CN106793530B - A kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature - Google Patents
A kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature Download PDFInfo
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- CN106793530B CN106793530B CN201710035717.3A CN201710035717A CN106793530B CN 106793530 B CN106793530 B CN 106793530B CN 201710035717 A CN201710035717 A CN 201710035717A CN 106793530 B CN106793530 B CN 106793530B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
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- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The present invention discloses a kind of preparation method of super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature, belong to printed circuit board technology field, by the way that common fine aluminium material to be put into micro-wave oven, and it is passed through pure helium, air is driven away from resonant cavity, when pressure is raised to 1000 standard atmospheric pressures, micro-wave oven and rotary shaft are opened, fine aluminium is heated, until when common fine aluminium material is in molten condition, electromagnetic device is connected again, can must surpass aluminium after continuing 35-45min.The present invention makes printed wiring board using super Solder for Al-Cu Joint Welding lines, it is other than all characteristics with traditional copper lines, also have the function of special low resistivity, superpower thermal conductivity and electromagnetism interference, by super Solder for Al-Cu Joint Welding lines sample test, its substrate adhesive force is good, can the tests such as solvent resistant test, solderability and soldering resistance all meet the requirements.
Description
Technical field
The present invention relates to a kind of circuit boards, and in particular to a kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature,
Belong to printed circuit board technology field.
Background technique
With the development of electronic technology, client proposes light, thin, small, multifunctional intelligent technical requirements to electronic equipment,
Thus promote people to remove the more advanced inexpensive electronic component of exploitation, tradition with copper conductor be leading pcb board drawback gradually
It fades in and exposes.Copper is typical heavy metal element, specific gravity 8.9g/cm3, aluminium (2.7g/cm with same volume3) compare,
The former is 3.3 times of the latter or so；Resistivity is 1.7 × 10 to copper at normal temperature-8Ω/m, aluminium at normal temperature resistivity be 2.82 ×
10-8Ω/m, it can be seen that the former conductivity is only 1.66 times of the latter.If aluminium is led in conducting current of equal
Electric section is about 1.6 times of copper, and the weight of aluminium only has the 50% of copper.In addition, the unit price of copper is also higher by than the unit price of aluminium
Much, in addition abundance of the copper in the earth's crust is only 0.00068%, and abundance of the latter's aluminium in the earth's crust is up to 8.3% unexpectedly, at
For the most metallic element of content in the earth's crust, content is only second to oxygen (abundance: 45.5%) and silicon (abundance: 28.2%), therewith
Close to only iron (abundance: 6.2%) and calcium (abundance: 4.6%), it can thus be seen that aluminium abundance in the earth's crust is copper abundance
12205.88 again.
In addition, other of copper and aluminium performance comparison, are shown in Table 1.
Other performance comparisons of 1 aluminium of table and copper
See from table 1: the molten of aluminium, boiling point are all more high than corresponding copper, and from heatproof, copper is not as good as aluminium；
And tensile strength, aluminium are 1.96 times of copper.Therefore, the research using aluminium as pcb board conducting wire is gradually taken seriously.
Summary of the invention
In view of the above existing problems in the prior art, the present invention provides a kind of super Solder for Al-Cu Joint Welding conducting wire printed circuit boards of high temperature
Pcb board function admirable is made in preparation method, at low cost.
To achieve the goals above, a kind of super aluminium that the present invention uses, in critical-temperature TC=100K, resistivity is
Zero.
The present invention also provides a kind of preparation methods of above-mentioned super aluminium, specifically includes the following steps:
Common fine aluminium material is put into micro-wave oven, and is passed through pure helium, air is driven away from resonant cavity, to pressure
When being raised to 1000 standard atmospheric pressures, micro-wave oven and rotary shaft are opened, fine aluminium is heated, until common fine aluminium material is in melting
When state, then electromagnetic device is connected, can must surpass aluminium after continuing 35-45min.
As an improvement, generating the high-intensity magnetic field of 10000 Gausses in the electromagnetic device.
