CN106847730A - Wafer overturning and safety protection equipment and wafer cleaning method - Google Patents
Wafer overturning and safety protection equipment and wafer cleaning method Download PDFInfo
- Publication number
- CN106847730A CN106847730A CN201710039040.0A CN201710039040A CN106847730A CN 106847730 A CN106847730 A CN 106847730A CN 201710039040 A CN201710039040 A CN 201710039040A CN 106847730 A CN106847730 A CN 106847730A
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- overturning
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- upset
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- 238000004140 cleaning Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 230000000903 blocking effect Effects 0.000 claims abstract description 30
- 210000000078 claw Anatomy 0.000 claims description 25
- 230000008676 import Effects 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 7
- 230000007306 turnover Effects 0.000 abstract description 7
- 238000005507 spraying Methods 0.000 abstract description 3
- 230000005484 gravity Effects 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer overturning and safety protecting device and a wafer cleaning method, wherein the device comprises: the water spraying device comprises a box body, a turnover chuck, a rotating shaft, a driving gear, a water retaining door, a water spraying pipe and a rack; a wafer inlet and a wafer outlet are formed in the side face of the box body; the turnover chuck is arranged in the box body; the rotating shaft is fixed on one side of the turnover chuck; the driving gear drives the rotating shaft to rotate; the water retaining door is arranged at the position of the wafer inlet and the wafer outlet of the box body; the water spray pipe is arranged at the top of the box body and is positioned above the turnover chuck; one end of the rack is connected with the water retaining door, and the driving gear is meshed with the rack. In the equipment, the wafer is movably connected with the turnover chuck by the gravity of the wafer, and the wafer is placed on the turnover chuck without a driving device, so that the equipment has a simple and reliable structure; the opening and closing of the water blocking door are automatically completed along with the overturning of the overturning chuck, and extra power driving and signal judgment are not needed; the overturning angle of the chuck and the falling prevention of the wafer are subjected to fool-proof safety design, and the reliability of the whole system is improved.
Description
Technical field
The invention belongs to cleaning equipment after CMP, more particularly to a kind of wafer overturns and safety features, and utilization should
The method for cleaning wafer that equipment is carried out.
Background technology
With developing rapidly for ic manufacturing technology, integrated circuit fabrication process also becomes to become increasingly complex and essence
Carefully, the flatness requirement to crystal column surface is also more and more stricter.And wide variety of method for semiconductor manufacturing can cause crystalline substance now
Round surface undulation is uneven, extremely disadvantageous to graphic making.For this reason, it may be necessary to be planarized (Planarization) to wafer
Treatment, makes each layer all have flatness higher.
At present, most common flatening process be cmp (Chemical Mechanical Polishing,
CMP).Cmp is a kind of complicated technical process, is planarized by the relative motion between wafer and grinding head
The surface of wafer.In chemical-mechanical grinding device, wafer is horizontal positioned during polishing, and the wafer after polishing is needed
Want on-line cleaning.Wafer is vertical cleaning in current existing mainstream model.During cleaning, online manipulator is by wafer from polishing
Area is transported to cleaning area, needs to carry out wafer 90 degree of upsets in cleaning area.Common wafer upset mode has two kinds, Yi Zhongshi
Realize that another kind is to carry out wafer upset using overturning chuck by multi-joint manipulator.The shortcoming of multi-joint manipulator is into
This height, takes up room big.Device structure is complicated in traditional overturning chuck mode, opening and the closing of claw need cylinder or
Motor drives, and water blocking door needs air cylinder driven, and water blocking door opens the state that overturning chuck must be judged during with closing, makes tumble card
During disk level, water blocking door is opened；When overturning chuck is vertical, water blocking door is closed.
The content of the invention
It is an object of the invention to provide a kind of upset of wafer and safety features and method for cleaning wafer.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of wafer upset and safety features, its bag
Include：
Casing, the side of the casing is provided with wafer import and export；
Overturning chuck, the overturning chuck is arranged in the casing；
Rotating shaft, rotating shaft is fixed on the side of the overturning chuck；
Drive gear, the drive gear drives the axis of rotation；
Water blocking door, the wafer that the water blocking door is arranged on the casing imports and exports position；
Sparge pipe, the sparge pipe is arranged on the top of the casing, positioned at the top of overturning chuck；
Tooth bar, one end of the tooth bar is connected with the water blocking door, and sliding tooth wheel and rack is meshed；
Overturning chuck has the first station and the second station, the overturning chuck of the first station be in horizontality or with the horizontal
Angle less than 5 degree, the overturning chuck of the second station is in vertical state or with vertical plane into the angle less than 5 degree；Tumble card
Disk is located at the first station hour rack driving water blocking door makes wafer import and export in open mode, when overturning chuck is located at the second station
Rack drives water blocking door is closed wafer import and export.
