CN106773251A - A kind of color membrane substrates and preparation method thereof and display panel and display - Google Patents
A kind of color membrane substrates and preparation method thereof and display panel and display Download PDFInfo
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- CN106773251A CN106773251A CN201611245102.5A CN201611245102A CN106773251A CN 106773251 A CN106773251 A CN 106773251A CN 201611245102 A CN201611245102 A CN 201611245102A CN 106773251 A CN106773251 A CN 106773251A
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- black matrix
- projection
- chock insulator
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- planarization layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention relates to the manufacture field of display, a kind of color membrane substrates and preparation method thereof and display panel and display are disclosed.The color membrane substrates include underlay substrate, black matrix, pixel cell, planarization layer, projection and post chock insulator matter；Wherein black matrix and pixel cell is formed on underlay substrate, and black matrix is filled between adjacent color pixel cells；Planarization layer is formed in black matrix and pixel cell；Projection is formed on planarization layer, positioned at the top of part black matrix；Post chock insulator matter includes the first post chock insulator matter and the second post chock insulator matter, and the first post chock insulator matter is formed on projection, and the second post chock insulator matter is formed on planarization layer, in the part black matrix for not forming projection.The color membrane substrates can be reduced fixes the risk that amount of liquid crystal causes Bubble or gravity Mura to liquid crystal display panel when producing line fluctuates；And can reduce display panel it is depressed when the bad risks of Gap occur.
Description
Technical field
The present invention relates to the manufacture field of display, in particular it relates to a kind of color membrane substrates and preparation method thereof and aobvious
Show panel and display.
Background technology
Liquid crystal display panel is mainly made up of color membrane substrates, array base palte and the liquid crystal being clipped between two substrates, color film base
It is additionally provided with to support the post chock insulator matter of liquid crystal cell on plate, for the Bubble (bubble) or gravity that prevent producing line wave zone from coming
Mura (referring to that display brightness is uneven, hot spot occur) phenomenons on color membrane substrates, it is necessary to set two kinds of columns of different height
Chock insulator matter, so as to reduce fix the risk that amount of liquid crystal causes Bubble or gravity Mura to liquid crystal display panel when producing line fluctuates.
In the prior art, two kinds of differences are typically formed in color membrane substrates by half tone mask (intermediate tone mask)
The cylindrical spacer of height, but when being exposed using half tone mask (intermediate tone mask), two kinds of different heights
The corresponding exposure intensity of cylindrical spacer be it is different, due to exposure diffraction, exposure intensity higher can be to relatively low exposure
Cylindrical spacer corresponding to intensity is impacted so that volcanic crater occurs in the cylindrical spacer corresponding to relatively low exposure intensity
Shape is bad, so as to cause cylindrical spacer to the support strength step-down of liquid crystal display panel, when liquid crystal display panel is depressed
When Gap bad (display that compression is caused is uneven) occurs.
The content of the invention
It is an object of the invention to provide a kind of color membrane substrates and preparation method thereof and display panel and display, to reduce
Occur Gap bad risks when display panel is depressed.
To achieve these goals, in the present invention there is provided a kind of color membrane substrates, the color membrane substrates include underlay substrate,
Black matrix, pixel cell, planarization layer, projection and post chock insulator matter；Wherein described black matrix and pixel cell are formed in the lining
On substrate, the black matrix is filled between adjacent color pixel cells；The planarization layer is formed in the black matrix
On pixel cell；The projection is formed on the planarization layer, positioned at the top of part black matrix；The post chock insulator matter bag
The first post chock insulator matter and the second post chock insulator matter are included, the first post chock insulator matter is formed on the projection, the second post dottle pin
Thing is formed on the planarization layer, in the part black matrix for not forming projection.
Meanwhile, a kind of preparation method of color membrane substrates is additionally provided in the present invention, the preparation method includes：S1, lining
Black matrix and pixel cell are formed on substrate, the black matrix is filled between adjacent color pixel cells；S2, described
Planarization layer is formed in black matrix and pixel cell and forms convex on the planarization layer, positioned at the top of part black matrix
Block；S3, while form the first post chock insulator matter in the top of the projection, on the planarization layer, positioned at not forming projection
The top of part black matrix forms the second post chock insulator matter.
In addition, additionally provide a kind of display panel in the present invention, the display panel include array base palte, color membrane substrates with
And the liquid crystal layer being arranged between, the color membrane substrates are according to color membrane substrates of the present invention.
Additionally, additionally providing a kind of display in the present invention, the display includes display panel, and the display panel is
Display panel of the invention.
