CN215121320U

CN215121320U - Copper-based PCB circuit board containing thermoelectric separation copper boss

Info

Publication number: CN215121320U
Application number: CN202121593332.7U
Authority: CN
Inventors: 向一敏
Original assignee: Shenzhen Zhengyang Jiye Electronics Co ltd
Current assignee: Shenzhen Zhengyang Jiye Electronics Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-12-10
Anticipated expiration: 2031-07-14

Abstract

The utility model discloses a copper base PCB circuit board that contains thermoelectric separation copper boss, lead to groove, copper boss, gluing layer, electronic component, assembly through groove, insulating coating, plating layer, fastener, lock groove, conducting layer, substrate layer, horizontal strengthening rib and vertical strengthening rib including copper base plate body, step, the step has been seted up and has been led to the groove in the inside of copper base plate body, and the inside that the step led to the groove settles and have the copper boss, the top of copper boss is connected with gluing layer, and the top on gluing layer is connected with electronic component, the assembly is seted up in the four corners of copper base plate body and has been led to the groove, and the inner wall that the groove was led to in the assembly is provided with insulating coating, the copper base plate body includes plating layer, conducting layer and substrate layer. This copper base PCB circuit board that contains thermoelectric separation copper boss can conveniently make the copper base plate body accomplish the assembly through the assembly logical groove after setting up, and utilizes insulating cladding material can play insulating effect to the installation nail, avoids causing the influence to the performance of copper base plate body.

Description

Copper-based PCB circuit board containing thermoelectric separation copper boss

Technical Field

The utility model relates to a PCB circuit board technical field, specific copper base PCB circuit board that contains thermoelectric separation copper boss that says so.

Background

PCBs, i.e., printed circuit boards, are important electronic components, support electronic components, and providers of electrical connections for electronic components. At present, with the rapid development of the PCB industry, the application of the PCB industry is more and more extensive. Electronic equipment is as small as electronic watches, calculators, general purpose computers, as large as computers, communication electronic equipment and military weapon systems, and as long as electronic components such as integrated circuits are arranged, the electrical interconnection among the electronic components is all made by using PCBs.

The circuit board of the existing PCB circuit board can generate a large amount of heat in the working process, the heat is gathered on the circuit board and can not be rapidly dissipated, the heat can seriously affect the working efficiency of the circuit board, the more serious consequence of the heat gathering can burn the circuit board to cause fire, and technical innovation is carried out on the basis of the existing PCB circuit board aiming at the above situation.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects existing in the prior art, the utility model aims at providing a copper-based PCB circuit board containing a thermoelectric separation copper boss.

The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is: a copper-based PCB circuit board containing a thermoelectricity separation copper boss comprises a copper substrate body, a step through groove, a copper boss, an adhesive layer, an electronic element, an assembly through groove, an insulating coating, an electroplating layer, a clamping piece, a buckling groove, a conductive layer, a substrate layer, a transverse reinforcing rib and a longitudinal reinforcing rib, wherein the step through groove is formed in the copper substrate body, the copper boss is arranged in the step through groove, the adhesive layer is connected above the copper boss, the electronic element is connected above the adhesive layer, the assembly through groove is formed in four corners of the copper substrate body, the insulating coating is arranged on the inner wall of the assembly through groove, the copper substrate body comprises the electroplating layer, the conductive layer and the substrate layer, the clamping piece is fixed on one side of the electroplating layer, the buckling groove is connected on the outer surface of the clamping piece, the conductive layer is fixed on the outer side wall of the buckling groove, and the substrate layer is arranged in the conductive layer, the surface of copper base plate body is provided with horizontal strengthening rib, and vertical strengthening rib is worn to be equipped with in the inside of horizontal strengthening rib.

The copper substrate body forms a clamping structure through the step through groove and the copper boss, the step through groove is matched with the appearance structure of the copper boss, and the copper boss is uniformly distributed along the upper surface of the copper substrate body at equal intervals.

The copper boss is connected with the electronic element in an adhesive mode through the adhesive layer, and the material of the adhesive layer is epoxy resin.

The assembling through groove penetrates through the inside of the copper substrate body, and the assembling through groove is connected with the insulating coating in an adhesion mode.

The electroplated layer and the conducting layer are symmetrically distributed about a horizontal central axis of the base material layer, and the thickness of the electroplated layer is equal to that of the conducting layer.

The electroplated layer forms a clamping structure between the clamping piece and the buckling groove and the conducting layer, and the conducting layer forms a clamping structure between the clamping piece and the buckling groove and the base material layer.

The transverse reinforcing ribs and the longitudinal reinforcing ribs are mutually staggered, and the transverse reinforcing ribs and the longitudinal reinforcing ribs are uniformly distributed on the outer surface of the copper substrate body.

The utility model has the advantages that:

1. the copper boss is pressed and embedded in the step through groove after arrangement, the binding force between the copper boss and the copper substrate body is increased, clamping position can be formed, the copper boss is effectively prevented from falling off, meanwhile, the step joint surface is convenient and accurate to position, the copper boss and the copper substrate body are guaranteed to be parallel and level to the maximum extent, the flatness is better, a piece is convenient to attach, the adhesive layer after arrangement is made of epoxy resin, and therefore, the electronic element can be tightly adhered by utilizing a plurality of unique advantages of high structural strength, good sealing performance and the like of the adhesive layer, the high heat-conducting performance of copper is utilized, heat generated by the electronic element is quickly conducted to the copper substrate body through the copper boss, the thermoelectric separation effect is achieved, and the heat dissipation performance of the copper substrate body is improved;

2. the copper substrate body can be conveniently assembled through the arranged assembling through grooves, the insulating plating layer can be used for insulating the mounting nail, the performance of the copper substrate body is prevented from being affected, the copper substrate body can be protected through the arranged plating layer, corrosion is prevented, the service life of the copper substrate body is prolonged, and the conducting layer can increase the conducting effect;

3. through the electroplated layer after setting up, connect through fastener and the mutual lock in lock groove between conducting layer and the substrate layer respectively, so can increase the life of copper base plate body, can increase the hardness of copper base plate body under the circumstances of guaranteeing the performance through mutually supporting of horizontal strengthening rib after setting up and vertical strengthening rib.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the structure of the joint between the step through groove and the copper boss of the present invention;

FIG. 3 is a schematic sectional view of the assembly through groove of the present invention;

fig. 4 is a schematic view of the explosion structure of the copper substrate body of the present invention;

fig. 5 is a schematic view of the structure of the fastener and the fastening groove of the present invention.

In the figure: 1. a copper substrate body; 2. a step through groove; 3. a copper boss; 4. an adhesive layer; 5. an electronic component; 6. assembling a through groove; 7. an insulating plating layer; 8. electroplating layer; 9. a fastener; 10. buckling the groove; 11. a conductive layer; 12. a substrate layer; 13. transverse reinforcing ribs; 14. and (5) longitudinal reinforcing ribs.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a copper-based PCB circuit board containing a thermoelectric separation copper boss comprises a copper substrate body 1, a stepped through groove 2, a copper boss 3, an adhesive layer 4, an electronic component 5, an assembly through groove 6, an insulating plating layer 7, an electroplating layer 8, a fastener 9, a fastening groove 10, a conductive layer 11, a substrate layer 12, a transverse reinforcing rib 13 and a longitudinal reinforcing rib 14, wherein the stepped through groove 2 is formed in the copper substrate body 1, the copper boss 3 is arranged in the stepped through groove 2, the adhesive layer 4 is connected above the copper boss 3, the electronic component 5 is connected above the adhesive layer 4, the assembly through grooves 6 are formed at four corners of the copper substrate body 1, the insulating plating layer 7 is arranged on the inner wall of the assembly through groove 6, the copper substrate body 1 comprises the electroplating layer 8, the conductive layer 11 and the substrate layer 12, the fastener 9 is fixed on one side of the electroplating layer 8, and the fastening groove 10 is connected on the outer surface of the fastener 9, the outer side wall of the buckling groove 10 is fixed with a conductive layer 11, a base material layer 12 is arranged inside the conductive layer 11, a transverse reinforcing rib 13 is arranged on the outer surface of the copper substrate body 1, and a longitudinal reinforcing rib 14 is arranged inside the transverse reinforcing rib 13 in a penetrating mode.

