CN106815429B

CN106815429B - Circuit board lamination deployment method and device

Info

Publication number: CN106815429B
Application number: CN201710028762.6A
Authority: CN
Inventors: 李德恒
Original assignee: Suzhou Wave Intelligent Technology Co Ltd
Current assignee: Suzhou Wave Intelligent Technology Co Ltd
Priority date: 2017-01-16
Filing date: 2017-01-16
Publication date: 2020-02-07
Anticipated expiration: 2037-01-16
Also published as: CN106815429A

Abstract

The invention provides a method and a device for deploying a laminated part of a circuit board, wherein the method for deploying the laminated part of the circuit board comprises the following steps: the method comprises the steps of determining the total number of the plate layers according to signal line attribute information, power line attribute information and ground line attribute information which are included in obtained line attribute information, determining a correspondingly deployed line type for each plate layer, and then determining the relative deployment position of each plate layer according to the correspondingly deployed line type of each plate layer. According to the process, the total number of the slabs is determined based on the acquired line attribute information, and the relative deployment position of each slab is also determined according to the line type of the corresponding deployment of each slab so as to reduce the space of the non-wiring in each slab, so that the utilization rate of the lamination deployment can be improved.

Description

Circuit board lamination deployment method and device

Technical Field

The invention relates to the technical field of computers, in particular to a circuit board lamination deployment method and device.

Background

Circuit boards, as physical carriers for various lines, are one of the important components in electronic devices. Part of the functions of the electronic device are implemented by the circuit board, and therefore, the stacked arrangement of the circuit board layers is very important.

Currently, in the stacked deployment of circuit boards, it is common to select a board layer having an even number of layers in advance according to signal lines, power lines, and ground lines to be deployed, and then deploy relevant lines in the board layer of the even number. There may be some cases where a part of the line cannot be laid due to the lack of space during the deployment of the line. Two additional layers are needed on the basis of the original even number layers, and the added two layers are used for deploying the part of the lines which cannot be laid due to no space.

However, when the partial lines that cannot be laid down due to the lack of space are disposed by using the added two layers, there may be a large amount of space left without wiring in the added two layers, and thus, the utilization rate of the conventional stacked disposition is low.

Disclosure of Invention

The invention provides a circuit board lamination deployment method and device, which can improve the utilization rate of lamination deployment.

In a first aspect, the present invention provides a method for deploying a circuit board lamination, the method comprising:

obtaining line attribute information, wherein the line attribute information includes: signal line attribute information, power line attribute information, and ground line attribute information;

determining the total number of the board layers according to the signal line attribute information, the power line attribute information and the ground line attribute information;

determining the line type of each corresponding board layer;

and determining the relative deployment position of each slab according to the line type correspondingly deployed by each slab.

Preferably, the first and second electrodes are formed of a metal,

the determining the total number of the board layers according to the signal line attribute information, the power line attribute information and the ground line attribute information includes:

determining a first number of the slabs on which the signal lines are deployed according to the number of the signal lines included in the signal line attribute information and the line width corresponding to each signal line, wherein the first number is a rational number;

determining a second number of the slabs on which the power lines are deployed according to the number of the power lines included in the power line attribute information and the line width corresponding to each power line, wherein the second number is a rational number;

determining a third number of the plate layers for deploying the ground wires according to the number of the ground wires included in the ground wire attribute information and the line width corresponding to each ground wire, wherein the third number is a rational number;

determining a total number of the plies based on the first number, the second number, and the third number.

Preferably, the first and second electrodes are formed of a metal,

determining, according to the number of signal lines included in the signal line attribute information and the line width corresponding to each signal line, a first number of the slabs on which the signal lines are disposed, including:

determining a first number of the board layers for disposing the signal lines by using a formula (1) according to the number of the signal lines, the line width corresponding to each signal line and a preset interval between every two adjacent signal lines;

wherein, T is_sCharacterizing the first quantity; the n represents the number of the signal lines; said D_aRepresenting the line width corresponding to the signal line a; said C is₁Characterizing a spacing between each adjacent two of the signal lines; the d characterizes the width of the ply; said K₁Characterizing the first coefficient;

preferably, the first and second electrodes are formed of a metal,

determining a second number of the slabs on which the power lines are deployed according to the number of the power lines included in the power line attribute information and the line width corresponding to each power line, including:

determining a second number of the slabs for deploying the power lines by using a formula (2) according to the number of the power lines, the line width corresponding to each power line and a preset interval between every two adjacent power lines;

wherein, T is_pCharacterizing the second quantity; the m represents the number of the power lines; said D_bRepresenting the line width corresponding to the power line b; said C is₂Characterizing a spacing between each adjacent two of the power lines; the d characterizes the width of the ply; said K₂Characterizing the second coefficient;

preferably, the first and second electrodes are formed of a metal,

determining a third number of the slabs on which the ground wires are deployed according to the number of the ground wires included in the ground wire attribute information and the line width corresponding to each ground wire, including:

determining a third number of the plate layers for deploying the ground wires by using a formula (3) according to the number of the ground wires, the line width corresponding to each ground wire and a preset interval between every two adjacent ground wires;

wherein, T is_gCharacterizing the third quantity; the r represents the number of the ground wires; said D_cRepresenting the line width corresponding to the ground line c; said C is₃Characterizing the interval between every two adjacent ground wires; the d characterizes the width of the ply; said K₃Characterizing the third coefficient.

Preferably, the first and second electrodes are formed of a metal,

said determining a total number of said plies from said first number, said second number, and said third number comprises:

when the first number, the second number and the third number are all integers, determining the total number of the slabs by using a formula (4);

T＝T_s+T_p+T_g(4)

wherein, T is_sCharacterizing the first quantity; the T is_pCharacterizing the second quantity; the T is_gCharacterizing the third quantity; the T characterizes a total number of plies;

determining the total number of plies using equation (5) when any of the first number, the second number, and the third number is a non-integer;

T＝[T_s]+[T_p]+[T_g]+1 (5)

wherein, T is_sCharacterizing the first quantity; the T is_pCharacterizing the second quantity;the T is_gCharacterizing the third quantity; the T characterizes a total number of plies; the [ 2 ]]A representation rounding symbol;

when any two of the first number, the second number and the third number are non-integers, determining whether the sum of fractional parts of the two non-integer numbers is smaller than a preset first threshold, if so, determining the total number of the slabs through a formula (5), otherwise, determining the total number of the slabs through a formula (6);

T＝[T_s]+[T_p]+[T_g]+2 (6)

wherein, T is_sCharacterizing the first quantity; the T is_pCharacterizing the second ply number; the T is_gCharacterizing the third quantity; the T characterizes a total number of plies; the [ 2 ]]A representation rounding symbol;

when the first number, the second number and the third number are all non-integers, sorting the fractional parts of the three non-integer numbers from large to small, and determining the fractional parts which are sorted at the second position and the third position; determining whether the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold, if so, determining the total number of the slabs through a formula (6), and otherwise, determining the total number of the slabs through a formula (7);

T＝[T_s]+[T_p]+[T_g]+3 (7)

wherein, T is_sCharacterizing the first quantity; the T is_pCharacterizing the second quantity; the T is_gCharacterizing the third quantity; the T characterizes a total number of plies; the [ 2 ]]The rounding symbols are characterized.

