CN112001146B - PCB (printed circuit board) lamination design method - Google Patents
PCB (printed circuit board) lamination design method Download PDFInfo
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- CN112001146B CN112001146B CN202010852418.0A CN202010852418A CN112001146B CN 112001146 B CN112001146 B CN 112001146B CN 202010852418 A CN202010852418 A CN 202010852418A CN 112001146 B CN112001146 B CN 112001146B
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000003475 lamination Methods 0.000 title claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 165
- 239000011889 copper foil Substances 0.000 claims abstract description 154
- 239000000463 material Substances 0.000 claims abstract description 135
- 239000000758 substrate Substances 0.000 claims abstract description 123
- 239000002648 laminated material Substances 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 5
- 102100024384 Replication termination factor 2 Human genes 0.000 description 2
- 101710175584 Replication termination factor 2 Proteins 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
- G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
- G06F16/22—Indexing; Data structures therefor; Storage structures
- G06F16/2282—Tablespace storage structures; Management thereof
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
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Abstract
The invention discloses a PCB (printed circuit board) laminated design method, which comprises the steps of establishing a database which stores a plurality of copper foil substrate material related parameters; establishing a laminated template in an Excel worksheet, wherein the laminated template comprises identification cells of each layer of the laminated layer, signal type cells of each layer and copper foil base plate material cells of each layer; the Excel worksheet sends a parameter acquisition command to the database, wherein the parameter acquisition command comprises a corresponding parameter identifier; the database returns the relevant parameters according to the parameter acquisition command; the Excel worksheet fills the relevant parameters returned by the database into the cells of the copper foil base plate material of each corresponding layer; and printing the lamination template to generate a lamination report. According to the invention, the database is established to store the related parameters of the copper foil substrate material, the Excel worksheet sends a command to acquire the related parameters from the database and automatically fills the related parameters into the laminated template, and in the process, few data need to be manually filled by workers, and multiple table lookup is not needed, so that the efficiency of laminated design is greatly improved, and the accuracy is effectively improved.
Description
Technical Field
The invention relates to the field of PCB (printed circuit board) lamination design, in particular to a PCB lamination design method.
Background
When the PCB enters the layout, the laminate needs to be set. The current lamination design is that a worker provides the layer number, the plate thickness and the plate material through related units to carry out lamination design. The lamination design needs to provide Lineup (glass cloth information list) by each CCL (wrapper clad laminate Copper foil substrate) material supplier, and select appropriate glass cloth materials and fill forms layer by layer through Lineup table look-up to stack to obtain a complete lamination design. The process needs repeated table lookup and table filling, and the filled table is easy to have numerical value misfilling or needs extra time to check and correct, so that the efficiency and the accuracy of the laminated design are greatly influenced.
Disclosure of Invention
In order to solve the problems, the invention provides a PCB (printed circuit board) laminated layer design method, which combines Excel with a database, reduces the table look-up and filling processes of workers as much as possible and improves the working efficiency and the accuracy.
The technical scheme of the invention is as follows: a PCB board lamination design method comprises the following steps:
establishing a database storing relevant parameters of a plurality of copper foil substrate materials;
establishing a laminated template in an Excel worksheet, wherein the laminated template comprises identification cells of each layer of the laminated layer, signal type cells of each layer and copper foil base plate material cells of each layer;
the Excel worksheet sends a parameter acquisition command to the database, wherein the parameter acquisition command comprises a corresponding parameter identifier;
the database returns the relevant parameters according to the parameter acquisition command;
the Excel worksheet fills the related parameters returned by the database into the cells of the copper foil base plate materials of the corresponding layers;
and printing the lamination template to generate a lamination report.
Furthermore, each layer of copper foil base plate material cell is provided with a pull-down option, and the pull-down option comprises a plurality of selectable copper foil base plate material types;
and selecting the pull-down options of the unit cells of each layer of copper foil base plate material, and triggering a parameter acquisition command to be sent to a database.