The utility model discloses in: the copper substrate body 1 forms a clamping structure with the copper boss 3 through the step through groove 2, the step through groove 2 is matched with the appearance structure of the copper boss 3, and the copper bosses 3 are uniformly distributed along the upper surface of the copper substrate body 1 at equal intervals; imbed in the logical groove 2 of step through the 3 pressfittings of copper boss after setting up, increase the cohesion between copper boss 3 and the copper base plate body 1 to can form the screens, prevent effectively that copper boss 3 from droing, step faying face location is convenient, accurate simultaneously, guarantees

copper boss

3 and 1 parallel and level of copper base plate body furthest, and the roughness is better, conveniently pastes the piece.

The utility model discloses in: copper boss 3 is connected through gluing layer 4 and electronic component 5 bonding, and the material on gluing layer 4 sets up to the epoxy material, gluing layer 4 after setting up is the epoxy material, so can utilize gluing layer 4 structural strength big with between many unique advantages such as sealing performance is good and the electronic component 5 inseparable bonding, thereby utilize the high heat conductivility of copper, conduct copper base plate body 1 through copper boss 3 fast with the produced heat of electronic component 5, reach thermoelectric separation's effect, improve 1 heat dispersion of copper base plate body.

The utility model discloses in: the assembly through groove 6 runs through in the inside of copper base plate body 1, and the assembly through groove 6 is connected with the bonding of insulating coating 7, and through groove 6 can conveniently make the assembly of copper base plate body 1 completion through the assembly after setting up, and utilizes insulating coating 7 can play insulating effect to the installation nail, avoids causing the influence to the performance of copper base plate body 1.

The utility model discloses in: electroplating layer 8 and conducting layer 11 are the symmetric distribution about the horizontal central line axle of substrate layer 12, and electroplating layer 8 equals with the thickness of conducting layer 11, can play the guard action to copper base plate body 1 through electroplating layer 8 after setting up, avoids receiving the corruption, increases its life, and then conducting layer 11 can increase electrically conductive effect.

The utility model discloses in: electroplating layer 8 passes through to constitute the block structure between fastener 9 and lock groove 10 and conducting layer 11, and conducting layer 11 passes through to constitute the block structure between fastener 9 and lock groove 10 and the substrate layer 12, connects through fastener 9 and the mutual lock in lock groove 10 respectively between electroplating layer 8, conducting layer 11 and the substrate layer 12 after setting up, so can increase copper base plate body 1's life.

The utility model discloses in: horizontal strengthening rib 13 and vertical strengthening rib 14 are crisscross each other, and horizontal strengthening rib 13 and vertical strengthening rib 14 equal evenly distributed about the surface of copper base plate body 1, can increase the hardness of copper base plate body 1 under the circumstances of guaranteeing the performance through horizontal strengthening rib 13 after setting up mutually supporting with vertical strengthening rib 14.

The utility model discloses a theory of operation is: during manufacturing, firstly, the copper boss 3 is pressed and embedded in the step through groove 2, so that the joint surface of the copper boss 3 and the step through groove 2 is a step surface, the binding force between the copper boss 3 and the copper substrate body 1 is increased, and a clamping position is formed, thereby effectively preventing the copper boss 3 from falling off, meanwhile, the positioning of the step joint surface is convenient and accurate, the copper boss 3 and the copper substrate body 1 are ensured to be flush to the maximum extent, the flatness is better, then, the electronic element 5 is bonded on the copper boss 3 at the corresponding position by using the adhesive layer 4, the heat generated by the electronic element 5 is rapidly transmitted to the copper substrate body 1 through the copper boss 3 by using the high heat-conducting property of copper, thereby achieving the effect of thermoelectric separation, thus improving the heat dissipation performance of the whole copper substrate body 1, reducing the surface temperature of the electronic element 5, further improving the service life of the electronic element 5, and then when being installed, the assembly that leads to groove 6 in accessible four corners is convenient for installation nail rapid Assembly, utilize insulating coating 7 to play insulating effect to the installation nail simultaneously, avoid causing the influence to copper base plate body 1's performance, secondly copper base plate body 1 is by plating layer 8 in proper order, conducting layer 11, substrate layer 12, conducting layer 11, plating layer 8 preparation forms, and plating layer 8, connect through fastener 9 and the mutual lock in lock groove 10 between conducting layer 11 and the substrate layer 12 respectively, so can play the guard action to copper base plate body 1, avoid receiving the corruption, increase copper base plate body 1's life, secondly can increase copper base plate body 1's hardness under the condition of guaranteeing copper base plate body 1 performance under the mutually supporting of horizontal strengthening rib 13 and vertical strengthening rib 14, and the product quality is improved.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a copper base PCB circuit board that contains thermoelectric separation copper boss, leads to groove (2), copper boss (3), gluing layer (4), electronic component (5), assembly lead to groove (6), insulating coating (7), plating layer (8), fastener (9), lock groove (10), conducting layer (11), substrate layer (12), horizontal strengthening rib (13) and vertical strengthening rib (14), its characterized in that including copper base plate body (1), step: the copper base plate comprises a copper base plate body (1), a step through groove (2) is formed in the copper base plate body (1), a copper boss (3) is arranged in the step through groove (2), an adhesive layer (4) is connected above the copper boss (3), an electronic element (5) is connected above the adhesive layer (4), assembling through grooves (6) are formed in four corners of the copper base plate body (1), an insulating plating layer (7) is arranged on the inner wall of each assembling through groove (6), the copper base plate body (1) comprises a plating layer (8), a conducting layer (11) and a base material layer (12), a clamping piece (9) is fixed on one side of the plating layer (8), a buckling groove (10) is connected to the outer surface of the clamping piece (9), a conducting layer (11) is fixed on the outer side wall of the buckling groove (10), the base material layer (12) is arranged in the conducting layer (11), and a transverse reinforcing rib (13) is arranged on the outer surface of the copper base plate body (1), and a longitudinal reinforcing rib (14) is arranged in the transverse reinforcing rib (13) in a penetrating way.

2. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: copper base plate body (1) leads to through the step and constitutes the block structure between groove (2) and copper boss (3), and the step leads to the groove (2) and is identical with the appearance structure of copper boss (3) to copper boss (3) are along the upper surface equidistance evenly distributed of copper base plate body (1).

3. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: copper boss (3) are connected with electronic component (5) through gluing layer (4) bonding, and the material of gluing layer (4) sets up to the epoxy material.

4. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: the assembling through groove (6) penetrates through the inside of the copper substrate body (1), and the assembling through groove (6) is connected with the insulating plating layer (7) in an adhering mode.

5. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: the electroplated layer (8) and the conductive layer (11) are symmetrically distributed about a horizontal central axis of the base material layer (12), and the thickness of the electroplated layer (8) is equal to that of the conductive layer (11).

6. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: the electroplated layer (8) forms a clamping structure with the conductive layer (11) through the clamping piece (9) and the buckling groove (10), and the conductive layer (11) forms a clamping structure with the base material layer (12) through the clamping piece (9) and the buckling groove (10).

7. The copper-based PCB circuit board with copper bosses for thermoelectric separation of claim 1, wherein: the transverse reinforcing ribs (13) and the longitudinal reinforcing ribs (14) are mutually staggered, and the transverse reinforcing ribs (13) and the longitudinal reinforcing ribs (14) are uniformly distributed on the outer surface of the copper substrate body (1).