In addition, the present invention also provides a kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature, including following step
It is rapid:
1) two-sided FR-4 copper-clad plate is cut into the sample panel of 30 × 45cm, if standby dry plate；
2) copper foil in sample panel is etched away with acidic etchant or alkaline etching, it is clean with pure water repeated flushing,
It is subsequently placed in the place of ventilation, naturally dry is stand-by；
3) sample panel of naturally dry is put into PEG silane slot and carries out silanization treatment, handle time 3-5min, and will
Temperature is controlled at 30-40 DEG C, and after to be processed, sample panel is taken out from silane slot, spare after natural drying；
4) high temperature-resistant liner bottom material is taken, is cut into the loading plate big with sample panel in step 1) etc. after several pieces, it is clear to carry out surface
It is clean；
5) loading plate for being used as heatproof substrate is placed in vapor deposition laboratory, closes the accent in vapor deposition laboratory tight；
6) after being put well in resonant cavity using the obtained super aluminium of above-mentioned preparation method, the door of resonant cavity is shut, and use helium
Gas drives air in resonant cavity and vapor deposition laboratory away as protective gas, starts to be evacuated later, until vacuum degree is 76Cm/Hg
Only, magnetic field is then adjusted to 10000 Gausses, is then turned on micro-wave oven and rotary shaft, rise to 3250-3750 DEG C to furnace temperature
When, it is then turned on spray head and is deposited, after 25-30min is deposited, turn off microwave, maintain magnetic field, remove magnetic field after cooling and will steam
The loading plate for plating super aluminium takes out and keeps from vapor deposition laboratory, is successively similarly operated, and production multi-disc vapor deposition is super
The loading plate of aluminium；
7) from above-mentioned steps 6) 50 are taken out in the super aluminium loading plate that has been deposited, it is placed in vapor deposition laboratory, it will be humorous
Super aluminium in vibration chamber changes Cu into, and drives air in resonant cavity and vapor deposition laboratory away with protective gas helium, starts to be evacuated later,
Helium is extracted out from resonant cavity and vapor deposition laboratory, until vacuum degree is stopped for 76Cm/Hg, is then turned on micro-wave oven and rotary shaft,
It when furnace temperature rises to 2595-3600 DEG C, is then turned on spray head and is deposited, micro-wave oven can be turned off after 2-3min is deposited, it is cooling
Super aluminium-Cu loading plate is taken out from vapor deposition laboratory afterwards；
8) the super aluminium-Cu loading plate being deposited in 50 steps 7), the middle super aluminium loading plate being deposited of 50 steps 6) are taken,
Layer will be deposited thereon respectively to strip down from loading plate, and carry out mark, take later pressing workshop, respectively with above-mentioned steps
3) sample panel in after silanization treatment is pressed, and pressing finishes, and is taken out from pressing chamber after several minutes cooling, then use dry film
After carrying out exposure mask by pre-designed pattern, lost respectively with hydrogen peroxide-aluminium chloride-hydrochloric acid and hydrogen peroxide-copper chloride-hydrochloric acid
It carves, super aluminum steel sample panel, the super Solder for Al-Cu Joint Welding lines sample panel of etching must be etched；
9) the super Solder for Al-Cu Joint Welding lines sample panel etched is taken into green oil workshop, silk-screen green oil solder mask is super to get high temperature
Solder for Al-Cu Joint Welding wire PCB plate.
As an improvement, the pressing-in temp in the step 8) is 175 DEG C, pressing time 70-80min, vacuum degree is
76Cm/Hg。
In addition, the present invention also provides a kind of above methods, and the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature, printing electricity is made
Road plate includes the sample panel after silanization treatment, and the sample panel is equipped with super aluminium-vapour deposition layer, and the super aluminium-vapour deposition layer is equipped with
Layer is deposited in copper, and copper is deposited layer and is equipped with solder mask.
The present invention using super Solder for Al-Cu Joint Welding lines production printed circuit board, it other than all characteristics with traditional copper lines,
Also have the function of special low resistivity, superpower thermal conductivity and electromagnetism interference, by super Solder for Al-Cu Joint Welding lines sample test, base
Material adhesive force is good, can the tests such as solvent resistant test, solderability and soldering resistance all meet the requirements.
Detailed description of the invention
Fig. 1 is the producing device schematic diagram of super aluminium in the present invention；
Fig. 2 is that the resistivity of super aluminium varies with temperature curve graph；
Fig. 3 is the magnetic cooling process schematic that super aluminium becomes superconducting state；
Fig. 4 is the producing device schematic diagram of super Solder for Al-Cu Joint Welding wire PCB plate in the present invention；
Fig. 5 is the resistance value of different super aluminum steel items；
Fig. 6 is the coefficient of expansion of different super aluminum steel items；
Fig. 7 is testing device for measuring thermal conductivity schematic diagram；
Fig. 8 is the histogram of super aluminum steel bar sample；
Fig. 9 is that super aluminum steel item steams thickness of coating schematic diagram；
In figure: 1, electromagnetic device, 2, rotary shaft, 3, external microwave emitter and temp probe, 4, resonant cavity, 5, sample, 6,
Spray head, 7, vapor deposition laboratory, 8, copper, 9, super aluminium, 10, heatproof substrate, 11, transformer, 12, rectifier, 13, limiter, 14, electricity
Flow table, 15, switch, 16, test sample, 17, thermocouple, 18, platinum filament, 19, switching switch, 20, thermometric connector, 21, elementary errors electricity
Position instrument, 22, recorder.