Wafer upset as described above of the invention and safety features, further, the overturning chuck includes chuck sheet
Body, claw and fore-set；The side centre position of the chuck body is fixed with rotating shaft, and claw and fore-set are fixed on the chuck sheet
The opposite side of body.
Wafer upset as described above of the invention and safety features, further, the quantity of the claw is two, support
Pawl is adjacent to be fixed in the chuck body；The quantity of the fore-set be two, fore-set it is adjacent be fixed on the chuck sheet
On body；The claw includes jacking part and stop part, and groove is formed between jacking part and stop part.
Wafer upset as described above of the invention and safety features, further, the drive gear includes mutually nibbling
The first gear and second gear of conjunction, the first gear are sector gear, and the first gear is connected with rotating shaft, described second
Wheel and rack is engaged.
Wafer upset of the invention as described above and safety features, further, the equipment also include upset limited block,
Horizontal limiting stud and vertical spacing stud；Horizontal limiting stud and vertically spacing stud are spaced and are fixed on the one of overturning chuck
Side；Upset limited block is fixed on casing, when overturning chuck is located at the first station, water on Horizontal limiting stud and upset limited block
Plane contact, when overturning chuck is located at the second station, vertical spacing stud is contacted with upset limited block left vertical face, will with this
Overturning chuck is limited in the range of 90 degree.
Wafer upset as described above of the invention and safety features, further, the equipment also includes overturning-preventing pillar,
The overturning-preventing pillar is arranged in the casing, overturning-preventing pillar and tumble card in the case where overturning chuck is located at the second station state
The top of disk is relative.
The present invention also provides a kind of method for cleaning wafer, and methods described is using wafer upset as above described in any one and pacifies
Full guard equipment is carried out, and is comprised the following steps：
Step 1, wafer upset and safety features are transported to by the wafer for polishing the horizontality for completing, and are passed in and out by wafer
Mouth enters into box house；
Step 2, wafer is placed on the overturning chuck of wafer upset and safety features, and wafer is in the first station；
Step 3, drive gear drives rotating shaft and overturning chuck rotation, wafer is in the second station；Drive gear band carry-over bar
Mobile, water blocking door blocks wafer import and export；
Step 4, sparge pipe is sprayed water to wafer, and the wafer after mechanical lapping is cleaned.
Method for cleaning wafer as described above of the invention, it is preferred that when overturning chuck is located at the first station, Horizontal limiting spiral shell
Post is contacted with upset limited block upper horizontal plane, and when overturning chuck is located at the second station, vertical spacing stud is left with upset limited block
Side vertical plane contact.
The beneficial effects of the invention are as follows：
Wafer is realized being flexibly connected with overturning chuck by the gravity of itself, and wafer is placed on without drive device on overturning chuck,
It is simple and reliable for structure；Wafer flip angle sets and is less than 90 degree, makes wafer vertical without falling；The switch of water blocking door is accompanied by upset
What the upset of chuck was automatically performed, judge without extra power drive and signal；Flip angle and wafer for chuck
Overturning-preventing has carried out the safe design of fool proof（There is provided upset limited block and overturning-preventing pillar）, improve the reliability of whole system
Property.
Brief description of the drawings
By the detailed description made in conjunction with the following drawings, of the invention above-mentioned and/or other aspects and advantage will become
Become apparent from and be easier to understand, these accompanying drawings are schematical, are not intended to limit the present invention, wherein：
Fig. 1 is the wafer upset of an embodiment of the present invention and safety features schematic diagram；
Fig. 2 is the schematic elevation view of Fig. 1；
Fig. 3 is the right side schematic view of Fig. 1；
Fig. 4 is the schematic top plan view of Fig. 1；
Fig. 5 is the overturning chuck schematic diagram of an embodiment of the present invention；
Fig. 6 is the side schematic view of the overturning chuck of an embodiment of the present invention；
Fig. 7 is the claw schematic diagram of an embodiment of the present invention；
Fig. 8 is the schematic elevation view of Fig. 7；
Fig. 9 is the right side schematic view of Fig. 7；
Figure 10 is the upset limited block schematic diagram of an embodiment of the present invention.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, casing, 2, water blocking door, 3, overturning chuck, 4, upset limited block, 5, first gear, 6, second gear, 7, tooth bar, 8, electricity
Motivation, 9, overturning-preventing pillar, 10, sparge pipe, 11, fore-set, 12, claw, 13, wafer, 14, jacking part, 15, stop part, 16, recessed
Groove, 17, rotating shaft, 18, wafer import and export, 19, Horizontal limiting stud, 20, spacing stud vertically.