Preferably, the determining the relative deployment position of each slab according to the line type of the corresponding deployment of each slab includes:

when any one of the number of the slabs corresponding to the signal lines, the number of the slabs corresponding to the power lines and the number of the slabs corresponding to the ground lines is an odd number, determining any one of the slabs with the odd number as a target slab, and deploying the target slab at a middle position; and other slabs are symmetrically arranged on the upper side and the lower side of the target slab layer according to the preset symmetrical arrangement rule and the line type of the other slabs.

In a second aspect, the present invention provides a circuit board stack deployment apparatus, the apparatus comprising:

an obtaining module, configured to obtain line attribute information, where the line attribute information includes: signal line attribute information, power line attribute information, and ground line attribute information;

the first determining module is used for determining the total number of the board layers according to the signal line attribute information, the power line attribute information and the ground line attribute information which are acquired by the acquiring unit;

the second determining module is used for determining the line type correspondingly deployed by each slab layer;

a third determining module, configured to determine a relative deployment position of each slab according to a line type of the corresponding deployment of each slab.

Preferably, the first determining module includes: a first determination unit, a second determination unit, a third determination unit and a fourth determination unit; wherein the content of the first and second substances,

the first determining unit is configured to determine, according to the number of signal lines included in the signal line attribute information and a line width corresponding to each signal line, a first number of slabs on which the signal lines are disposed, where the first number is a rational number;

the second determining unit is configured to determine, according to the number of power lines included in the power line attribute information and a line width corresponding to each power line, a second number of the slabs where the power lines are deployed, where the second number is a rational number;

the third determining unit is configured to determine, according to the number of ground lines included in the ground line attribute information and a line width corresponding to each ground line, a third number of the slab layers on which the ground lines are deployed, where the third number is a rational number;

the fourth determining unit is configured to determine the total number of slabs according to the first number, the second number, and the third number.

Preferably, the first and second electrodes are formed of a metal,

the first determining unit is specifically configured to determine, according to the number of the signal lines, a line width corresponding to each signal line, and a preset interval between every two adjacent signal lines, a first number of the slabs on which the signal lines are disposed by using a formula (1);

and/or the presence of a gas in the gas,

the second determining unit is specifically configured to determine, according to the number of the power lines, a line width corresponding to each power line, and a preset interval between every two adjacent power lines, a second number of the slabs on which the power lines are disposed by using a formula (2);

preferably, the first and second electrodes are formed of a metal,

the third determining unit is specifically configured to determine, according to the number of the ground lines, the line width corresponding to each ground line, and a preset interval between every two adjacent ground lines, a third number of the slab layers on which the ground lines are deployed by using a formula (3);

Preferably, the fourth determination unit includes: a first determining subunit, a second determining subunit, a third determining subunit, and a fourth determining subunit, wherein,

the first determining subunit is configured to determine, when the first number, the second number, and the third number are all integers, a total number of the slabs by using a formula (4);

T＝T_s+T_p+T_g(4)

the second determining subunit is configured to determine, when any one of the first number, the second number, and the third number is a non-integer number, a total number of the slabs using formula (5);

T＝[T_s]+[T_p]+[T_g]+1 (5)

wherein, T is_sCharacterizing the first quantity; the T is_pCharacterizing the second quantity; the T is_gCharacterizing the third quantity; the T characterizes a total number of plies; the [ 2 ]]A representation rounding symbol;

the third determining subunit is configured to, when any two of the first number, the second number, and the third number are non-integers, determine whether a sum of fractional parts of the two non-integer numbers is smaller than a preset first threshold, if so, determine the total number of the slabs by using formula (5), otherwise, determine the total number of the slabs by using formula (6);

T＝[T_s]+[T_p]+[T_g]+2 (6)

the fourth determining subunit is configured to, when the first number, the second number, and the third number are all non-integers, sort the fractional parts of the three non-integer numbers in descending order, and determine the fractional parts sorted in the second and third positions; determining whether the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold, if so, determining the total number of the slabs through a formula (6), and otherwise, determining the total number of the slabs through a formula (7);

T＝[T_s]+[T_p]+[T_g]+3 (7)

Preferably, the first and second electrodes are formed of a metal,

the fourth determining module is specifically configured to determine, when any one of the number of slabs deployed corresponding to the signal line, the number of slabs deployed corresponding to the power line, and the number of slabs deployed corresponding to the ground line is an odd number, any one of the slabs with the odd number as a target slab, and deploy the target slab at an intermediate position; and other slabs are symmetrically arranged on the upper side and the lower side of the target slab layer according to the preset symmetrical arrangement rule and the line type of the other slabs.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a flowchart of a circuit board stack deployment method according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the relative slab disposition of 9 slabs provided by an embodiment of the present invention;

FIG. 3 is a schematic diagram of the relative position of 8 slabs provided by an embodiment of the present invention;

fig. 4 is a schematic diagram of relative position disposition of slabs according to an embodiment of the present invention, wherein the slab includes 9 slabs for simultaneously disposing two types of lines;

fig. 5 is a schematic diagram of the relative position disposition of the slabs, including at least two slabs, for simultaneously disposing 9 slabs of two line types, according to an embodiment of the present invention;

FIG. 6 is a schematic illustration of the relative position of 8 plies provided by another embodiment of the present invention;

fig. 7 is a flowchart of a circuit board stack deployment method according to another embodiment of the invention;

FIG. 8 is a schematic illustration of a relative slab position deployment of 8 slabs provided in accordance with yet another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a circuit board stack deployment apparatus according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a circuit board stack deployment apparatus according to another embodiment of the present invention;

fig. 11 is a schematic structural diagram of a circuit board stack deployment apparatus according to another embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer and more complete, the technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention, and based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the scope of the present invention.

As shown in fig. 1, an embodiment of the present invention provides a method for laying up a circuit board lamination, which may include the following steps:

step 101: obtaining line attribute information, wherein the line attribute information includes: signal line attribute information, power line attribute information, and ground line attribute information;

step 102: determining the total number of the board layers according to the signal line attribute information, the power line attribute information and the ground line attribute information;

step 103: determining the line type of each corresponding board layer;

step 104: and determining the relative deployment position of each slab according to the line type correspondingly deployed by each slab.

According to the embodiment shown in fig. 1, the circuit board stack deployment method comprises the following steps: the method comprises the steps of determining the total number of the plate layers according to signal line attribute information, power line attribute information and ground line attribute information which are included in obtained line attribute information, determining a correspondingly deployed line type for each plate layer, and then determining the relative deployment position of each plate layer according to the correspondingly deployed line type of each plate layer. Through the process, the total number of the board layers is determined based on the acquired line attribute information, and the relative deployment position of each board layer is also determined according to the line type correspondingly deployed by each board layer, so that the space without wiring in each board layer is reduced, and therefore the utilization rate of the lamination deployment can be improved.

In an embodiment of the present invention, the determining the total number of the board layers according to the signal line attribute information, the power line attribute information, and the ground line attribute information includes:

The content included in the signal line attribute information, the power line attribute information, and the ground line attribute information may be determined according to specific service requirements, for example, the number of lines, the line width of each line, and the material of each line may be included.

