CN106814549B - A kind of damping frame structure - Google Patents
A kind of damping frame structure Download PDFInfo
- Publication number
- CN106814549B CN106814549B CN201510859956.1A CN201510859956A CN106814549B CN 106814549 B CN106814549 B CN 106814549B CN 201510859956 A CN201510859956 A CN 201510859956A CN 106814549 B CN106814549 B CN 106814549B
- Authority
- CN
- China
- Prior art keywords
- support column
- main substrate
- frame structure
- damping frame
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Vibration Prevention Devices (AREA)
Abstract
The present invention provides a kind of damping frame structure, damper, hanging box, support column and main substrate are sequentially consisted of in vertical direction, the damper supports the hanging box, the support column supports the main substrate, the support column is placed in the hanging box, the support column and the main substrate are internally provided with cavity, and absorbing object is filled in the cavity, and the absorbing object absorbs the vibration of the damping frame structure.The present invention in the support column internal cavities of the main substrate of carrying optical measuring system and support main substrate by filling absorbing object, after the vibration of ground is slowed down by damper, absorbing object in support column and main substrate can further absorb reduction vibration, it is located at the vibration that the optical measuring system on main substrate is subject to so significantly to be slowed down, and since absorbing object is filled in inside main substrate and support column, without other occupied space, therefore this damping frame structure has the advantages that occupied space is few, damping effect is notable.
Description
Technical field
The present invention relates to semiconductor lithography machine field, more particularly to a kind of damping frame structure.
Background technology
In ic manufacturing process, a complete chip usually requires to have made by multiple photolithographic exposure
At.It in photoetching operation, is carry by work stage and is exposed object (generally wafer), often placed optics above work stage and survey
Amount system, is placed with mask plate therebetween, in photoetching, by the observation and measurement of optical measuring system, is to control
It unites transmission data, then control system travelling workpiece platform so that mask plate is aligned with the presumptive area of the upper wafer of work stage,
Just exposure is proceeded by after alignment.Since the pattern on mask plate is more small, in alignment, optical measuring system is needed
With higher precision.At present in actual production, generally optical measuring system is placed on the frame structure, frame structure
Be placed on ground, vertically upward since ground, frame structure successively include damper, hanging box, support column and main substrate,
Optical measuring system is then placed on main substrate, and objective system is often additionally provided on main substrate, and work is placed in hanging box
Part platform, since optical measuring system uses measurement light that wafer is made to be aligned with mask plate, therefore it is required that external environment such as ground
Deng disturbance it is small as possible, to reduce disturbance to optical measuring system, objective system and workpiece table system etc. and error.But due to
General litho machine is located in industrial building, and other large scale equipments will necessarily be made in the running in machine itself operating and workshop
At foundation vibration, therefore the vibration for how slowing down this external environment becomes important topic.
A kind of fine motion module equipped with shock-absorbing means is disclosed in patent CN203259773U, including fine motion plate, setting exist
Bogey and the shock-absorbing means that is arranged on fine motion plate on fine motion plate top is arranged in the isolation mounting of fine motion plate lower part.This
Kind of damping effect of the fine motion module by shock-absorbing means can be with to the shock-absorbing means of fine motion mould fine motion plate connection and reasonable arrangement in the block
Effective compacting higher amplitude caused by fine motion module intrinsic frequency is close to bandwidth, it is solid to fine motion module so as to reduce
The requirement for having frequency to improve reduces difficulty of processing and cost, and can be simple and quick effective by adjusting shock-absorbing means
Control the vibration of fine motion module.But this fine motion module equipped with shock-absorbing means occupies many skies in Optical Coatings for Photolithography
Between, used shock-absorbing means is the connection for including transmission holder, clump weight, elastic component and connection transmission holder and clump weight
Part, other than it can increase additional cost, this tiny mechanical device is in terms of trouble shooting and inconvenient.In addition, the skill
Art is primarily directed to some local vibration, and the vibration of entire work stage but can not significantly be slowed down.Therefore, for
Upper disadvantage, it is necessary to invent and a kind of occupy little space, can significantly slow down the vibration of entire work stage and structure at low cost.
Invention content
To solve the above problems, the present invention proposes a kind of damping frame structure, in the main base of carrying optical measuring system
Plate and the support column inside filling absorbing substance for supporting main substrate, are not necessarily to other occupied space, of low cost, and can be substantially
Degree slows down influence of the vibration of ground to the work stage and the optical measuring system being placed on main substrate that are placed in hanging box.
