CN106793707A - The framework and its processing method of a kind of diode (led) module - Google Patents
The framework and its processing method of a kind of diode (led) module Download PDFInfo
- Publication number
- CN106793707A CN106793707A CN201710031887.4A CN201710031887A CN106793707A CN 106793707 A CN106793707 A CN 106793707A CN 201710031887 A CN201710031887 A CN 201710031887A CN 106793707 A CN106793707 A CN 106793707A
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- China
- Prior art keywords
- copper sheet
- diode
- aluminium base
- led
- framework
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The framework and its processing method of a kind of diode (led) module, are related to diode (led) module field.Disclose the framework and its processing method of a kind of delicate structure, low easy to process, processing cost and the good diode (led) module of Stability Analysis of Structures, thermal diffusivity.Including aluminium base, insulating coating and n copper sheet, the n copper sheet is attached on a side surface of aluminium base, the insulating coating is coated in aluminium base towards the side surface of copper sheet one and coats the copper sheet, and n convergent belt connecting hole, 2 diode connecting holes of 2n and a pair of cable connecting holes are offered on the insulating coating.During present invention processing, aluminium base and copper sheet can be cut respectively first, be polished, then copper sheet is placed in the surface of aluminium base, finally be coated insulating coating, it is processed extremely convenient, and the requirement to processing jig is extremely low, and the process-cycle is extremely short.The characteristics of present invention has low easy to process, processing cost and good Stability Analysis of Structures, thermal diffusivity on the whole.
Description
Technical field
The present invention relates to diode (led) module field.
Background technology
Representative diode (led) module such as State Bureau is in a entitled of the announcement on the 24th of August in 2016 in the prior art
" low junction temperature photovoltaic junction box and the chip assembly for low junction temperature photovoltaic junction box ", Application No. " 201610284804.8 "
Shown in Chinese invention patent, the case is mainly made up of aluminium base, diode, binding post and diode connecting bridge, but such skill
Art scheme is influenceed by architectural characteristic, needs respectively to be processed all parts, then is assembled one by one, welded, therefore, to machining accuracy
It is required that high, and high requirement is brought to processing jig so that the production cycle is extremely long, welding precision requirement is high and
With high percent defective.
The content of the invention
The present invention is directed to problem above, it is proposed that a kind of delicate structure, low easy to process, processing cost and Stability Analysis of Structures,
The framework and its processing method of the good diode (led) module of thermal diffusivity.
The technical scheme is that：Including aluminium base, insulating coating and n copper sheet, the n copper sheet is attached to aluminium base
On one side surface of plate, the insulating coating is coated in aluminium base towards the side surface of copper sheet one and coats the copper sheet, described exhausted
N convergent belt connecting hole, 2n-2 diode connecting hole and a pair of cable connecting holes are offered on edge coating.
The 2n mounting hole and n-1 for wearing convergent belt is offered on the aluminium base for housing the appearance of diode
Put hole.
The framework also includes insulating frame, and the insulating frame includes sheet noumenon and 2n projection, and the 2n projection is equal
It is fixedly connected on a side surface of sheet noumenon and is arranged in mounting hole so that sheet noumenon fits in aluminium base dorsad
On the surface of copper sheet, the projection middle part offers the through hole for wearing convergent belt, is offered on the sheet noumenon and led to
The through hole that hole corresponds and is connected.
The thickness sum of the aluminium base, copper sheet and insulating coating is h, and the height of the projection is H, h<H.
The insulating frame is made up of resistant to elevated temperatures insulating materials.
It is processed according to the following steps：
1), aluminium base processing：Strip aluminium panels are taken, and n mounting holes and n-1 accommodating hole are gone out in predeterminated position；
2), copper sheet processing：Strip copper sheet material is taken, and n copper sheet is punched out by preset shape；
3), paster：Copper sheet is attached on the top surface of aluminium panels；
4), spray：By insulating coating coat and be covered with aluminium panels towards on the side surface of copper sheet one；
5), cut off：Data according to n are cut off to aluminium panels；Finish.
During present invention processing, aluminium base and copper sheet can be cut respectively first, be polished, then copper sheet is placed in aluminium base
Surface, finally coat insulating coating, its processing is got up extremely convenient, and the requirement to processing jig is extremely low, and processing is all
Phase is extremely short.Hereafter, operating personnel directly the two ends of diode can be welded on exposed copper sheet in diode connecting hole, will
One end of convergent belt is welded on exposed copper sheet in convergent belt connecting hole, one end of cable is welded in convergent belt connection
In hole on exposed copper sheet, and finally complete overall plastic packaging；Processing gets up very convenient, and positioning method is simple, positioning
Effect is good, machining accuracy is high.Further, since this case uses aluminium as the making material of aluminium base, therefore, also cause diode die
Radiating effect when block is used is significantly improved.The present invention is low with easy to process, processing cost on the whole and structure is steady
Calmly, the characteristics of thermal diffusivity is good.