Further, storing a plurality of copper foil substrate material related parameters of a plurality of merchants in a database;
each layer of copper foil base material cell comprises a copper foil base material merchant total cell, a copper foil base material type total cell, a copper foil thickness cell, a copper foil type cell, a base plate type cell, copper foil base material merchant sub-cells which are in one-to-one correspondence with each layer, and copper foil base material type sub-cells which are in one-to-one correspondence with each layer;
the copper foil substrate material type general cells, the copper foil thickness cells, the copper foil type cells, the substrate type cells, the copper foil substrate material business family sub cells and the copper foil substrate material type sub cells are all provided with pull-down options;
the pull-down options of the total cells of the copper foil substrate material type comprise selectable merchant and mixed pressing options, and the pull-down options of the total cells of the copper foil substrate material type comprise selectable material type options corresponding to merchants; when any merchant option is selected from the pull-down options of the total unit grids of the copper-clad laminate material merchant, closing the sub unit grids of the copper-clad laminate material merchant and the total unit grids of the copper-clad laminate material type; when the mixed pressing option is selected according to the pull-down option of the total unit cell of the copper foil substrate material merchant, the sub unit cell of the copper foil substrate material merchant is open, the pull-down option of the sub unit cell of the copper foil substrate material merchant comprises a selectable merchant option, and the pull-down option of the sub unit cell of the copper foil substrate material type comprises a selectable material type option under the corresponding merchant;
the pull-down options for the copper foil thickness cells include selectable copper foil thickness corresponding to the copper foil substrate material type;
the pull-down options of the copper foil type cells comprise selectable copper foil types corresponding to the copper foil substrate material types;
the pull-down options for the substrate type cells include selectable substrate material types corresponding to the copper foil substrate material types.
Further, the Excel worksheet sends a parameter acquisition command to the database, and the database returns relevant parameters according to the parameter acquisition command, and the method specifically comprises the following steps:
selecting any option from the pull-down options of the total cells of the copper clad laminate material merchant, triggering and sending a first parameter acquisition command to a database, returning the selectable copper clad laminate material type of the corresponding merchant to an Excel worksheet according to the first parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the total cells of the copper clad laminate material type by the Excel worksheet;
selecting any option from the pull-down options of the total unit cells of the copper foil substrate material types, triggering and sending a second parameter acquisition command to the database, returning the selectable copper foil thickness, the copper foil type and the substrate material type corresponding to the copper foil substrate material type to an Excel worksheet by the database according to the second parameter acquisition command, and using the returned data as the pull-down selectable options of the unit cells of the copper foil thickness, the copper foil type and the substrate type by the Excel worksheet;
selecting any option from the pull-down options of the copper foil substrate material manufacturer sub-cells, triggering and sending a third parameter acquisition command to the database, returning the selectable copper foil substrate material type of the corresponding manufacturer to the Excel worksheet according to the third parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the copper foil substrate material type sub-cells by the Excel worksheet;
and the database returns the selectable copper foil thickness and the substrate material type corresponding to the copper foil substrate material type to an Excel worksheet according to the fourth parameter acquisition command, and the Excel worksheet takes the returned data as the pull-down selectable items of the copper foil thickness cells, the copper foil type and the substrate type cells.
Furthermore, each layer of copper foil base material unit cell also comprises a substrate thickness, dielectric constant unit cells of the substrate material at different frequencies and dielectric loss unit cells at different frequencies;
the Excel worksheet sends a parameter acquisition command to the database, and the database returns relevant parameters according to the parameter acquisition command, and the method further comprises the following steps:
selecting one option from the pull-down options of the substrate type cells, triggering and sending a fifth parameter acquisition command to the database, returning the thickness of the corresponding substrate material, the dielectric constant at different frequencies and the dielectric loss at different frequencies to the Excel worksheet by the database according to the fifth parameter acquisition command, and filling the returned data into the corresponding cells by the Excel worksheet.
