CN104244574A - Pcb signal wiring structure and electronic product interface - Google Patents
Pcb signal wiring structure and electronic product interface Download PDFInfo
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- CN104244574A CN104244574A CN201410473012.6A CN201410473012A CN104244574A CN 104244574 A CN104244574 A CN 104244574A CN 201410473012 A CN201410473012 A CN 201410473012A CN 104244574 A CN104244574 A CN 104244574A
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- signal line
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Abstract
The invention provides a PCB signal wiring structure and an electronic product interface. The PCB signal wiring structure comprises a PCB of a structure with at least four layers of boards. A differential signal wiring unit is formed by every four layers of boards. Each differential signal wiring unit comprises a top layer, a bottom layer and two middle layers arranged between the top layer and the bottom layer. The top layers and the bottom layers are differential signal reference plane layers, and every two middle layers are differential signal wiring layers, wherein one middle layer is provided with positive electrode signal wires, the other middle layer is correspondingly provided with negative electrode signal wires, the positive electrode signal wires and the negative electrode signal wires of differential signals are arranged on the two adjacent layers respectively, and differential signal wiring is achieved as well. In this way, in the narrow PCB, wiring of the multiple differential pair signals can be achieved.
Description
Technical field
The present invention relates to PCB design technology, particularly a kind of PCB signal routing structure and electronic product interface.
Background technology
Along with the fast development of electronic product, impel the generation of personalization of product.Make interiors of products structure space compacter, narrower, thus make the pcb board area of product also can become less, narrower.The LVDS interface that in digital product, trend uses, MIPI interface all form by organizing differential pair signal more.Many groups differential signal is walked when same layer, just needs more roomy PCB surface to amass, and the more roomy PCB surface of demand is amassed, and will bring very large impact, even affect the realizability of product design to interiors of products structural design.
Summary of the invention
Based on this, need larger area for above-mentioned many group differential signal lines and affect the problem of interiors of products structure, the present invention proposes a kind of PCB signal routing structure and electronic product interface.
The present invention proposes a kind of PCB signal routing structure, and its technical scheme is as follows:
A kind of PCB signal routing structure, comprise the PCB of at least four-sheet structure, wherein every four layers are formed as a differential signal wiring unit; Each described differential signal wiring unit comprises top layer and bottom, and is arranged on the adjacent intermediate layer of between described top layer and bottom two; Described top layer and bottom are differential signal reference planes layer, and two described intermediate layers are differential signal routing layer; Two described differential signal routing layers, wherein one deck is furnished with positive signal line, and one deck correspondence is furnished with negative signal line in addition.
By the differential signal routing layer in one deck will be arranged in prior art, same layer is arranged on by the positive signal line of differential signal and negative signal line, change into and differential signal routing layer is set to two-layer, and the positive signal line of differential signal and negative signal line are arranged in this adjacent two-layer on, realize differential signal cabling equally.Like this, just in narrower PCB surface is long-pending, many group differential pair signal cablings can be realized.
Below its further technical scheme is described:
Preferably, each described differential signal wiring unit comprises at least one pair of differential signal line, and often pair of differential signal line comprises the positive signal line being arranged on a differential signal routing layer, and is arranged on the negative signal line of another differential signal routing layer.Be about to the positive signal line of a pair differential signal line being originally arranged in same layer and negative signal line is corresponding is respectively arranged in two intermediate layers of differential signal routing layer, the width of original required PCB layout area can be reduced half.
Preferably, a described differential signal routing layer is provided with multiple positive signal line and/or negative signal line, and another differential signal routing layer correspondence is provided with multiple negative signal line and/or positive signal line, positive signal line described in every root is corresponding with a negative signal line.To make on a positive signal line on a differential signal routing layer and another differential signal routing layer the linear differential signal line in a pair of negative signal that corresponding, thus form multipair differential signal line.