In this embodiment, the signal line attribute information includes the number of signal lines and the line width corresponding to each signal line, for example, the number of signal lines is 3, which are respectively a signal line 1, a signal line 2, and a signal line 3; the line width of the signal line 1 was 10 mils, the line width of the signal line 2 was 15 mils, and the line width of the signal line 3 was 18 mils. Determining a first number of board layers for disposing the signal lines according to the number of the signal lines and the line width corresponding to each signal line, where the first number is a rational number, that is, may be an integer, such as 4; but also a decimal number such as 4.3.

The power line attribute information in this embodiment includes the quantity of power line and the line width that each power line corresponds, for example the quantity of power line is 4, is power line 1, power line 2, power line 3 and power line 4 respectively, and wherein, the line width of power line 1 is 8 mils, the line width of power line 2 is 20 mils for the line width of 15mil power line 3 and 18 mils for the line width of power line 4. Determining a second number of the board layers for disposing the power lines according to the number of the power lines and the line width corresponding to each power line, where the second number is a rational number, that is, may be an integer, such as 5; but also a decimal number such as 4.8.

In this embodiment, the ground line attribute information includes the number of ground lines and the line width corresponding to each ground line, for example, the number of ground lines is 2, and the number of ground lines is respectively ground line 1 and ground line 2, where the line width of ground line 1 is 12 mils and the line width of low line 2 is 15 mils. Determining a third number of the plate layers for arranging the ground wires according to the number of the ground wires and the line width corresponding to each ground wire, where the third number is a rational number, that is, may be an integer, such as 2; but also a decimal number, such as 1.8.

And determining the total number of the slabs according to the determined first number of the slabs on which the signal lines are deployed, the determined second number of the slabs on which the power lines are deployed and the determined third number of the slabs on which the ground lines are deployed.

According to the embodiment, the total number of the slabs is determined by determining the number of the slabs for deploying the signal lines according to the number of the signal lines and the width corresponding to each signal line, determining the number of the slabs for deploying the power lines according to the number of the power lines and the width corresponding to each power line, and determining the number of the slabs for deploying the ground lines according to the number of the ground lines and the width corresponding to each ground line, so that the determined total number of the slabs can meet the deployment requirement of the lines, and the vacant space of each slab can be reduced.

In an embodiment of the present invention, the determining, according to the number of signal lines included in the signal line attribute information and the line width corresponding to each signal line, a first number of slabs on which the signal lines are disposed includes:

the predetermined interval C between every two adjacent signal lines₁And a first coefficient K₁Each of the signal lines may be determined according to specific service requirements, for example, the set interval C between every two adjacent signal lines₁A first coefficient K of 5mil₁Is 1.2.

The width d of the plate layer is determined according to the width of the selected plate, for example, the width of the selected plate is 20 cm, and the width d of the plate layer is 20 cm.

In the present embodiment, there are, for example, 100 signal lines in number, where the line widths D of the signal lines 1 to 30₁A line width D of 10mil and signal lines 31 to 70₂A line width D of 15mil and signal lines 71 to 100₃Was 18 mil. And in advanceThe set interval C between every two adjacent signal lines₁A first coefficient K of 5mil₁1.2, the selected width D of the board layer is 20 cm, when the first number of the board layers for arranging the signal lines is determined, the number n of the signal lines and the line width D corresponding to each signal line are calculated₁To D₃And a preset interval C between every two adjacent signal lines₁Width d of the sheet layer and first coefficient K₁Substituting into formula (1), the first number of slabs on which the signal lines are disposed is determined to be 2.47 by formula (1), and it can be seen that the determined first number is a decimal.

According to the embodiment, in the process of determining the number of the slabs on which the signal lines are deployed, the number of the slabs on which the signal lines are deployed is determined to be high in accuracy due to the fact that parameters such as the number of the signal lines, the line width corresponding to each signal line, the interval between every two adjacent signal lines, the width of the slab and the like are integrated.

In an embodiment of the present invention, the determining, according to the number of power lines included in the power line attribute information and the line width corresponding to each power line, a second number of slabs on which the power lines are disposed includes:

the preset interval C between every two adjacent power lines₂And a second coefficient K₂Can be determined according to specific service requirements, for example, the set interval C between every two adjacent power lines₂A second coefficient K of 7mil₂Is 1.1.

In the present embodiment, there are, for example, 120 power supply lines in number, where the line widths D of the power supply lines 1 to 40₁Line width D of power supply line 41-80 of 10mil₂A line width D of 9mil and power lines 81-100₃Line width D of 18mil and power lines 101 to 120₄Was 13 mil. And the preset interval C between every two adjacent power lines₂A second coefficient K of 7mil₁1.1, the selected width D of the board layer is 20 cm, and then when determining the second number of the board layers for disposing the power lines, the number m of the power lines and the line width D corresponding to each signal line are determined₁To D₄A preset interval C between every two adjacent power lines₂Width d of the sheet layer and a second coefficient K₂Substituting into equation (2), the second number of slabs on which the power supply line is disposed is determined to be 3.24 by equation (2), and it can be seen that the determined second number is a decimal.

According to the embodiment, in the process of determining the number of the slabs on which the power lines are deployed, the number of the slabs on which the power lines are deployed is determined to be high in accuracy due to the fact that parameters such as the number of the power lines, the line width corresponding to each power line, the interval between every two adjacent power lines, the width of the slabs are integrated.

In an embodiment of the present invention, the determining, according to the number of ground lines included in the ground line attribute information and the line width corresponding to each of the ground lines, a third number of the slab layers on which the ground lines are disposed includes:

The preset interval C between every two adjacent ground wires₃And a third coefficient K₃Each of the distances may be determined according to specific service requirements, for example, the set distance C between every two adjacent ground lines₃A third coefficient K of 6mil₃Is 1. The width d of the plate layer is determined according to the width of the selected plate, for example, the width of the selected plate is 20 cm, and the width d of the plate layer is 20 cm.

In the present embodiment, for example, the number r of the ground lines is 92, where the line widths D of the ground lines 1 to 40₁Line width D of 10mil, ground line 41 to 50₂Line width D of 9mil, ground line 51 to 92₃Is 15 mil. And the preset interval C between every two adjacent ground wires₃A third coefficient K of 4mil₁1, the selected slab width D is 20 cm, and then when determining the third number of slabs on which the ground wires are deployed, the number r of the ground wires and the line width D corresponding to each ground wire are calculated₁To D₃A preset interval C between every two adjacent ground wires₃Width d of the sheet layer and a third coefficient K₃Substituting into formula (3), the third number of the slabs where the ground wires are disposed is determined to be 1.86 by formula (3), and it can be seen that the determined third number is a decimal.

According to the embodiment, in the process of determining the number of the ground wire deployment slabs, the number of the ground wires, the line width corresponding to each ground wire, the interval between every two adjacent ground wires, the width of the slab and other parameters are integrated, so that the accuracy of determining the number of the ground wire deployment slabs is high.

In one embodiment of the present invention, said determining the total number of plies from said first number, said second number and said third number comprises:

T＝T_s+T_p+T_g(4)

T＝[T_s]+[T_p]+[T_g]+1 (5)

T＝[T_s]+[T_p]+[T_g]+2 (6)

T＝[T_s]+[T_p]+[T_g]+3 (7)

For the above-mentioned case where the first number, the second number and the third number are all integers, for example, the determined first number is 3, the determined second number is 3 and the determined third number is 4, and it can be seen that the first number, the second number and the third number are all integers, and then the first number 3, the second number 3 and the third number 4 are directly substituted into the formula (4), so as to determine that the total number of the slabs is 10.