Specific embodiment
Hereinafter, wafer of the invention upset and safety features and method for cleaning wafer are described with reference to the accompanying drawings
Embodiment.
The embodiment recorded herein is specific specific embodiment of the invention, for illustrating design of the invention,
It is explanatory and exemplary, should not be construed as the limitation to embodiment of the present invention and the scope of the invention.Except what is recorded herein
Implement exception, those skilled in the art can also be based on the application claims and specification disclosure of that using aobvious
Other technical schemes being clear to, these technical schemes include any obvious using making for the embodiment to recording herein
The technical scheme of substitutions and modifications.
The accompanying drawing of this specification is schematic diagram, aids in illustrating design of the invention, it is schematically indicated the shape of each several part
And its correlation.Note that for the ease of clearly showing the structure of each part of the embodiment of the present invention, between each accompanying drawing
Do not drawn according to identical ratio.Identical reference marker is used to represent identical part.
Fig. 1-4 shows the wafer upset and safety features of an embodiment of the present invention, and it includes：
Casing 1, the side of the casing 1 is provided with wafer and imports and exports 18；In the embodiment show in figure 1, the shape of the casing
It is cubic, being provided with wafer in the side corresponding to casing front view imports and exports 18；
Overturning chuck 3, the overturning chuck 3 is arranged in the casing 1；In the embodiment show in figure 1, at overturning chuck 3
In horizontality；
Rotating shaft 17, rotating shaft 17 is fixed on the side of the overturning chuck 3, and the effect of rotating shaft is to drive rotary chuck rotation；
Drive gear, the drive gear drives the rotating shaft 17 to rotate；
Water blocking door 2, the wafer that the water blocking door 2 is arranged on the casing 1 imports and exports 18 positions；In a kind of specific embodiment,
Water blocking door is arranged on the casing by slideway, can be moved in slideway under the driving of tooth bar；
Sparge pipe 10, the sparge pipe 10 is arranged on the top of the casing 1, positioned at the top of overturning chuck 3；Shown in Fig. 1
Embodiment in, the quantity of sparge pipe is two, and the effect of sparge pipe is to rinse wafer；It is placed on the wafer on overturning chuck 3
After being transformed to vertical state by horizontality, the cleaning fluid sprayed by sparge pipe is cleaned；
Tooth bar 7, one end of the tooth bar 7 is connected with the water blocking door 2, and sliding tooth wheel and rack 7 is meshed；As shown in Figure 3
In embodiment, tooth bar vertical direction is set, and is moved under in the vertical direction under the driving of drive gear；
The overturning chuck 3 that overturning chuck 3 has the first station and the second station, the first station is in horizontality or and horizontal plane
Into the angle less than 5 degree, the overturning chuck 3 of the second station is in vertical state or with vertical plane into the angle less than 5 degree；Upset
Chuck 3 is located at the first station hour rack 7 and drives the water blocking door 2 wafer is imported and exported 18 in open mode, and overturning chuck 3 is located at the
Two station hour rack 7 drives water blocking door 2 wafer is imported and exported 18 and is closed.
The method for cleaning wafer carried out using the said equipment is comprised the following steps：
Step 1, wafer upset and safety features are transported to by the wafer for polishing the horizontality for completing, and are passed in and out by wafer
Mouth enters into box house；
Step 2, wafer is placed on the overturning chuck of wafer upset and safety features, and wafer is in the first station；
Step 3, drive gear drives rotating shaft and overturning chuck rotation, wafer is in the second station；Drive gear band carry-over bar
Mobile, water blocking door blocks wafer import and export；
Step 4, sparge pipe is sprayed water to wafer, and the wafer after mechanical lapping is cleaned.
As shown in Figure 5 and Figure 6, the overturning chuck 3 includes chuck body, claw 12 and fore-set 11；The chuck body
Side centre position be fixed with rotating shaft, claw 12 and fore-set 11 are fixed on the opposite side of the chuck body.