Specific embodiment
In order to make the objectives, technical solutions and advantages of the present invention clearer, below by accompanying drawings and embodiments, to this
Invention is further elaborated.However, it should be understood that the specific embodiments described herein are merely illustrative of the present invention,
The range being not intended to restrict the invention.
Unless otherwise defined, all technical terms and scientific terms used herein are led with technology of the invention is belonged to
The normally understood meaning of the technical staff in domain is identical, and term as used herein in the specification of the present invention is intended merely to retouch
State the purpose of specific embodiment, it is not intended that in the limitation present invention.
Embodiment one
A kind of preparation method of super aluminium, producing device as shown in connection with fig. 1, specifically includes the following steps:
Common fine aluminium material is put into micro-wave oven, and is passed through pure helium, air is driven away from resonant cavity 4, wait press
When being raised to 1000 standard atmospheric pressures by force, micro-wave oven and rotary shaft 2 are opened, it is right by external microwave emitter and temp probe 3
Fine aluminium is heated, until when common fine aluminium material is in molten condition, then electromagnetic device 1 (high-intensity magnetic field for generating 10000 Gausses) is connected,
It can must surpass aluminium 9 after continuing 35-45min.
Varying with temperature curve from the super aluminium resistivity in Fig. 2 can be seen that super aluminium in critical-temperature TC=100K or so
Resistivity has become zero, and resistivity increases as the temperature rises and sharply later, but its resistivity is about at normal temperature
6.12×10-7Ω/cm, this numerical value are only the 36% of the resistivity of copper conductor；Again to super aluminium carry out magnetic susceptibility test (see
Fig. 3), in 100K, super aluminium has become complete diamagnetic body, i.e., external magnetic field no longer generates effect to it.Therefore, at low temperature,
Accomplish conducting wire with super aluminium, electromagnetic interference can be completely eliminated.
Embodiment two
A kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature, the producing device in conjunction with shown in attached drawing 4, including with
Lower step:
1) two-sided FR-4 copper-clad plate is cut into the sample panel of 30 × 45cm, no less than 100；
2) copper foil in sample panel is etched away with acidic etchant or alkaline etching, it is clean with pure water repeated flushing,
It is subsequently placed in the place of ventilation, naturally dry is stand-by；
3) sample panel of naturally dry being put into PEG silane slot and carries out silanization treatment, the processing time is 3-5min, and
Temperature is controlled at 30-40 DEG C, after to be processed, sample panel is taken out from silane slot, it is spare after natural drying；
4) a collection of high temperature-resistant liner bottom material is taken, is cut into the loading plate big with sample panel in step 1) etc. after several pieces, carries out table
Face cleaning treatment；
5) loading plate for being used as heatproof substrate 10 is placed on the vapor deposition laboratory 7 in producing device shown in Fig. 4, is closed tight
The accent in laboratory 7 is deposited；
6) sample 5 position of the super aluminium 9 in resonant cavity 4 will be made using preparation method described in any of the above-described to put well,
The door of resonant cavity 4 is shut, and the air for using helium to drive resonant cavity 4 away as protective gas and be deposited in laboratory 7, is started later
Pumping is then turned on electromagnetic device 1 (high-intensity magnetic field for generating 10000 Gausses), is then turned on micro- until vacuum degree is stopped for 76Cm/Hg
Wave furnace and rotary shaft 2, are heated by external microwave emitter and temp probe 3, rise to 3250-3750 DEG C to furnace temperature
When, it is then turned on spray head 6 and is deposited, after 25-30min is deposited, turn off microwave, maintain magnetic field, remove magnetic field after cooling and incite somebody to action
The loading plate of super aluminium takes out and keeps from vapor deposition laboratory 7 on vapor deposition, is successively similarly operated, production multi-disc vapor deposition
The loading plate of super aluminium；
7) from above-mentioned steps 6) 50 are taken out in the super aluminium loading plate that has been deposited, it is placed in vapor deposition laboratory 7, it will be humorous
Super aluminium 9 in vibration chamber 4 changes copper 8 into, and drives resonant cavity 4 and the vapor deposition inner air in laboratory 7 away with protective gas helium, starts later
Pumping extracts helium out from resonant cavity 4 and vapor deposition laboratory 7, until vacuum degree is stopped for 76Cm/Hg, be then turned on micro-wave oven and
Rotary shaft 2 is then turned on spray head 6 and carries out copper vapor deposition, can turn off after 2-3min is deposited when furnace temperature rises to 2595-3600 DEG C
Micro-wave oven takes out super aluminium-Cu loading plate from vapor deposition laboratory after cooling；
8) the super aluminium-Cu loading plate being deposited in 50 steps 7), the middle super aluminium loading plate being deposited of 50 steps 6) are taken,
Layer will be deposited thereon respectively to strip down from loading plate, and carry out mark, take later pressing workshop, respectively with above-mentioned steps
3) sample panel in after silanization treatment is pressed, and pressing-in temp is 175 DEG C, pressing time 70-80min, and vacuum degree is
76Cm/Hg, pressing finish, and take out from pressing chamber after several minutes cooling, then carry out exposure mask by pre-designed pattern with dry film
Afterwards, respectively with hydrogen peroxide-aluminium chloride-hydrochloric acid to super aluminium sample panel, with hydrogen peroxide-copper chloride-hydrochloric acid to super Solder for Al-Cu Joint Welding sample panel into
Row etching must etch super aluminum steel sample panel, the super Solder for Al-Cu Joint Welding lines sample panel of etching；
9) the super Solder for Al-Cu Joint Welding lines sample panel etched is taken into green oil workshop, silk-screen green oil solder mask is super to get high temperature
Solder for Al-Cu Joint Welding wire PCB plate.