For the case where any one of the first number, the second number, and the third number is a non-integer, for example, the determined first number is 3, the determined second number is 3.5, and the determined third number is 4, it can be seen that the first number 3 and the third number 4 are both integers, and the second number 3.5 is a decimal number, the first number 3, the second number 3.5, and the third number 4 are substituted into formula (5), and after the first number 3, the second number 3.5, and the third number 4 are rounded in formula (5), the total number of slabs is determined to be 11.

In the case where any two of the first number, the second number, and the third number are non-integers, the fractional part of the non-integer number may be obtained by using the following formula (8);

Y_x＝X_α-[X_α](8)

wherein, the above Y_αCharacterizing the fractional part of the quantity X; x is above_αCharacterizing the α th quantity, the above]A representation rounding symbol;

for example, the first number is determined to be 3.5, the second number to be 4, and the third number to be 2.3. The first number 3.5 and the third number 2.3 are determined to be non-integers, the fractional part of the first number is determined to be 0.5 and the fractional part of the third number is determined to be 0.3 according to equation (8). Then, it is determined whether the sum of the two fractional parts 0.8 is smaller than a set first threshold, where the first threshold can be determined according to the service requirement, for example, the first threshold is set to 0.9, and obviously, the sum of the two fractional parts 0.8 is smaller than the first threshold 0.9, then the total number of slabs is determined to be 10 by formula (5). If the first threshold value is set to 0.7, the sum of the two fractional parts is determined to be greater than the first threshold value of 0.7, and the total number of plies is determined to be 11 by equation (6).

For the case where the first number, the second number, and the third number are all non-integers, there are three cases of determining the three decimal parts in this case:

case 1: the three fractional parts are all equal;

for example, if the three fractional parts are 0.3, then when the fractional parts are sorted from large to small, the fractional parts sorted in the second and third positions are both determined to be 0.3.

Case 2: any two decimal parts in the three decimal parts are equal;

for example, if the three fractional parts are 0.3, and 0.2, respectively, then when sorting is performed in the order from large to small, the fractional part sorted at the second bit is determined to be 0.3 and the fractional part at the third bit is determined to be 0.2. If the three fractional parts are 0.3, 0.2 and 0.2 respectively, the fractional parts at the second position and the third position are 0.2 respectively when the three fractional parts are sorted from large to small.

Case 3: the three fractional parts are all unequal;

for example, if the three fractional parts are 0.4, 0.3, and 0.2, respectively, then when sorting is performed in the order from large to small, the fractional part sorted at the second bit is determined to be 0.3 and the fractional part at the third bit is determined to be 0.2.

The following example is for the case where the fractional parts are not equal, such as the first number being determined to be 2.5, the second number to be 2.3, and the third number to be 4.2. The first number of fractional parts is determined to be 0.5, the second number of fractional parts is determined to be 0.3, and the third number of fractional parts is determined to be 0.2, respectively, using equation (8). Then, the three decimal parts determined above are sorted from high to low, and it can be seen that the decimal part located at the second bit is determined to be 0.3, the decimal part located at the third bit is determined to be 0.2, and then the sum of the decimal parts located at the second bit and the third bit is determined to be 0.5. Then, it is determined whether the sum of the two fractional parts 0.5 is smaller than a set second threshold, where the second threshold can be determined according to the service requirement, for example, the second threshold is set to 0.9, and obviously, the sum of the two fractional parts 0.5 is smaller than the second threshold 0.9, then the total number of slabs is determined to be 9 by formula (6). If it is determined that the sum of the two fractional parts 0.5 is greater than the second threshold value, the total number of plies is determined to be 10 by equation (7).

According to the above-described embodiment, by calculating the total number of plies corresponding to the case according to the specific case of determining whether the first number, the second number, and the third number are integers, the accuracy of determining the total number of plies is high.

In an embodiment of the present invention, the determining a line type corresponding to each of the slabs includes:

when the first number, the second number and the third number are positive integers, determining the slabs of the first number as slabs on which the signal lines are correspondingly arranged, determining the slabs of the second number as slabs on which the power lines are correspondingly arranged, and determining the slabs of the third number as slabs on which the ground lines are correspondingly arranged;

when any one of the first number, the second number, and the third number is a non-integer, there are three cases:

case 1: when the first number is determined to be a non-integer, determining the first number plus 1 as a corresponding signal line-deployed slab, determining the second number of slabs as corresponding power line-deployed slabs, and determining the third number of slabs as corresponding ground line-deployed slabs.

Case 2: when the second number is determined to be a non-integer, the first number of slabs are determined to be corresponding slabs on which the signal lines are deployed, the second number plus 1 of slabs are determined to be corresponding slabs on which the power lines are deployed, and the third number of slabs are determined to be corresponding slabs on which the ground lines are deployed.

Case 3: when the third number is determined to be a non-integer, the first number of slabs are determined to be corresponding slabs on which the signal lines are deployed, the second number of slabs are determined to be corresponding slabs on which the power lines are deployed, and the third number plus 1 is determined to be corresponding slabs on which the ground lines are deployed.

When any two of the first number, the second number, and the third number are non-integers, there are six cases:

case 1: when the first number and the second number are determined to be non-integers, and the sum of the decimal part of the first number and the decimal part of the second number is smaller than a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining the remaining 1 of the slabs to be correspondingly disposed with the signal lines and the power lines.

Case 2: when the first number and the second number are determined to be non-integers, and the sum of the decimal part of the first number and the decimal part of the second number is greater than or equal to a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining a first laminate of the remaining 2 of the board layers as corresponding to the signal lines; the second laminate of the remaining 2 of the plies is determined to be the corresponding deployment of the power conductor.

Case 3: when the first number and the third number are determined to be non-integers, and the sum of the decimal part of the first number and the decimal part of the third number is smaller than a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining the remaining 1 slab as the corresponding disposition of the signal line and the ground line.

Case 4: when the first number and the third number are determined to be non-integers, and the sum of the decimal part of the first number and the decimal part of the third number is greater than or equal to a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining a first laminate of the remaining 2 of the board layers as corresponding to the signal lines; and determining the second laminate in the remaining 2 laminates as the corresponding arrangement of the ground wire.

Case 5: when the second number and the third number are determined to be non-integers, and the sum of the decimal part of the second number and the decimal part of the third number is smaller than a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining the remaining 1 of the slabs as corresponding to the power line and the ground line.

Case 6: when the second number and the third number are determined to be non-integers, and the sum of the decimal part of the second number and the decimal part of the third number is greater than or equal to a preset first threshold value, determining the slabs of the first number as slabs on which the signal lines are correspondingly deployed, determining the slabs of the second number as slabs on which the power lines are correspondingly deployed, and determining the slabs of the third number as slabs on which the ground lines are correspondingly deployed; determining a first laminate of the remaining 2 of the plies as corresponding to the deployment of the power line; and determining the second laminate in the remaining 2 laminates as the corresponding arrangement of the ground wire.