As shown in Figure 5 and Figure 6, the quantity of the claw 12 be two, claw 12 it is adjacent be fixed on the chuck body
On；The quantity of the fore-set 11 is two, and fore-set 11 is adjacent to be fixed in the chuck body；Such as Fig. 7, Fig. 8 and Fig. 9 institute
Show, the claw 12 includes jacking part 14 and stop part 15, groove 16 is formed between jacking part 14 and stop part 15.Claw 12
The Position Design of wafer 13 is contacted into groove type, wafer 13 can be avoided to skid off claw 12.
In an embodiment as illustrated in figure 3, the drive gear includes intermeshing first gear 5 and second gear 6,
The first gear 5 is sector gear, and the first gear 5 is connected with rotating shaft 17, and the second gear 6 is engaged with tooth bar 7.The
One gear 5 figure 1 illustrates motor 8 be rotated by.
In an embodiment as illustrated in figure 3, the equipment also includes upset limited block 4, Horizontal limiting stud 19 and limits vertically
Position stud 20；Horizontal limiting stud and vertical spacing stud interval are fixed on the side of overturning chuck, in reality as shown in Figure 10
Apply in example, Horizontal limiting stud and vertical spacing stud are spaced the side relative with claw for being fixed on overturning chuck；Upset limit
Position block 4 is fixed on 1 on casing, when overturning chuck 3 is located at the first station, level on Horizontal limiting stud 19 and upset limited block 4
Face is contacted, and when overturning chuck 3 is located at the second station, vertical spacing stud 20 is contacted with upset limited block 4 left vertical face, with this
Overturning chuck 3 is limited in the range of 90 degree.Be limited in the range of 90 degree for the rotation of overturning chuck 3 by upset limited block 4, it is to avoid
Flip angle is out of control.
In embodiment shown as shown in Figure 1, Figure 3 and Figure 4, the equipment also includes overturning-preventing pillar 9, the overturning-preventing pillar
9 are arranged in the casing 1, the top of overturning-preventing pillar 9 and overturning chuck 3 in the case where overturning chuck 3 is located at the second station state
Relatively.When the flip angle of overturning chuck 3 is more than 90 degree, wafer 13 has the possibility toppled over, and overturning-preventing branch 9 is used for protecting surprisingly inclines
Wafer 13 after.
Two fore-sets 11 and two claws 12 are fixed in the side of the overturning chuck 3, overturning chuck 3 in horizontality,
Wafer 13 is placed on two fore-sets 11 and two claws 12.Overturning chuck 3 overturns under the driving of motor 8, after upset
Upper, two claws 12 are under for two fore-sets 11；The flip angle of the overturning chuck 3 is controlled at 89 degree so that the quilt of wafer 13
Two claws 12 are held, and lean against on two fore-sets 11.The flip angle of overturning chuck 3 can avoid wafer 13 laterally for 89 degree
Topple over；Two claws 12 contact the Position Designs of wafer 13 into groove, for limiting movement of the wafer 13 after upset；Upset
The function of chuck 3 is that wafer 13 is become into plumbness from horizontality.
For example, motor 8 drives overturning chuck 3 to turn over turning 90 degrees, 90 degree of 5 rotate counterclockwise of sector gear, sector are driven
Taking turns 90 degree of 5 rotate counterclockwise drives the dextrorotation of Knucle-gear 6 to turn 90 degrees, and it is upward that the dextrorotation of Knucle-gear 6 turn 90 degrees band carry-over bar 7
Motion, tooth bar 7 moves drive water blocking door 2 and moves upwards upwards, and water blocking door 2 moves the wafer import and export 18 for blocking casing 1 upwards；
The effect of water blocking door 2 is to block wafer to import and export 18, the water spluttering for preventing the sparge pipe 10 installed in casing 1 from spraying.
Each technical characteristic of above-mentioned disclosure is not limited to disclosed and further feature combination, and those skilled in the art are also
Other combinations between each technical characteristic can be carried out according to the purpose of invention, is defined by the purpose for realizing the present invention.
Claims (8)
1. a kind of wafer overturns and safety features, it is characterised in that including：
Casing, the side of the casing is provided with wafer import and export；
Overturning chuck, the overturning chuck is arranged in the casing；
Rotating shaft, rotating shaft is fixed on the side of the overturning chuck；
Drive gear, the drive gear drives the axis of rotation；
Water blocking door, the wafer that the water blocking door is arranged on the casing imports and exports position；
Sparge pipe, the sparge pipe is arranged on the top of the casing, positioned at the top of overturning chuck；
Tooth bar, one end of the tooth bar is connected with the water blocking door, and sliding tooth wheel and rack is meshed；
Overturning chuck has the first station and the second station, the overturning chuck of the first station be in horizontality or with the horizontal
Angle less than 5 degree, the overturning chuck of the second station is in vertical state or with vertical plane into the angle less than 5 degree；Tumble card
Disk is located at the first station hour rack driving water blocking door makes wafer import and export in open mode, when overturning chuck is located at the second station
Rack drives water blocking door is closed wafer import and export.