Super aluminum steel sample panel obtained in embodiment two, super Solder for Al-Cu Joint Welding lines sample panel are tested for the property respectively, specifically
It tests as follows.
1. surpass the test of aluminum steel sample panel
The test of 1.1 resistivity
5 are taken out from the super aluminum steel sample panel made, and use multimeter again after the lines of 5 on pieces are carried out label
It is tested one by one, it is as follows to measure resistance value:
Table 2 surpasses the resistance of aluminum steel item
| Serial number | Resistance value | Serial number | Resistance value | Serial number | Resistance value | Serial number | Resistance value |
| 1 | 123.88 | 6 | 125.01 | 11 | 124.62 | 16 | 118.41 |
| 2 | 115.64 | 7 | 114.42 | 12 | 127.94 | 17 | 139.65 |
| 3 | 123.21 | 8 | 118.27 | 13 | 107.07 | 18 | 120.07 |
| 4 | 120.46 | 9 | 120.50 | 14 | 114.90 | 19 | 129.54 |
| 5 | 125.97 | 10 | 127.25 | 15 | 123.55 | 20 | 136.65 |
As can be seen from Table 2: the average resistance of super aluminum steel item is about 122.4m Ω, this average value is then substituted into electricity
Resistance rate formula:In obtain average resistivityThis value is than existing
The resistivity 1.7 × 10 of some fine copper conducting wires-6Ω/m is with regard to low many because super aluminium is under high-intensity magnetic field and high pressure, atom it is micro-
Structure is seen to be rearranged, it is rearranging the result is that make aluminium atom more ordering, electronics is eventually led in super aluminum steel item
The resistance of transmittance process becomes smaller, conductive capability enhancing.
The test of 1.2 coefficients of expansion
And then the sample panel that above-mentioned resistance test is crossed is put into double glazing electronic expansion meter and is fixed, then heated
To after 100 DEG C, the coefficient of expansion for measuring super aluminum steel item one by one is as follows:
Table 3 surpasses the coefficient of expansion of aluminum steel item
As can be seen from Table 3: the average ratio of super aluminum steel item is 18.8PPM/ DEG C, with 16.4PPM/ DEG C of expansion rate of copper
Compared to very close, and compared with 23PPM/ DEG C of the expansion rate of non-modified aluminium, hence it is evident that reduce 4.2PPM/ DEG C.
The test of 1.3 thermal conductivities
5 are separately taken out from super aluminum steel sample panel to come, and the lines of 5 on pieces are subjected to label respectively, further according to test
Requirement, using test device shown in lower Fig. 7 carry out measuring thermal conductivity, the test device include transformer 11, with transformer 11
The rectifier 12 of connection and the limiter 13 connecting with rectifier 12, limiter 13 are connect with test sample 16, test sample 16
In parallel with switch 15 and ammeter 14, the one of test sample 16 is terminated with platinum filament 18, thermocouple 17, further includes being arranged in test specimens
The switching switch 19, thermometric connector 20, elementary errors potentiometer 21, recorder 22 of 16 one end of product.