When the first number, the second number, and the third number are all non-integers, there are six cases:

case 1: when the first number of fractional parts, the second number of fractional parts and the third number of fractional parts are sorted in descending order, determining that the second-order and third-order fractional parts include: the second number of fractional portions and the third number of fractional portions; when the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold value, determining the first number of slabs as slabs corresponding to the arrangement of the signal lines, determining the second number of slabs as slabs corresponding to the arrangement of the power lines, and determining the third number of slabs as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 2 of the board layers as corresponding to the signal lines; determining a second laminate of the remaining 2 of the plies to correspondingly deploy the power and ground lines.

Case 2: when the first number of decimal parts, the second number of decimal parts and the third number of decimal parts are all different, the determining that the decimal parts in the second and third positions are sorted according to the descending order comprises: a second number of decimal parts, a third number of decimal parts; when the sum of the decimal parts located at the second position and the third position is determined to be larger than a preset second threshold value, determining the slabs of the first number as slabs corresponding to the arrangement of the signal lines, determining the slabs of the second number as slabs corresponding to the arrangement of the power lines, and determining the slabs of the third number as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 3 of the plies as corresponding to the deployment of the signal lines; determining a second laminate of the remaining 3 of the plies as corresponding to the deployment of the power line; and determining a third laminate in the remaining 3 laminates as corresponding to the arrangement of the ground wire.

Case 3: when the first number of decimal parts, the second number of decimal parts and the third number of decimal parts are all different, the determining that the decimal parts in the second and third positions are sorted according to the descending order comprises: the first number of decimal parts and the third number of decimal parts are the third number of decimal parts; when the sum of the decimal parts located at the second position and the third position is determined to be smaller than a preset second threshold value, determining the first number of slabs as slabs corresponding to the arrangement of the signal lines, determining the second number of slabs as slabs corresponding to the arrangement of the power lines, and determining the third number of slabs as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 2 of the plies as corresponding to the deployment of the power line; determining a second laminate of the remaining 2 of the board layers to dispose the signal line and the ground line correspondingly.

Case 4: when the first number of decimal parts, the second number of decimal parts and the third number of decimal parts are all different, the determining that the decimal parts in the second and third positions are sorted according to the descending order comprises: the first number of decimal parts and the third number of decimal parts are the third number of decimal parts; when the sum of the decimal parts located at the second position and the third position is determined to be larger than a preset second threshold value, determining the slabs of the first number as slabs corresponding to the arrangement of the signal lines, determining the slabs of the second number as slabs corresponding to the arrangement of the power lines, and determining the slabs of the third number as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 3 of the plies as corresponding to the deployment of the power line; determining a second laminate of the remaining 3 of the plies to be correspondingly deployed with the signal lines; and determining a third laminate in the remaining 3 laminates as corresponding to the arrangement of the ground wire.

Case 5: when the first number of decimal parts, the second number of decimal parts and the third number of decimal parts are all different, the determining that the decimal parts in the second and third positions are sorted according to the descending order comprises: a first number of decimal parts, a third number of decimal parts being a second number of decimal parts; when the sum of the decimal parts located at the second position and the third position is determined to be smaller than a preset second threshold value, determining the first number of slabs as slabs corresponding to the arrangement of the signal lines, determining the second number of slabs as slabs corresponding to the arrangement of the power lines, and determining the third number of slabs as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 2 plies as the corresponding ground wire; determining a second laminate of the remaining 2 of the board layers to dispose the signal line and the power line correspondingly.

Case 6: when the first number of decimal parts, the second number of decimal parts and the third number of decimal parts are all different, the determining that the decimal parts in the second and third positions are sorted according to the descending order comprises: a first number of decimal parts, a third number of decimal parts being a second number of decimal parts; when the sum of the decimal parts located at the second position and the third position is determined to be larger than a preset second threshold value, determining the slabs of the first number as slabs corresponding to the arrangement of the signal lines, determining the slabs of the second number as slabs corresponding to the arrangement of the power lines, and determining the slabs of the third number as slabs corresponding to the arrangement of the ground lines; determining a first laminate of the remaining 3 of the plies as corresponding to the deployment of the signal lines; determining a second laminate of the remaining 3 of the plies as corresponding to the deployment of the power line; and determining a third laminate in the remaining 3 laminates as corresponding to the arrangement of the ground wire.

According to the embodiment, the corresponding line types are correspondingly deployed for each slab according to the specific condition that whether the first number, the second number and the third number are integers or not, so that the matching degree of the line types correspondingly deployed for each slab is high.

In an embodiment of the present invention, the determining the relative deployment position of each slab according to the line type of the corresponding deployment of each slab includes:

For the above situation, for example, if the number of the slabs corresponding to the signal lines is odd 5, the number of the slabs corresponding to the power lines is 2, and the number of the slabs corresponding to the ground lines is 2, then the total number of the slabs is 9, it can be seen that the fifth layer is an intermediate layer, as shown in fig. 2 (the insulating layer in the figure is only schematic, and is not described herein), one layer in the signal lines is determined as a target slab, and is arranged at the fifth layer L5 in the intermediate layer. And the rest of the other slabs are symmetrically arranged on the upper side and the lower side of the fifth layer according to a symmetrical arrangement rule, it can be seen from fig. 2 that 2 slabs corresponding to the power line are respectively arranged on the fourth layer L4 and the sixth layer L6, any two of the 4 slabs corresponding to the signal line except the target slab are symmetrically arranged on the third layer L3 and the seventh layer L7, 2 slabs corresponding to the ground line are symmetrically arranged on the second layer L2 and the eighth layer L8, and the rest 2 slabs corresponding to the signal line are symmetrically arranged on the first layer L1 and the ninth layer L9.

The above method of determining the relative deployment position of each slab is only one way, and the following description will be made for different cases:

case 1: when the number of the slabs on which the signal lines are correspondingly disposed, the number of the slabs on which the power lines are correspondingly disposed, and the number of the slabs on which the ground lines are correspondingly disposed are even numbers, the relative disposition position of each slab can be performed according to the symmetrical disposition rule. For example, the number of the slabs where the signal lines are correspondingly disposed is 4, the number of the slabs where the power lines are correspondingly disposed is 2, and the number of the slabs where the ground lines are correspondingly disposed is 2, then the total number of the slabs is 8, as shown in fig. 3 (an insulating layer in the drawing is only illustrated, and is not described herein), the number of the slabs where the power lines are correspondingly disposed is 2, which are disposed according to a symmetric arrangement rule, at the fourth layer L4 and the fifth layer L5, any two of the 4 slabs where the signal lines are correspondingly disposed are symmetrically disposed at the third layer L3 and the sixth layer L6, the 2 slabs where the ground lines are correspondingly disposed are symmetrically disposed at the second layer L2 and the seventh layer L7, and the remaining 2 slabs where the signal lines are correspondingly disposed are symmetrically disposed at the first layer L1 and the eighth layer L8.

