CN106756704A - Chip automatic tin coating device - Google Patents
Chip automatic tin coating device Download PDFInfo
- Publication number
- CN106756704A CN106756704A CN201510811190.XA CN201510811190A CN106756704A CN 106756704 A CN106756704 A CN 106756704A CN 201510811190 A CN201510811190 A CN 201510811190A CN 106756704 A CN106756704 A CN 106756704A
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- CN
- China
- Prior art keywords
- chip
- tin
- ward
- control
- coating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of chip automatic tin coating device of the invention, wherein, including：Four axles ward off tin workbench, chip positioning device, flux bath, at least tin pot and control device；The chip positioning frock is used to for chip to be placed in chip positioning frock, to determine the center of chip；The control device is used for the center according to chip, controls four axle to ward off the action of tin workbench；At least tin pot to chip for carrying out warding off tin；The flux bath is used to add scaling powder to chip.Chip automatic tin coating device of the invention is accurately controlled wards off tin highly, and uniformity is good；Pin is difficult short circuit and deformation；Operated without hand-held chip, do not influenceed by people's muscle power, warded off tin efficiency high；The risk that people's hand contamination chip and static electricity on human body may bring can be avoided.
Description
Technical field
The present invention relates to field of chip manufacture technology, more particularly to a kind of chip automatic tin coating dress
Put.
Background technology
The tin operation of warding off of existing chip is completed by the hand-held chip of operator, there is problems with：
The highly bad control of tin is warded off, planarization is bad, wards off tin precision low；Pin is easily short-circuit, pin
There is deformation；Ward off tin efficiency low, people wants hand-held chip, influenceed by muscle power, it is impossible to grasp for a long time
Make；Hand has oil stain, grey mark etc., easily pollutes chip, causes solderability to decline；Static electricity on human body,
In the presence of the risk for damaging chip.
The content of the invention
It is an object of the invention to provide a kind of automatic tin coating device of chip, for solving to operate
The hand-held chip of person ward off that tin operational consistency is poor, pin easily short circuit, ward off that tin efficiency is low, people
Hand easily pollutes chip and electrostatic there is a problem of damaging chip risk.
A kind of chip automatic tin coating device of the invention, wherein, including：It is flat that four axles ward off tin work
Platform, chip positioning device, flux bath, at least tin pot and control device；The chip is determined
Position frock is used to for chip to be placed in chip positioning frock, to determine the center of chip；Should
Control device is used for the center according to chip, controls four axle to ward off the dynamic of tin workbench
Make；At least tin pot to chip for carrying out warding off tin；The flux bath is used to give chip addition
Scaling powder.
One embodiment of chip automatic tin coating device of the invention, wherein, switch board
The size of the center computing chip according to chip, and according to the size of chip, control
The pin for adding the chip of scaling powder is needed immersion tin pot and helps weldering by vacuum chuck device
The depth of agent groove.
One embodiment of chip automatic tin coating device of the invention, wherein, also include
Control arm, for control chip in the chip positioning device, the flux bath and the tin
Moved between pot, and control chip ward off the angle of tin and addition scaling powder.
One embodiment of chip automatic tin coating device of the invention, wherein, also include
Vacuum chuck device, for control chip the chip positioner, the flux bath,
Moved between tin pot, and control chip ward off the angle of tin and addition scaling powder.
One embodiment of chip automatic tin coating device of the invention, wherein, also include
Chip retracting device, for being reclaimed after chip wards off tin.
One embodiment of chip automatic tin coating device of the invention, wherein, the chip
Positioner, the flux bath and an at least tin pot integrated installation ward off tin in four axle
On workbench.
One embodiment of chip automatic tin coating device of the invention, wherein, four axle
Ward off movement, upset, rotation and positioning that tin workbench is capable of control chip.
Chip automatic tin coating device of the invention can reach following technique effect：Can be accurate
Control wards off tin highly, and uniformity is good；Pin is difficult short circuit and deformation；Without hand-held chip
Operated, do not influenceed by people's muscle power, warded off tin efficiency high；People's hand contamination core can be avoided
The risk that piece and static electricity on human body may bring.
Brief description of the drawings
Fig. 1 show the structural representation of chip automatic tin coating device.
Specific embodiment
It is below in conjunction with the accompanying drawings and real to make the purpose of the present invention, content and advantage clearer
Example is applied, specific embodiment of the invention is described in further detail.
