CN106783694A - A kind of wafer stage chip upside-down mounting locating platform - Google Patents
A kind of wafer stage chip upside-down mounting locating platform Download PDFInfo
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- CN106783694A CN106783694A CN201710065563.2A CN201710065563A CN106783694A CN 106783694 A CN106783694 A CN 106783694A CN 201710065563 A CN201710065563 A CN 201710065563A CN 106783694 A CN106783694 A CN 106783694A
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- platform
- wafer
- angular displacement
- mobile platform
- displacement compensation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of wafer stage chip upside-down mounting locating platform, including being used to carry wafer, and the X-axis mobile platform that can be moved by a relatively large margin and Y-axis mobile platform, it is characterized in that, also include with the rotation platform rotated by a relatively large margin in X/Y plane for the wafer, the rotation platform is provided with so that the wafer is rotated more by a small margin in X/Y plane, and the angular displacement compensation device that can be carried out along X-axis and Y-axis compared with experiencing small oscillating movements, it is provided with to detect the vision feedback system of the wafer position above the angular displacement compensation device.Above-mentioned wafer stage chip upside-down mounting locating platform, realizes the grand micro- compound of the planar three freedom with angular displacement compensation.
Description
Technical field
The present invention relates to flip-chip equipment technical field, more particularly to a kind of wafer stage chip upside-down mounting locating platform.
Background technology
In wafer stage chip upside-down mounting field and IC (integrated circuit) Packaging Industry, the positioning for wafer is very crucial.
It is main to use two kinds of complex methods of single-degree-of-freedom or XY two-freedoms in existing locating platform, so set
The wafer stage chip upside-down mounting locating platform put is difficult to meet wafer detection field and IC package industry for angular displacement positioning accurate
Accurate problem.At the same time, existing high-precision sensor such as laser displacement sensor, optical fibre displacement sensor, laser interference
There is integrated installation difficulty, high cost in the use of instrument, grating scale etc..
The content of the invention
It is an object of the invention to provide a kind of wafer stage chip upside-down mounting locating platform, the wafer stage chip upside-down mounting locating platform
Realize the grand micro- compound of the planar three freedom with angular displacement compensation.
To achieve the above object, the present invention provides a kind of wafer stage chip upside-down mounting locating platform, including be used to carry wafer,
And the X-axis mobile platform that can be moved by a relatively large margin and Y-axis mobile platform, also including with so that the wafer is in X/Y plane
The rotation platform for inside being rotated by a relatively large margin, the rotation platform be provided with carried out in X/Y plane for the wafer compared with
Rotation and the angular displacement compensation device that can carry out compared with experiencing small oscillating movements along X-axis and Y-axis, the angular displacement compensation dress by a small margin
The top put is provided with to detect the vision feedback system of the wafer position.
It is flat using X-axis movement relative to the wafer stage chip upside-down mounting locating platform that above-mentioned background technology, the present invention are provided
Platform, Y-axis mobile platform and rotation platform may insure that wafer is moved on required track, in addition, be set on rotation platform
There is angular displacement compensation device, rotated more by a small margin in X/Y plane with for wafer, and angular displacement compensation device can also
Enough motions for being carried out in X-axis and Y-axis relative to rotation platform more by a small margin；That is, for wafer in X/Y plane
Rotation, and, using rotation platform and angular displacement compensation device collective effect, wafer can be realized along X-axis and Y-axis experiencing small oscillating movements
Displacement, and rotation platform rotational steps are larger, and angular displacement compensation device rotational steps are smaller, are arranged such, in rotary flat
Under the collective effect of platform and angular displacement compensation device, the angular displacement accurate positioning of wafer is realized；Can using vision feedback system
The position of exact knowledge wafer, is conducive to carrying out it detection of surface quality.
Preferably, the X-axis mobile platform is located on the Y-axis mobile platform, and the rotation platform is located at the X
On axle mobile platform.
Preferably, the upper surface of the angular displacement compensation device is provided with to fix the circular clamp work of the wafer
Face.
Preferably, also including being used to control the X-axis mobile platform, the Y-axis mobile platform, the rotation platform and institute
The control device of angular displacement compensation device cooperative motion is stated, and the control device is connected with the vision feedback system.
Preferably, the vision that the vision feedback system can specially be detected using sub-pix template matching method
Reponse system.
Preferably, the X-axis mobile platform is driven by linear electric motors respectively with the Y-axis mobile platform, the rotary flat
Platform is driven by torque motor, and the angular displacement compensation device is driven by piezoelectric ceramic actuator.