Brief description of the drawings
Fig. 1 is the structural representation of this case,
Fig. 2 is the left view of Fig. 1,
Fig. 3 is the rearview of Fig. 1,
Fig. 4 is the structural representation of copper sheet in this case,
Fig. 5 is the structural representation of aluminium base in this case,
Fig. 6 is the structural representation of insulating frame in this case,
Fig. 7 is the left view of Fig. 6,
Fig. 8 is the installation process schematic diagram of convergent belt in this case；
1 is aluminium base in figure, and 11 is mounting hole, and 12 is accommodating hole, and 2 is insulating coating, and 21 is convergent belt connecting hole, and 22 are
Diode connecting hole, 23 is cable connecting hole, and 3 is copper sheet, and 4 is insulating frame, and 41 is sheet noumenon, and 410 are through hole 42 is
Projection, 420 is through hole；
H is the thickness sum of aluminium base, copper sheet and insulating coating, and H is the height of projection.
Specific embodiment
The present invention as shown in figures 1-8, including aluminium base 1, insulating coating 2 and n (n is the integer more than 1) individual copper sheet 3, n
The copper sheet 3 is attached on a side surface of aluminium base 1, and the insulating coating 2 is coated in aluminium base 1 towards the side table of copper sheet 3
Face and the cladding copper sheet 3, offer n convergent belt connecting hole 21,2n-2 diode connecting hole on the insulating coating 2
23 and a pair of cable connecting holes 23.So as to while aluminium base front keeps good insulating properties so that part copper sheet is naked
Expose outside, for the connection between part and copper sheet such as follow-up diode, convergent belt, cable.
During present invention processing, aluminium base and copper sheet can be cut respectively first, be polished, then copper sheet is placed in aluminium base
Surface, finally coat insulating coating, its processing is got up extremely convenient, and the requirement to processing jig is extremely low, and processing is all
Phase is extremely short.Hereafter, operating personnel directly the two ends of diode can be welded on exposed copper sheet in diode connecting hole, will
One end of convergent belt is welded on exposed copper sheet in convergent belt connecting hole, one end of cable is welded in convergent belt connection
In hole on exposed copper sheet, and finally complete overall plastic packaging；Processing gets up very convenient, and positioning method is simple, positioning
Effect is good, machining accuracy is high.
Further, since this case uses aluminium as the making material of aluminium base, therefore, when also causing that diode (led) module is used
Radiating effect is significantly improved.Data below is obtained through experiment, as shown in table 1：
The 2n mounting hole 11 for wearing convergent belt is offered on the aluminium base 1 (for ease of different clients never
With angle, direction convergent belt is installed) and n-1 (reserve placement sky to diode for housing the accommodating hole 12 of diode
Between).
The framework also includes insulating frame 4, and the insulating frame 4 includes sheet noumenon 41 and 2n projection 42, and 2n described
During projection 42 is fixedly connected with a side surface of sheet noumenon 41 and is arranged in mounting hole 11 so that sheet noumenon 41 is pasted
Together on the aluminium base 1 dorsad surface of copper sheet 3, the middle part of the projection 42 offers the through hole 420 for wearing convergent belt, described
The through hole 410 for corresponding and being connected with through hole is offered on sheet noumenon 41.So, can be by convergent belt from peace during processing
Dress is passed in hole, and is welded on exposed copper sheet in convergent belt connecting hole, so as to effectively completely cut off convergent belt and aluminium base
Contact, that is, be prevented effectively from after convergent belt installs, the adjacent convergent belt brought because convergent belt is in contact with aluminium base it
Between short circuit problem, bring greatly lifting to stability in use and the reliability of diode module.
The thickness sum of the aluminium base 1, copper sheet 3 and insulating coating 2 is h, and the height of the projection 42 is H, h<H.Such as
Shown in Fig. 8, so, convergent belt after body and projection is sequentially passed through, simultaneously weld with exposed in convergent belt connecting hole by bending
When on copper sheet, the knuckle of convergent belt will keep certain gap between insulating coating, so as to effectively prevent convergent belt with it is exhausted
The directly contact of edge coating, insulating coating generation electric leakage is punctured so as to avoid the convergent belt caused because insulating coating is excessively thin
Problem, greatly lifting is brought to the stability in use of diode (led) module.