Further, before the method prints the overlay template to generate the overlay report, the method further comprises the following steps:
filling the thicknesses of the upper and lower layers of assembly welding layers in the laminated template;
automatically converting the thickness of the copper foil in mil according to the content of each layer of copper foil thickness cell;
and adding the thickness of the upper layer and the lower layer of the assembly welding layer, the thickness of each layer of copper foil in mil and the thickness of the substrate to obtain the thickness of the substrate, and filling the thickness of the substrate into the laminated template.
Further, the laminated template further comprises line width and line distance cells and reference layer cells;
before a lamination template is printed to generate a lamination report, the method also judges the strip line type of each inner layer according to the signal type of each layer, and specifically comprises the following steps:
judging the number N of laminated layers;
judging whether the signal layer is a signal layer or not from the third layer;
if the signal layer is the signal layer, opening the line width and line distance cell for filling, and judging whether the upper layer and the lower layer of the signal layer have the signal layer;
if there is a signal layer on the upper and lower layers of the layer, the layer is of dual strip line type, and its reference layer is an adjacent non-signal layer;
if the upper and lower layers of the layer have no signal layer, the layer is of a strip line type, and the reference layer is the upper and lower layers of the layer.
Further, if the stack is a symmetrical structure, after filling the parameters of the upper layer, the parameters of the lower layer are filled through the mapping function, which specifically includes:
judging the number N of laminated layers;
the central point N/2 of the grabbing layer number is rounded;
starting from the first layer, copying the relevant parameters of the ith layer to the (N-i + 1) th layer until the execution is finished to the central point of the layer number.
According to the PCB laminated design method provided by the invention, the database is established to store the related parameters of the copper foil substrate material, the Excel worksheet sends a command to obtain the related parameters from the database and automatically fill the related parameters into the laminated template, the process needs little data manually filled by workers and does not need to check the table for many times, the laminated design efficiency is greatly improved, and the accuracy is effectively improved.
Drawings
FIG. 1 is a schematic flow chart of a method according to an embodiment of the present invention;
FIG. 2 is a laminated template Excel sheet in the case where an ITEQ merchant is selected for a total cell of a copper foil substrate merchant according to an embodiment of the present invention;
FIG. 3 is a laminated template Excel table under the condition of selective hybrid pressing of total cells of a copper foil substrate material merchant.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings by way of specific examples, which are illustrative of the present invention and are not limited to the following embodiments.
The embodiment provides a method for designing a PCB stack, which enables an Excel worksheet to automatically acquire data to be filled in by establishing a database, and improves the efficiency and accuracy of stack design.
As shown in fig. 1, the method comprises the following steps:
s1, establishing a database in which a plurality of copper foil substrate material related parameters are stored;
it should be noted that, in order to cover more parameters for the user to select, the database contains the parameters of the copper foil substrate materials of multiple merchants, including the types of the copper foil substrate materials that can be provided by the merchants, the thickness and type of the corresponding copper foil under each type, the type of the substrate material, the thickness, the dielectric constant, the dielectric loss, and the like.
The related parameters of different merchants can be stored in a table respectively, and the related data are read in a table look-up mode when the parameter acquisition command received by the database is received.
S2, establishing a laminated template in an Excel worksheet, wherein the laminated template comprises laminated identification cells of each layer, signal type cells of each layer and copper foil base material cells of each layer;
as shown in FIG. 2, TOP, L2-L7, BOT are the contents of each layer identification cell, wherein TOP represents the TOP layer, L2 represents the L2 layer, and BOT represents the bottom layer. The contents of each layer of the identified cells are manually filled in by the user.
In the figure, SINGAL, GND and PWR indicate that the layer is a signal layer, GND indicates that the layer is a ground layer and PWR indicates that the layer is a power layer.
Each layer of copper foil base material unit cell comprises a plurality of functional unit cells for selecting trade companies, copper foil base material types, copper foil thicknesses, copper foil types, base material related parameters and the like.
S3, sending a parameter acquisition command to a database by the Excel worksheet, wherein the parameter acquisition command comprises a corresponding parameter identifier;
in the embodiment, each layer of copper foil base plate material cell is provided with a pull-down option, and the pull-down option comprises a plurality of selectable copper foil base plate material types; and selecting the pull-down options of the unit cells of each layer of copper foil base plate material, and triggering a parameter acquisition command to be sent to a database. The parameter acquisition command comprises a parameter identification corresponding to the required acquisition, so that the database can read the relevant data.