Preferably, the positioning precision of the angular displacement compensation device is 0.2arcsec~0.8arcsec.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Inventive embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
The schematic diagram of the wafer stage chip upside-down mounting locating platform that Fig. 1 is provided by the embodiment of the present invention；
Fig. 2 is the structural representation of angular displacement compensation device in Fig. 1；
Fig. 3 is the fundamental diagram of vision feedback system in Fig. 1.
Wherein：
1-X axles mobile platform, 2-Y axles mobile platform, 3- rotation platforms, 4- angular displacements compensation device, 5- visual feedbacks system
System, 9- wafers to be detected.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the accompanying drawings and specific implementation
The present invention is described in further detail for mode.
Fig. 1, Fig. 2 and Fig. 3 are refer to, the wafer stage chip upside-down mounting locating platform that Fig. 1 is provided by the embodiment of the present invention
Schematic diagram；Fig. 2 is the structural representation of angular displacement compensation device in Fig. 1；Fig. 3 is the operation principle of vision feedback system in Fig. 1
Figure.
A kind of wafer stage chip upside-down mounting locating platform that the present invention is provided, mainly includes that the movement of X-axis mobile platform 1, Y-axis is flat
Platform 2, rotation platform 3, angular displacement compensation device 4 and vision feedback system 5, as shown in Figure of description 1.
Wafer to be detected 9 is located in angular displacement compensation device 4, is fixed by angular displacement compensation device 4；X-axis mobile platform 1 can
With the movement for carrying out by a relatively large margin along X-direction, the movement that Y-axis mobile platform 2 can carry out by a relatively large margin along Y direction, rotation
Turning platform 3 can by a relatively large margin be rotated in X/Y plane, and angular displacement compensation device 4 can carry out more small size in X/Y plane
Degree rotation, and angular displacement compensation device 4 can carry out shifting more by a small margin relative to rotation platform 3 in X-axis and Y direction
It is dynamic.
Wherein, the running accuracy of rotation platform 3 is less than the running accuracy of angular displacement compensation device 4, X-axis mobile platform 1
Translation precision is below the translation precision of angular displacement compensation device 4 with the translation precision of Y-axis mobile platform 2.It should be evident that X
The range of translation of axle mobile platform 1 is all higher than the range of translation of angular displacement compensation device 4 with the range of translation of Y-axis mobile platform 2,
And the rotating range of rotation platform 3 is more than the rotating range of angular displacement compensation device 4；Possesses the angular displacement compensation dress of such feature
4 are put, it can more by a small margin be rotated relative to rotation platform 3 in X/Y plane, and can be along X-direction and Y-axis side
To the movement for carrying out more by a small margin.
The range of movement of X-axis mobile platform 1, Y-axis mobile platform 2 and rotation platform 3 is larger, and precision is mended less than angular displacement
Repay the precision of device 4；Can be by X-axis mobile platform 1, Y-axis mobile platform 2 and rotation platform 3 referred to as grand dynamic component, and angle position
Move compensation device 4 and be referred to as fine motion part；Wafer stage chip upside-down mounting locating platform of the invention is to realize grand micro- compound, raising
The mobile efficiency of wafer to be detected 9.
When being detected to wafer to be detected 9 using wafer stage chip upside-down mounting locating platform, first by wafer to be detected 9
It is positioned in angular displacement compensation device 4, wafer to be detected 9 is fixed by angular displacement compensation device 4, then X-axis mobile platform 1, Y
Axle mobile platform 2 and rotation platform 3 are moved on a large scale, after mobile certain position, are entered by angular displacement compensation device 4
The motion of row small range, and by the position of the real-time detection of vision feedback system 5 wafer 9 to be detected, and adjust according to actual needs
Grand dynamic component and fine motion part are saved, the position of to be detected wafer 9 of the realization in angular displacement compensation device 4 is accurate.
For angular displacement compensation device 4, as shown in Figure of description 2；Can be oriented to using flexible hinge in the prior art
Xy θ Three Degree Of Freedom accuracy compensation devices set-up mode, angular displacement compensation device 4 concrete shape construction may be referred to existing skill
Art, repeats no more herein.
It is arranged such, can to greatest extent improves detection efficiency, using grand dynamic component and the associated movement of fine motion part
Adjust the position of wafer to be detected 9, it is ensured that wafer to be detected 9 in the position range needed for, improves wafer to be detected 9 all the time
Positioning precision, disclosure satisfy that wafer current detection field and IC package industry for the accurate positioning of wafer to be detected 9
It is required that.
For the set-up mode of X-axis mobile platform 1, Y-axis mobile platform 2, rotation platform 3 and angular displacement compensation device 4, this
Be located at X-axis mobile platform 1 on Y-axis mobile platform 2 by invention, and rotation platform 3 is located on X-axis mobile platform 1, such as explanation
Shown in book accompanying drawing 1.
