CN106785921A - A kind of semiconductor laser stacks of mechanical erection - Google Patents
A kind of semiconductor laser stacks of mechanical erection Download PDFInfo
- Publication number
- CN106785921A CN106785921A CN201611240955.XA CN201611240955A CN106785921A CN 106785921 A CN106785921 A CN 106785921A CN 201611240955 A CN201611240955 A CN 201611240955A CN 106785921 A CN106785921 A CN 106785921A
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- China
- Prior art keywords
- chip
- chip unit
- semiconductor laser
- mounting blocks
- conductive substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention proposes a kind of semiconductor laser stacks of mechanical connection, including multiple is provided with the chip unit of installation screw, is tightly fastened the chip unit group to form electric connection between chip unit by bolt；The chip unit includes laser chip and conductive substrates bonded thereto, and installation screw is set on conductive substrates, and conductive substrates insulate with bolt.Adjacent chips unit module is connected by screw and bolt mode in the present invention, can carry out dismounting replacement to one single chip unit in use and in later maintenance, and can be assembled into the semiconductor laser of random length, with flexibility higher.
Description
Technical field
The present invention relates to a kind of semiconductor laser, specially the encapsulation knot of the semiconductor laser stacks of mechanical erection
Structure.
Background technology
The encapsulating structure of the folded battle array of existing high-power semiconductor laser（As shown in Figure 1）It is multiple semiconductor laser cores
Piece and multiple radiation conductive substrate bondings are for after a bar bar group, entirety is bonded on an insulating substrate, then again by the module key
Close on heat sink；Or laser chip is bonded to conductive substrates and forms a unit module, multiple unit modules are bonded successively again
To dielectric substrate and it is heat sink on.In the semiconductor laser stacks structure of above-mentioned encapsulating structure, laser chip, conductive substrates, absolutely
Edge substrate with it is heat sink between using the technique that is mutually bonded, it is necessary to multiple high temp backflow completes being bonded between device, production plus
Work required precision is high, qualification rate is low；Additionally, final folded battle array is in use when damaging occurs in chip, due to what is damaged
Chip is difficult to replace, and can cause entirely to fold battle array failure；The semiconductor laser later maintenance of the structure is complicated, in long-term use
The failure of one single chip is difficult to individually maintenance and changes, and then influences the reliability and maintenance cost of whole semiconductor laser.
Chinese patent CN201410538287.5（A kind of encapsulation for mechanically connecting conduction cooling type semiconductor laser stacks
Structure）In disclose the method for packing that a kind of use mechanical installation mode realizes the folded battle array of semiconductor laser, in the structure
Installation unit is chip and the substrate welded with it, and the construction machine mounting means is the fastening in the electrode block by two ends
Screw applies pressure, this to apply the more difficult control of stressed method, it is possible to cause the damage to chip in practical operation,
Causing device reliability reduces.
The content of the invention
In order to solve the deficiencies in the prior art, the present invention proposes a kind of semiconductor laser stacks of mechanical erection.
Technical scheme is as follows：
A kind of semiconductor laser stacks of mechanical connection, including multiple is provided with the chip unit of installation screw, chip unit
Between the chip unit group to form electric connection is tightly fastened by bolt；The chip unit include laser chip and with its key
The conductive substrates of conjunction, installation screw is set on conductive substrates, and conductive substrates insulate with bolt.
Described chip unit also includes the electric connecting sheet being bonded with laser chip and is arranged at conductive substrates and is electrically connected
Buffer insulation structure between contact pin, electric connecting sheet is used to realize the electrical connection of laser chip and adjacent chip unit, above-mentioned
Installation screw runs through conductive substrates, buffer insulation structure and electric connecting sheet.
The buffer insulation structure setting is in the one side of laser chip, or is divided into two parts are arranged at laser chip two
Side.
The semiconductor laser stacks of mechanical connection of the invention also include that basis is heat sink and is respectively arranged at foregoing core
The positive pole mounting blocks and negative pole mounting blocks at blade unit group two ends, are provided with and chip unit on positive pole mounting blocks and negative pole mounting blocks
Matching and the installation screw of insertion so that bolt is installed on the peace of insertion positive pole mounting blocks, chip unit group and negative pole mounting blocks
In dress screw, realization is tightly fastened and electrically connects；The positive pole mounting blocks and negative pole mounting blocks be additionally provided with for basal heat
The installation screw of heavy connection so that the foregoing positive pole mounting blocks being tightly fastened, chip unit group, the integral installation of negative pole mounting blocks in
On basis is heat sink；Insulating barrier is provided between the conductive substrates of the chip unit and basis are heat sink.
Described conductive substrates are copper tungsten or copper or graphite metal composite.
The insulation system is aluminium nitride ceramics.