In order to achieve the above objectives, the present invention provides a kind of damping frame structure, sequentially consists of in vertical direction
Damper, hanging box, support column and main substrate, the damper support the hanging box, the support column to support the main substrate,
The support column is placed in the hanging box, which is characterized in that and the support column and the main substrate are internally provided with cavity, and
Absorbing object is filled in the cavity, the absorbing object absorbs the vibration of the damping frame structure.
Preferably, the absorbing object is rubber grain, the shape of the rubber grain is ball or polyhedron.
Preferably, the radius of a ball of the circumsphere of the rubber grainWherein h is the support column or described
The depth of the cavity of the cavity inside main substrate.
Preferably, the structure of the rubber grain is coated metal particle inside elastomeric skin layer, the interior metal
The radius of grain is less than the thickness of the elastomeric skin layer.
Preferably, the absorbing object is polyurethane glue-line, the polyurethane glue-line is layer structure, the polyurethane adhesive
Thickness d the ＞ 2H, wherein H of layer are the thickness for the wall that the cavity is surrounded in the support column or the main substrate.
Preferably, the polyurethane adhesive that the polyurethane glue-line uses is two-component polyurethane adhesive, the polyurethane glue-line
Shore hardness after hardening is 40~45.
Preferably, the main substrate and the respective surface of the support column are equipped with hole for injecting glue.
Preferably, the hanging box is triangular framing or quadrilateral frame, the number of the support column be three or
Person four, the number of the damper be three either four main substrate shapes be triangle or quadrangle.
Preferably, the optical measuring system includes projection objective group, alignment subsystem and interferometer measurement point is
System, the projection objective group includes several projection objectives, several described projection objectives are arranged into two row in the horizontal direction,
The alignment subsystem is distributed between the two row projection objectives, and the interferometer measurement subsystem includes several interferometers
Measurement sensor, several described interferometer measurement sensors are all on the same horizontal plane, and around the projection object
Microscope group is distributed.
Preferably, the interferometer measurement subsystem includes measuring holder, the measurement internal stent is provided with holder
Cavity is filled with the absorbing object in the holder cavity.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention provides a kind of damping frame structure, in Vertical Square
Damper, hanging box, support column and main substrate are sequentially consisted of upwards, and the damper supports the hanging box, for subtracting
Few vibration of the ground to the hanging box, the support column support the main substrate, and the support column is placed in the hanging box,
Optical measuring system is placed on the main substrate, and work stage is placed in the hanging box, the support column and the main substrate
Inside has cavity, and absorbing object is filled in the cavity, and this absorbing object enables to Oscillation Amplitude fast in vibration
Speed declines, and the vibration that can then drive support column and main substrate to generate when foundation vibration, this absorbing object can absorb branch
The kinetic energy of platen and main substrate vibration, and this absorbing object is filled in main substrate and in support column, therefore can absorb multiple
The vibration in direction.After the vibration of ground is slowed down by damper, the absorbing object in support column and main substrate can be into one with cavity
Step, which absorbs, reduces vibration, is located at the vibration that the optical measuring system on main substrate is subject in this way and is significantly slowed down, because
This slows down the influence of disturbance of the external environments such as ground to optical measuring system, and due to absorbing object be filled in main substrate with
Inside support column, it is not necessarily to other occupied space, without adding vibration absorber or addition part, therefore this damping frame structure
Have the advantages that occupied space is few, damping effect is notable.
The absorbing object being filled in the present invention in main substrate and support column internal cavities is rubber grain or polyurethane adhesive
Layer, both substances all have the feature damped greatly, and the cost of rubber grain or polyurethane adhesive is smaller, therefore this damping
Frame structure has the advantages that of low cost.
Description of the drawings
Fig. 1 is to damp circuit theory schematic diagram in the embodiment of the present invention one；
Fig. 2 is the sectional view of support column and main substrate at A-A in Fig. 1；
Fig. 3 is the sectional view of support column and main substrate at A-A in the embodiment of the present invention three.
In figure：1- main substrates, 2- optical measuring systems, 3- support columns, 4- work stages, 5- hanging boxes, 6- dampers, 7- absorbings
Object.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.