The driver part of X-axis mobile platform 1, Y-axis mobile platform 2, rotation platform 3 and angular displacement compensation device 4 is mutually only
It is vertical, it is each non-interference, can move simultaneously, and then quickly determine the position of wafer to be detected 9.
The upper surface of angular displacement compensation device 4 is provided with to fix the circular clamp working face of wafer to be detected 9, such as explanation
Shown in book accompanying drawing 2.
It is well known that for the production and processing of wafer, the wafer after often cutting is rounded, wafer stage chip of the invention
Upside-down mounting locating platform, the upper surface of its angular displacement compensation device 4 is provided with circular clamp working face, is used to enter wafer to be detected 9
Row fixed clamp, it is ensured that to the uniform force application of circular wafer to be detected 9, reduce the probability of the damage caused by clamping.Certainly,
The concrete shape construction of circular clamp working face can also refer to prior art.
In order to further improve the detection efficiency of wafer stage chip upside-down mounting locating platform, control device can also be set, controlled
Device processed connects with X-axis mobile platform 1, Y-axis mobile platform 2, rotation platform 3, angular displacement compensation device 4 and vision feedback system 5
Connect, the cooperative motion of X-axis mobile platform 1, Y-axis mobile platform 2, rotation platform 3 and angular displacement compensation device 4 can be controlled.
When vision feedback system 5 monitors that wafer to be detected 9 is separated by a certain distance with required position, X-axis can be controlled
Mobile platform 1, Y-axis mobile platform 2, rotation platform 3 are moved with angular displacement compensation device 4 in most preferred mode, are realized
Wafer to be detected 9 quickly reaches required position.
Vision feedback system of the invention 5 can specially can be using regarding that sub-pix template matching method is detected
Feel reponse system；Figure of description 3 gives the operation principle of vision feedback system 5；It passes through light source, CCD, camera lens, USD and connects
The parts such as mouth realize the position detection to wafer to be detected 9, and specific detection process and sub-pix template matching method can join
Prior art is examined, the present invention is repeated no more.
X-axis mobile platform 1 is driven by linear electric motors respectively with Y-axis mobile platform 2, and rotation platform 3 is driven by torque motor,
Angular displacement compensation device 4 is driven by piezoelectric ceramic actuator.
Two linear electric motors drive X-axis mobile platform 1 and Y-axis mobile platform 2, torque motor to drive rotation platform 3 respectively,
Grand dynamic regulation is realized using two linear electric motors and torque motor；Angular displacement compensation device 4 is driven by piezoelectric ceramic actuator, profit
Micro-positioning regulators are realized with piezoelectric ceramic actuator；Be arranged such, can be better achieved rotation platform 3 carried out in X/Y plane compared with
Significantly rotate, the purpose that angular displacement compensation device 4 is rotated more by a small margin in X/Y plane.
In the present invention, the stroke range of X-axis mobile platform 1 is 200mm~300mm, the positioning precision of X-axis mobile platform 1
Scope is 0.0002mm~0.0008mm；The stroke range of Y-axis mobile platform 2 is 200mm~300mm, Y-axis mobile platform 2
Positioning precision scope is 0.0002mm~0.0008mm.At the same time, the positioning precision of angular displacement compensation device 4 is
0.2arcsec~0.8arcsec.Wherein, arcsec refers to rad, once 3,006 1 percent.It will be clear that angle
The positioning precision of displacement compensation device 4 is higher, is conducive to the precise positioning for wafer to be detected 9.
It should be noted that in this manual, such as first and second etc relational terms are used merely to one
Entity makes a distinction with other several entities, and not necessarily require or imply between these entities exist it is any this actual
Relation or order.
Wafer stage chip upside-down mounting locating platform provided by the present invention is described in detail above.It is used herein
Specific case is set forth to principle of the invention and implementation method, and the explanation of above example is only intended to help and understands this
The method and its core concept of invention.It should be pointed out that for those skilled in the art, not departing from this hair
On the premise of bright principle, some improvement and modification can also be carried out to the present invention, these are improved and modification also falls into power of the present invention
In the protection domain that profit is required.
Claims (7)
1. a kind of wafer stage chip upside-down mounting locating platform, including it is used to the X-axis that carry wafer and can be moved by a relatively large margin
Mobile platform and Y-axis mobile platform, it is characterised in that also including being revolved by a relatively large margin in X/Y plane with for the wafer
The rotation platform for turning, the rotation platform is provided with so that the wafer is rotated and energy more by a small margin in X/Y plane
Enough angular displacement compensation devices carried out along X-axis and Y-axis compared with experiencing small oscillating movements, are provided with above the angular displacement compensation device and are used to
Detect the vision feedback system of the wafer position.