Another kind technical scheme of the invention is：
A kind of semiconductor laser stacks of mechanical erection, including the multigroup chip unit being arranged in order, the chip unit is
Laser chip and conductive substrates bonded thereto, it is characterised in that：Also include mechanical mounting device, mechanical mounting device includes two
Individual U-shaped card hoop, and U-shaped card hoop is provided with installation screw so that after 2 U-shaped card hoops are fastened by bolts, multigroup chip unit exists
Closely connected under fastening pressure in its U-shaped area.
Described chip unit also includes the electric connecting sheet being bonded with laser chip and is arranged at conductive substrates and is electrically connected
Buffer insulation structure between contact pin, electric connecting sheet is used to connect laser chip and adjacent chip unit.U-shaped card hoop and chip
Insulating barrier is provided between unit, for both electric insulations.
Elastic conduction heat-conducting layer is filled between described chip unit.
The present invention has advantages below：
1）Each chip unit can realize independent test, screening, aging, improve the qualification rate after assembling product；Adjacent chips
Unit module mechanically (screw and bolt mode) connection, in use and in later maintenance can be to one single chip
Unit carries out dismounting replacement, and can be assembled into the semiconductor laser of random length, with flexibility higher.
2) mechanical pressure does not apply pressure to laser chip directly in the present invention, but is buffered by buffer insulation structure
The pressure that laser chip is born, effectively prevent laser chip because damaging caused by external pressure and failing, the device of raising
The reliability of part.
Brief description of the drawings
Fig. 1 is existing packing forms.
Fig. 2 is the structural representation of the semiconductor laser stacks of mechanical erection of the invention.
Fig. 3 is the schematic diagram of embodiments of the invention one.
Fig. 4 a- Fig. 4 b are the structural representation of another chip unit in the present invention
Fig. 5 is the structural representation of the semiconductor laser stacks based on Fig. 4 b chip units.
The schematic diagram of Fig. 6 a- Fig. 6 b embodiments of the invention two.
Drawing reference numeral explanation：1- laser chips, 2- conductive substrates, 3- bases are heat sink, 4- insulating barriers, 5- chip units, 6-
Buffer insulation structure, 7- electric connecting sheets, 8- bolts, 9- installation screws, 10-U type clips, 11- elastomeric pads.
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be described.
Fig. 2 is the structural representation of the semiconductor laser stacks of mechanical erection of the invention, including multiple is provided with peace
The chip unit 5 of screw is filled, the chip unit group to form electric connection is tightly fastened by bolt 8 between chip unit 5；The core
Blade unit 5 is laser chip 1 and conductive substrates 2 bonded thereto, and installation screw 9 is arranged in conductive substrates 2, and conductive
Substrate 2 and the mutually insulated of bolt 8, prevent short circuit between chip unit.In order to improve the contact between adjacent chips unit, with reality
The pressure that now more preferable heat conductivility and reduction laser chip are born, can be in the laser chip of chip unit and adjacent core
Increase elastic conduction heat-conducting layer, such as carbon nano-tube film between blade unit.
Fig. 3 is embodiments of the invention one, excellent in Fig. 2 structures in order to optimize the mechanical pressure that laser chip 1 is born
The structure of chip unit 5 is changed, described chip unit 5 also includes the electric connecting sheet 7 being bonded with laser chip 1 and is arranged at
Buffer insulation structure 6 between conductive substrates 2 and electric connecting sheet 7, electric connecting sheet 7 is used to realize laser chip 1 and adjacent core
The electrical connection of blade unit, above-mentioned installation screw 9 runs through conductive substrates 2, buffer insulation structure 6 and electric connecting sheet 7.
As shown in figure 3, the buffer insulation structure 6 is arranged at the one side of laser chip, or as shown in fig. 4 a, insulation is slow
The both sides that 6 points of structure is arranged at laser chip for two parts are rushed, both methods to set up of buffer insulation structure cause chip
Unit size in one direction is tried one's best and laser chip is closely sized to, to realize the minimum of folded battle array size.Fig. 4 b are
A kind of structure of the chip unit realized based on Fig. 4 a, is provided with and conductive substrates, 2 buffer insulation structures 6 on electric connecting sheet 7
The installation screw 9 of matching.
Fig. 5 is the folded battle array structure realized based on Fig. 4 b chip units, and the direction of arrow along figure of bolt 8 is installed and chip list
In the installation screw of unit, the mutual fastening between multigroup chip unit is realized.
In actual applications, the semiconductor laser stacks of mechanical erection of the invention can also include basis it is heat sink and
It is respectively arranged at foregoing chip unit group two ends（Specially set along the stacking direction of chip unit）Positive pole mounting blocks and
Be provided with negative pole mounting blocks, positive pole mounting blocks and negative pole mounting blocks matched with chip unit and insertion installation screw so that
Being tightly fastened and electrically connecting for positive pole mounting blocks, negative pole mounting blocks and chip unit group is realized by bolt；The positive pole peace
Dress block and negative pole mounting blocks are additionally provided with for the installation screw B with basic heat sink connection so that the foregoing positive pole being tightly fastened
Mounting blocks, chip unit group, the integral installation of negative pole mounting blocks are on basis is heat sink.The conductive substrates of the chip unit and basis
Insulating barrier 4 is provided between heat sink so that heat sink not charged work.
Fig. 6 a- Fig. 6 b are the embodiment two of the semiconductor laser stacks of mechanical erection of the invention, and the structure is equally
Mechanical erection is carried out based on installation screw；The semiconductor laser stacks of above-mentioned mechanical erection include the multigroup chip being arranged in order
Unit, the chip unit is laser chip and conductive substrates bonded thereto, additionally including mechanical mounting device, the machine
Tool installing component includes two U-shaped card hoops 10, and U-shaped card hoop is provided with installation screw so that 2 U-shaped card hoops are tight by bolt
Gu after, multigroup chip unit is closely connected in its U-shaped area under fastening pressure.
In order to increase the heat conductivility between adjacent chips unit, and reduction external mechanical stress is made to laser chip
Into influence, described chip unit also includes the electric connecting sheet being bonded with laser chip and is arranged at conductive substrates and is electrically connected
Buffer insulation structure 6 between contact pin, electric connecting sheet is used to connect laser chip and adjacent chip unit.
Additionally, being filled with elastic conduction heat-conducting layer between laser chip and adjacent chip unit, it is also possible to realize
Increase heat conductivility and reduce the effect that pressure influences on laser chip.The preferred CNT of elastic conduction heat-conducting layer is thin
Film, or heat conductive silica gel, or heat-conducting silicone grease.
Above-mentioned U-shaped card hoop is metal material（Such as copper）Or nonmetallic materials（Such as plastics）, it is required to ensure U-shaped card
Insulation between hoop and chip unit if metal material, is then needed in U-shaped card hoop and core with preventing short circuit between chip unit
The position of blade unit contact sets and is provided with elastomeric pad 11 between insulating barrier, and two U-shaped card hoops.
Conductive substrates in above-described embodiment are the conductive material of high thermal conductivity, such as the metal, preferably thermal expansion system such as copper
The material that number is matched with laser chip, such as copper-tungsten, graphite metal composite, copper tungsten copper layer structure etc..
Above-mentioned buffer insulation structure is High-heat-conductiviinsulation insulation material, such as aluminium nitride ceramics, beryllium oxide ceramics etc..
Claims (10)
1. a kind of semiconductor laser stacks of mechanical erection, it is characterised in that：The chip of installation screw is provided with including multiple
Unit, is tightly fastened the chip unit group to form electric connection by bolt between chip unit；The chip unit includes laser
Chip and conductive substrates bonded thereto, installation screw are set on conductive substrates, and conductive substrates insulate with bolt.
2. semiconductor laser stacks of mechanical erection according to claim 1, it is characterised in that：Described chip unit
Also include the electric connecting sheet being bonded with laser chip and the buffer insulation structure being arranged between conductive substrates and electric connecting sheet,
Electric connecting sheet is used to realizing the electrical connection of laser chip and adjacent chip unit, above-mentioned installation screw run through conductive substrates,
Buffer insulation structure and electric connecting sheet.
3. semiconductor laser stacks of mechanical erection according to claim 2, it is characterised in that：The buffer insulation knot
Structure is arranged at the one side of laser chip, or is divided into the both sides that two parts are arranged at laser chip.
4. according to the semiconductor laser stacks of one of claim 1-3 described mechanical erection, it is characterised in that：Also include base
Plinth is heat sink and is respectively arranged at the positive pole mounting blocks and negative pole mounting blocks at foregoing chip unit group two ends, positive pole mounting blocks and negative
Be provided with the mounting blocks of pole matched with chip unit and insertion installation screw so that bolt be installed on insertion positive pole mounting blocks,
In the installation screw of chip unit group and negative pole mounting blocks, realization is tightly fastened and electrically connects；The positive pole mounting blocks and negative pole
Mounting blocks are additionally provided with for the installation screw with basic heat sink connection so that foregoing positive pole mounting blocks, the chip being tightly fastened
Unit group, the integral installation of negative pole mounting blocks are on basis is heat sink；Set between the conductive substrates of the chip unit and basis are heat sink
It is equipped with insulating barrier.
5. according to the semiconductor laser stacks of one of claim 1-3 described mechanical erection, it is characterised in that：Described leads
Electric substrate is copper tungsten or copper or graphite metal composite.
6. according to the semiconductor laser stacks of one of claim 1-3 described mechanical erection, it is characterised in that：The insulation
Structure is aluminium nitride ceramics.
7. a kind of semiconductor laser stacks of mechanical erection, including the multigroup chip unit being arranged in order, the chip unit
It is laser chip and conductive substrates bonded thereto, it is characterised in that：Also include mechanical mounting device, mechanical mounting device includes
Two U-shaped card hoops, and U-shaped card hoop is provided with installation screw so that after 2 U-shaped card hoops are fastened by bolts, multigroup chip unit
Closely connected under fastening pressure in its U-shaped area.
8. semiconductor laser stacks of a kind of mechanical erection according to claim 7, it is characterised in that：Described chip
Unit also includes the electric connecting sheet being bonded with laser chip and the buffer insulation being arranged between conductive substrates and electric connecting sheet
Structure, electric connecting sheet is used to connect laser chip and adjacent chip unit.
9. semiconductor laser stacks of a kind of mechanical erection according to claim 7, it is characterised in that：Described chip
Elastic conduction heat-conducting layer is filled between unit.
10. semiconductor laser stacks of a kind of mechanical erection according to claim 7, it is characterised in that：U-shaped card hoop
Insulating barrier is provided between chip unit, for both electric insulations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611240955.XA CN106785921A (en) | 2016-12-29 | 2016-12-29 | A kind of semiconductor laser stacks of mechanical erection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611240955.XA CN106785921A (en) | 2016-12-29 | 2016-12-29 | A kind of semiconductor laser stacks of mechanical erection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106785921A true CN106785921A (en) | 2017-05-31 |
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ID=58923463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611240955.XA Pending CN106785921A (en) | 2016-12-29 | 2016-12-29 | A kind of semiconductor laser stacks of mechanical erection |
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| Country | Link |
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| CN (1) | CN106785921A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110535027A (en) * | 2019-09-05 | 2019-12-03 | 西安航空学院 | For manufacturing the method and optoelectronic semiconductor component of optoelectronic semiconductor component |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978396A (en) * | 1995-07-13 | 1999-11-02 | Thomson-Csf | Semiconductor laser source |
| US6643302B1 (en) * | 1999-07-30 | 2003-11-04 | Fanuc Ltd. | Cooling device and surface emitting device comprising same |
| CN1906821A (en) * | 2004-03-17 | 2007-01-31 | 浜松光子学株式会社 | Semiconductor laser equipment |
| CN204190159U (en) * | 2014-10-09 | 2015-03-04 | 西安炬光科技有限公司 | The medical high-power semiconductor laser system of a kind of Conduction cooled type |
| CN204190157U (en) * | 2014-10-09 | 2015-03-04 | 西安炬光科技有限公司 | A kind of mechanical connection Conduction cooled type semiconductor laser stacks encapsulating structure |
| CN105470810A (en) * | 2015-12-15 | 2016-04-06 | 西安炬光科技股份有限公司 | Macro-channel liquid-cooling high-power semiconductor laser module and apparatus |
| CN206340826U (en) * | 2016-12-29 | 2017-07-18 | 西安炬光科技股份有限公司 | A kind of semiconductor laser stacks of mechanical erection |
-
2016
- 2016-12-29 CN CN201611240955.XA patent/CN106785921A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978396A (en) * | 1995-07-13 | 1999-11-02 | Thomson-Csf | Semiconductor laser source |
| US6643302B1 (en) * | 1999-07-30 | 2003-11-04 | Fanuc Ltd. | Cooling device and surface emitting device comprising same |
| CN1906821A (en) * | 2004-03-17 | 2007-01-31 | 浜松光子学株式会社 | Semiconductor laser equipment |
| CN204190159U (en) * | 2014-10-09 | 2015-03-04 | 西安炬光科技有限公司 | The medical high-power semiconductor laser system of a kind of Conduction cooled type |
| CN204190157U (en) * | 2014-10-09 | 2015-03-04 | 西安炬光科技有限公司 | A kind of mechanical connection Conduction cooled type semiconductor laser stacks encapsulating structure |
| CN105470810A (en) * | 2015-12-15 | 2016-04-06 | 西安炬光科技股份有限公司 | Macro-channel liquid-cooling high-power semiconductor laser module and apparatus |
| CN206340826U (en) * | 2016-12-29 | 2017-07-18 | 西安炬光科技股份有限公司 | A kind of semiconductor laser stacks of mechanical erection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110535027A (en) * | 2019-09-05 | 2019-12-03 | 西安航空学院 | For manufacturing the method and optoelectronic semiconductor component of optoelectronic semiconductor component |
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