S4, the database returns the relevant parameters according to the parameter acquisition command;
after the parameter acquisition command received by the database, the parameter identification contained in the command is analyzed, and the relevant parameters (namely relevant data) are read by a table look-up method.
S5, filling the related parameters returned by the database into the corresponding copper foil base plate material cells of each layer by using the Excel worksheet;
the Excel worksheet automatically fills the returned data into the corresponding cells, and the process of manual filling by a user is omitted.
S6, printing the lamination template to generate a lamination report;
and after all the parameters are set or filled, printing the laminated template in the Excel worksheet to generate a laminated report. It should be noted that the entire page may be copied to the new workbook first, and some additional information may be hidden, such as hiding the impedance.
As shown in fig. 2 and 3, the laminated template of the present embodiment includes a total unit cell of a copper-clad substrate material merchant (for example, ITEQ in fig. 2, i.e., the merchant of selecting ITEQ, hybrid in fig. 3, i.e., hybrid in fig. 3), a total unit cell of a copper-clad substrate material type (for example, IT _170GAR1 in fig. 2, which indicates that IT _170GAR1 under the ITEQ merchant is selected), a unit cell of a copper-clad thickness (for example, 1oz, 2oz, etc. in fig. 2 and 3), a unit cell of a copper-clad substrate material type (for example, RTF2 in fig. 2 and 3), a unit cell of a substrate material merchant (for example, ITEQ, EMC in fig. 2 and 3), and a unit cell of a copper-clad substrate material type (for example, IT _958G, EM _370 in fig. 3) corresponding to each layer one to one.
The total cells of the copper foil substrate material merchants, the total cells of the copper foil substrate material types, the copper foil thickness cells, the copper foil type cells, the substrate type cells, the sub-cells of the copper foil substrate material merchants and the sub-cells of the copper foil substrate material types are all provided with pull-down options.
The drop-down options of the total unit cell of the copper clad laminate material merchant comprise selectable merchant (such as ITEQ in figure 2) and mixed-pressing (such as Hybrid in figure 3) options, and the selection of mixed pressing indicates that copper clad laminates of different merchants can be selected in each layer. The pull-down options of the total cells of the copper foil substrate material type comprise selectable material type options of corresponding merchants; when any merchant option is selected as the pull-down option of the total unit of the copper foil substrate material merchant, the sub-unit of the copper foil substrate material merchant and the total unit of the copper foil substrate material type are closed (for example, the total unit of the sub-unit of the copper foil substrate material merchant and the total unit of the copper foil substrate material type is not provided in fig. 2); when the mixed-pressing option is selected by the pull-down option of the total unit cell of the copper-clad laminate material merchant, the sub-unit cell of the copper-clad laminate material merchant is open (for example, the sub-unit cell of the copper-clad laminate material merchant and the total unit of the material type of the copper-clad laminate in fig. 3), the pull-down option of the sub-unit cell of the copper-clad laminate material merchant includes a selectable merchant option, and the pull-down option of the sub-unit cell of the material type of the copper-clad laminate material includes a selectable material type option under the corresponding merchant.
The drop down options for the copper foil type cells include selectable copper foil types (e.g., RTF2 in fig. 2 and 3) corresponding to the type of copper foil substrate material.
The pull-down options for the substrate type cells include selectable substrate material types (e.g., 1078_3 × 1 in fig. 2 and 3, etc.) corresponding to the copper foil substrate material types.