Using above-mentioned color membrane substrates provided by the present invention and preparation method thereof and display panel and display, by
Projection is formed on the planarization layer of color membrane substrates so that in the step of being subsequently formed chock insulator matter, without using intermediate tone mask just
Can simultaneously be formed in same step and form the first post chock insulator matter positioned at the top of the projection, and in the planarization layer
Formation the second post chock insulator matter in top upper, positioned at the part black matrix for not forming projection.By setting the projection so that first
Relative altitude at the top of post chock insulator matter and the second post chock insulator matter is different, can reduce and amount of liquid crystal is fixed when producing line fluctuates to liquid crystal
Show that panel causes the risk of Bubble or gravity Mura；And prepared by same process so that the first post chock insulator matter and the second post
The top surface of chock insulator matter is smooth, intensity is identical, can reduce display panel it is depressed when the bad risks of Gap occur.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute the part of specification, with following tool
Body implementation method is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 shows the structural representation of the color membrane substrates according to an embodiment of the present invention；
Fig. 2-1 to Fig. 2-4 shows the schematic flow sheet for preparing color membrane substrates according to an embodiment of the present invention；
Fig. 3-1 to Fig. 3-6 shows the schematic flow sheet for preparing color membrane substrates according to another kind embodiment of the invention.
Description of reference numerals
1 is underlay substrate, 2 is black matrix, 3 is pixel cell, 31 is red pixel cell, 32 is green pixel cell,
33 is blue pixel cells, 4 is planarization layer, 4 ' is planarization layer Tooth preparation, 5 is projection, 61 is the first post chock insulator matter, 62 are
Second post chock insulator matter, 7 be projection photoresist layer, 8 for sacrifice photoresist layer, 8 ' be mask block.
Specific embodiment
Specific embodiment of the invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
In the present invention, in the case where opposite explanation is not made, the noun of locality for using as " on " and " lower is that this area is usual
Relative position relation under relative position relation under meaning, such as structure shown in accompanying drawing 1.
A kind of color membrane substrates are provided in the present invention, as shown in figure 1, the color membrane substrates include underlay substrate 1, black matrix
2nd, pixel cell 3, planarization layer 4, projection 5 and post chock insulator matter 6；Wherein described black matrix 2 and pixel cell 3 are formed in the lining
On substrate 1, the black matrix 2 is filled between adjacent color pixel cells 3；The planarization layer is formed in the black square
In battle array 2 and pixel cell 3；The projection 5 is formed on the planarization layer 4, positioned at the top of part black matrix 2；The post
Chock insulator matter 6 includes the first post chock insulator matter 61 and the second post chock insulator matter 62, and the first post chock insulator matter 61 is formed in the projection 5
On, the second post chock insulator matter 62 is formed on the planarization layer 4, in the part black matrix 2 for not forming projection 5.
Color membrane substrates of the invention, it focuses on forming projection on planarization layer, to cause the first post dottle pin
Relative altitude at the top of thing and the second post chock insulator matter is different, and it is for underlay substrate, black matrix, pixel cell, planarization layer, convex
The specific material that block, the first post chock insulator matter, the second post chock insulator matter are used does not have particular/special requirement, with reference to known in the art
Conventional material, such as described underlay substrate 1 can be transparency carrier, and it can be specifically using glass, quartz, transparent tree
The substrate that the leaded light with certain robustness such as fat and nonmetallic materials are made.Wherein for the first post chock insulator matter and the second post every
The set location and setting quantity of underbed do not have particular/special requirement, are referred to the conventional arrangement mode of this area.
Color membrane substrates of the invention, for the first post chock insulator matter 61 and the second post chock insulator matter 62 height not
There is particular/special requirement, be referred to the general thickness requirement of this area, under preferable case, the first post chock insulator matter 61 and the second post
Chock insulator matter 62 it is highly identical, respectively 3-4 μm.
Color membrane substrates of the invention, do not have particular/special requirement for the height of projection 5, and two are being prepared with reference to this area
When planting the post chock insulator matter of different height, both differences in height.Under preferable case, the height of the projection 5 is 0.3-0.6 μ
M, preferably 0.4-0.5 μm.
Color membrane substrates of the invention, under preferable case, the projection 5 is by same material with the planarization layer 4
Material, same operation is integrally formed and obtains.
Color membrane substrates of the invention, wherein not having particular/special requirement, Ke Yican for the selection of the pixel cell 3
According to the conventional selection of this area；The pixel cell can include the pixel cell of various different colours, as long as this various different face
The pixel cell of color combines to form white light.Under preferable case, the pixel cell 3 includes red pixel adjacent two-by-two
Unit 31, green pixel cell 32 and blue pixel cells 33.