Before with the device to test conduction process, successively sample bearing plate is placed, then one end of super aluminum steel item
Be connected on the platinum filament (as thermistor) of 0.1mm, it be connected to again in kelvin double bridge hole later, it is another terminate to it is super
On aluminum steel item, the test of thermal coefficient is carried out after powering on respectively, measures data such as the following table 4 of thermal coefficient:
Table 4 surpasses aluminum steel thermal conductivity
| Serial number | Thermal conductivity | Serial number | Thermal conductivity | Serial number | Thermal conductivity | Serial number | Thermal conductivity |
| 1 | 4.73 | 6 | 4.86 | 11 | 5.11 | 16 | 4.87 |
| 2 | 4.96 | 7 | 5.26 | 12 | 5.50 | 17 | 4.82 |
| 3 | 5.20 | 8 | 5.38 | 13 | 5.06 | 18 | 4.97 |
| 4 | 5.05 | 9 | 4.90 | 14 | 5.96 | 19 | 5.30 |
| 5 | 5.27 | 10 | 5.06 | 15 | 4.87 | 20 | 5.40 |
It can be seen that super aluminum steel average thermal conductivity is 5.08W/cm × K, fluctuating range 0.204W/ from table 4, Fig. 8
Cm × K, this value has been higher by 1.28 times than the thermal conductivity of copper, and improves 2.14 times than the thermal conductivity of fine aluminium.
1.4 surpass the test of aluminium-vapour deposition thickness degree
Super aluminum steel sample panel 5 is separately taken, and the lines of 5 on pieces are subjected to label one by one, with manual Ai Sida ASIDA-
QF16 type is sliced sampler and goes out 5 slices in lines location side, will through formalities such as encapsulating, solidification, standing, grinding, polishings
Milled slice is put on the objective table of metallographic microscope, is selected the eyepiece and object lens of suitable multiplying power, is then turned on the power switch, left
Right front and back adjusting knob recalls the measurement of Motic Images Plus 2.0 as soon as being in light and camera lens on center
Software, and Capture window window is clicked, then left and right up and down adjustment knob, until clicking get after image clearly
Photol icon and measure icon recall measure table and are chosen to moral X40 and number of significant digit 1, then point Line figure
Mapping must surpass aluminium-vapour deposition thickness degree such as the following table 5:
Table 5 surpasses aluminum steel item and steams thickness of coating
| Serial number | Thickness | Serial number | Thickness | Serial number | Thickness | Serial number | Thickness |
| 1 | 49.99 | 6 | 50.01 | 11 | 50.00 | 16 | 50.00 |
| 2 | 50.01 | 7 | 49.97 | 12 | 49.98 | 17 | 49.99 |
| 3 | 50.02 | 8 | 50.01 | 13 | 50.02 | 18 | 50.02 |
| 4 | 49.97 | 9 | 49.97 | 14 | 49.99 | 19 | 50.00 |
| 5 | 50.02 | 10 | 49.98 | 15 | 50.00 | 20 | 50.00 |
It can be seen that super aluminum steel item vapor deposition layer average thickness is 50 μm from table 5, Fig. 9, upper and lower fluctuating range is only
0.3 μm, and the fluctuating range up and down of traditional electro-coppering is up to ± 20% unexpectedly sometimes.
1.5 surpass aluminum steel item vapor deposition layer surface roughness test
Super aluminum steel item vapor deposition layer surface roughness test is very simple, and super aluminium-vapour deposition layer thickness value is exactly subtracted average value 50
μm, following table can be obtained:
Table 6 surpasses aluminum steel item vapor deposition layer surface roughness
| Serial number | Roughness | Serial number | Roughness | Serial number | Roughness | Serial number | Roughness |
| 1 | -0.01 | 6 | 0.01 | 11 | 0.00 | 16 | 0.00 |
| 2 | 0.01 | 7 | -0.03 | 12 | -0.02 | 17 | -0.01 |
| 3 | 0.02 | 8 | 0.01 | 13 | 0.02 | 18 | 0.02 |
| 4 | -0.03 | 9 | -0.03 | 14 | -0.01 | 19 | 0.00 |
| 5 | 0.02 | 10 | -0.02 | 15 | 0.00 | 20 | 0.00 |
It can be seen that super aluminum steel item vapor deposition layer surface roughness fluctuating range very little in table 6.
1.6 tensile strength test
In this test, under first super aluminum steel item is intactly removed from laboratory sample loading plate with bark knife
Come, after then measuring pulling force with ZO-101 tension tester, then with measured value divided by obtaining tensile strength such as after line width and length
The following table 7:
Table 7 surpasses the tensile strength of aluminum steel item vapor deposition layer
As can be seen from Table 7: the average tensile strength of super aluminum steel item vapor deposition layer is 30.5MPa.