Preferably, the positive signal line of often pair of described differential signal line and negative signal line are parallel to each other isometric, wide, and adjacent bed is overlapping.According to the characteristic of differential signal line, adjacent differential signal routing layer arranges positive signal line and corresponding negative signal line.
The present invention also proposes a kind of electronic product interface, comprises above-mentioned PCB signal routing structure.Above-mentioned PCB signal routing structure be applied in electronic product interface, when making to have multipair differential signal line in product interface, the width of interface is also unlikely to wide, and affects the realization of product structure.
Below its further technical scheme is described:
Preferably, described electronic product interface comprises LVDS interface or/and MIPI interface.Above-mentioned PCB signal routing structure can being applied to LVDS interface or/and in MIPI interface, when having multipair differential signal line, also normally can realizing the signal lead of LVDS interface and MIPI interface.
The present invention has following outstanding beneficial effect:
1, be not limited to and differential signal line is arranged on one deck PCB layer, improve PCB design flexibility;
2, the positive signal line of differential signal line and negative signal line are arranged on two-layer PCB layer, the wiring area of constriction multi-layer PCB;
3, be beneficial to product structure design to realize, can not be too much because of differential signal line, and normally cannot realize the structure of product.
Accompanying drawing explanation
Fig. 1 is schematic diagram when being provided with a pair differential signal line in the signal routing of PCB described in embodiment of the present invention structure;
Fig. 2 is schematic diagram when being provided with multipair differential signal line in the signal routing of PCB described in embodiment of the present invention structure;
Fig. 3 is the schematic diagram of PCB signal routing structure in prior art.
Description of reference numerals: (100,100a)-differential signal reference planes layer, (110,110a)-top layer, (120,120a)-bottom, (200,200a)-differential signal routing layer, (210,220)-intermediate layer, (212,212a, 214)-positive signal line (or negative signal line), (222,222a, 224)-negative signal line (or positive signal line).
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail.
As shown in Figure 1 to Figure 2, a kind of PCB signal routing structure, comprises the PCB of at least four-sheet structure, and wherein every four layers are formed as a differential signal wiring unit.Each differential signal wiring unit comprises top layer 110 and bottom 120, and is arranged on the adjacent intermediate layer (210,220) of between top layer 110 and bottom 120 two.Top layer 110 and bottom 120 are differential signal reference planes layer 100, two intermediate layer (210,220) and are differential signal routing layer 200; Two differential signal routing layers 200, wherein one deck is furnished with positive signal line (212,214), and one deck correspondence is furnished with negative signal line (222,224) in addition.
As shown in Figure 3, by the differential signal routing layer 200a (being arranged between top layer 110a and bottom 120a) in one deck will be arranged in prior art, same layer is arranged on by the positive signal line 212a of differential signal and negative signal line 222a, change into and differential signal routing layer 200 is set to two-layer, and by the positive signal line (212 of differential signal, 214) and negative signal line (222,224) be arranged in this adjacent two-layer on, realize differential signal cabling equally.Like this, just in narrower PCB surface is long-pending, many group differential pair signal cablings can be realized.
Particularly, each differential signal wiring unit comprises at least one pair of differential signal line, often pair of differential signal line comprises the positive signal line (212 being arranged on a differential signal routing layer 200,214), and be arranged on the negative signal line (222,224) of another differential signal routing layer 200.Be about to positive signal line and negative signal line corresponding two intermediate layers (210 being arranged in differential signal routing layer respectively of a pair differential signal line being originally arranged in same layer, 220), in, the width of original required PCB layout area can be reduced half.
Further, a differential signal routing layer 200 is provided with multiple positive signal line (212,214) and/or negative signal line (222,224), and another differential signal routing layer 200 correspondence is provided with multiple negative signal line (222,224) and/or positive signal line (212,214), every root positive signal line is corresponding with a negative signal line.Can arrange many holding wires on one deck differential signal routing layer 200, these holding wires being arranged in one deck can be all positive signal line (or negative signal line), also can be the mixing of positive signal line and negative signal line; Then arranging many negative signal lines (or positive signal line) another layer of differential signal routing layer 200 correspondence, also can be negative signal line or positive signal line.In a word, a corresponding linear differential signal line in a pair of negative signal on a positive signal line on a differential signal routing layer and another differential signal routing layer, thus form multipair differential signal line, adjacent two differential signal routing layers realize the layout of multipair differential signal line.