Meanwhile, a kind of preparation method of color membrane substrates is additionally provided in the present invention, the preparation method includes：S1, lining
Black matrix 2 and pixel cell 3 are formed on substrate 1, the black matrix 2 is filled between adjacent color pixel cells 3；S2、
Planarization layer 4 is formed in the black matrix 2 and pixel cell 3 and on the planarization layer 4, positioned at part black matrix 2
Top forms projection 5；S3, while the projection 5 top formed the first post chock insulator matter 61, on the planarization layer 4, position
The second post chock insulator matter 62 is formed in the top of the part black matrix 2 for not forming projection 5.
The preparation method of above-mentioned color membrane substrates provided by the present invention, process is simple, it is easy to implement, it is adaptable to big rule
The production of mould.The method by planarization layer 4 formed projection 5, with cause the first post chock insulator matter and the second post chock insulator matter top
The relative altitude in portion is different, and then fixation amount of liquid crystal causes Bubble or gravity to liquid crystal display panel when reducing producing line fluctuation
The risk of Mura；The first post chock insulator matter and the second post chock insulator matter are prepared by using same process so that both tops simultaneously
Smooth, intensity is identical, so can reduce display panel it is depressed when the bad risks of Gap occur.
According to the above method of the present invention, wrapped the step of black matrix 2 and pixel cell 3 are formed on underlay substrate 1 in S1
Include：S11 forms the black matrix 2 of required pattern on underlay substrate；S12, formed at the pattern openings of the black matrix needed for
Pixel cell 3.Wherein：
In the step of S11 forms black matrix, the forming method for black matrix can be without particular/special requirement, with reference to ability
The conventional scheme in domain.Under preferable case, the step S11 includes：(1), black matrix photoetching is coated in the underlay substrate
Glue, forms black matrix photoresist layer；(2) development, is exposed to the black matrix photoresist layer, being formed has black matrix pattern
Black matrix precursor；(3), the drying black matrix precursor forms the black matrix.
Under preferable case, in the step of forming black matrix, the method for the exposure imaging for being used can also be black to be formed
The conventional method of matrix, for example, can use DNK companies of Japan RZ-1300IXF/C exposure sources, and operating condition includes, in 22-
24℃、30-50MJ/cm2Under intensity, 10-20s is exposed.
Under preferable case, in the step of forming black matrix, the drying black matrix precursor forms the step of the black matrix
In rapid, dry condition includes：Under the conditions of being 200-250 DEG C in temperature, more than 25min, preferably 25-50min are dried.
In the step of S12 forms pixel cell, forming pixel cell can be without particular/special requirement, with reference to this area
Conventional method.Wherein described pixel cell can include the pixel cell of various different colours, as long as this various different face
The pixel cell of color combines to form white light.Under preferable case, the pixel cell includes red pixel adjacent two-by-two
Unit, green pixel cell and blue pixel cells.Now in the step of forming the pixel cell, respectively in order successively
Form red pixel cell, green pixel cell and blue pixel cells.
In one embodiment, when forming red pixel cell 31, green pixel cell 32 or blue pixel cells 33,
Comprise the following steps respectively：(1) pixel cell that coats respective color is formed with the surface of black matrix side in substrate
Photoresist, forms corresponding pixel cell photoresist layer；(2) development is exposed to the pixel cell photoresist layer for being formed,
To form corresponding pixel cell precursor at the respective openings of black matrix pattern；(3) the drying pixel cell precursor is formed
The pixel cell.
Under preferable case, in the step of forming pixel cell, the photoresist for being used can not have particular/special requirement,
Raw material commonly used in the art can be used.
Under preferable case, in the step of forming pixel cell, the method for the exposure imaging for being used can also be formation
The conventional method of pixel cell, for example, can use DNK companies of Japan RZ-1300IXF/C equipment, and operating condition includes, in 22-
24℃、30-50MJ/cm2Under intensity, 10-20s is exposed.
Under preferable case, in the method for forming pixel cell, the drying pixel cell precursor forms the pixel list
In the step of unit, dry condition includes：Under the conditions of being 200-250 DEG C in temperature, more than 25min, preferably 25-50min are dried.
According to the inventive method, in a preferred embodiment, the S2 includes：S21, as shown in Fig. 2-1, described
Planarization layer 4 is formed in black matrix 2 and pixel cell 3；S22, as shown in Fig. 2-2, on the planarization layer 4 coat projection light
Photoresist, forms projection photoresist layer 7；S23, as Figure 2-3, is exposed development to the projection photoresist layer 7, and such as Fig. 2-
Shown in 4, projection precursor is formed on the planarization layer 4, positioned at the top of part black matrix 2；Before S24, the drying projection
Body forms the projection 5.
Under preferable case, in the step of forming planarization layer 4, the material for being used can be conventionally used for shape for this area
Into the material of planarization layer, such as, commercially available from the PIG-7414 materials of JNC companies, the thickness of the planarization layer for being formed can be
The general thickness of this area, such as thickness are 2-3 μm.
Under preferable case, in the step of forming projection 5, do not have particular/special requirement for the material of projection photoresist, can
With use and existing planarization layer identical material, such as commercially available from the PIG-7414 of JNC companies
Under preferable case, in the step of forming projection 5, the method for the exposure imaging for being used can also be this area institute
Known conventional method, for example, can use DNK companies of Japan RZ-1300IXF/C exposure sources, and operating condition includes, in 22-
24℃、10-20MJ/cm2Under intensity, 10-20s is exposed.
Under preferable case, in the step of forming projection 5, dry condition includes：It is 200-250 DEG C of condition in temperature
Under, dry more than 25min, preferably 25-50min.
According to the inventive method, in another preferred embodiment, the S2 includes：S21, as shown in figure 3-1, in institute
State and planarization layer Tooth preparation 4 ' is formed on black matrix 2 and pixel cell 3；S22, as shown in figure 3-2, in the planarization layer preparation
Above photoresist is sacrificed in coating to body 4 ', is formed and is sacrificed photoresist layer 8；S23, as shown in Fig. 3-3 and Fig. 3-4, to the sacrifice photoetching
Glue-line 8 is exposed development, and mask block 8 ' is formed on the planarization layer Tooth preparation 4 ', positioned at the top of part black matrix 2；
S24, as in Figure 3-5, along the mask block 8 ' planarization layer Tooth preparation 4 ' described in dry etching downwards, forms planarization layer 4
Projection 5 is formed with the planarization layer 4, positioned at the top of part black matrix 2；S25, as seen in figures 3-6, covers described in removal
Film block 8 '.
Under preferable case, in the step of forming planarization layer Tooth preparation 4 ', the material of the planarization layer Tooth preparation 4 ' is adopted
With the material of the conventional planarization layer in this area, for example with the PIG-7414 materials commercially available from JNC companies；The planarization
The thickness of layer Tooth preparation 4 ' is bigger 0.3-0.6 μm than the thickness of the planarization layer that this area is routinely formed, preferably 0.4-0.5 μm,
To reserve the thickness of projection 5.
Under preferable case, the sacrifice photoresist for being used does not have particular/special requirement, if planarization layer is had no side effect, and
It is easily removed, such as commercially available from the AZ4620 of AZ companies.The step of development is exposed to the sacrifice photoresist layer 8
In, the conventional method that the method for the exposure imaging for being used can also be well known in the art for example can be using Japan DNK public affairs
Department's RZ-1300IXF/C exposure sources, operating condition includes, in 22-24 DEG C, 20-40MJ/cm2Under intensity, 20-30s is exposed.
Under preferable case, along the mask block 8 ' formation of planarization layer Tooth preparation 4 ' planarization described in dry etching downwards
In the step of layer and projection 5, the method for dry etching uses dry plasma etch technique.
In the present invention, in the step of forming projection 5 on planarization layer 4, do not have for the position set by projection 5
Particular/special requirement, as long as being formed in black matrix top, you can with random arrangement, it is also possible to according to certain regular array.
The method according to the invention, the S4 includes：S31, on the planarization layer 4 and the projection 5 coat post every
Underbed photoresist, forms post chock insulator matter photoresist layer；S32, development is exposed in the post chock insulator matter photoresist layer, described
The top of projection 5 forms the first post chock insulator matter precursor, on the planarization layer 4, positioned at the part black matrix for not forming projection 5
Top formed the second post chock insulator matter precursor；S33, the dry first post chock insulator matter precursor and the second post chock insulator matter precursor
Form the first post chock insulator matter 61 and the second post chock insulator matter 62.
Under preferable case, formed the first post chock insulator matter 61 and the second post chock insulator matter 62 the step of in, the post for being used every
Underbed photoresist can be the conventional material of this area, for example with the JNPC-933 commercially available from JSR companies.Formed the first post every
The height of the post chock insulator matter 62 of underbed 61 and second is 3-4 μm.
Under preferable case, in the step of forming the first post chock insulator matter 61 and the second post chock insulator matter 62, the exposure for being used
The method of development can also be the conventional method to form pixel cell, for example, can use DNK companies of Japan RZ-1300IXF/C
Equipment, operating condition includes, in 22-24 DEG C, 30-50MJ/cm2Under intensity, 10-20s is exposed.
Under preferable case, in the step of forming the first post chock insulator matter 61 and the second post chock insulator matter 62, described first is dried
The condition of post chock insulator matter precursor and the second post chock insulator matter precursor includes：Temperature be 200-250 DEG C under the conditions of, dry 25min with
On, preferably 25-50min.
In addition, according to the third aspect of the present invention, additionally providing a kind of display panel, the display panel includes array base
Plate, color membrane substrates and the liquid crystal layer being arranged between, wherein color membrane substrates are according to color membrane substrates of the present invention.
Additionally, according to the fourth aspect of the invention, additionally providing a kind of display device, the display device is included according to this hair
The bright display panel.The display device can be：Mobile phone, panel computer, television set, display, notebook computer, number
Any product or part with display function such as photo frame, navigator.
Below with reference to specific embodiment illustrating beneficial effects of the present invention.
Embodiment 1
The preparation of color membrane substrates：
S1, the glass (commercially available from the AN100 of AGC companies) using thickness as 0.5mm as underlay substrate, to the underlay substrate
Carrying out ultra-pure water cleaning makes the dustless free from admixture ion in its surface；
S2, use black matrix photoresist (commercially available from the BK-6180SL of TOK companies)；By black matrix photoresist coating
Black matrix photoresist layer is formed on the underlay substrate, the underlay substrate for being coated with black matrix photoresist layer is placed in exposure and sets
In standby (commercially available from the RZ-1300IXF/C models of Japanese DNK companies), in 23 DEG C, 40MJ/cm2Under intensity, 15s is exposed, formed
Black matrix precursor with black matrix pattern, dries 30 minutes at 230 DEG C, formation black matrix (；
S3, prepare red pixel cell photoresist (commercially available from the product of the IT-GR335SC-49A trades mark of DFC companies), green
Color pixel unit photoresist (commercially available from the product of the IT-GG746SC-2 trades mark of DFC companies) and blue pixel cells photoresist
(commercially available from the product of the TDN-SC7002B trades mark of DFC companies)；
It is formed with the surface of black matrix pattern side in underlay substrate, coated red pixel cell photoresist, is filled black
Matrix pattern opening simultaneously covers black matrix, forms red pixel cell photoresist layer, will be formed with red pixel cell photoresist
The underlay substrate of layer is put into exposure sources (commercially available from the RZ-1300IXF/C of Japanese DNK companies), in 23 DEG C, 40MJ/cm2
Under intensity, 15s is exposed, red pixel cell precursor is formed at corresponding black matrix pattern openings, 30 points are dried at 230 DEG C
Clock, forms red pixel cell；
It is formed with the surface of black matrix pattern side in underlay substrate, coats green pixel cell photoresist, filling is surplus
In remaining black matrix pattern openings and cover black matrix and red pixel cell, green pixel cell photoresist layer is formed, by shape
Exposure sources are put into the underlay substrate for having green pixel cell photoresist layer (commercially available from the RZ-1300IXF/C of DNK companies)
In, in 23 DEG C, 40MJ/cm2Under intensity, 15s is exposed, before formation green pixel cell at corresponding black matrix pattern openings
Body, dries 30 minutes at 230 DEG C, forms green pixel cell
It is formed with the surface of black matrix pattern side in underlay substrate, coats blue pixel cells photoresist, filling is surplus
At remaining black matrix pattern openings and cover black matrix, red pixel cell and green pixel cell, form blue pixel cells
Photoresist layer, the underlay substrate that will be formed with blue pixel cells photoresist layer puts into exposure sources (commercially available from DNK companies
RZ-1300IXF/C in), in 23 DEG C, 40MJ/cm2Under intensity, 15s is exposed, blue pixel is formed in corresponding black matrix pattern
Unit precursor, dries 30 minutes at 230 DEG C, forms blue pixel cells；
S4, to form thickness in the black matrix 2 and pixel cell 3 be that (material is commercially available from JNC for 2 μm of planarization layer 4
The PIG-7414 of company), form the structure as shown in 2-1；
S5, on the planarization layer 4 coat projection photoresist (commercially available from PIG-7414 of JNC companies) formed thickness be
10 μm of projection photoresist layer 7, obtains structure shown in Fig. 2-2, and the underlay substrate that will be formed with projection photoresist layer 7 puts into exposure
In light device (commercially available from the RZ-1300IXF/C of DNK companies), as Figure 2-3, in 23 DEG C, 15MJ/cm2Under intensity, exposure
10s, in part, the top of black matrix forms projection precursor, is dried 30 minutes at 230 DEG C, forms projection (thickness is 0.5 μm),
Obtain structure shown in Fig. 2-4；
S6, on the planarization layer 4 the post chock insulator matter photoresist of the covering projection is coated (commercially available from JSR companies
JNPC-933 post chock insulator matter photoresist layer) is formed, the underlay substrate that will be formed with post chock insulator matter photoresist layer is put into exposure and set
In standby (commercially available from the RZ-1300IXF/C of DNK companies), in 23 DEG C, 40MJ/cm2Under intensity, 15s is exposed, in the projection 5
Top forms the first post chock insulator matter precursor, on the planarization layer 4, positioned at the top of the part black matrix for not forming projection 5
The second post chock insulator matter precursor is formed, is dried 30 minutes at 230 DEG C, form the first post chock insulator matter 61 and second that thickness is 3 μm
Post chock insulator matter 62, obtains the color membrane substrates of structure shown in Fig. 1.
Embodiment 2
S1-S3：With reference to corresponding steps in embodiment 1；
S4, (material is in the black matrix 2 and pixel cell 3 to form the planarization layer Tooth preparation 4 ' that thickness is 2.5 μm
Commercially available from the PIG-7414 of JNC companies), form the structure as shown in 3-1；
S5, coating sacrifice photoresist (commercially available from AZ4620 of AZ companies) the formation thickness on the planarization layer Tooth preparation 4 '
The sacrifice photoresist layer 8 for 10 μm is spent, structure shown in Fig. 3-2 is obtained, the underlay substrate that will be formed with sacrifice photoresist layer 8 is put into
To in exposure sources (commercially available from the RZ-1300IXF/C of DNK companies), as shown in Fig. 3-3, in 23 DEG C, 30MJ/cm2Under intensity,
Exposure 25s, in part, the top of black matrix forms mask block 8 ', obtains structure shown in Fig. 3-4；
S6, along the mask block 8 ' planarization layer Tooth preparation 4 ' described in dry plasma etch downwards, it is 2 μm to form thickness
Planarization layer 4 and be 0.5 μm of projection 5 on the planarization layer 4, positioned at the top thickness of the part black matrix 2, obtains
Structure, removes the mask block 8 ' as in Figure 3-5, obtains structure as seen in figures 3-6；
S7 coats the post chock insulator matter photoresist for covering the projection (commercially available from JSR companies on the planarization layer 4
JNPC-933 post chock insulator matter photoresist layer) is formed, the underlay substrate that will be formed with post chock insulator matter photoresist layer is put into exposure and set
In standby (commercially available from the RZ-1300IXF/C of DNK companies), in 23 DEG C, 40MJ/cm2Under intensity, 15s is exposed, in the projection 5
Top forms the first post chock insulator matter precursor, on the planarization layer 4, positioned at the top of the part black matrix for not forming projection 5
The second post chock insulator matter precursor is formed, is dried 30 minutes at 230 DEG C, form thickness for 3 μm of first post of post chock insulator matter 61 and second
Chock insulator matter 62, obtains the color membrane substrates of structure shown in Fig. 1.
Embodiment 3
The preparation of display panel：The display panel includes array base palte, color membrane substrates and is arranged between
Liquid crystal layer, wherein color membrane substrates are using the color membrane substrates prepared by embodiment 1 or 2.
Embodiment 4
The preparation of display：The display includes display panel, and the display panel is using prepared in embodiment 3
Display panel.
Color membrane substrates using technical solution of the present invention and preparation method thereof and display panel, by color membrane substrates
Projection is formed on planarization layer so that in the step of being subsequently formed chock insulator matter, just can be same without use intermediate tone mask
Formed simultaneously in step and form the first post chock insulator matter positioned at the top of the projection, and on the planarization layer, positioned at not
The top for forming the part black matrix of projection forms the second post chock insulator matter.By setting the projection so that the first post chock insulator matter
It is different with the relative altitude at the top of the second post chock insulator matter, fixation amount of liquid crystal when producing line fluctuates can be reduced liquid crystal display panel is made
Into Bubble or the risk of gravity Mura；And prepared by same process so that the first post chock insulator matter and the second post chock insulator matter
Intensity is identical, can reduce display panel it is depressed when the bad risks of Gap occur.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in range of the technology design of the invention, various letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned specific embodiment, in not lance
In the case of shield, can be combined by any suitable means.In order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy is no longer separately illustrated.