Embodiment one
Fig. 1 is please referred to, the present invention provides a kind of damping frame structure, sequentially consists of damper in vertical direction
6, hanging box 5, support column 3 and main substrate 1, the damper 6 support the hanging box 5, and the support column 3 supports the main base
Plate 1, the support column 3 are placed in the hanging box 5, and optical measuring system 2 is placed on the main substrate 1, and work stage 4 is placed
In the hanging box 5.Please refer to Fig. 2, wherein the support column 3 and 1 inside of the main substrate are filled with absorbing object 7, the suction
The object 7 that shakes slows down the vibration of entire damping frame structure.
Usually, damper 6 is positioned on ground, therefore damper 6 is used as first of vibration absorber, significantly reduces and subtracts
Shake the top of device 6 hanging box Oscillation Amplitude.
The shape of the hanging box 5 can be triangle or quadrangle.If the shape of hanging box 5 is triangle, correspondingly
Main substrate 1 above 5 three interior angles of hanging box above piece support of support column 3 of each self-configuring, piece vibration damping of each self-configuring in lower section
Device 6, therefore a total of three support columns and three dampers, and correspondingly the shape of main substrate 1 is also triangle.If hanging box 5
Shape be quadrangle, then correspondingly piece support column 3 of each self-configuring above 5 four interior angles of hanging box, each self-configuring in lower section one
Root damper 6, therefore four support columns 3 and four dampers 6 in total, correspondingly the shape of main substrate 1 is also quadrangle.
The optical measuring system 2 includes that projection objective (not shown), alignment subsystem (not shown) and interferometer are surveyed
Subsystem (not shown) is measured, optical measuring system 2 is mainly used for making mask plate and the silicon chip pair in work stage 4 in photoetching
Standard, mask plate is between the optical measuring system 2 and work stage 4, and usually, optical measuring system 2 is sequentially connected control
Then system and work stage 4 will feed back to control system with the real-time alignment information measured observed by optical measuring system 2, control
System processed adjusts the position of work stage 4 according to real-time alignment information, and the alignment of silicon chip and mask plate is realized by mobile silicon chip.
The interferometer measurement subsystem includes mainly light source, optical interferometer and measuring system, between optical interferometer and measuring system
And all parts are connected by measurement holder inside measuring system.
Preferably, it is again provided with cavity in measurement holder in the interferometry subsystem, and in these cavitys
Absorbing object is inside also filled up, slowing down vibration also can be further absorbed in this way in optical measuring system.
Fig. 2 is please referred to, preferably, the absorbing object 7 is rubber grain, since rubber has the characteristic damped greatly,
When vibration is transmitted in rubber grain, rubber grain can significantly slowing down vibration, reduce vibration frequency and amplitude, significantly
Absorb and slow down vibration.Wherein, the rubber that rubber grain uses can be natural rubber, nitrile rubber, polyurethane etc..
The shape of the rubber grain is ball either cuboid or irregular polyhedrons.In order to enable rubber grain
Main substrate 1 and 3 internal cavities of support column is set to fill up, it is preferable that control the size of rubber grain.It is found through examining：Work as rubber
When particle is irregular polyhedrons or cuboid, the radius of a ball of circumsphereWherein h is support column 3 or main base
The depth of 1 internal cavities cavity of plate；Alternatively, when rubber grain is sphere, then its radius of sphericityWherein h is still branch
The depth of the cavity of 1 internal cavities of platen 3 or main substrate.In these cases, rubber grain enables to main substrate 1 and branch
3 internal cavities of platen fill up, so that the rubber grain of internal cavities each section can be uniformly distributed, and be inhaled steadily and significantly
The vibrational energy of all directions is received, preventing some part due to internal cavities to be not filled by rubber grain causes the part to rely only on sky
Aspiration vibrational energy will necessarily either cause each section to absorb shaking of slowing down in main substrate 1 or support column 3 in this way
Kinetic energy generates larger difference, causes since vibration frequency and amplitude difference will produce the resonance of a new round everywhere.
Preferably, support column 3 is made of with the cavity in main substrate 1 several areolas, filled in these areolas
Absorbing object 7 is separated using interlayer between each areola.In the primary base plate 1, these areolas are arranged in one in the horizontal direction
Row, in support column 3, these areolas are arranged in a row in vertical direction.Support column 3 and main substrate 1 can be increased in this way
Quality, improve load-bearing capacity.