1.7 peel strength test
In this trial, 5 are taken out from the super aluminum steel sample panel made, point test in five days is therefrom taken out every time
1 piece is taken, reaches ASID-BIIB type peel strength tester with Ace with after the pure isopropanol processing 60s of heat (temperature is 75 DEG C) analysis
Peel strength data is measured, it is one group, after acquiring cell mean that then the super aluminum steel item of every 1 on piece, which is compiled, is obtained after carrying out system evaluation
Final result is following (unit ft lbf/mm) out:
Peel strength Capability index (Peel Strength Capability Index)
Tantile: (peel strength)
Statistical value (peel strength)
| Average value | Standard deviation | Average error value | Upper 95% value | Lower 95% value | N | Sum |
| 25.72 | 0.48 | 0.0505 | 25.77 | 25.68 | 90 | 90 |
Capability analysis (peel strength)
Capability index (peel strength)
Above tables lattice are analyzed it is found that covering copper with the peel strength ratio that peel strength tester measures super aluminum steel sample panel
The copper-clad plate peel strength that plate producer is produced by normal process also wants 2-3 times big, and Capability index is also very considerable, shows sample
Plate passes through PEG silane treatment before pressing, can be effectively improved peel strength.
The test of 1.8 solvent resistances
15 are taken out from the super aluminum steel sample panel made, and are then divided into 3 groups, are indicated respectively with A, B, C, wherein A
Group is impregnated 1 minute with 10% NaOH, and for B group with sulfuric acid treatment 1 minute of 10%, C group handled 60 with 75 DEG C of pure isopropanols of analysis
Second, then with 3M seccotine to measure result as follows:
Table 8 surpasses the solvent resistance test of aluminum steel item vapor deposition layer
As can be seen from Table 8, even if after lengthening test (soaking time is 120 seconds), super aluminum steel item vapor deposition layer does not have yet
Occur the sign to fall off.
2. surpass the test of Solder for Al-Cu Joint Welding lines sample panel
2.1 surpass the test of Solder for Al-Cu Joint Welding lines copper evaporation thickness
5 are taken out from the super Solder for Al-Cu Joint Welding lines sample panel made, and are used again after the lines of 5 on pieces are carried out label
The Oxford OXFORD CM-7000 type table hole copper tester is tested one by one, measures the copper vapor deposition layer thickness value of super Solder for Al-Cu Joint Welding lines such as
The following table 9:
Table 9 surpasses Solder for Al-Cu Joint Welding lines copper evaporation thickness test value
| Serial number | Thickness | Serial number | Thickness | Serial number | Thickness | Serial number | Thickness |
| 1 | 2.48 | 6 | 2.47 | 11 | 2.49 | 16 | 2.48 |
| 2 | 2.46 | 7 | 2.47 | 12 | 2.50 | 17 | 2.47 |
| 3 | 2.54 | 8 | 2.51 | 13 | 2.57 | 18 | 2.54 |
| 4 | 2.53 | 9 | 2.58 | 14 | 2.57 | 19 | 2.55 |
| 5 | 2.47 | 10 | 2.50 | 15 | 2.45 | 20 | 2.50 |
As can be seen from Table 9: the copper vapor deposition layer average thickness of super Solder for Al-Cu Joint Welding lines is 2.508 μm or so, can be effectively played
The purpose of tin welding.
2.2 testing impedance
By the above-mentioned lines with Oxford CM-7000 table hole copper tester, then use TDR-ZK2020 impedance instrument instead one by one
It is tested, it is as follows to measure impedance data:
Table 10 surpasses Solder for Al-Cu Joint Welding lines testing impedance value
As can be seen from Table 10: the average impedance values of super Solder for Al-Cu Joint Welding lines are 148m Ω, and upper and lower fluctuating range is 5m Ω.
2.3 voltage-withstand test
The super Solder for Al-Cu Joint Welding lines sample panel made is divided into five groups by us before this test, point is tested within five days, every time from
It is middle to extract 5 pieces, it is preheated 5 minutes after being then switched on by the testing process of CY1/2671B pressure tester, then in voltage display window
It is middle that voltage is set as 1000V, electric current is set as 20mA in electric current display window, will be set the time in time showing window
It is set to 60 seconds, the nib of red-black pen is placed on to the route both ends of super Solder for Al-Cu Joint Welding lines sample panel later, presses ON key and start pressure-resistant survey
Examination.As issued beep-beep-alarm in test, and along with arc discharge and the stink burnt, show that style plate circuit line is breakdown
, if the testing time is more than preset value, time window auto zero returns to standby mode after showing test passes, then will be pressure-resistant
The nib of tester red and black pen changes another single line, presses ON key, into the test of next round, repeats aforesaid operations, we are each
5 blocks of style plates are tested, every block of plate show that pressure-resistant data are as follows after testing 5 times:
Table 11 surpasses Solder for Al-Cu Joint Welding lines voltage-withstand test value
| Line-spacing | Apply voltage | Testing time | As a result |
| 2.5mm | DC1500V20mA | 1 point 30 seconds | OK |
| 2.5mm | DC1500V20mA | 1 point 30 seconds | OK |
| 2.5mm | DC1500V20mA | 1 point 30 seconds | OK |
| 2.5mm | DC1500V20mA | 1 point 30 seconds | OK |
| 2.5mm | DC1500V20mA | 1 point 30 seconds | OK |
In terms of test process, apply voltage although improving and extend the testing time, without finding arc discharge, burns
Burnt or punch-through, this indicates that the super Solder for Al-Cu Joint Welding lines sample panel made of the method is to meet IPC-TM-650 professional standard
's.