Additionally, can also be combined between a variety of implementation methods of the invention, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of color membrane substrates, it is characterised in that the color membrane substrates include underlay substrate (1), black matrix (2), pixel cell
(3), planarization layer (4), projection (5) and post chock insulator matter；Wherein described black matrix (2) and pixel cell (3) are formed in the lining
On substrate (1), the black matrix (2) is filled between adjacent color pixel cells (3)；The planarization layer (4) is formed
In the black matrix (2) and pixel cell (3)；The projection (5) is formed on the planarization layer (4), black positioned at part
The top of matrix (2)；The post chock insulator matter include the first post chock insulator matter (61) and the second post chock insulator matter (62), first post every
Underbed (61) is formed on the projection (5), and the second post chock insulator matter (62) is formed on the planarization layer (4), is located at
Do not formed in the part black matrix (2) of projection (5).
2. color membrane substrates according to claim 1, wherein, the first post chock insulator matter (61) and the second post chock insulator matter (62)
It is highly identical, respectively 3-4 μm, the height of the projection (5) is 0.3-0.6 μm, preferably 0.4-0.5 μm；
Preferably, the projection (5) is integrally formed with the planarization layer (4).
3. color membrane substrates according to claim 1 and 2, it is characterised in that the pixel cell (3) is including adjacent two-by-two
Red pixel cell (31), green pixel cell (32) and blue pixel cells (33).
4. a kind of preparation method of color membrane substrates, it is characterised in that the preparation method includes：
S1, black matrix (2) and pixel cell (3) are formed on underlay substrate (1), the black matrix (2) is filled in adjacent coloured silk
Between color pixel unit (3)；
S2, form in the black matrix (2) and pixel cell (3) planarization layer (4) and on the planarization layer (4), position
Projection (5) is formed in the top of part black matrix (2)；
S3, while the projection (5) top formed the first post chock insulator matter (61), on the planarization layer (4), positioned at not
The top for forming the part black matrix (2) of projection (5) forms the second post chock insulator matter (62).
5. preparation method according to claim 4, wherein, the S2 includes：
S21, in the black matrix (2) and pixel cell (3) form planarization layer (4)；
S22, coating projection photoresist (7) on the planarization layer (4), form projection photoresist layer；
S23, development is exposed to the projection photoresist layer (7), on the planarization layer (4), positioned at part black matrix
(2) top forms projection precursor；
S24, the drying projection precursor form the projection (5).
6. preparation method according to claim 4, wherein, the S2 includes：
S21, in the black matrix (2) and pixel cell (3) form planarization layer Tooth preparation (4 ')；
S22, the coating sacrifice photoresist on the planarization layer Tooth preparation, form and sacrifice photoresist layer (8)；
S23, to it is described sacrifice photoresist layer (8) be exposed development, on the planarization layer Tooth preparation (4 '), positioned at part
The top of black matrix (2) forms mask block (8 ')；
S24, along the mask block (8 ') planarization layer Tooth preparation (4 ') described in dry etching downwards, formed planarization layer (4) and
Projection (5) is formed on the planarization layer (4), positioned at the top of part black matrix (2)；
S25, the removal mask block (8 ').
7. preparation method according to claim 4, the S4 includes：
S31, the coating post chock insulator matter photoresist on the planarization layer (4) and the projection (5), form post chock insulator matter photoresist
Layer；
S32, development is exposed in the post chock insulator matter photoresist layer, the first post dottle pin is formed in the top of the projection (5)
Thing precursor, the second post dottle pin is formed on the planarization layer (4), positioned at the top of the part black matrix for not forming projection (5)
Thing precursor；
S33, dry the first post chock insulator matter precursor and the second post chock insulator matter precursor formed the first post chock insulator matter (61) and
Second post chock insulator matter (62).
8. preparation method according to claim 4, the pixel cell formed in the S2 includes adjacent red two-by-two
Color pixel unit (31), green pixel cell (32) and blue pixel cells (33).
9. a kind of display panel, the display panel includes array base palte, color membrane substrates and the liquid crystal being arranged between
Layer, it is characterised in that the color membrane substrates are the color membrane substrates described in claim 1 or 2.