Case 2: when two types of lines are deployed in one laminate at the same time, the relative deployment position of each laminate can be performed according to the symmetrical arrangement rule. For example, if the number of the signal lines corresponding to the deployed layer is 4, the number of the power lines corresponding to the deployed layer is 2, the number of the ground lines corresponding to the deployed layer is 2, and the number of the ground lines corresponding to the deployed layer is 1, the total number of the layers is 9, it can be seen that the fifth layer is an intermediate layer, as shown in fig. 4 (the insulating layer in the figure is merely schematic, and is not described herein), a layer in which the ground lines and the power lines are deployed simultaneously is determined as a target layer, and is arranged at the fifth layer L5 in the intermediate layer. And the rest of the other slabs are symmetrically arranged on the upper side and the lower side of the fifth layer according to a symmetrical arrangement rule, it can be seen from fig. 4 that 2 slabs corresponding to the power line are respectively arranged on the fourth layer L4 and the sixth layer L6, any two of the 4 slabs corresponding to the signal line except the target slab are symmetrically arranged on the third layer L3 and the seventh layer L7, 2 slabs corresponding to the ground line are symmetrically arranged on the second layer L2 and the eighth layer L8, and the rest 2 slabs corresponding to the signal line are symmetrically arranged on the first layer L1 and the ninth layer L9.

Case 3: when there are at least one layer board in which two types of lines are deployed simultaneously, the relative deployment position of each layer board can also be performed according to the symmetrical arrangement rule. For example, the number of the slabs on which the signal line is disposed correspondingly is 2, the number of the slabs on which the power line is disposed correspondingly is 1, the number of the slabs on which the ground line is disposed correspondingly is 2, and the number of the slabs on which the ground line and the signal line are disposed correspondingly is 4, then the total number of the slabs is 9, as shown in fig. 5 (the insulating layer in the figure is only illustrated, and is not described here), 1 slab on which the power line is disposed correspondingly is disposed in the fifth layer L5, and 4 slabs on which the ground line and the signal line are disposed simultaneously are symmetrically disposed in the second layer L2, the third layer L3, the sixth layer L6, and the seventh layer L7, respectively. It should be noted that since any two of the 4 board layers where the ground line and the signal line are disposed at the same time are adjacent positions, the same line types on the upper and lower two board layers are to be arranged at opposite positions to avoid interference, as shown in fig. 5, the ground line in the third layer L3 is at the a position, the signal line is at the B position, and then the ground line in the fourth layer L4 adjacent thereto is at the B position, and the signal line is at the a position.

In all cases, each slab disposed oppositely may change its position according to specific situations, but it is to be ensured that the correspondingly disposed line types thereof are to be symmetrically disposed, for example, as shown in fig. 3, it may be modified as shown in fig. 6 according to the service requirements, and it will be seen that 2 slabs disposed correspondingly to the power lines are respectively disposed at the second layer L2 and the seventh layer L7, and 2 slabs disposed correspondingly to the ground lines are symmetrically disposed at the fourth layer L4 and the fifth layer L5. Other situations may also make this change according to the service requirement, and will not be described herein.

According to the embodiment, the relative deployment position of each slab layer is determined according to the symmetrical arrangement rule according to the line type correspondingly deployed by each slab layer, so that the crosstalk between the slab layers can be reduced.

The following takes a Printed Circuit Board (PCB) as an example. A circuit board lamination deployment method is developed, and as shown in fig. 5, the circuit board lamination deployment method may include the following steps:

step 701: the interval between every two adjacent signal lines, the interval between every two adjacent power lines, the interval between every two adjacent ground lines, the slab width, the first coefficient, the second coefficient, the third coefficient, the first threshold value, and the second threshold value are set in advance.

In this step, the interval between every two adjacent signal lines is set to 4 mils, the interval between every two adjacent power supply lines is set to 6 mils, and the interval between every two adjacent ground lines is set to 5 mils in advance. The ply width was 20 cm, the first factor was 0.98, the second factor was 1.2, the third factor was 1, the first threshold was 0.95 and the second threshold was 0.9.

Step 702: the number of the signal lines, the line width and the number of the power lines corresponding to each signal line, the line width and the number of the ground lines corresponding to each power line and the line width corresponding to each ground line are obtained.

In this step, the number of the signal lines is 150, the line widths corresponding to the signal lines 1 to 50 are 10 mils, the line widths corresponding to the signal lines 51 to 100 are 15 mils, and the line widths corresponding to the signal lines 101 to 150 are 8 mils. The number of the obtained power lines is 100, the line width corresponding to the power lines 1 to 50 is 10mil, and the line width corresponding to the power lines 51 to 100 is 8 mil. The number of the obtained ground lines is 80, the line widths corresponding to the ground lines 1 to 50 are 6mil, and the line widths corresponding to the signal lines 51 to 80 are 15 mil.

Step 703: determining a first number of the board layers for arranging the signal lines according to the number of the signal lines, the line width corresponding to each signal line, a first coefficient and the width of the board layers; determining a second number of the slabs on which the power lines are deployed according to the number of the power lines, the line width corresponding to each power line, a second coefficient and the slab width; and determining the third number of the layer layers for arranging the ground wires according to the number of the ground wires, the line width corresponding to each ground wire, the second coefficient and the layer width.

In this step, the first number of slabs on which the signal lines are disposed is determined to be 2.8 according to formula (1). The second number of slabs on which the power line is disposed is determined to be 2.29 according to equation (2), and the third number of slabs on which the power line is disposed is determined to be 1.46 according to equation (3).

Step 704: judging whether the first quantity, the second quantity and the third quantity are integers, and executing a step 705 when the three quantities are integers; when any one of the three numbers is a non-integer, executing step 706; when any two of the three numbers are non-integers, performing step 707; when all three numbers are non-integers, step 709 is executed.

In this step, if it is determined that the first number 2.8, the second number 2.29 and the third number 1.46 are all non-integers, step 709 is executed.

Step 705: using the formula T ═ T_s+T_p+T_gDetermining a total number of plies;

step 706: using the formula T ═ T_s]+[T_p]+[T_g]+1 determining the total number of plies;

step 707: judging whether the sum of the fractional parts of the two non-integer numbers is smaller than a preset first threshold value, if so, executing a step 706, otherwise,

step 708: using the formula T ═ T_s]+[T_p]+[T_g]+2 determines the total number of plies.

In this step, the total number of plies determined was 7.

Step 709: sorting the three fractional parts with non-integer quantity according to the descending order, and determining the fractional parts which are sorted at the second position and the third position; and determining whether the sum of the fractional parts located in the second bit and the third bit is less than a preset second threshold, if so, executing step 708, otherwise, executing step 710.

In this step, the fractional parts of the three non-integers are 0.8, 0.29 and 0.46, respectively, and after sorting in descending order, the fractional part located at the second bit is determined to be 0.46, the fractional part located at the third bit is determined to be 0.29, the sum 0.75 of 0.46 and 0.29 is determined to be less than the set second threshold value 0.9, and step 708 is executed.

Step 710: using the formula T ═ T_s]+[T_p]+[T_g]+3 determining the total number of plies;

step 711: and determining the type of the line correspondingly deployed by each slab.

In this step, it is determined that 3 slabs are determined as slabs corresponding to the deployed signal lines, 2 slabs are determined as slabs corresponding to the deployed power lines, 1 slab is determined as a slab corresponding to the deployed ground lines, and 1 slab is determined as a slab corresponding to the deployed ground lines and the deployed power lines.

Step 712: and determining the relative deployment position of each slab according to the line type correspondingly deployed by each slab.