2. wafer according to claim 1 overturns and safety features, it is characterised in that the overturning chuck includes card
Disk body, claw and fore-set；The side centre position of the chuck body is fixed with rotating shaft, and claw and fore-set are fixed on the card
The opposite side of disk body.
3. wafer according to claim 2 overturns and safety features, it is characterised in that the quantity of the claw is two
Individual, claw is adjacent to be fixed in the chuck body；The quantity of the fore-set be two, fore-set it is adjacent be fixed on the card
On disk body；The claw includes jacking part and stop part, and groove is formed between jacking part and stop part.
4. wafer according to claim 1 overturns and safety features, it is characterised in that the drive gear includes phase
The first gear and second gear for mutually engaging, the first gear are sector gear, and the first gear is connected with rotating shaft, described
Second gear is engaged with tooth bar.
5. wafer according to claim 1 upset and safety features, it is characterised in that also including upset limited block,
Horizontal limiting stud and vertical spacing stud；Horizontal limiting stud and vertically spacing stud are spaced and are fixed on the one of overturning chuck
Side；Upset limited block is fixed on casing, when overturning chuck is located at the first station, water on Horizontal limiting stud and upset limited block
Plane contact, when overturning chuck is located at the second station, vertical spacing stud is contacted with upset limited block left vertical face.
6. wafer according to claim 1 overturns and safety features, it is characterised in that also including overturning-preventing pillar,
The overturning-preventing pillar is arranged in the casing, overturning-preventing pillar and tumble card in the case where overturning chuck is located at the second station state
The top of disk is relative.
7. a kind of method for cleaning wafer, methods described is using the wafer upset and safeguard protection described in claim any one of 1-6
Equipment is carried out, and is comprised the following steps：
Step 1, wafer upset and safety features are transported to by the wafer for polishing the horizontality for completing, and are passed in and out by wafer
Mouth enters into box house；
Step 2, wafer is placed on the overturning chuck of wafer upset and safety features, and wafer is in the first station；
Step 3, drive gear drives rotating shaft and overturning chuck rotation, wafer is in the second station；Drive gear band carry-over bar
Mobile, water blocking door blocks wafer import and export；
Step 4, sparge pipe is sprayed water to wafer, and the wafer after mechanical lapping is cleaned.
8. method for cleaning wafer according to claim 7, it is characterised in that when overturning chuck is located at the first station, level
Spacing stud is contacted with upset limited block upper horizontal plane, and when overturning chuck is located at the second station, vertical spacing stud is limited with upset
The contact of position block left vertical face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710039040.0A CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710039040.0A CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847730A true CN106847730A (en) | 2017-06-13 |
| CN106847730B CN106847730B (en) | 2019-05-17 |
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ID=59124453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710039040.0A Active CN106847730B (en) | 2017-01-19 | 2017-01-19 | Wafer overturning and safety protection equipment and wafer cleaning method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106847730B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
| CN113745140A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer mechanical arm, wafer horizontal supporting device and supporting method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201425681Y (en) * | 2009-04-30 | 2010-03-17 | 庄添财 | Turnover mechanism |
| CN103811397A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Substrate turning and aligning device |
| US9449849B2 (en) * | 2009-07-21 | 2016-09-20 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device using meander-shaped heating element |
-
2017
- 2017-01-19 CN CN201710039040.0A patent/CN106847730B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201425681Y (en) * | 2009-04-30 | 2010-03-17 | 庄添财 | Turnover mechanism |
| US9449849B2 (en) * | 2009-07-21 | 2016-09-20 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device using meander-shaped heating element |
| CN103811397A (en) * | 2012-11-13 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Substrate turning and aligning device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
| CN113745140A (en) * | 2021-05-07 | 2021-12-03 | 上海大族富创得科技有限公司 | Wafer transfer mechanical arm, wafer horizontal supporting device and supporting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106847730B (en) | 2019-05-17 |
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Effective date of registration: 20230410 Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 100176 No. 1, Taihe 3rd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE (THE 45TH Research Institute OF CETC) |