And according to the characteristic of differential signal line, positive signal line (212,214) and the negative signal line (222,224) of often pair of differential signal line are parallel to each other isometric, wide, and adjacent bed is overlapping.Namely positive signal line and corresponding negative signal line are set on adjacent differential signal routing layer.
The present invention also proposes a kind of electronic product interface, comprises above-mentioned PCB signal routing structure.Above-mentioned PCB signal routing structure be applied in electronic product interface, when making to have multipair differential signal line in product interface, the width of interface is also unlikely to wide, and affects the realization of product structure.
Particularly, also above-mentioned PCB signal routing structure can being applied to LVDS interface or/and in MIPI interface, when having multipair differential signal line, also normally can realizing the signal lead of LVDS interface and MIPI interface.In addition, can also be applied in other electronic product interfaces, or in other similar PCB structures.
In the present embodiment, according to differential signal characteristic, the positive signal line of differential pair and negative signal line are walked respectively in adjacent two-layer differential signal routing layer, by the cabling rule of differential signal, the positive signal line of differential pair and negative signal line adjacent bed overlap, be parallel to each other cabling.Can in narrower PCB surface be long-pending, realize the similar signal lead by organizing LVDS interface that differential pair forms, MIPI interface more.Can improve the flexibility of PCB design like this, the wiring area of constriction multi-layer PCB, thus it is narrower that PCB configuration design can be made to obtain, and is beneficial to the realization of product structure design.
The above embodiment only have expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (6)
1. a PCB signal routing structure, is characterized in that, comprises the PCB of at least four-sheet structure, and wherein every four layers are formed as a differential signal wiring unit;
Each described differential signal wiring unit comprises top layer and bottom, and is arranged on the adjacent intermediate layer of between described top layer and bottom two; Described top layer and bottom are differential signal reference planes layer, and two described intermediate layers are differential signal routing layer;
Two described differential signal routing layers, wherein one deck is furnished with positive signal line, and one deck correspondence is furnished with negative signal line in addition.
2. PCB signal routing structure according to claim 1, it is characterized in that, each described differential signal wiring unit comprises at least one pair of differential signal line, often pair of differential signal line comprises the positive signal line being arranged on a differential signal routing layer, and is arranged on the negative signal line of another differential signal routing layer.
3. PCB signal routing structure according to claim 2, it is characterized in that, a described differential signal routing layer is provided with multiple positive signal line and/or negative signal line, and another differential signal routing layer correspondence is provided with multiple negative signal line and/or positive signal line, positive signal line described in every root is corresponding with a negative signal line.
4. the PCB signal routing structure according to claim 1-3 any one, is characterized in that, the positive signal line of often pair of described differential signal line and negative signal line are parallel to each other isometric, wide, and adjacent bed is overlapping.
5. an electronic product interface, is characterized in that, comprises the PCB signal routing structure described in claim 1-4 any one.