In this step, as shown in fig. 8 (the insulating layer in the figure is only schematic, and details are not repeated here), one slab layer on which the power line and the ground line are correspondingly disposed is disposed on the fourth layer, two slab layers of the 3 slab layers on which the signal line is correspondingly disposed are disposed on the third layer and the fifth layer, the 3 slab layers on which the power line is correspondingly disposed are disposed on the second layer and the sixth layer, the remaining one slab layer on which the signal line is correspondingly disposed is disposed on the first layer, and the 1 slab layer on which the ground line is correspondingly disposed is disposed on the seventh layer.

As shown in fig. 9, an embodiment of the present invention provides a circuit board stack deployment apparatus, including:

an obtaining module 901, configured to obtain line attribute information, where the line attribute information includes: signal line attribute information, power line attribute information, and ground line attribute information;

a first determining module 902, configured to determine the total number of board layers according to the signal line attribute information, the power line attribute information, and the ground line attribute information acquired by the acquiring unit 901;

a second determining module 903, configured to determine a line type that each slab is deployed correspondingly;

a third determining module 904, configured to determine a relative deployment position of each slab according to a line type of the corresponding deployment of each slab.

As an embodiment shown in fig. 9, the circuit board stack deployment apparatus comprises: the device comprises an acquisition module, a first determination module, a second determination module and a third determination module; the first determining module determines the total number of the plate layers according to the signal line attribute information, the power line attribute information and the ground line attribute information acquired by the acquiring unit; the second determining module determines the line type of each corresponding board layer; and a third determining module determines the relative deployment position of each slab according to the line type correspondingly deployed by each slab. Through the process, the total number of the board layers is determined based on the acquired line attribute information, and the relative deployment position of each board layer is also determined according to the line type correspondingly deployed by each board layer, so that the space without wiring in each board layer is reduced, and therefore the utilization rate of the lamination deployment can be improved.

In an embodiment of the present invention, as shown in fig. 10, the first determining module 902 includes: a first determination unit 1001, a second determination unit 1002, a third determination unit 1003, and a fourth determination unit 1004; wherein the content of the first and second substances,

the first determining unit 1001 is configured to determine, according to the number of signal lines included in the signal line attribute information and a line width corresponding to each signal line, a first number of slabs on which the signal lines are disposed, where the first number is a rational number;

the second determining unit 1002 is configured to determine, according to the number of power lines included in the power line attribute information and a line width corresponding to each power line, a second number of slabs on which the power lines are deployed, where the second number is a rational number;

the third determining unit 1003 is configured to determine, according to the number of the ground lines included in the ground line attribute information and the line width corresponding to each ground line, a third number of the slab layers on which the ground lines are deployed, where the third number is a rational number;

the fourth determining unit 1004 is configured to determine the total number of slabs according to the first number, the second number, and the third number.

In an embodiment of the present invention, the first determining unit 1001 is specifically configured to determine, according to the number of the signal lines, a line width corresponding to each signal line, and a preset interval between every two adjacent signal lines, a first number of the board layers on which the signal lines are disposed by using a formula (1);

in an embodiment of the present invention, the second determining unit 1002 is specifically configured to determine, according to the number of the power lines, a line width corresponding to each power line, and a preset interval between every two adjacent power lines, a second number of the board layers on which the power lines are disposed by using a formula (2);

in an embodiment of the present invention, the third determining unit 1003 is specifically configured to determine, according to the number of the ground lines, the line width corresponding to each ground line, and a preset interval between every two adjacent ground lines, a third number of the plate layers on which the ground lines are disposed by using a formula (3);

In an embodiment of the present invention, as shown in fig. 11, the fourth determining unit 1002 includes: a first determining sub-unit 1101, a second determining sub-unit 1102, a third determining sub-unit 1103, and a fourth determining sub-unit 1104, wherein,

the first determining subunit 1101 is configured to determine the total number of the slabs by using formula (4) when the first number, the second number, and the third number are all integers;

T＝T_s+T_p+T_g(4)

the second determining subunit 1102 is configured to determine, when any one of the first number, the second number, and the third number is a non-integer, a total number of the slabs by using formula (5);

T＝[T_s]+[T_p]+[T_g]+1 (5)

the third determining subunit 1103 is configured to, when any two of the first number, the second number, and the third number are non-integers, determine whether a sum of fractional parts of the two non-integer numbers is smaller than a preset first threshold, if so, determine the total number of slabs through formula (5), otherwise, determine the total number of slabs by using formula (6);

T＝[T_s]+[T_p]+[T_g]+2 (6)

the fourth determining subunit 1104, configured to, when the first number, the second number, and the third number are all non-integers, sort the fractional parts of the three non-integer numbers in descending order, and determine the fractional parts sorted in the second and third positions; determining whether the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold value, if so, determining the total number of the slabs through a formula (6), and otherwise, determining the total number of the slabs through a formula (7);

T＝[T_s]+[T_p]+[T_g]+3 (7)

In an embodiment of the present invention, the third determining module 804 is specifically configured to determine, when any one of the number of slabs where the signal line is correspondingly disposed, the number of slabs where the power line is correspondingly disposed, and the number of slabs where the ground line is correspondingly disposed is an odd number, any one of the slabs with the odd number is a target slab, and the target slab is disposed at an intermediate position; and other slabs are symmetrically arranged on the upper side and the lower side of the target slab layer according to the preset symmetrical arrangement rule and the line type of the other slabs.

Because the information interaction, execution process, and other contents between the units in the device are based on the same concept as the method embodiment of the present invention, specific contents may refer to the description in the method embodiment of the present invention, and are not described herein again.

In summary, the embodiments of the present invention can at least achieve the following beneficial effects:

1. in an embodiment of the present invention, the circuit board stack deployment method includes: the method comprises the steps of determining the total number of the plate layers according to signal line attribute information, power line attribute information and ground line attribute information which are included in obtained line attribute information, determining a correspondingly deployed line type for each plate layer, and then determining the relative deployment position of each plate layer according to the correspondingly deployed line type of each plate layer. Through the process, the total number of the board layers is determined based on the acquired line attribute information, and the relative deployment position of each board layer is also determined according to the line type correspondingly deployed by each board layer, so that the space without wiring in each board layer is reduced, and therefore the utilization rate of the lamination deployment can be improved.

2. In the embodiment of the invention, the total number of the slabs is determined by determining the number of the slabs for deploying the signal lines according to the number of the signal lines and the width corresponding to each signal line, determining the number of the slabs for deploying the power lines according to the number of the power lines and the width corresponding to each power line, and determining the number of the slabs for deploying the ground lines according to the number of the ground lines and the width corresponding to each ground line, so that the determined total number of the slabs can meet the deployment requirement of the lines, and the vacant space of each slab can be reduced.

3. In the embodiment of the invention, in the process of determining the number of the slabs on which the signal lines are deployed, the number of the slabs on which the signal lines are deployed is determined to be high in accuracy due to the fact that parameters such as the number of the signal lines, the line width corresponding to each signal line, the interval between every two adjacent signal lines, the width of the slab and the like are integrated.

4. In the embodiment of the invention, in the process of determining the number of the slabs for deploying the power lines, the number of the power lines, the line width corresponding to each power line, the interval between every two adjacent power lines, the width of the slab and other parameters are integrated, so that the accuracy of determining the number of the slabs for deploying the power lines is high.

