the card
The other side of disk ontology.
3. wafer overturning according to claim 2 and safety features, which is characterized in that the quantity of the claw is two
A, claw is adjacent to be fixed in the chuck body；The quantity of the top pillar be two, top pillar it is adjacent be fixed on the card
On disk ontology；The claw includes jacking part and blocking portion, and groove is formed between jacking part and blocking portion.
4. wafer overturning according to claim 1 and safety features, which is characterized in that the driving gear includes phase
The first gear and second gear mutually engaged, the first gear are sector gear, and the first gear is connect with shaft, described
Second gear is engaged with rack.
5. wafer overturning according to claim 1 and safety features, which is characterized in that it further include overturning-preventing pillar,
The overturning-preventing pillar is mounted in the cabinet, overturning-preventing pillar and tumble card in the case where overturning chuck is located at second station state
The top of disk is opposite.
6. a kind of method for cleaning wafer, the method utilizes the described in any item wafer overturnings of claim 1-5 and safeguard protection
Equipment carries out, comprising the following steps:
Step 1, the wafer for the horizontality that polishing is completed is transported to wafer overturning and safety features, is passed in and out by wafer
Mouth enters box house；
Step 2, wafer is placed on the overturning chuck of wafer overturning and safety features, wafer is in the first station；
Step 3, gear band turn axis and overturning chuck rotation are driven, wafer is made to be in second station；Drive gear band carry-over bar
Mobile, water blocking door blocks wafer inlet and outlet；
Step 4, sparge pipe is sprayed water to wafer, is cleaned to the wafer after mechanical lapping.
7. method for cleaning wafer according to claim 6, which is characterized in that horizontal when overturning chuck is located at the first station
Limit stud is contacted with overturning limited block upper horizontal plane, and when overturning chuck is located at second station, the vertical stud that limits is limited with overturning
Position block left vertical face contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710039040.0A CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710039040.0A CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847730A CN106847730A (en) | 2017-06-13 |
| CN106847730B true CN106847730B (en) | 2019-05-17 |
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ID=59124453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710039040.0A Active CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106847730B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201425681Y (en) * | 2009-04-30 | 2010-03-17 | 庄添财 | Turnover mechanism |
| CN103811397A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Substrate turning and aligning device |
| US9449849B2 (en) * | 2009-07-21 | 2016-09-20 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device using meander-shaped heating element |
-
2017
- 2017-01-19 CN CN201710039040.0A patent/CN106847730B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201425681Y (en) * | 2009-04-30 | 2010-03-17 | 庄添财 | Turnover mechanism |
| US9449849B2 (en) * | 2009-07-21 | 2016-09-20 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device using meander-shaped heating element |
| CN103811397A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Substrate turning and aligning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106847730A (en) | 2017-06-13 |
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