Therefore it is filled among 3 internal cavities of main substrate 1 and support column using rubber grain in the present embodiment so that from
The vibration that ground transmits largely is absorbed by rubber grain again after first passing through 6 vibration damping of damper so that the optics on main substrate 1
Measuring system can hardly be influenced by foundation vibration, improve the precision of optical measurement.
Embodiment two
The difference between this embodiment and the first embodiment lies in the structure of the rubber grain is coated metal inside elastomeric skin layer
Particle, the radius of the internal metallic particles are less than the thickness of the elastomeric skin layer, elastomeric skin layer are positioned over using metallic particles
The rubber grain of middle formation can increase the quality of rubber grain, therefore can significantly absorb vibrational energy, significantly increase
The decaying of big vibrational energy.
Embodiment three
Fig. 3 is please referred to, the difference between this embodiment and the first embodiment lies in the absorbing object 7 is polyurethane glue-line, it is described poly-
Thickness d the ＞ 2H, wherein H of urethane glue-line are the wall of the wall of 1 inside encirclement cavity of the support column 3 or the main substrate
It is thick.
Preferably, the polyurethane adhesive that the polyurethane glue-line uses is two-component polyurethane adhesive, this dual-component polyurethane
Glue when in use, can be just prepared into after needing the liquid reactant mixing using two components of A, B suitable for being filled in cavity
Polyurethane adhesive, wherein component A be milky or thick pale yellow shape base polyurethane prepolymer for use as, B component be curing agent and auxiliary agent etc.
Black body of paste or liquid made of mixed dehydration, two components of A, B are with 1:1 ratio mixing stirs evenly light and slowly, prevents
Bring a large amount of bubbles in air into stirring.It is equipped with side in the main substrate 1 and 3 respective surface of the support column
Hole for injecting glue after two components of A, B are mixed evenly, is perfused by hole for injecting glue to main substrate 1 and support column 3, and 30
Minute in embedding sizing finish, allow polyurethane adhesive to cure at room temperature, after solidification the shore hardness of the polyurethane adhesive be 40~
45。
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment.Obvious this field
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations within the scope of the claims of the present invention and its equivalent technology, then the present invention be also intended to include
Including these modification and variations.
Claims (10)
1. a kind of damping frame structure sequentially consists of damper, hanging box, support column and main base in vertical direction
Plate, the damper support the hanging box, the support column that the main substrate, the support column is supported to be placed on the hanging box
On, which is characterized in that the support column and the main substrate are internally provided with cavity, and absorbing is filled in the cavity
Object, the absorbing object absorb the vibration of the damping frame structure；The absorbing object be rubber grain or polyurethane glue-line, it is described
The structure of rubber grain is coated metal particle inside elastomeric skin layer.
2. damping frame structure as described in claim 1, which is characterized in that the shape of the rubber grain is ball or more
Face body.
3. damping frame structure as claimed in claim 2, which is characterized in that the radius of a ball of the circumsphere of the rubber grainWherein h is the depth of the cavity of the cavity inside the support column or the main substrate.
4. damping frame structure as claimed in claim 3, which is characterized in that the radius of the internal metallic particles is less than described
The thickness of elastomeric skin layer.
5. damping frame structure as described in claim 1, which is characterized in that the polyurethane glue-line is layer structure, described
Thickness d the ＞ 2H, wherein H of polyurethane glue-line are the thickness for the wall that the cavity is surrounded in the support column or the main substrate
Degree.
6. damping frame structure as claimed in claim 5, which is characterized in that the polyurethane adhesive that the polyurethane glue-line uses is
Two-component polyurethane adhesive, the shore hardness of the polyurethane glue-line after hardening are 40~45.
7. damping frame structure as claimed in claim 5, which is characterized in that the main substrate and the respective table of the support column
Face is equipped with hole for injecting glue.
8. damping frame structure as described in claim 1, which is characterized in that the hanging box is triangular framing or four sides
Shape frame, the number of the support column are that the number of three either four dampers is three or four, the main base
Plate shape is triangle or quadrangle.