5. In the embodiment of the invention, in the process of determining the number of the ground wire deployment slabs, the number of the ground wires, the line width corresponding to each ground wire, the interval between every two adjacent ground wires, the width of the slab and other parameters are integrated, so that the accuracy of determining the number of the ground wire deployment slabs is high.

6. In the embodiment of the invention, the total number of the slabs corresponding to the situation is calculated according to the specific situation of determining whether the first number, the second number and the third number are integers, so that the accuracy of determining the total number of the slabs is high.

7. In the embodiment of the present invention, a corresponding line type is correspondingly deployed for each slab according to a specific condition that whether the first number, the second number, and the third number are integers, so that the matching degree of the line type correspondingly deployed for each slab is high.

8. In the embodiment of the invention, the relative deployment position of each slab layer is determined according to the symmetrical arrangement rule according to the line type correspondingly deployed by each slab layer, so that the crosstalk between the slab layers can be reduced.

10. In an embodiment of the present invention, the circuit board stack deployment apparatus includes: the device comprises an acquisition module, a first determination module, a second determination module and a third determination module; the first determining module determines the total number of the plate layers according to the signal line attribute information, the power line attribute information and the ground line attribute information acquired by the acquiring unit; the second determining module determines the line type of each corresponding board layer; and a third determining module determines the relative deployment position of each slab according to the line type correspondingly deployed by each slab. Through the process, the total number of the board layers is determined based on the acquired line attribute information, and the relative deployment position of each board layer is also determined according to the line type correspondingly deployed by each board layer, so that the space without wiring in each board layer is reduced, and therefore the utilization rate of the lamination deployment can be improved.

11. In the embodiment of the invention, the accuracy of calculating the total number of the slabs corresponding to the situation is high by determining whether the first number, the second number and the third number are integers. Thus reducing the cost and improving the product competitiveness.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a" does not exclude the presence of other similar elements in a process, method, article, or apparatus that comprises the element.

Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.

Finally, it is to be noted that: the above description is only a preferred embodiment of the present invention, and is only used to illustrate the technical solutions of the present invention, and not to limit the protection scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims

1. A method of circuit board layer deployment, comprising:

determining the line type of each corresponding board layer;

determining the relative deployment position of each slab layer according to the line type correspondingly deployed by each slab layer;

determining a total number of the plies based on the first number, the second number, and the third number;

determining a first number of the board layers for disposing the signal lines by using a first formula according to the number of the signal lines, the line width corresponding to each signal line and a preset interval between every two adjacent signal lines;

the first formula includes:

and/or the presence of a gas in the gas,

determining a second number of the plate layers for deploying the power lines by using a second formula according to the number of the power lines, the line width corresponding to each power line and a preset interval between every two adjacent power lines;

the second formula includes:

determining a third number of the plate layers for deploying the ground wires by using a third formula according to the number of the ground wires, the line width corresponding to each ground wire and a preset interval between every two adjacent ground wires;

the third formula includes:

wherein, T is_gCharacterizing the third quantity; the r represents the number of the ground wires; said D_cRepresenting the line width corresponding to the ground line c; said C is₃Characterizing the interval between every two adjacent ground wires; the d represents the width of the plyDegree; said K₃Characterizing the third coefficient.

2. The method of claim 1,

when the first number, the second number and the third number are all integers, determining the total number of the slabs by using a fourth formula;

the fourth formula includes:

T＝T_s+T_p+T_g

when any one of the first number, the second number and the third number is a non-integer, determining the total number of the slabs by using a fifth formula;

the fifth formula includes:

T＝[T_s]+[T_p]+[T_g]+1

when any two of the first number, the second number and the third number are non-integers, determining whether the sum of the decimal parts of the two non-integer numbers is smaller than a preset first threshold, if so, determining the total number of the slabs through a fifth formula, otherwise, determining the total number of the slabs through a sixth formula;

the sixth formula includes:

T＝[T_s]+[T_p]+[T_g]+2

wherein, T is_sCharacterizing the firstThe number of the particles; the T is_pCharacterizing the second ply number; the T is_gCharacterizing the third quantity; the T characterizes a total number of plies; the [ 2 ]]A representation rounding symbol;

when the first number, the second number and the third number are all non-integers, sorting the fractional parts of the three non-integer numbers from large to small, and determining the fractional parts which are sorted at the second position and the third position; determining whether the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold value, if so, determining the total number of the slabs through a sixth formula, and otherwise, determining the total number of the slabs through a seventh formula;

the seventh formula includes:

T＝[T_s]+[T_p]+[T_g]+3

3. The method according to any one of claims 1 to 2, wherein the determining the relative deployment position of each slab according to the line type of the corresponding deployment of each slab comprises:

4. A circuit board stack deployment device, comprising:

a third determining module, configured to determine a relative deployment position of each slab according to a line type that each slab is correspondingly deployed;

the first determining module includes: a first determination unit, a second determination unit, a third determination unit and a fourth determination unit; wherein the content of the first and second substances,

the fourth determining unit is used for determining the total number of the slabs according to the first number, the second number and the third number;

the first determining unit is specifically configured to determine, according to the number of the signal lines, a line width corresponding to each signal line, and a preset interval between every two adjacent signal lines, a first number of the slabs on which the signal lines are disposed by using a first formula;

the first formula includes:

and/or the presence of a gas in the gas,

the second determining unit is specifically configured to determine, according to the number of the power lines, a line width corresponding to each power line, and a preset interval between every two adjacent power lines, a second number of the slabs on which the power lines are disposed by using a second formula;

the second formula includes:

the third determining unit is specifically configured to determine, according to the number of the ground lines, the line width corresponding to each ground line, and a preset interval between every two adjacent ground lines, a third number of the plate layers where the ground lines are deployed by using a third formula;

the third formula includes:

5. The apparatus of claim 4, wherein the fourth determining unit comprises: a first determining subunit, a second determining subunit, a third determining subunit, and a fourth determining subunit, wherein,

the first determining subunit is configured to determine, by using a fourth formula, the total number of the slabs when the first number, the second number, and the third number are all integers;

the fourth formula includes:

T＝T_s+T_p+T_g

the second determining subunit is configured to determine, by using a fifth formula, the total number of the slabs when any one of the first number, the second number, and the third number is a non-integer;

the fifth formula includes:

T＝[T_s]+[T_p]+[T_g]+1

the third determining subunit is configured to, when any two of the first number, the second number, and the third number are non-integers, determine whether a sum of fractional parts of the two non-integers is smaller than a preset first threshold, if so, determine the total number of the slabs through the fifth formula, otherwise, determine the total number of the slabs through a sixth formula;

the sixth formula includes:

T＝[T_s]+[T_p]+[T_g]+2

the fourth determining subunit is configured to, when the first number, the second number, and the third number are all non-integers, sort the fractional parts of the three non-integer numbers in descending order, and determine the fractional parts sorted in the second and third positions; determining whether the sum of the decimal parts located at the second position and the third position is smaller than a preset second threshold value, if so, determining the total number of the slabs through a sixth formula, and otherwise, determining the total number of the slabs through a seventh formula;

the seventh formula includes:

T＝[T_s]+[T_p]+[T_g]+3

6. The apparatus according to any one of claims 4 to 5,