Fig. 1 show the structural representation of chip automatic tin coating device, as shown in figure 1, chip is certainly
Dynamic tinning device includes：Four axles ward off tin workbench 1, chip positioning device 2, flux bath 3,
Vacuum chuck device 4, tin pot 5, tin pot 6, chip retracting device 7 and switch board 8.
As shown in figure 1, vacuum sucker base 4, chip positioning device 2, flux bath 3, tin pot 5,
Tin pot 6, the integrated installation of chip retracting device 7 on the basic machine that four axles ward off tin workbench 1,
Entirely tin motion process is warded off to be controlled by switch board 8.
With reference to Fig. 1, chip positioning frock 2 is used to for chip to be placed in chip positioning frock, with true
Determine the center of chip, and the size of chip is determined according to center, the size of chip is passed
Give switch board 8.Switch board 8 is used for the action for controlling four axles to ward off tin workbench 1, and parameter is matched somebody with somebody
Put, ward off tin time etc..Vacuum chuck device 4 is used to suck chip, and chip is determined in chip
Position device 2, flux bath 3, tin pot 5 is moved between tin pot 6 and chip retracting device 7,
Control chip ward off the angle of tin and addition scaling powder simultaneously.Flux bath 3 is used for chip
Addition scaling powder, switch board 8 determines that vacuum chuck device 4 immerses chip according to the size of chip
The depth of flux bath, the pin to chip adds scaling powder.It is right that tin pot 5 and tin pot 6 are used for
Chip carries out warding off tin, wherein, the present embodiment is real by taking 6 two tin pots of tin pot 5 and tin pot as an example
The quantity of tin pot 5 can be as the case may be selected on border.Switch board 8 is true according to the size of chip
Determining vacuum chuck device 4 needs the pin for adding the chip of scaling powder to immerse the depth of tin pot.
For other embodiment, vacuum chuck device 4 can be consolidated using other control arms with chip
It is fixed, such as engaging etc..
With reference to Fig. 1, for one embodiment, four axles ward off tin workbench 1 for automatic tin coating device
Main part, including motion and basic machine.Motion has four frees degree：
Horizontal leading screw pair (X-axis), longitudinal leadscrew pair (Z axis), two-axle rotating table (A and B axle), four
Axle sets displacement, the anglec of rotation, movement velocity and the pause of chip according to switch board 8
The parameters such as time, by kinetic control system realize chip movement, 90 ° upset, rotation and
Positioning etc., all motions are realized by motor；Basic machine is used to install four motion Axle moulds
Block, and be fixed on antistatic workbench；Vacuum sucker base 4 is arranged on two-axle rotating table (A
And B axle) one end, for picking up and discharging chip, it is connected with magnetic valve in switch board,
Control to magnetic valve is realized by kinetic control system, to replace the hand-held chip of operator to grasp
Make；Switch board 8 realizes the option and installment of technological parameter, there is provided different model chip wards off tin
Technological parameter database, warding off tin for different model chip can be joined with Selection and call and configuration technique
Number.
With reference to Fig. 1, the course of work of chip automatic tin coating device of the present invention is further illustrated, very
Empty sucker disk seat 4 is placed on the measurement size of chip positioning device 2, and measurement result is sent into control
Be placed on chip on flux bath 3 again add scaling powder in each angle by cabinet 8, vacuum sucker base 4,
The chip that scaling powder will be added again carries out warding off tin on tin pot 5, will ward off the complete chip of tin and puts back to again
Flux bath 3 adds scaling powder again, on tin pot 6 ward off tin again afterwards, and after tin being warded off
Chip be placed on chip retracting device 7 and reclaimed.
Compared with prior art, using design of the present invention, following technology can be reached
Effect：
Accurately control and ward off tin highly, uniformity is good；
Pin is difficult short circuit and deformation；
Operated without hand-held chip, do not influenceed by people's muscle power, warded off tin efficiency high；
The risk that people's hand contamination chip and static electricity on human body may bring can be avoided.
The above is only the preferred embodiment of the present invention, it is noted that led for this technology
For the those of ordinary skill in domain, on the premise of the technology of the present invention principle is not departed from, can be with
Some improvement and deformation are made, these are improved and deformation also should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of chip automatic tin coating device, it is characterised in that including：Four axles ward off tin work
Platform, chip positioning device, flux bath, at least tin pot and control device；The chip
Positioning tool is used to for chip to be placed in chip positioning frock, to determine the center of chip；
The control device is used for the center according to chip, controls four axle to ward off the dynamic of tin workbench
Make；At least tin pot to chip for carrying out warding off tin；The flux bath is used to give chip addition
Scaling powder.
2. chip automatic tin coating device as claimed in claim 1, it is characterised in that control
Cabinet processed according to the size of the center computing chip of chip, and according to the size of chip,
Control vacuum chuck device by add scaling powder chip pin need immersion tin pot and
The depth of flux bath.
3. chip automatic tin coating device as claimed in claim 1, it is characterised in that also
Including control arm, for control chip the chip positioning device, the flux bath and
Moved between tin pot, and control chip ward off the angle of tin and addition scaling powder.
4. chip automatic tin coating device as claimed in claim 1, it is characterised in that also
Including vacuum chuck device, for control chip in the chip positioner, the scaling powder
Moved between groove, tin pot, and control chip ward off the angle of tin and addition scaling powder.
5. chip automatic tin coating device as claimed in claim 1, it is characterised in that also
Including chip retracting device, for being reclaimed after chip wards off tin.
6. chip automatic tin coating device as claimed in claim 1, it is characterised in that should
Chip positioning device, the flux bath and an at least tin pot integrated installation are in four axle
Ward off on tin workbench.
7. chip automatic tin coating device as claimed in claim 1, it is characterised in that should
Four axles ward off movement, upset, rotation and the positioning that tin workbench is capable of control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811190.XA CN106756704A (en) | 2015-11-20 | 2015-11-20 | Chip automatic tin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510811190.XA CN106756704A (en) | 2015-11-20 | 2015-11-20 | Chip automatic tin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106756704A true CN106756704A (en) | 2017-05-31 |
Family
ID=58885875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510811190.XA Pending CN106756704A (en) | 2015-11-20 | 2015-11-20 | Chip automatic tin coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106756704A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108754380A (en) * | 2018-06-15 | 2018-11-06 | 德阳帛汉电子有限公司 | A kind of tin plating method and automatic tinning stack |
| CN113634843A (en) * | 2021-08-12 | 2021-11-12 | 四川航天燎原科技有限公司 | Automatic tin-coating equipment and method for through-hole component |
| CN114769770A (en) * | 2022-04-11 | 2022-07-22 | 北京计算机技术及应用研究所 | Welding cup tin coating method based on laser heating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1792937A (en) * | 2005-11-30 | 2006-06-28 | 哈尔滨工业大学 | Automatic bonding machine for MEMS high temp. pressure sensor |
| CN201459225U (en) * | 2009-05-21 | 2010-05-12 | 北京航天光华电子技术有限公司 | Automatic tin coating machine |
| CN204143479U (en) * | 2014-09-24 | 2015-02-04 | 广东曙光自动化设备股份有限公司 | Intelligent card chip antenna immersion tin device |
-
2015
- 2015-11-20 CN CN201510811190.XA patent/CN106756704A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1792937A (en) * | 2005-11-30 | 2006-06-28 | 哈尔滨工业大学 | Automatic bonding machine for MEMS high temp. pressure sensor |
| CN201459225U (en) * | 2009-05-21 | 2010-05-12 | 北京航天光华电子技术有限公司 | Automatic tin coating machine |
| CN204143479U (en) * | 2014-09-24 | 2015-02-04 | 广东曙光自动化设备股份有限公司 | Intelligent card chip antenna immersion tin device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108754380A (en) * | 2018-06-15 | 2018-11-06 | 德阳帛汉电子有限公司 | A kind of tin plating method and automatic tinning stack |
| CN113634843A (en) * | 2021-08-12 | 2021-11-12 | 四川航天燎原科技有限公司 | Automatic tin-coating equipment and method for through-hole component |
| CN114769770A (en) * | 2022-04-11 | 2022-07-22 | 北京计算机技术及应用研究所 | Welding cup tin coating method based on laser heating |
| CN114769770B (en) * | 2022-04-11 | 2024-04-05 | 北京计算机技术及应用研究所 | Welding cup tin coating method based on laser heating |
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Application publication date: 20170531 |
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