CN100529522C - Backlight module, and plane lamp - Google Patents
Backlight module, and plane lamp Download PDFInfo
- Publication number
- CN100529522C CN100529522C CNB2006100877894A CN200610087789A CN100529522C CN 100529522 C CN100529522 C CN 100529522C CN B2006100877894 A CNB2006100877894 A CN B2006100877894A CN 200610087789 A CN200610087789 A CN 200610087789A CN 100529522 C CN100529522 C CN 100529522C
- Authority
- CN
- China
- Prior art keywords
- section portion
- substrate
- encapsulating material
- lamp
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention relates to a plane lamp. It includes first baseplate, second baseplate, first external electrode, second external electrode, first packaging material and second packaging material. The first baseplate is superimposed on second baseplate, first external electrode is placed on the external surface of said first baseplate and second baseplate, and is close to a first side of said plane lamp, said second external electrode is placed on the external surface of said first baseplate and said second baseplate, and is close to a second side of said plane lamp. Said first external electrode is covered with said first packaging material and said second external electrode is covered with said second packaging material.
Description
Technical field
The present invention is about a kind of plane lamp, particularly about a kind of plane lamp that is applied to backlight module.
Background technology
With reference to Fig. 1 a, it shows traditional backlight module 1, comprises a plane lamp 10, a housing 13, a plurality of support member 14 and a plurality of fixture 15.Plane lamp 10 comprises a upper substrate 11 and an infrabasal plate 12.Upper substrate 11 and infrabasal plate 12 overlaids.The outer surface of infrabasal plate 12 is provided with outer electrode 16.Outer electrode 16 contacts support members 14, and the heat of plane lamp 10 directly is passed to support member 14.Please refer to Fig. 1 b, it is support member 14 detailed structure view that a conventional plastic material is made.The structure of support member 14 is still needed above support member 14 in addition and is provided with high temperature insulation sheet 17 except must comprising locking part 18.High temperature insulation sheet 17 is attached on the support member 14, and contact outer electrode 16.In conventional art, because support member 14 need be provided with extra locking part 18 fixedly upper substrate 11, infrabasal plate 12 and fixture 15, and needs use extra high temperature insulation sheet 17 to carry out heat conduction (with plastics as material time).Therefore, the manufacturing cost of backlight module 1 is higher, and assembling process is also comparatively complicated.
Summary of the invention
The present invention has been the problem that solves conventional art, and a kind of plane lamp that provides comprises first substrate, second substrate, first outer electrode, second outer electrode, first encapsulating material and second encapsulating material.Overlapping this second substrate of first substrate.First outer electrode is located at the outer surface of this first substrate and second substrate, and one first side of close this plane lamp.Second outer electrode is located at the outer surface of this first substrate and second substrate, and one second side of close this plane lamp.First encapsulating material is positioned at the sidepiece of plane lamp and coats this first outer electrode.Second encapsulating material coats this second outer electrode.
Use backlight module of the present invention and plane lamp thereof, because the plane lamp encapsulates and coat its electrode with first encapsulating material and second encapsulating material in manufacture process.Therefore, can directly utilize size, shape and the material behavior of first encapsulating material and second encapsulating material that the function of location and heat conduction is provided.Compared to conventional art, backlight module of the present invention provides the location and the function of heat conduction with first encapsulating material and second encapsulating material, can save cost of parts (for example, saving the use of high temperature insulation sheet), shortens the manufacture craft time and improve dimensional accuracy.
Description of drawings
Fig. 1 a shows traditional backlight module schematic diagram;
It is the support member of material that Fig. 1 b shows with plastics;
Fig. 2 a shows the stereogram of plane of the present invention lamp;
Fig. 2 b shows the side view of plane of the present invention lamp;
Fig. 3 shows backlight module of the present invention;
Fig. 4 shows the variation of backlight module of the present invention;
Fig. 5 a shows the variation of plane of the present invention lamp;
Fig. 5 b shows the another variation of plane of the present invention lamp.
The primary clustering symbol description
1～backlight module; 10～plane lamp;
11～upper substrate; 12～infrabasal plate;
13～housing; 14～support member;
15～fixture; 16～outer electrode;
17～high temperature insulation sheet; 18～locking part;
100～plane lamp; 111～the first substrates;
112～the second substrates; 131,132～the first outer electrodes;
141,142～the second outer electrodes; 150～the first encapsulating materials;
151～the first sections portions; 152～the second sections portions;
153～positioning convex point; 154～locating notch;
155～opening; 160～the second encapsulating materials;
The 161～three section portion; The 162～four section portion;
163～positioning convex point; 164～locating notch;
165～opening; 200～backlight module;
210～fixture; 211～locating convex block;
220～housing; 221～locating hole;
230～conductor.
The specific embodiment
With reference to Fig. 2 a, Fig. 2 b, it shows plane of the present invention lamp 100, comprises first substrate 111, second substrate, 112, the first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141, second outer bottom electrode 142, first encapsulating material 150 and second encapsulating material 160.First substrate 111 is relative with this second substrate 112, and puts on an encapsulant (not shown) around the inner surface side of first substrate 111 and second substrate 112, with involution first substrate 111 and second substrate 112.The first outside top electrode 131 is located at the outer surface of this first substrate 111, and one first side of close this plane lamp 100.This first outer bottom electrode 132 is located at the outer surface of this second substrate 112, and is near this first side of this plane lamp 100, corresponding and in contrast to this first outside top electrode 131.The second outside top electrode 141 is located at the outer surface of this first substrate 111, and one second side of close this plane lamp 100.This second outer bottom electrode 142 is located at the outer surface of this second substrate 112, and is near this second side of this plane lamp 100, corresponding and in contrast to this upper electrode 141 outside second.
The first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141 and second outer bottom electrode 142 can be by attaching conductive foil (for example, copper sheet), or, mode such as silver coating, tin conducting film and forming.
This first encapsulating material 150 comprises one first section portion 151 and one second section portion 152, and 151 pairs in this first section portion should the first outside top electrode 131, and 152 pairs in this second section portion should first outer bottom electrode 132.This second encapsulating material 160 comprise 161 pairs in one the 3rd section portion 161 and 162, the three sections portions of one the 4th section portion should 162 pairs in 141, the four sections portions of the second outside top electrode should second outer bottom electrode 142.
This first encapsulating material 150 and this second encapsulating material 160 comprise the material that is electrically insulated, for example, and silica gel, rubber, plastics or epoxide resin material.
This first encapsulating material 150 and this second encapsulating material 160 also can comprise metallic, to increase its heat-conducting effect.
First encapsulating material 150 and this second encapsulating material 160 can combine with first substrate 111, second substrate, 112, the first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141, second outer bottom electrode 142 respectively in the mode of ejection formation.First encapsulating material 150 and this second encapsulating material 160 can also put on the top of the first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141, second outer bottom electrode 142 in the mode of coating/hot pressing, to coat and to encapsulate the top of the first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141, second outer bottom electrode 142.Certainly, other is arranged on the outside of outer electrode with first encapsulating material 150 and this second encapsulating material 160, can coat the mode of package outside electrode, can also be applied to the plane lamp of this case, does not exceed with foregoing.
With reference to Fig. 3, it shows backlight module 200 of the present invention, comprises plane lamp 100, fixture 210 and housing 220.Plane lamp 100 is located among the housing 220.The free degree of fixture 210 restriction plane lamps 100.Wherein, plane lamp 100 contacts housings 220 by this second section portion 152 and the 4th section portion 162, simultaneously, and by this first section portion 151 and the 3rd section portion's 161 touch fasteners 210.Be applied among the embodiment of backlight module one, because the top of plane lamp will combine with display floater, therefore the thickness of this first section portion 151 and the 3rd section portion 161 is preferably between 0～15 millimeter, and use hardness higher, heat passes the lower material of coefficient, so can avoid the heat that the plane lamp produced to pass to display floater, but and between control plane lamp and the display floater apart from certain scope.The thickness of second section portion 152 and the 4th section portion 162 is preferably between 2～4 millimeters; and use hardness lower; heat passes the higher material of coefficient, and the heat that so the plane lamp can be produced leads away from the direction of display floater, and can provide the plane lamp enough buffer protections.Certainly, aforesaid thickness and material be as limit, visual actual design demand and revising.
As shown in Figure 3, Figure 4, be first section portion 151 and second section portion 152, or the 3rd section portion 161 and the 4th section portion 162 of separating illustrate to separate; Certainly, be understandable that, first section portion 151 and second section portion 152, or the 3rd section portion 161 and the 4th section portion 162 can also mutually combine and be one, and coat the side of first substrate 111 and second substrate 112.
In backlight module 200 of the present invention and plane lamp 100 thereof, because plane lamp 100 encapsulates and coat its electrode with first encapsulating material 150 and second encapsulating material 160 in manufacture process.Therefore, can directly utilize size, shape and the material behavior of first encapsulating material 150 and second encapsulating material 160 that the function of location and heat conduction is provided.Compared to conventional art, first encapsulating material 150 of backlight module 200 of the present invention and second encapsulating material 160 provide the function of location and heat conduction, can save cost of parts (for example, saving the use of high temperature insulation sheet), shorten the manufacture craft time and improve dimensional accuracy.
With reference to Fig. 4, it shows a variation of backlight module 200 of the present invention, wherein, this first encapsulating material 150 also comprises a plurality of positioning convex points 153 and a location breach 154, this second encapsulating material 160 also comprises a plurality of positioning convex points 163 and a location breach 164, housing 220 comprises more than one locating hole 221, and fixture 210 comprises a location projection 211. Positioning convex point 153 and 163 corresponding locating holes 221, whereby, plane lamp 100 can be positioned on the housing 220.A locating notch 154 and a location breach 164 correspond respectively to the locating convex block 211 of fixture 210, and whereby, plane lamp 100 can obtain constraint with respect to the position of fixture 210.In the present invention, because positioning convex point 153, locating notch 154, positioning convex point 163 and locating notch 164 all form in integrally formed mode, therefore can save cost of parts, shorten the manufacture craft time and improve dimensional accuracy.
Simultaneously, first encapsulating material 150 can also comprise opening 155, second encapsulating material 160 can also comprise opening 165, stretches into wherein for conductor 230, and electrically connects this first outside top electrode 131, first outer bottom electrode, 132, the second outside top electrode 141 and second outer bottom electrode 142.
With reference to Fig. 5 a, it shows the plane lamp 100 ' of a variation of the present invention, and its characteristics are, omit first outer bottom electrode 132 and second outer bottom electrode 142, and only conduct electricity with the first outside top electrode 131 and two outside top electrodes 141.
With reference to Fig. 5 b, it shows the plane lamp 100 of another variation of the present invention ", its characteristics are, omit the first outside top electrode 131 and the second outside top electrode 141, and only conduct electricity with first outer bottom electrode 132 and second outer bottom electrode 142.Though the present invention with concrete preferred embodiment openly as above; right its is not in order to qualification the present invention, and any insider is in the spirit and scope that do not break away from the present invention's work; still can do a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (14)
1. plane lamp comprises:
One first substrate;
One second substrate is relative with this first substrate;
One first outer electrode is located at the outer surface of this first substrate, and near one first side of this plane lamp, this first outer electrode more is formed at the outer surface of this second substrate;
One first encapsulating material, described first encapsulating material only is positioned at the sidepiece of this plane lamp and coats this first outer electrode, this first encapsulating material comprises one first section portion and one second section portion, this first section portion is to should first substrate, this second section portion is to should second substrate, the heat biography coefficient that the hardness of this first section portion is higher than this second section portion and this first section portion is lower than this second section portion, wherein the thickness of this first section portion is between 0～15 millimeter, and the thickness of this second section portion is between 2～4 millimeters.
2. plane according to claim 1 lamp, wherein, this first encapsulating material comprises the material that is electrically insulated.
3. plane according to claim 2 lamp, wherein, this first encapsulating material comprises silica gel, rubber or plastics.
4. plane according to claim 2 lamp, wherein, this first encapsulating material comprises epoxide resin material.
5. plane according to claim 1 lamp, wherein, this first encapsulating material comprises metallic.
6. plane according to claim 1 lamp, wherein, this first encapsulating material comprises that an opening and a conductor stretch into this opening, this conductor electrically connects this first outer electrode.
7. plane according to claim 1 lamp, it comprises that also one has second encapsulating material and one second outer electrode of metallic, this second outer electrode is located at the outer surface of this first substrate, and one second side of close this plane lamp, this second side is in contrast to this first side, and this second encapsulating material coats this second outer electrode.
8. plane according to claim 7 lamp, wherein, this second encapsulating material comprises that an opening and a conductor stretch into this opening, this conductor electrically connects this second outer electrode.
9. backlight module comprises:
One housing; And
One plane lamp, comprise one first substrate, one second substrate, one first outer electrode and one has first encapsulating material of metallic, overlapping this first substrate of this second substrate, this first outer electrode is located at the outer surface of this first substrate, and one first side of close this plane lamp, this first encapsulating material only is positioned at the sidepiece of this plane lamp and coats this first outer electrode, this first encapsulating material comprises one first section portion and one second section portion, this first section portion is to should first substrate, this second section portion is to should second substrate, the heat biography coefficient that the hardness of this first section portion is higher than this second section portion and this first section portion is lower than this second section portion, wherein the thickness of this first section portion is between 0～15 millimeter, and the thickness of this second section portion is between 2～4 millimeters.