10. a kind of display, the display includes display panel, it is characterised in that the display panel is claim 9 institute
The display panel stated.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132705A (en) * | 2017-07-18 | 2017-09-05 | 京东方科技集团股份有限公司 | Spacer material, the preparation method of spacer material, display panel and display device |
| CN107422522A (en) * | 2017-09-20 | 2017-12-01 | 武汉华星光电技术有限公司 | A kind of colored filter substrate and preparation method thereof |
| CN107479260A (en) * | 2017-09-08 | 2017-12-15 | 深圳市华星光电技术有限公司 | COA substrates and preparation method thereof, display panel |
| CN107589586A (en) * | 2017-09-26 | 2018-01-16 | 京东方科技集团股份有限公司 | Color membrane substrates, display panel, the preparation method of display device and color membrane substrates |
| CN108832027A (en) * | 2018-06-07 | 2018-11-16 | 广州市得胜光电科技有限公司 | A kind of raising WOLED+COA manufacture of substrates |
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| WO2022057453A1 (en) * | 2020-08-24 | 2022-03-24 | 北京芯海视界三维科技有限公司 | Optical material filling method and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257482A (en) * | 2013-03-19 | 2013-08-21 | 京东方科技集团股份有限公司 | Color film substrate, production method thereof and liquid crystal panel |
| CN103529591A (en) * | 2013-10-15 | 2014-01-22 | 合肥京东方光电科技有限公司 | Color film substrate and preparation method thereof, display panel and preparation method thereof and display device |
| CN103901672A (en) * | 2014-03-21 | 2014-07-02 | 京东方科技集团股份有限公司 | Array substrate, liquid crystal display panel and display device |
| CN104238199A (en) * | 2014-09-10 | 2014-12-24 | 京东方科技集团股份有限公司 | Color film substrate, manufacturing method thereof and display device |
| CN105652527A (en) * | 2016-01-22 | 2016-06-08 | 京东方科技集团股份有限公司 | Color film substrate, manufacture method thereof and display device |
-
2016
- 2016-12-29 CN CN201611245102.5A patent/CN106773251A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257482A (en) * | 2013-03-19 | 2013-08-21 | 京东方科技集团股份有限公司 | Color film substrate, production method thereof and liquid crystal panel |
| CN103529591A (en) * | 2013-10-15 | 2014-01-22 | 合肥京东方光电科技有限公司 | Color film substrate and preparation method thereof, display panel and preparation method thereof and display device |
| CN103901672A (en) * | 2014-03-21 | 2014-07-02 | 京东方科技集团股份有限公司 | Array substrate, liquid crystal display panel and display device |
| CN104238199A (en) * | 2014-09-10 | 2014-12-24 | 京东方科技集团股份有限公司 | Color film substrate, manufacturing method thereof and display device |
| CN105652527A (en) * | 2016-01-22 | 2016-06-08 | 京东方科技集团股份有限公司 | Color film substrate, manufacture method thereof and display device |
Non-Patent Citations (2)
| Title |
|---|
| 王阳元等: "《集成电路工艺基础》", 31 May 1991 * |
| 高鸿锦等: "《新型显示技术下》", 30 August 2014 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107132705A (en) * | 2017-07-18 | 2017-09-05 | 京东方科技集团股份有限公司 | Spacer material, the preparation method of spacer material, display panel and display device |
| CN107479260A (en) * | 2017-09-08 | 2017-12-15 | 深圳市华星光电技术有限公司 | COA substrates and preparation method thereof, display panel |
| CN107422522A (en) * | 2017-09-20 | 2017-12-01 | 武汉华星光电技术有限公司 | A kind of colored filter substrate and preparation method thereof |
| CN107422522B (en) * | 2017-09-20 | 2019-12-13 | 武汉华星光电技术有限公司 | Color filter substrate and manufacturing method thereof |
| CN107589586A (en) * | 2017-09-26 | 2018-01-16 | 京东方科技集团股份有限公司 | Color membrane substrates, display panel, the preparation method of display device and color membrane substrates |
| CN108832027A (en) * | 2018-06-07 | 2018-11-16 | 广州市得胜光电科技有限公司 | A kind of raising WOLED+COA manufacture of substrates |
| CN114063336A (en) * | 2020-07-31 | 2022-02-18 | 北京小米移动软件有限公司 | Black matrix and manufacturing method thereof, color film substrate and manufacturing method thereof and display screen |
| CN114063336B (en) * | 2020-07-31 | 2024-03-05 | 北京小米移动软件有限公司 | Black matrix and manufacturing method thereof, color film substrate and manufacturing method thereof, and display screen |
| WO2022057453A1 (en) * | 2020-08-24 | 2022-03-24 | 北京芯海视界三维科技有限公司 | Optical material filling method and device |
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