CN106793707B - Frame of diode module and processing method thereof - Google Patents
Frame of diode module and processing method thereof Download PDFInfo
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- CN106793707B CN106793707B CN201710031887.4A CN201710031887A CN106793707B CN 106793707 B CN106793707 B CN 106793707B CN 201710031887 A CN201710031887 A CN 201710031887A CN 106793707 B CN106793707 B CN 106793707B
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- aluminum substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
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- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
A frame of a diode module and a processing method thereof relate to the field of diode modules. A frame of diode module with compact structure, convenient processing, low processing cost, stable structure and good heat dissipation and its processing method are disclosed. The LED lamp comprises an aluminum substrate, an insulating coating and n copper sheets, wherein the n copper sheets are attached to the surface of one side of the aluminum substrate, the insulating coating is coated on the surface of one side, facing the copper sheets, of the aluminum substrate and wraps the copper sheets, and the insulating coating is provided with n bus belt connecting holes, 2n-2 diode connecting holes and a pair of cable connecting holes. When the aluminum base plate is processed, the aluminum base plate and the copper sheet can be cut and polished respectively, then the copper sheet is placed on the surface of the aluminum base plate, and finally the insulating coating is coated. The invention has the characteristics of convenient processing, low processing cost, stable structure and good heat dissipation on the whole.
Description
Technical Field
The present invention relates to the field of diode modules.
Background
As shown in a chinese invention patent with an application number of 201684804.8, which is published by the national office on 24/8/2016, a representative diode module in the prior art, and is named as "low-junction-temperature photovoltaic junction box and chip assembly for the same" in the prior art, the diode module mainly comprises an aluminum substrate, a diode, a binding post and a diode wiring bridge, however, such technical scheme is influenced by structural characteristics, and each component needs to be processed, assembled and welded one by one, so that the processing precision requirement is extremely high, and extremely high requirements are brought to a processing jig, so that the production period is extremely long, the welding precision requirement is extremely high, and the rejection rate is extremely high.
Disclosure of Invention
Aiming at the problems, the invention provides a diode module frame which has the advantages of exquisite structure, convenient processing, low processing cost, stable structure and good heat dissipation and a processing method thereof.
The technical scheme of the invention is as follows: the LED lamp comprises an aluminum substrate, an insulating coating and n copper sheets, wherein the n copper sheets are attached to one side surface of the aluminum substrate, the insulating coating is coated on one side surface, facing the copper sheets, of the aluminum substrate and covers the copper sheets, and the insulating coating is provided with n bus bar connecting holes, 2n-2 diode connecting holes and a pair of cable connecting holes.
The aluminum substrate is provided with 2n mounting holes for penetrating the bus bars and n-1 accommodating holes for accommodating diodes.
The frame still includes the insulating frame, the insulating frame includes slice body and 2n lugs, 2n the equal fixed connection of lug is on one side of slice body surface, and wears to locate in the mounting hole for the slice body laminating is on the aluminium base board copper sheet of the back of the body surface, the lug middle part is seted up and is used for wearing to establish the through-hole that converges the area, set up the through-hole that just is linked together with the through-hole one-to-one on the slice body.
The sum of the thicknesses of the aluminum substrate, the copper sheet and the insulating coating is H, the height of the bump is H, and H is less than H.
The insulating frame is made of high-temperature-resistant insulating materials.
The processing method comprises the following steps:
1) And processing an aluminum substrate: taking a strip-shaped aluminum plate, and punching n mounting holes and n-1 accommodating holes in a preset position;
2) And processing the copper sheet: taking a strip-shaped copper sheet, and punching n copper sheets according to a preset shape;
3) And surface mounting: attaching a copper sheet to the top surface of the aluminum plate;
4) And spraying: coating and spreading an insulating coating on the surface of one side, facing the copper sheet, of the aluminum plate;
5) And cutting off: cutting the aluminum plate according to the data of n; and (6) finishing.
When the aluminum base plate is processed, the aluminum base plate and the copper sheet can be cut and polished respectively, then the copper sheet is placed on the surface of the aluminum base plate, and finally the insulating coating is coated, so that the aluminum base plate is very convenient to process, has extremely low requirements on processing jigs, and has an extremely short processing period. Then, an operator can directly weld two ends of the diode on the copper sheet exposed in the connecting hole of the diode, weld one end of the bus bar on the copper sheet exposed in the connecting hole of the bus bar, weld one end of the cable on the copper sheet exposed in the connecting hole of the bus bar, and finally complete the integral plastic package; the processing is very convenient, and the positioning mode is simple, the positioning effect is good, and the processing precision is high. In addition, because the aluminum is adopted as the manufacturing material of the aluminum substrate, the heat dissipation effect of the diode module in use is greatly improved. The invention has the characteristics of convenient processing, low processing cost, stable structure and good heat dissipation performance on the whole.
Drawings
FIG. 1 is a schematic structural diagram of the present invention,
figure 2 is a left side view of figure 1,
figure 3 is a rear view of figure 1,
FIG. 4 is a schematic diagram of the structure of the copper sheet in the present case,
FIG. 5 is a schematic structural diagram of an aluminum substrate in the present case,
FIG. 6 is a schematic view of the structure of the insulation frame in the present case,
figure 7 is a left side view of figure 6,
FIG. 8 is a schematic view of the installation process of the bus bar in the present case;
in the figure, 1 is an aluminum substrate, 11 is a mounting hole, 12 is a containing hole, 2 is an insulating coating, 21 is a bus bar connecting hole, 22 is a diode connecting hole, 23 is a cable connecting hole, 3 is a copper sheet, 4 is an insulating frame, 41 is a sheet body, 410 is a through hole, 42 is a bump, and 420 is a through hole;
h is the sum of the thicknesses of the aluminum substrate, the copper sheet and the insulating coating, and H is the height of the bump.
Detailed Description
As shown in fig. 1 to 8, the invention includes an aluminum substrate 1, an insulating coating 2 and n (n is an integer greater than 1) copper sheets 3, the n copper sheets 3 are attached to one side surface of the aluminum substrate 1, the insulating coating 2 is coated on one side surface of the aluminum substrate 1 facing the copper sheets 3 and covers the copper sheets 3, and the insulating coating 2 is provided with n bus bar connection holes 21, 2n-2 diode connection holes 22 and a pair of cable connection holes 23. Therefore, the front surface of the aluminum substrate keeps good insulativity, and meanwhile, part of the copper sheet is exposed to the outside so as to be used for communication between subsequent components such as diodes, bus bars, cables and the like and the copper sheet.
When the aluminum base plate is processed, the aluminum base plate and the copper sheet can be cut and polished respectively, then the copper sheet is placed on the surface of the aluminum base plate, and finally the insulating coating is coated, so that the aluminum base plate is very convenient to process, has extremely low requirements on processing jigs, and has an extremely short processing period. Then, an operator can directly weld two ends of the diode on the copper sheet exposed in the connecting hole of the diode, weld one end of the bus bar on the copper sheet exposed in the connecting hole of the bus bar, weld one end of the cable on the copper sheet exposed in the connecting hole of the bus bar, and finally complete the integral plastic package; the processing is very convenient, and the positioning mode is simple, the positioning effect is good, and the processing precision is high.
In addition, because the aluminum is adopted as the manufacturing material of the aluminum substrate, the heat dissipation effect of the diode module in use is greatly improved. The following data were obtained experimentally, as shown in table 1:
the aluminum substrate 1 is provided with 2n mounting holes 11 for passing bus strips (for different customers to mount the bus strips from different angles and directions) and n-1 accommodating holes 12 for accommodating diodes (for reserving a placing space for the diodes).
The frame further comprises an insulating frame 4, the insulating frame 4 comprises a sheet-shaped body 41 and 2n bumps 42,2n bumps 42 are fixedly connected to the surface of one side of the sheet-shaped body 41 and penetrate through the mounting hole 11, so that the sheet-shaped body 41 is attached to the surface, opposite to the copper sheet 3, of the aluminum substrate 1, through holes 420 for penetrating the bus bars are formed in the middle of the bumps 42, and through holes 410 which correspond to the through holes one to one and are communicated with the through holes are formed in the sheet-shaped body 41. Therefore, the bus bar belt can penetrate out of the mounting hole during machining and is welded on the copper sheet exposed in the bus bar belt connecting hole, so that the contact between the bus bar belt and the aluminum substrate is effectively isolated, the problem of short circuit between adjacent bus bar belts caused by the contact between the bus bar belt and the aluminum substrate after the bus bar belt is installed is effectively avoided, and the service stability and reliability of the diode module are greatly improved.
The sum of the thicknesses of the aluminum substrate 1, the copper sheet 3 and the insulating coating 2 is H, the height of the bump 42 is H, and H is less than H. As shown in fig. 8, after the bus bar sequentially passes through the body and the bump, when the bus bar is bent, welded and exposed on the copper sheet in the connecting hole of the bus bar, a certain gap is kept between the bent angle of the bus bar and the insulating coating, so that the direct contact between the bus bar and the insulating coating is effectively avoided, the problem that the bus bar breaks through the insulating coating to generate electric leakage due to the fact that the insulating coating is too thin is avoided, and the service stability of the diode module is greatly improved.
The insulating frame 4 is made of a high temperature resistant insulating material. Therefore, the bus bar can still maintain good structural stability and insulation when being welded.
The processing method comprises the following steps:
1) And processing an aluminum substrate: taking a strip-shaped aluminum plate, and punching n mounting holes and n-1 accommodating holes in a preset position;
2) And processing the copper sheet: taking a strip-shaped copper sheet, and punching n copper sheets according to a preset shape;
3) And surface mounting: attaching a copper sheet to the top surface of the aluminum plate;
4) And spraying: coating and spreading an insulating coating on the surface of one side, facing the copper sheet, of the aluminum plate;
5) And cutting off: cutting off the aluminum plate according to the data of n; and (6) finishing.
Claims (3)
1. A framework of a diode module is characterized by comprising an aluminum substrate, an insulating coating and n copper sheets, wherein the n copper sheets are attached to the surface of one side of the aluminum substrate, the insulating coating is coated on the surface of one side, facing the copper sheets, of the aluminum substrate and wraps the copper sheets, and n bus bar connecting holes, 2n-2 diode connecting holes and a pair of cable connecting holes are formed in the insulating coating;
2n mounting holes for penetrating the bus bars and n-1 accommodating holes for accommodating diodes are formed in the aluminum substrate;
the frame further comprises an insulating frame, the insulating frame comprises a sheet-shaped body and 2n convex blocks, the 2n convex blocks are fixedly connected to the surface of one side of the sheet-shaped body and penetrate through the mounting hole, so that the sheet-shaped body is attached to the surface, back to the copper sheet, of the aluminum substrate, the middle of each convex block is provided with a through hole for penetrating the bus bar, and the sheet-shaped body is provided with through holes which correspond to the through holes one by one and are communicated with the through holes;
the sum of the thicknesses of the aluminum substrate, the copper sheet and the insulating coating is H, the height of the bump is H, and H is less than H.
2. The frame for a diode module as claimed in claim 1, wherein the insulating frame is made of a high temperature resistant insulating material.
3. A method of manufacturing a frame of a diode module according to claim 1, comprising the steps of:
1) And processing an aluminum substrate: taking a strip-shaped aluminum plate, and punching n mounting holes and n-1 accommodating holes in a preset position;
2) And processing the copper sheet: taking a strip-shaped copper sheet, and punching n copper sheets according to a preset shape;
3) And surface mounting: attaching a copper sheet to the top surface of the aluminum plate;
4) And spraying: coating and spreading an insulating coating on the surface of one side, facing the copper sheet, of the aluminum plate;
5) And cutting off: cutting off the aluminum plate according to the data of n; and (6) finishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031887.4A CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710031887.4A CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793707A CN106793707A (en) | 2017-05-31 |
| CN106793707B true CN106793707B (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710031887.4A Active CN106793707B (en) | 2017-01-17 | 2017-01-17 | Frame of diode module and processing method thereof |
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| CN (1) | CN106793707B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108540088A (en) * | 2018-05-31 | 2018-09-14 | 苏州同泰新能源科技有限公司 | Micro power management module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4635836B2 (en) * | 2005-11-14 | 2011-02-23 | パナソニック株式会社 | Sheet electronic circuit module |
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| CN203288626U (en) * | 2013-06-19 | 2013-11-13 | 扬州扬杰电子科技股份有限公司 | Novel photovoltaic diode integrated module |
| CN105304727B (en) * | 2015-11-11 | 2017-06-16 | 扬州扬杰电子科技股份有限公司 | A kind of frame assembly and its processing technology |
| CN206490053U (en) * | 2017-01-17 | 2017-09-12 | 扬州扬杰电子科技股份有限公司 | The framework of diode (led) module |
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- 2017-01-17 CN CN201710031887.4A patent/CN106793707B/en active Active
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| CN106793707A (en) | 2017-05-31 |
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