10. backlight module according to claim 9, wherein, this this housing of first encapsulating material butt.
11. backlight module according to claim 9, wherein, this first encapsulating material comprises a location salient point, and this housing comprises a locating hole, and this positioning convex point stretches among this locating hole, to locate this plane lamp.
12. backlight module according to claim 9, it also comprises a fixture, is arranged on this first substrate top, this first encapsulating material comprises a location breach, this fixture comprises a location projection, and this this locating notch of locating convex block butt is to locate this plane lamp.
13. a backlight module preparation method comprises:
One first substrate and one second substrate are provided;
This first substrate of involution and this second substrate;
Side in this first outer surface of substrate is provided with an outer electrode;
Coat this first outer electrode with an encapsulating material, thereby form a plane lamp, and this encapsulating material only is positioned at the sidepiece of this plane lamp, this encapsulating material comprises one first section portion and one second section portion, this first section portion is to should first substrate, this second section portion is to should second substrate, the heat biography coefficient that the hardness of this first section portion is higher than this second section portion and this first section portion is lower than this second section portion, wherein the thickness of this first section portion is between 0～15 millimeter, and the thickness of this second section portion is between 2～4 millimeters.
14. backlight module preparation method according to claim 13, it also comprises is located at this plane lamp on one housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100877894A CN100529522C (en) | 2006-06-07 | 2006-06-07 | Backlight module, and plane lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100877894A CN100529522C (en) | 2006-06-07 | 2006-06-07 | Backlight module, and plane lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1873309A CN1873309A (en) | 2006-12-06 |
| CN100529522C true CN100529522C (en) | 2009-08-19 |
Family
ID=37483862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100877894A Expired - Fee Related CN100529522C (en) | 2006-06-07 | 2006-06-07 | Backlight module, and plane lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100529522C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734756A (en) * | 2011-04-11 | 2012-10-17 | 苏州世鼎电子有限公司 | Method for assembling insulating sheet on shell of backlight module |
| CN103216739A (en) * | 2012-01-19 | 2013-07-24 | 南亚光电股份有限公司 | Planar light-emitting diode illumination |
| TWI596980B (en) * | 2012-06-11 | 2017-08-21 | 友達光電股份有限公司 | Plate limiting structure |
-
2006
- 2006-06-07 CN CNB2006100877894A patent/CN100529522C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1873309A (en) | 2006-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11302889B2 (en) | Flexible display module having a flexible glass layer | |
| KR100629496B1 (en) | Led package structure and manufacturing method for the same | |
| US9648755B2 (en) | Method for manufacturing a non-planar printed circuit board assembly | |
| CN107535050A (en) | Multilayer bus board | |
| EP2445024B1 (en) | Led array module and fabrication method thereof | |
| US20140198454A1 (en) | Integrated power module packaging structure | |
| KR102464287B1 (en) | Method of manufacturing electronic assembly and electronic assembly | |
| CN101690438B (en) | Electric apparatus unit | |
| CN100529522C (en) | Backlight module, and plane lamp | |
| US20140117525A1 (en) | Power module package and method of manufacturing the same | |
| US10595420B2 (en) | Encapsulation structure and display apparatus | |
| CN110597416B (en) | Flexible circuit board, touch display panel and touch display device | |
| CN105448202B (en) | A kind of LED display with transparent soft substrate | |
| CN208016152U (en) | Electronic device filled with heat conduction capsulation material | |
| JP7145262B2 (en) | Touch device and its manufacturing method | |
| TW202400932A (en) | Integrated multilayer structure containing optically functional module and related method of manufacture | |
| CN102762034A (en) | Circuit board manufacturing method and base circuit board | |
| AU2016290374B2 (en) | Flexible printed circuit, concentrated photovoltaic module, concentrated photovoltaic panel, and method for manufacturing flexible printed circuit | |
| US8217506B2 (en) | Semiconductor packaging structure having conductive gel to package semiconductor device | |
| CN203932109U (en) | Luminous package and bearing structure thereof | |
| CN219998205U (en) | Chip-embedded packaging substrate structure | |
| US8845909B2 (en) | Process of fabricating heat dissipation substrate | |
| TWI722724B (en) | Power module | |
| CN102044599B (en) | Light-emitting diode (LED) | |
| TW200924112A (en) | Portable electronic device and stamping method of circuit element thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20200607 |