9. damping frame structure as described in claim 1, which is characterized in that further include an optical measuring system, the light
Measuring system is learned to be arranged on the main substrate；The optical measuring system includes projection objective group, alignment subsystem and does
Interferometer measures subsystem, and the projection objective group includes several projection objectives, several described projection objectives are in the horizontal direction
On be arranged into two row, the alignment subsystem is distributed between the two row projection objectives, the interferometer measurement subsystem packet
Several interferometer measurement sensors are included, several described interferometer measurement sensors enclose all on the same horizontal plane
It is distributed around the projection objective group.
10. damping frame structure as described in claim 9, which is characterized in that the interferometer measurement subsystem includes surveying
Holder is measured, the measurement internal stent is provided with holder cavity, and the absorbing object is filled in the holder cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510859956.1A CN106814549B (en) | 2015-11-30 | 2015-11-30 | A kind of damping frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510859956.1A CN106814549B (en) | 2015-11-30 | 2015-11-30 | A kind of damping frame structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106814549A CN106814549A (en) | 2017-06-09 |
| CN106814549B true CN106814549B (en) | 2018-09-18 |
Family
ID=59155847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510859956.1A Active CN106814549B (en) | 2015-11-30 | 2015-11-30 | A kind of damping frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106814549B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN104563161A (en) * | 2015-01-30 | 2015-04-29 | 郑州轻工业学院 | Anti-impact type inspection well lid with multi-stage vibration reduction and energy dissipation function |
| CN104950587A (en) * | 2014-03-25 | 2015-09-30 | 上海微电子装备有限公司 | Exposure device and exposure method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010205553A (en) * | 2009-03-03 | 2010-09-16 | Sharp Corp | Lighting device |
-
2015
- 2015-11-30 CN CN201510859956.1A patent/CN106814549B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226343A (en) * | 2008-01-29 | 2008-07-23 | 芯硕半导体（中国）有限公司 | Method for improving photolithography exposure energy homogeneity using grey level compensation |
| CN104950587A (en) * | 2014-03-25 | 2015-09-30 | 上海微电子装备有限公司 | Exposure device and exposure method |
| CN104563161A (en) * | 2015-01-30 | 2015-04-29 | 郑州轻工业学院 | Anti-impact type inspection well lid with multi-stage vibration reduction and energy dissipation function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106814549A (en) | 2017-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104343885B (en) | High-accuracy magnetic suspension active vibration damping equipment | |
| CN101398636A (en) | Precision vibration damping assembly and vibration damping platform composed of the assembly | |
| Okwudire et al. | Minimization of the residual vibrations of ultra-precision manufacturing machines via optimal placement of vibration isolators | |
| WO2016112685A1 (en) | Three-component standard shaker based on aerostatic decoupling device | |
| CN202133856U (en) | Vibration damping platform | |
| CN106015454B (en) | A kind of control-moment gyro combined vibration-damping device | |
| CN105563225A (en) | Dynamically stable machine tool | |
| CN101477316B (en) | Gravity compensator | |
| CN104465413A (en) | Chip sticking device | |
| CN106814549B (en) | A kind of damping frame structure | |
| KR101860406B1 (en) | Objective lens support device and photoetching machine | |
| CN108695228A (en) | Levelling mechanism, wafer lift mechanism and the reaction chamber of wafer carrier | |
| CN107942622A (en) | A kind of three-freedom degree precision based on double-flexibility pair adjusts parallel institution | |
| CN110114725A (en) | Handling device, exposure device, exposure method, the manufacturing method of flat-panel monitor, manufacturing method and method for carrying | |
| WO2020001513A1 (en) | Workpiece table system and photolithography device | |
| CN207093656U (en) | A kind of roller shock isolation pedestal | |
| CN106241405A (en) | A kind of universal group of screens installing is standby | |
| CN108547496A (en) | Compound magnetorheological fluid granule damper | |
| KR102265142B1 (en) | Vibration control apparatus | |
| CN107797217B (en) | Projection objective supporting device and photoetching machine equipment | |
| CN104070518A (en) | Three freedom precision control apparatus based on eccentric structure | |
| US10480608B2 (en) | Machine vibration isolation | |
| CN206905782U (en) | One kind measurement apparatus shock-damping structure | |
| CN102537207A (en) | Balance mass body | |
| CN207601508U (en) | Three-freedom degree precision based on double-flexibility pair adjusts parallel institution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Applicant before: Shanghai Micro Electronics Equipment Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |