CN106793550A - A kind of circuit board and the anti-welding skew monitoring methods of PCB - Google Patents
A kind of circuit board and the anti-welding skew monitoring methods of PCB Download PDFInfo
- Publication number
- CN106793550A CN106793550A CN201611232937.7A CN201611232937A CN106793550A CN 106793550 A CN106793550 A CN 106793550A CN 201611232937 A CN201611232937 A CN 201611232937A CN 106793550 A CN106793550 A CN 106793550A
- Authority
- CN
- China
- Prior art keywords
- welding
- circuit board
- pcb
- metal pad
- welding skew
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of circuit board and the anti-welding skew monitoring methods of PCB, belong to field of circuit boards.The circuit board includes PCB graphics fields and anti-welding skew control zone, wherein anti-welding skew control zone is arranged at outside the PCB graphics fields of circuit board, at least one anti-welding skew control unit is provided with anti-welding skew control zone.Wherein, anti-welding skew control unit is under equal conditions formed with PCB graphics fields, anti-welding skew control unit includes the metal pad and solder mask window that are arranged concentrically, the radius of solder mask window is more than the radius of metal pad, and the difference of solder mask window radius and metal pad radius is designed to corresponding anti-welding side-play amount.By checking on metal pad whether there is ink to judge that PCB whether there is anti-welding skew.Through the above way, the present invention can Rapid Detection PCB whether there is anti-welding skew, improve detection efficiency.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to a kind of circuit board and the anti-welding skew monitoring methods of PCB.
Background technology
As PCB develops towards lightening and highdensity direction, the alignment precision to each operation in PCB production processes will
More and more higher is sought, quality standard is also more and more stricter.Current BGA designs pad size and distance values gradually in reduction,
The BGA of 0.3mmPitch has been increasingly becoming main flow, and under so compact design, the abnomal results difficulty of anti-welding skew is carried significantly
Rise.
Existing anti-welding off normal visual examination mode is divided into two kinds of the visual examination of AVI automated opticals and artificial visual examination.
But, the limited resolution of existing routine inspection machine, it is impossible to meet the quality requirements of aligning accuracy product high；And manually examine
During survey, not only Detection capability is limited and detection efficiency is low.
The content of the invention
The present invention solves the technical problem of a kind of circuit board and the anti-welding skew monitoring methods of PCB is provided, can be both
Soon and accurately detect whether there is the anti-welding skews of PCB.
In order to solve the above technical problems, one aspect of the present invention is：A kind of circuit board, including PCB are provided
Graphics field and anti-welding skew control zone；Wherein anti-welding skew control zone is arranged at outside the PCB graphics fields of circuit board,
At least one anti-welding skew control unit is provided with the anti-welding skew control zone of circuit board；Wherein, anti-welding skew control is single
Unit is under equal conditions formed with PCB graphics fields, and anti-welding skew control unit includes the metal pad that is arranged concentrically and anti-welding
Windowing, the radius of the radius more than metal pad of solder mask window, and the difference of solder mask window radius and metal pad radius are designed
It is the anti-welding side-play amount of correspondence.
Wherein, the difference of solder mask window radius and metal pad radius is designed to corresponding minimum anti-welding side-play amount.
Wherein, the anti-welding of at least two correspondence different preventing weldering side-play amounts is provided with the anti-welding skew control zone of circuit board
Skew control unit, each anti-welding side-play amount is corresponding with a kind of anti-welding offset accuracy in PCB graphics fields.
Wherein, the difference of the anti-welding side-play amount corresponding to each anti-welding offset accuracy is 0.1~1.5mil.
Wherein, metal pad is copper pad.
Wherein, metal pad and solder mask window are circle.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of anti-welding skew prisons of PCB are provided
Survey method, including：At least one set of foregoing circuit plate is provided, by checking on metal pad whether there is ink to judge whether PCB deposits
In anti-welding skew.
Wherein, when being provided with the anti-of at least two correspondence different preventings weldering side-play amounts in the anti-welding skew control zone of circuit board
Be partially welded shifting control unit when, by check on metal pad whether have ink judge PCB with the presence or absence of it is anti-welding skew include examine
Whether look on metal pad has ink.
If being judged to that testing result is best all without ink on the metal pad of all anti-welding skew control units；
If having ink on the metal pad of all anti-welding skew control units, it is judged to that testing result is worst.