The insulating frame 4 is made up of resistant to elevated temperatures insulating materials.So as to can still keep good when welding conflux
Structural stability and insulating properties.
It is processed according to the following steps：
1), aluminium base processing：Strip aluminium panels are taken, and n mounting holes and n-1 accommodating hole are gone out in predeterminated position；
2), copper sheet processing：Strip copper sheet material is taken, and n copper sheet is punched out by preset shape；
3), paster：Copper sheet is attached on the top surface of aluminium panels；
4), spray：By insulating coating coat and be covered with aluminium panels towards on the side surface of copper sheet one；
5), cut off：Data according to n are cut off to aluminium panels；Finish.
Claims (6)
1. a kind of framework of diode (led) module, it is characterised in that including aluminium base, insulating coating and n copper sheet, the n copper
Skin is attached on a side surface of aluminium base, and the insulating coating is coated in aluminium base towards the side surface of copper sheet one and cladding institute
Copper sheet is stated, n convergent belt connecting hole, 2n-2 diode connecting hole and a pair of cable connections are offered on the insulating coating
Hole.
2. the framework of a kind of diode (led) module according to claim 1, it is characterised in that offer 2n on the aluminium base
Individual mounting hole and n-1 for wearing convergent belt is used to house the accommodating hole of diode.
3. the framework of a kind of diode (led) module according to claim 1, it is characterised in that the framework also includes insulation
Frame, the insulating frame includes sheet noumenon and 2n projection, and the individual projections of 2n are fixedly connected with the side table in sheet noumenon
On face and it is arranged in mounting hole so that sheet noumenon fits in aluminium base dorsad on the surface of copper sheet, and the projection middle part is opened
The through hole for wearing convergent belt is provided with, the through hole for corresponding and being connected with through hole is offered on the sheet noumenon.
4. the framework of a kind of diode (led) module according to claim 3, it is characterised in that the aluminium base, copper sheet and absolutely
The thickness sum of edge coating is h, and the height of the projection is H, h<H.
5. the framework of a kind of diode (led) module according to claim 3, it is characterised in that the insulating frame is by resistant to elevated temperatures
Insulating materials is made.
6. the processing method of the framework of a kind of diode (led) module described in a kind of claim 1, it is characterised in that according to the following steps
It is processed：
1), aluminium base processing：Strip aluminium panels are taken, and n mounting holes and n-1 accommodating hole are gone out in predeterminated position；
2), copper sheet processing：Strip copper sheet material is taken, and n copper sheet is punched out by preset shape；
3), paster：Copper sheet is attached on the top surface of aluminium panels；
4), spray：By insulating coating coat and be covered with aluminium panels towards on the side surface of copper sheet one；
5), cut off：Data according to n are cut off to aluminium panels；Finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031887.4A CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031887.4A CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793707A true CN106793707A (en) | 2017-05-31 |
| CN106793707B CN106793707B (en) | 2023-03-14 |
Family
ID=58947047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710031887.4A Active CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793707B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019227569A1 (en) * | 2018-05-31 | 2019-12-05 | 苏州同泰新能源科技有限公司 | Micro power supply management module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134618A (en) * | 2005-11-14 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Sheet-form electronic circuit module, and method of manufacturing same |
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| CN203288626U (en) * | 2013-06-19 | 2013-11-13 | 扬州扬杰电子科技股份有限公司 | Novel photovoltaic diode integrated module |
| CN105304727A (en) * | 2015-11-11 | 2016-02-03 | 扬州扬杰电子科技股份有限公司 | Frame assembly and processing technology thereof |
| CN206490053U (en) * | 2017-01-17 | 2017-09-12 | 扬州扬杰电子科技股份有限公司 | The framework of diode (led) module |
-
2017
- 2017-01-17 CN CN201710031887.4A patent/CN106793707B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007134618A (en) * | 2005-11-14 | 2007-05-31 | Matsushita Electric Ind Co Ltd | Sheet-form electronic circuit module, and method of manufacturing same |
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| CN203288626U (en) * | 2013-06-19 | 2013-11-13 | 扬州扬杰电子科技股份有限公司 | Novel photovoltaic diode integrated module |
| CN105304727A (en) * | 2015-11-11 | 2016-02-03 | 扬州扬杰电子科技股份有限公司 | Frame assembly and processing technology thereof |
| CN206490053U (en) * | 2017-01-17 | 2017-09-12 | 扬州扬杰电子科技股份有限公司 | The framework of diode (led) module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019227569A1 (en) * | 2018-05-31 | 2019-12-05 | 苏州同泰新能源科技有限公司 | Micro power supply management module |
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| Publication number | Publication date |
|---|---|
| CN106793707B (en) | 2023-03-14 |
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