The test of 2.4 adhesive force
12 are taken out from the super Solder for Al-Cu Joint Welding lines sample panel made, is then divided into 3 groups, is indicated respectively with A, B, C, wherein A
Group is impregnated 1 minute with hot acetone (analysis is pure), and B group is opened grease with heat and handled 1 minute, and C group is indicated with (the analysis of 75 DEG C of isopropanols
It is pure) processing 60 seconds, then with 3M seccotine to measure result as follows:
Table 12 surpasses the adhesive force test of aluminum steel item vapor deposition layer
In this test, not only there is obscission without discovery in proper testing, but also also do not have in lengthening test
It was found that obscission.
2.5 solderabilities and soldering resistance test
In this trial, the super Solder for Al-Cu Joint Welding lines sample panel made is divided into five groups, point test in five days, every time therefrom
5 pieces are extracted, the drift weldering of tin furnace carries out solderability and soldering resistance test, it is as follows to measure result:
Table 13 surpasses Solder for Al-Cu Joint Welding line plate solderability and soldering resistance test result
As can be seen from Table 13, upper tin is full, and upper tin rate is above 99%, and in soldering resistance test, also do not send out
It the abnormal phenomenon such as now blisters, change colour, burning.
The present invention using super Solder for Al-Cu Joint Welding lines production printed wiring board, it other than all characteristics with traditional copper lines,
Also have the function of special low resistivity, superpower thermal conductivity and electromagnetism interference, by super Solder for Al-Cu Joint Welding lines sample test, base
Material adhesive force is good, can the tests such as solvent resistant test, solderability and soldering resistance all meet the requirements.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (4)
1. a kind of preparation method of super aluminium, which is characterized in that specifically includes the following steps:
Common fine aluminium material is put into micro-wave oven, and is passed through pure helium, air is driven away from resonant cavity, is raised to pressure
When 1000 standard atmospheric pressures, micro-wave oven and rotary shaft are opened, fine aluminium is heated, until common fine aluminium material is in molten condition
When, then the electromagnetic device for generating 10000 Gauss high-intensity magnetic fields is connected, it can obtain after continuing 35-45min in critical-temperature TC=100K
When, super aluminium that resistivity is zero.
2. a kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature, which comprises the following steps:
1) two-sided FR-4 copper-clad plate is cut into the sample panel of 30 × 45cm, if standby dry plate；
2) copper foil in sample panel is etched away with acidic etchant or alkaline etching, it is clean with pure water repeated flushing, then
It is placed in the place of ventilation, naturally dry is stand-by；
3) sample panel of naturally dry is put into PEG silane slot and carries out silanization treatment, handle time 3-5min, and by temperature
After to be processed, sample panel is taken out from silane slot at 30-40 DEG C for control, spare after natural drying；
4) high temperature-resistant liner bottom material is taken, is cut into the loading plate big with sample panel in step 1) etc. after several pieces, carries out surface cleaning；
5) loading plate for being used as heatproof substrate is placed in vapor deposition laboratory, closes the accent in vapor deposition laboratory tight；
6) after being put well in resonant cavity using the obtained super aluminium of preparation method described in claim 1, the door of resonant cavity is shut, and
It uses helium to drive air in resonant cavity and vapor deposition laboratory away as protective gas, starts to be evacuated later, until vacuum degree is
760mmHg stops, and magnetic field is then adjusted to 10000 Gausses, is then turned on micro-wave oven and rotary shaft, rises to 3250- to furnace temperature
It at 3750 DEG C, is then turned on spray head and is deposited, after 25-30min is deposited, turn off microwave, maintain magnetic field, remove magnetic field after cooling
And the loading plate of aluminium super on vapor deposition is taken out and kept from vapor deposition laboratory, it is successively similarly operated, makes multi-disc
The loading plate of super aluminium is deposited；
7) from above-mentioned steps 6) 50 are taken out in the super aluminium loading plate that has been deposited, it is placed in vapor deposition laboratory, by resonant cavity
In super aluminium change Cu into, and drive air in resonant cavity and vapor deposition laboratory away with protective gas helium, start to be evacuated later, by helium