Wherein, the anti-welding skew also including other at least one correspondence different preventing weldering side-play amount compares unit, by checking
Whether there is ink on metal pad to judge that PCB also includes with the presence or absence of anti-welding skew：If the only anti-welding skew control in part
There is ink on the metal pad of unit, be then judged to that testing result is good.
Wherein, after judging PCB with the presence or absence of anti-welding skew, also include：Testing result is that best circuit board can be straight
Tap into next step operation, without to confirming in PCB graphics fields；Testing result is that good circuit board is entering next
, it is necessary to carrying out sampling observation confirmation in PCB graphics fields before step operation；Testing result is that worst circuit board is entering next step
, it is necessary to carrying out full inspection confirmation in PCB graphics fields before operation.
The beneficial effects of the invention are as follows：The situation of prior art is different from, the present invention is by setting anti-welding skew check plot
Domain, it is not necessary to checked intensive PCB graphics fields and just can intuitively judge very much with the presence or absence of anti-welding skew quickly.
Brief description of the drawings
Fig. 1 is the structural representation of the implementation method of circuit board of the present invention.
Fig. 2 is the structural representation of another implementation method of circuit board of the present invention.
Fig. 3 is the structural representation of the another implementation method of circuit board of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1 is referred to, Fig. 1 is the structural representation of the implementation method of circuit board of the present invention.Wherein, circuit board 10 includes
PCB graphics fields 11 and anti-welding skew control zone 12, at least one anti-welding skew is provided with anti-welding skew control zone 12
Control unit 13, anti-welding skew control unit 13 includes the metal pad 131 and solder mask window 132 that are arranged concentrically, solder mask window
Radius of 132 radius more than metal pad 131.
Wherein, anti-welding skew control unit 13 is under equal conditions formed with PCB graphics fields 11, i.e., in etching PCB figures
Metal pad 131 is etched in shape region 11 while circuitous pattern.Specifically, metal pad 131 be copper pad, or
Other metal pads such as platinum.Alternatively, metal pad 131 and solder mask window 132 are circle, can also be square, rhombus or
The polygon of the rule such as hexagon, or other irregular shapes etc..
Wherein, the difference of the radius of the radius of solder mask window 132 and metal pad 131 is designed to corresponding anti-welding side-play amount.
Specifically, according to production needs, different circuit boards 10 can set the minimum anti-welding offset X in a PCB graphics fields 11, then
The difference of the radius of solder mask window 132 and the radius of metal pad 131 is designed to the numerical value less than or equal to X, such as X, X-
0.2mil, X-0.4mil, X-0.8mil, X-1.5mil etc..
Fig. 2 is referred to, Fig. 2 is the structural representation of another implementation method of circuit board of the present invention.The anti-of circuit board 20 is partially welded
The anti-welding skew control unit 23 and 24 that at least two correspondence different preventing weldering side-play amounts are provided with control zone 22 is moved, wherein,
The radius of the difference and solder mask window 242 of the radius of solder mask window 232 and the radius of metal pad 231 and the half of metal pad 241
The difference in footpath is different, i.e., corresponding that anti-welding side-play amount is different.The anti-welding of side-play amount is welded by setting at least two correspondence different preventings
Skew control unit, can classify to anti-welding offset accuracy, and each one anti-welding skew of anti-welding side-play amount correspondence
Accuracy class.
Referring again to Fig. 1, the present invention also provides a kind of anti-welding skew monitoring methods of PCB, and the method includes providing circuit board
At least one anti-welding skew control unit 13 is provided with 10, and circuit board 10, anti-welding skew control unit 13 includes with one heart
The metal pad 131 and solder mask window 132 of setting；By judging whether there is ink to judge that PCB whether there is on metal pad 131
Anti-welding skew.
Referring again to Fig. 2, the anti-welding skew monitoring methods of PCB that the present invention is provided can also be divided anti-welding offset accuracy
Level.Specifically, the anti-welding skew control unit 23 and 24 of at least two correspondence different preventing weldering side-play amounts is provided with circuit board 20,
Wherein, radius and metal pad of the difference of the radius of the radius of solder mask window 232 and metal pad 231 less than solder mask window 242
The difference of 241 radius.Alternatively, the difference of the radius of the radius of solder mask window 232 and metal pad 231 is X-0.5mil, anti-welding
The difference of the radius of the radius and metal pad 241 of windowing 242 is X.Check on metal pad 231 and 241 whether there is ink.