6. electronic product interface according to claim 5, is characterized in that, described electronic product interface comprises LVDS interface or/and MIPI interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410473012.6A CN104244574A (en) | 2014-09-16 | 2014-09-16 | Pcb signal wiring structure and electronic product interface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410473012.6A CN104244574A (en) | 2014-09-16 | 2014-09-16 | Pcb signal wiring structure and electronic product interface |
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| CN104244574A true CN104244574A (en) | 2014-12-24 |
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| CN201410473012.6A Pending CN104244574A (en) | 2014-09-16 | 2014-09-16 | Pcb signal wiring structure and electronic product interface |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107041062A (en) * | 2015-12-30 | 2017-08-11 | 泰科电子公司 | It is configured to the printed circuit and circuit board assemblies of quaternary signal transmission |
| US9913364B2 (en) | 2016-08-04 | 2018-03-06 | Jahwa Electronics Co., Ltd. | Printed circuit board and vibration actuator including the same |
| CN108282952A (en) * | 2017-01-05 | 2018-07-13 | 北京普源精电科技有限公司 | A kind of wiring method across PCB functional areas |
| WO2019000834A1 (en) * | 2017-06-29 | 2019-01-03 | 郑州云海信息技术有限公司 | Wiring structure and method for improving signal integrity (si) |
| CN109600163A (en) * | 2018-12-04 | 2019-04-09 | 曙光信息产业(北京)有限公司 | The test fixture of QSFP56 optical module |
| WO2020082446A1 (en) * | 2018-10-23 | 2020-04-30 | 惠科股份有限公司 | Differential wires for circuit board, and circuit board |
| CN111385965A (en) * | 2020-04-17 | 2020-07-07 | 歌尔光学科技有限公司 | Printed circuit board |
| CN115023026A (en) * | 2021-10-27 | 2022-09-06 | 荣耀终端有限公司 | Circuit board and electronic device |
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| CN1658734A (en) * | 2004-02-19 | 2005-08-24 | 惠普开发有限公司 | Printed circuit board substrate and method for constructing same |
| CN101064992A (en) * | 2006-04-29 | 2007-10-31 | 英业达股份有限公司 | Printed circuit board and wiring method |
| US20110273240A1 (en) * | 2010-05-05 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and layout method thereof |
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2014
- 2014-09-16 CN CN201410473012.6A patent/CN104244574A/en active Pending
Patent Citations (3)
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| CN1658734A (en) * | 2004-02-19 | 2005-08-24 | 惠普开发有限公司 | Printed circuit board substrate and method for constructing same |
| CN101064992A (en) * | 2006-04-29 | 2007-10-31 | 英业达股份有限公司 | Printed circuit board and wiring method |
| US20110273240A1 (en) * | 2010-05-05 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and layout method thereof |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107041062A (en) * | 2015-12-30 | 2017-08-11 | 泰科电子公司 | It is configured to the printed circuit and circuit board assemblies of quaternary signal transmission |
| US9913364B2 (en) | 2016-08-04 | 2018-03-06 | Jahwa Electronics Co., Ltd. | Printed circuit board and vibration actuator including the same |
| CN108282952A (en) * | 2017-01-05 | 2018-07-13 | 北京普源精电科技有限公司 | A kind of wiring method across PCB functional areas |
| WO2019000834A1 (en) * | 2017-06-29 | 2019-01-03 | 郑州云海信息技术有限公司 | Wiring structure and method for improving signal integrity (si) |
| US11126777B2 (en) | 2017-06-29 | 2021-09-21 | Zhengzhou Yunhai Information Technology Co., Ltd. | Layout routing structure and layout routing method for improving SI performance of signal |
| WO2020082446A1 (en) * | 2018-10-23 | 2020-04-30 | 惠科股份有限公司 | Differential wires for circuit board, and circuit board |
| US11546985B2 (en) | 2018-10-23 | 2023-01-03 | HKC Corporation Limited | Differential signal routing line of circuit board and circuit board |
| CN109600163A (en) * | 2018-12-04 | 2019-04-09 | 曙光信息产业(北京)有限公司 | The test fixture of QSFP56 optical module |
| CN111385965A (en) * | 2020-04-17 | 2020-07-07 | 歌尔光学科技有限公司 | Printed circuit board |
| CN111385965B (en) * | 2020-04-17 | 2023-03-03 | 歌尔光学科技有限公司 | Printed circuit board |
| CN115023026A (en) * | 2021-10-27 | 2022-09-06 | 荣耀终端有限公司 | Circuit board and electronic device |
| CN115023026B (en) * | 2021-10-27 | 2023-04-14 | 荣耀终端有限公司 | Circuit board and electronic device |
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Application publication date: 20141224 |