As above step S3, selecting among the pull-down options of each layer of copper foil base material cells, triggering the parameter acquisition command to be sent to the database, specifically including:
s301, selecting any option from the pull-down options of the total cells of the copper clad laminate material merchant, triggering and sending a first parameter acquisition command to a database, returning the selectable copper clad laminate material type of the corresponding merchant to an Excel worksheet according to the first parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the total cells of the copper clad laminate material type by the Excel worksheet;
s302, selecting any option from the pull-down options of the total cells of the copper foil substrate material types, triggering and sending a second parameter acquisition command to a database, returning the selectable copper foil thickness, the copper foil type and the substrate material type corresponding to the copper foil substrate material type to an Excel worksheet according to the second parameter acquisition command by the database, and using the returned data as the pull-down selectable options of the copper foil thickness cells, the copper foil type and the substrate type cells by the Excel worksheet;
s303, selecting any option from pull-down options of the copper foil substrate material manufacturer sub-cells, triggering and sending a third parameter acquisition command to a database, returning the selectable copper foil substrate material type of the corresponding manufacturer to an Excel worksheet according to the third parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the copper foil substrate material type sub-cells by the Excel worksheet;
s304, any option is selected from the pull-down options of the copper foil substrate material type sub-cells, a fourth parameter acquisition command is triggered and sent to the database, the database returns the selectable copper foil thickness and the substrate material type corresponding to the copper foil substrate material type to the Excel worksheet according to the fourth parameter acquisition command, and the Excel worksheet takes the returned data as the pull-down selectable options of the copper foil thickness sub-cells, the copper foil type sub-cells and the substrate type sub-cells.
In addition, the laminated design also requires the thickness of the substrate, the dielectric constant and the dielectric loss of the substrate material at different frequencies, so the unit cells of the copper foil substrate material of the embodiment also comprise the thickness of the substrate, the dielectric constant unit cells of the substrate material at different frequencies and the dielectric loss unit cells at different frequencies.
The Excel worksheet sends a parameter acquisition command to the database, and the database returns relevant parameters according to the parameter acquisition command, and the method further comprises the following steps:
s305, selecting an option from the substrate type cell pull-down options, triggering and sending a fifth parameter obtaining command to the database, where the database returns the thickness of the corresponding substrate material, the dielectric constants at different frequencies, and the dielectric losses at different frequencies to the Excel worksheet according to the fifth parameter obtaining command, and the Excel worksheet fills the returned data into the corresponding cell (for example, the substrate thickness of L3 in fig. 3 is 11.52mil, and it needs to be noted that the laminated template is further provided with a substrate design thickness, that is, an ideal expected thickness).
The stack design also requires the stack thickness, and before the stack template is printed in step S6 to generate the stack report, the embodiment further provides the following steps:
s5-1, filling the thicknesses of the upper and lower layers of assembly welding layers in the laminated template (as each layer is 0.6mil in the figure 2);
s5-2, automatically converting the thickness of the copper foil in unit of mil according to the content of each layer of copper foil thickness cell; for example, 1.2mil for 1oz (oz is ounce) and 1.2mil for L3 in FIG. 2;
s5-3, adding the copper foil thickness of each layer in mils to the substrate thickness to obtain the substrate thickness, and filling the laminated template (such as 62.4 mils in FIG. 2, which is actually 62.36 mils, and is rounded to 62.4 mils).
In addition, the method also automatically judges the types of the strip lines of the inner layers, and correspondingly, the laminated template also comprises line width and line distance cells and reference layer cells.
Before the lamination template is printed to generate a lamination report, judging the strip line type of each inner layer according to the signal type of each layer, specifically:
s5-4, judging the number N of the laminated layers; wherein N is an integer greater than 3;
s5-5, judging whether the signal layer is a signal layer or not from the third layer;
s5-6, if the signal layer is the signal layer, opening the line width and line distance cell for filling, and judging whether the upper layer and the lower layer of the signal layer have the signal layer;
s5-7, if the upper layer and the lower layer of the layer have signal layers, the layer is of a double-strip line type, and the reference layer is an adjacent non-signal layer;
and S5-8, if the upper layer and the lower layer of the layer have no signal layer, the layer is of a strip line type, and the reference layer is the upper layer and the lower layer of the layer.
In this embodiment, if the stack is a symmetrical structure, after filling the parameters of the upper layer, the parameters of the lower layer are filled through the mapping function, which may save half of the time, specifically:
judging the number N of laminated layers; n is an integer greater than 3;
the central point N/2 of the grabbing layer number is rounded;
starting from the first layer, copying the relevant parameters of the ith layer to the (N-i + 1) th layer until the execution is finished to the center point of the layer number.
The above disclosure is only for the preferred embodiments of the present invention, but the present invention is not limited thereto, and any non-inventive changes that can be made by those skilled in the art and several modifications and amendments made without departing from the principle of the present invention shall fall within the protection scope of the present invention.
Claims (6)
1. A PCB lamination design method is characterized by comprising the following steps:
establishing a database storing relevant parameters of a plurality of copper foil substrate materials;
establishing a laminated template in an Excel worksheet, wherein the laminated template comprises identification cells of each layer of the laminated layer, signal type cells of each layer and copper foil base plate material cells of each layer;
the Excel worksheet sends a parameter acquisition command to the database, wherein the parameter acquisition command comprises a corresponding parameter identifier;
the database returns the relevant parameters according to the parameter acquisition command;
the Excel worksheet fills the relevant parameters returned by the database into corresponding cells of the copper foil base plate material of each layer;
printing the lamination template to generate a lamination report;
each layer of copper foil base plate material cell is provided with a pull-down option, and the pull-down option comprises a plurality of selectable copper foil base plate material types; selecting from the pull-down options of each layer of copper foil base material cell, and triggering a parameter acquisition command to be sent to a database;
storing a plurality of copper foil substrate material related parameters of a plurality of merchants in a database;
each layer of copper foil base material cell comprises a copper foil base material merchant total cell, a copper foil base material type total cell, a copper foil thickness cell, a copper foil type cell, a base plate type cell, copper foil base material merchant sub-cells which are in one-to-one correspondence with each layer, and copper foil base material type sub-cells which are in one-to-one correspondence with each layer;
the copper foil substrate material merchant general cell, the copper foil substrate material type general cell, the copper foil thickness cell, the copper foil type cell, the substrate type cell, the copper foil substrate material merchant sub-cell and the copper foil substrate material type sub-cell are all provided with pull-down options;
the pull-down options of the total cells of the copper foil substrate material type comprise selectable merchant and mixed pressing options, and the pull-down options of the total cells of the copper foil substrate material type comprise selectable material type options of corresponding merchants; when any merchant option is selected from the pull-down options of the total unit grids of the copper-clad laminate material merchant, closing the sub unit grids of the copper-clad laminate material merchant and the total unit grids of the copper-clad laminate material type; when the mixed pressing option is selected according to the pull-down option of the total unit cell of the copper foil substrate material merchant, the sub unit cell of the copper foil substrate material merchant is open, the pull-down option of the sub unit cell of the copper foil substrate material merchant comprises a selectable merchant option, and the pull-down option of the sub unit cell of the copper foil substrate material type comprises a selectable material type option under the corresponding merchant;
the pull-down options for the copper foil thickness cells include selectable copper foil thickness corresponding to the copper foil substrate material type;
the pull-down options of the copper foil type cells comprise selectable copper foil types corresponding to the copper foil substrate material types;
the pull-down options for the substrate type cells include selectable substrate material types corresponding to the copper foil substrate material types.
2. The method of claim 1, wherein the Excel worksheet sends a parameter acquisition command to the database, and the database returns relevant parameters according to the parameter acquisition command, and the method specifically comprises:
selecting any option from the pull-down options of the total cells of the copper clad laminate material merchant, triggering and sending a first parameter acquisition command to a database, returning the selectable copper clad laminate material type of the corresponding merchant to an Excel worksheet according to the first parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the total cells of the copper clad laminate material type by the Excel worksheet;
selecting any option from the pull-down options of the total unit cells of the copper foil substrate material types, triggering and sending a second parameter acquisition command to the database, returning the selectable copper foil thickness, the copper foil type and the substrate material type corresponding to the copper foil substrate material type to an Excel worksheet by the database according to the second parameter acquisition command, and taking the returned data as the pull-down selectable options of the copper foil thickness unit cells, the copper foil type unit cells and the substrate type unit cells by the Excel worksheet;
selecting any option from the pull-down options of the copper foil substrate material manufacturer sub-cells, triggering and sending a third parameter acquisition command to the database, returning the selectable copper foil substrate material type of the corresponding manufacturer to an Excel worksheet according to the third parameter acquisition command by the database, and using the returned data as the pull-down selectable option of the copper foil substrate material type sub-cells by the Excel worksheet;
and the database returns the selectable copper foil thickness and the substrate material type corresponding to the copper foil substrate material type to an Excel worksheet according to the fourth parameter acquisition command, and the Excel worksheet takes the returned data as the pull-down selectable items of the copper foil thickness cells and the substrate type cells.
3. The method of claim 2, wherein each layer of copper foil substrate material cells further comprises substrate thickness cells, dielectric constant cells of substrate material at different frequencies, and dielectric loss cells at different frequencies;
the Excel worksheet sends a parameter acquisition command to the database, and the database returns relevant parameters according to the parameter acquisition command, and the method further comprises the following steps:
selecting an option from the substrate type cell pull-down options, triggering and sending a fifth parameter acquisition command to the database, returning the thickness of the corresponding substrate material, the dielectric constants of the substrate material at different frequencies and the dielectric loss at different frequencies to the Excel worksheet according to the fifth parameter acquisition command by the database, and filling the returned data into the corresponding cells by the Excel worksheet.
4. The method of claim 3, further comprising the following steps before printing the overlay template to generate the overlay report:
filling the thickness of the upper and lower layers of assembly welding layers in the laminated template;
automatically converting the thickness of the copper foil in mil according to the content of each layer of copper foil thickness cell;
adding the thickness of the upper and lower layers of assembly welding layer, the thickness of each layer of copper foil in mil and the thickness of the substrate to obtain the new thickness of the substrate, and filling the new thickness of the substrate into the laminated template.
5. The PCB plate lamination design method of claim 4, wherein the lamination template further comprises line-width line-spacing unit cells and reference layer unit cells;
before a lamination template is printed to generate a lamination report, the method also judges the type of the strip line of each inner layer according to the signal type of each layer, and specifically comprises the following steps:
judging the number N of laminated layers;
judging whether the signal layer is a signal layer or not from the third layer;
if the signal layer is the signal layer, opening the line width and line distance cell for filling, and judging whether the upper layer and the lower layer of the signal layer have the signal layer;
if the upper and lower layers of the layer have signal layers, the layer is of a double-strip line type, and the reference layer is an adjacent non-signal layer;
if the upper and lower layers of the layer have no signal layer, the layer is of a strip line type, and the reference layer is the upper and lower layers of the layer.
6. The method of claim 5, wherein if the stack is a symmetrical structure, after filling the parameters of the upper layer, the filling of the parameters of the lower layer is realized through an image function, specifically:
judging the number N of laminated layers;
the central point N/2 of the grabbing layer number is rounded;
starting from the first layer, copying the relevant parameters of the ith layer to the (N-i + 1) th layer until the execution is finished to the central point of the layer number.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944082A (en) * | 2010-09-10 | 2011-01-12 | 中国恩菲工程技术有限公司 | Excel-like report processing method |
| CN103970736A (en) * | 2013-01-25 | 2014-08-06 | 苏州精易会信息技术有限公司 | Method for converting Excel sheet to database table |
| CN109977383A (en) * | 2019-03-11 | 2019-07-05 | 湖南纬拓信息科技有限公司 | A kind of form information extracting method based on Excel |
-
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101944082A (en) * | 2010-09-10 | 2011-01-12 | 中国恩菲工程技术有限公司 | Excel-like report processing method |
| CN103970736A (en) * | 2013-01-25 | 2014-08-06 | 苏州精易会信息技术有限公司 | Method for converting Excel sheet to database table |
| CN109977383A (en) * | 2019-03-11 | 2019-07-05 | 湖南纬拓信息科技有限公司 | A kind of form information extracting method based on Excel |
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