If all without ink on metal pad 231 and 241, being judged to testing result preferably, circuit board 20 can be direct
Into next step operation, without to confirming in PCB graphics fields 21.
If having ink on metal pad 231 and 241, it is judged to that testing result is worst, circuit board 20 is under entrance
, it is necessary to carrying out full inspection confirmation in PCB graphics fields 21 before one step operation.
Fig. 3 is referred to, Fig. 3 is the structural representation of the another implementation method of circuit board of the present invention.The PCB that the present invention is provided prevents
Being partially welded shifting monitoring method also includes multiple grades when being classified to anti-welding offset accuracy.Specifically, circuit board 30 is included extremely
The anti-welding skew control unit 33,34 and 35 of few three correspondences different preventing weldering side-play amount, wherein, each anti-welding skew control unit
The difference of middle solder mask window radius and metal pad radius is incremented by successively.Alternatively, the radius and metal pad of each solder mask window
The difference of radius be respectively X-0.6mil, X-0.3mil, X.Check on metal pad 331,341 and 351 whether there is ink.
If all without ink on metal pad 331,341 and 351, being judged to testing result preferably, circuit board 30 can
Next step operation is directly entered, without to confirming in PCB graphics fields 31.
If having ink on metal pad 331,341 and 351, it is judged to that testing result is worst, circuit board 30 is entering
, it is necessary to carrying out full inspection confirmation in PCB graphics fields 31 before entering next step operation.
If there is ink on metal pad 331 without ink on metal pad 341, it is judged to that testing result is good, electricity
Road plate 30 is before next step operation is entered, it is necessary to carrying out sampling observation confirmation in PCB graphics fields 31.
If there is ink on metal pad 341 without ink on metal pad 351, it is judged to that testing result is general, electricity
Road plate 30 is before next step operation is entered, it is necessary to confirm to carrying out repeatedly sampling observation in PCB graphics fields 31.
Alternatively, more anti-welding skew control units such as four, five or six can also be set on circuit board, to anti-
The weldering more grades of offset accuracy point.
Specifically, the instruments such as microscope are used to the inspection for whetheing there is ink on metal pad in anti-welding control unit to set
It is standby, anti-welding skew can be whether there is with Rapid Detection, and anti-welding offset accuracy is classified, it is possible to increase detection efficiency.
The circuit board high for anti-welding offset accuracy can be directly entered next step operation, and the circuit board relatively low for anti-welding offset accuracy
Using manually PCB graphics fields are inspected by random samples and full inspection confirm, it is possible to increase detection precision.By setting anti-welding skew control
Unit is simultaneously classified to anti-welding offset accuracy, and inspection efficiency can be both improved with the test mode being manually combined using machine
Also can guarantee that detection precision.
In a further embodiment, multiple anti-welding skew control zones can be set in multiple positions of circuit board.Each
Each anti-welding skew control unit vertical arrangement, arranged in parallel or according to circuit board shape are adapted in anti-welding skew control zone
Property arrangement.The radius of metal pad is identical or different in each anti-welding skew control unit.
The above-mentioned anti-welding skew monitoring methods of PCB are applied in the solder resistance process of circuit board, particularly from welded ball array
In the circuit board of (Ball Grid Array, BGA) packaged type because using in graphics field in the circuit board of BGA package compared with
Intensive, distance is short between pin, is difficult detection.Anti-welding the control design of unit and setting for encapsulation welding tray in an application scenarios
Meter mode is identical or different, i.e., define (Non-Solder-Mask Defined, NSMD) mode or solder joint screen with non-solder shielding
Cover that to define (solder-mask Defined, SMD) mode identical or different.
The anti-welding skew monitoring methods of PCB, unit is compareed and to anti-welding offset accuracy by setting anti-welding skew in sum
Classified, can both improve inspection with the test mode being manually combined using machine efficiency or can guarantee that detection precision.
Embodiments of the present invention are the foregoing is only, the scope of the claims of the invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, is included within the scope of the present invention.
Claims (10)
1. a kind of circuit board, it is characterised in that including：
PCB graphics fields；
Anti-welding skew control zone, is arranged at outside the PCB graphics fields of the circuit board, and the described of the circuit board prevents
It is partially welded to move and at least one anti-welding skew control unit is provided with control zone；
Wherein, the anti-welding skew control unit is under equal conditions formed with the PCB graphics fields, and the anti-welding skew is right
According to metal pad and solder mask window that unit includes being arranged concentrically, the radius of the solder mask window is more than the half of the metal pad
Footpath, and the difference of the solder mask window radius and the metal pad radius is designed to corresponding anti-welding side-play amount.