Gas is extracted out from resonant cavity and vapor deposition laboratory, until vacuum degree is stopped for 760mmHg, micro-wave oven and rotary shaft is then turned on, to furnace
When temperature rises to 2595-3600 DEG C, be then turned on spray head and be deposited, micro-wave oven can be turned off after 2-3min is deposited, it is cooling after from
It is deposited in laboratory and takes out super aluminium-Cu loading plate；
8) the super aluminium-Cu loading plate being deposited in 50 steps 7), the middle super aluminium loading plate being deposited of 50 steps 6) are taken, respectively
Layer will be deposited thereon to strip down from loading plate, and carry out mark, take later pressing workshop, respectively with above-mentioned steps 3) in
Sample panel after silanization treatment is pressed, and pressing finishes, and is taken out from pressing chamber after several minutes cooling, then with dry film by pre-
After first designing pattern progress exposure mask, it is etched respectively with hydrogen peroxide-aluminium chloride-hydrochloric acid and hydrogen peroxide-copper chloride-hydrochloric acid,
Super aluminum steel sample panel, the super Solder for Al-Cu Joint Welding lines sample panel of etching must be etched；
9) the super Solder for Al-Cu Joint Welding lines sample panel etched is taken into green oil workshop, silk-screen green oil solder mask surpasses Solder for Al-Cu Joint Welding to get high temperature
Wire PCB plate.
3. a kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature as claimed in claim 2, which is characterized in that institute
Stating the pressing-in temp in step 8) is 175 DEG C, pressing time 70-80min, vacuum degree 760mmHg.
4. the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature is made in a kind of any one of claim 2-3 the method, which is characterized in that
The printed circuit board includes the sample panel after silanization treatment, and the sample panel is equipped with super aluminium-vapour deposition layer, the super aluminium-vapour deposition
Layer is equipped with copper and layer is deposited, and copper is deposited layer and is equipped with solder mask.
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| CN201710035717.3A CN106793530B (en) | 2017-01-17 | 2017-01-17 | A kind of preparation method of the super Solder for Al-Cu Joint Welding conducting wire printed circuit board of high temperature |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88100338A (en) * | 1987-01-27 | 1988-09-07 | 工业技术院 | High-temperature superconductor and manufacturing process thereof |
| CN88102627A (en) * | 1987-05-08 | 1988-12-07 | 富士通株式会社 | Superconducting circuit board and coating used by same |
| US5882538A (en) * | 1995-08-28 | 1999-03-16 | Georgia Tech Research Corporation | Method and apparatus for low energy electron enhanced etching of substrates |
| CN1213864A (en) * | 1997-10-07 | 1999-04-14 | 电子科技大学 | Nd-Ba-Cu oxygen high temp. superconductive epitaxial thin film with typical value of 95K critical temp. |
| JP2006203154A (en) * | 2004-04-20 | 2006-08-03 | National Institutes Of Natural Sciences | Superconducting pulse coil, and superconducting device and superconducting power storage using same |
-
2017
- 2017-01-17 CN CN201710035717.3A patent/CN106793530B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88100338A (en) * | 1987-01-27 | 1988-09-07 | 工业技术院 | High-temperature superconductor and manufacturing process thereof |
| CN88102627A (en) * | 1987-05-08 | 1988-12-07 | 富士通株式会社 | Superconducting circuit board and coating used by same |
| US5882538A (en) * | 1995-08-28 | 1999-03-16 | Georgia Tech Research Corporation | Method and apparatus for low energy electron enhanced etching of substrates |
| CN1213864A (en) * | 1997-10-07 | 1999-04-14 | 电子科技大学 | Nd-Ba-Cu oxygen high temp. superconductive epitaxial thin film with typical value of 95K critical temp. |
| JP2006203154A (en) * | 2004-04-20 | 2006-08-03 | National Institutes Of Natural Sciences | Superconducting pulse coil, and superconducting device and superconducting power storage using same |
Non-Patent Citations (1)
| Title |
|---|
| "A novel feature in aluminum cluster photoionization spectra and possibility of electron pairing at T≥100K";Avik Halder,Anthony Liang, and Vitaly V.Kresin;《Nano Letters》;20151231;摘要和第10页方法部分 |
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| CN106793530A (en) | 2017-05-31 |
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Denomination of invention: A preparation method of high temperature ultra aluminum copper conductor printed circuit board Effective date of registration: 20210629 Granted publication date: 20190219 Pledgee: Shunde Guangdong rural commercial bank Limited by Share Ltd. Pledgor: GUANGDONG CHENGDE ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980005535 |