2. wafer stage chip upside-down mounting locating platform according to claim 1, it is characterised in that the X-axis mobile platform position
On the Y-axis mobile platform, and the rotation platform is located on the X-axis mobile platform.
3. wafer stage chip upside-down mounting locating platform according to claim 2, it is characterised in that the angular displacement compensation device
Upper surface be provided with to fix the circular clamp working face of the wafer.
4. the wafer stage chip upside-down mounting locating platform according to claims 1 to 3 any one, it is characterised in that also include
It is used to control the X-axis mobile platform, the Y-axis mobile platform, the rotation platform to be cooperateed with the angular displacement compensation device
The control device of motion, and the control device is connected with the vision feedback system.
5. wafer stage chip upside-down mounting locating platform according to claim 4, it is characterised in that the vision feedback system tool
Body is the vision feedback system that can be detected using sub-pix template matching method.
6. wafer stage chip upside-down mounting locating platform according to claim 5, it is characterised in that the X-axis mobile platform with
The Y-axis mobile platform is driven by linear electric motors respectively, and the rotation platform is driven by torque motor, the angular displacement compensation dress
Put and driven by piezoelectric ceramic actuator.
7. wafer stage chip upside-down mounting locating platform according to claim 6, it is characterised in that the angular displacement compensation device
Positioning precision be 0.2arcsec~0.8arcsec.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710065563.2A CN106783694A (en) | 2017-02-06 | 2017-02-06 | A kind of wafer stage chip upside-down mounting locating platform |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710065563.2A CN106783694A (en) | 2017-02-06 | 2017-02-06 | A kind of wafer stage chip upside-down mounting locating platform |
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| CN106783694A true CN106783694A (en) | 2017-05-31 |
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| CN201710065563.2A Pending CN106783694A (en) | 2017-02-06 | 2017-02-06 | A kind of wafer stage chip upside-down mounting locating platform |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257174A (en) * | 2018-01-10 | 2018-07-06 | 广东工业大学 | Image block matching method and soldered ball position-recognizing system based on sub-pixel level image |
| CN108827689A (en) * | 2018-09-06 | 2018-11-16 | 广东工业大学 | A kind of cell micro-dissection system |
| CN109570950A (en) * | 2019-01-14 | 2019-04-05 | 青岛理工大学 | Micro-nano assembly platform device based on machine vision |
| CN112289712A (en) * | 2020-10-26 | 2021-01-29 | 苏州艾科瑞思智能装备股份有限公司 | Wafer transferring device with quick correction function and wafer loading machine |
| CN113990778A (en) * | 2021-10-22 | 2022-01-28 | 华海清科股份有限公司 | Substrate post-processing device |
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| WO2014035346A1 (en) * | 2012-08-31 | 2014-03-06 | Semiconductor Technologies & Instruments Pte Ltd | Single ultra-planar wafer table structure for both wafers and film frames |
| CN106053886A (en) * | 2016-07-28 | 2016-10-26 | 中国计量大学 | Large-scale atomic force microscope scanning and positioning system |
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| WO2014035346A1 (en) * | 2012-08-31 | 2014-03-06 | Semiconductor Technologies & Instruments Pte Ltd | Single ultra-planar wafer table structure for both wafers and film frames |
| CN103021919A (en) * | 2012-12-27 | 2013-04-03 | 上海交通大学 | Wafer prealignment device |
| CN103252761A (en) * | 2013-04-28 | 2013-08-21 | 合肥工业大学 | Long-stroke two-dimensional nano worktable system with angle compensation function |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257174A (en) * | 2018-01-10 | 2018-07-06 | 广东工业大学 | Image block matching method and soldered ball position-recognizing system based on sub-pixel level image |
| CN108827689A (en) * | 2018-09-06 | 2018-11-16 | 广东工业大学 | A kind of cell micro-dissection system |
| CN109570950A (en) * | 2019-01-14 | 2019-04-05 | 青岛理工大学 | Micro-nano assembly platform device based on machine vision |
| CN112289712A (en) * | 2020-10-26 | 2021-01-29 | 苏州艾科瑞思智能装备股份有限公司 | Wafer transferring device with quick correction function and wafer loading machine |
| CN112289712B (en) * | 2020-10-26 | 2023-05-16 | 苏州艾科瑞思智能装备股份有限公司 | Wafer material transferring device with quick correcting function and wafer loading machine |
| CN113990778A (en) * | 2021-10-22 | 2022-01-28 | 华海清科股份有限公司 | Substrate post-processing device |
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