2. circuit board according to claim 1, it is characterised in that the solder mask window radius and the metal pad radius
Difference be designed to the minimum anti-welding side-play amount of correspondence.
3. circuit board according to claim 1, it is characterised in that in the described anti-welding skew control zone of the circuit board
Be provided with least two correspondence different preventings weldering side-play amounts anti-welding skews control units, each described anti-welding side-play amount with it is described
A kind of anti-welding offset accuracy in PCB graphics fields is corresponding.
4. circuit board according to claim 3, it is characterised in that described anti-corresponding to each described anti-welding offset accuracy
The difference for welding side-play amount is 0.1~1.5mil.
5. circuit board according to claim 1, it is characterised in that the metal pad is copper pad.
6. circuit board according to claim 1, it is characterised in that the metal pad and the solder mask window are circle.
7. anti-welding skew monitoring methods of a kind of PCB, it is characterised in that including：
At least one set of circuit board as described in claim any one of 1-6 is provided；
By checking on the metal pad whether there is ink to judge that the PCB whether there is anti-welding skew.
8. method according to claim 7, it is characterised in that
The anti-of side-play amounts is welded when at least two correspondence different preventings are provided with the described anti-welding skew control zone of the circuit board
It is described by checking on the metal pad that whether having ink judges the PCB with the presence or absence of anti-when being partially welded shifting control unit
Being partially welded shifting includes：
Check on the metal pad whether there is ink；
If being judged to testing result most all without ink on the metal pad of all anti-welding skew control units
It is good；If having ink on the metal pad of all anti-welding skew control units, it is judged to that testing result is worst.
9. method according to claim 8, it is characterised in that
Also include the anti-welding skew control unit of other at least one correspondence different preventing weldering side-play amount, it is described by checking the gold
Whether there is ink on category pad to judge that the PCB also includes with the presence or absence of anti-welding skew：
If only having ink on the metal pad of the part anti-welding skew control unit, it is judged to that testing result is good
It is good.
10. method according to claim 9, it is characterised in that judge the PCB with the presence or absence of anti-welding skew described
Afterwards, also include：
Testing result is that best circuit board can be directly entered next step operation, without to being carried out in the PCB graphics fields really
Recognize；
Testing result was good circuit board before next step operation is entered, it is necessary to being taken out in the PCB graphics fields
Inspection confirms；
Testing result was worst circuit board before next step operation is entered, it is necessary to complete to being carried out in the PCB graphics fields
Inspection confirms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232937.7A CN106793550A (en) | 2016-12-28 | 2016-12-28 | A kind of circuit board and the anti-welding skew monitoring methods of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232937.7A CN106793550A (en) | 2016-12-28 | 2016-12-28 | A kind of circuit board and the anti-welding skew monitoring methods of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793550A true CN106793550A (en) | 2017-05-31 |
Family
ID=58921343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611232937.7A Pending CN106793550A (en) | 2016-12-28 | 2016-12-28 | A kind of circuit board and the anti-welding skew monitoring methods of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793550A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322399A (en) * | 2011-11-29 | 2013-06-01 | Powertech Technology Inc | Wiring substrate for optically detecting opening shift of solder mask within tolerance range |
| JP2013205176A (en) * | 2012-03-28 | 2013-10-07 | Hitachi Chemical Co Ltd | Inspection method for wiring board |
| CN103796417A (en) * | 2012-10-31 | 2014-05-14 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacture method thereof |
| CN105592629A (en) * | 2014-10-24 | 2016-05-18 | 深圳崇达多层线路板有限公司 | Design method for pad soldering checking |
-
2016
- 2016-12-28 CN CN201611232937.7A patent/CN106793550A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201322399A (en) * | 2011-11-29 | 2013-06-01 | Powertech Technology Inc | Wiring substrate for optically detecting opening shift of solder mask within tolerance range |
| JP2013205176A (en) * | 2012-03-28 | 2013-10-07 | Hitachi Chemical Co Ltd | Inspection method for wiring board |
| CN103796417A (en) * | 2012-10-31 | 2014-05-14 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacture method thereof |
| CN105592629A (en) * | 2014-10-24 | 2016-05-18 | 深圳崇达多层线路板有限公司 | Design method for pad soldering checking |
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Application publication date: 20170531 |