CN106753226B - A kind of microelectronic chip assembling sealant - Google Patents
A kind of microelectronic chip assembling sealant Download PDFInfo
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- CN106753226B CN106753226B CN201611082923.1A CN201611082923A CN106753226B CN 106753226 B CN106753226 B CN 106753226B CN 201611082923 A CN201611082923 A CN 201611082923A CN 106753226 B CN106753226 B CN 106753226B
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 23
- 239000000565 sealant Substances 0.000 title claims abstract description 22
- 239000000843 powder Substances 0.000 claims abstract description 99
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 claims abstract description 30
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000002253 acid Substances 0.000 claims abstract description 29
- UBJVUCKUDDKUJF-UHFFFAOYSA-N Diallyl sulfide Chemical compound C=CCSCC=C UBJVUCKUDDKUJF-UHFFFAOYSA-N 0.000 claims abstract description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229960000892 attapulgite Drugs 0.000 claims abstract description 20
- 125000001246 bromo group Chemical group Br* 0.000 claims abstract description 20
- 150000002148 esters Chemical class 0.000 claims abstract description 20
- 239000003595 mist Substances 0.000 claims abstract description 20
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 20
- 229920001470 polyketone Polymers 0.000 claims abstract description 19
- -1 nano zine oxide Chemical compound 0.000 claims abstract description 18
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims abstract description 15
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920003180 amino resin Polymers 0.000 claims abstract description 15
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims abstract description 15
- 125000006226 butoxyethyl group Chemical group 0.000 claims abstract description 15
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims abstract description 15
- 229940075507 glyceryl monostearate Drugs 0.000 claims abstract description 15
- 230000036571 hydration Effects 0.000 claims abstract description 15
- 238000006703 hydration reaction Methods 0.000 claims abstract description 15
- 239000004292 methyl p-hydroxybenzoate Substances 0.000 claims abstract description 15
- 235000010270 methyl p-hydroxybenzoate Nutrition 0.000 claims abstract description 15
- LXCFILQKKLGQFO-UHFFFAOYSA-N methylparaben Chemical compound COC(=O)C1=CC=C(O)C=C1 LXCFILQKKLGQFO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000001788 mono and diglycerides of fatty acids Substances 0.000 claims abstract description 15
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 15
- 239000004945 silicone rubber Substances 0.000 claims abstract description 15
- 239000011734 sodium Substances 0.000 claims abstract description 15
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 15
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003921 oil Substances 0.000 claims abstract description 14
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004288 Sodium dehydroacetate Substances 0.000 claims abstract description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004359 castor oil Substances 0.000 claims abstract description 13
- 235000019438 castor oil Nutrition 0.000 claims abstract description 13
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims abstract description 13
- 229940079839 sodium dehydroacetate Drugs 0.000 claims abstract description 13
- 235000019259 sodium dehydroacetate Nutrition 0.000 claims abstract description 13
- DSOWAKKSGYUMTF-GZOLSCHFSA-M sodium;(1e)-1-(6-methyl-2,4-dioxopyran-3-ylidene)ethanolate Chemical compound [Na+].C\C([O-])=C1/C(=O)OC(C)=CC1=O DSOWAKKSGYUMTF-GZOLSCHFSA-M 0.000 claims abstract description 13
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims abstract description 10
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims abstract description 10
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229940070527 tourmaline Drugs 0.000 claims abstract description 10
- 229910052613 tourmaline Inorganic materials 0.000 claims abstract description 10
- 239000011032 tourmaline Substances 0.000 claims abstract description 10
- 229910052582 BN Inorganic materials 0.000 claims abstract description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 9
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 claims abstract description 9
- 229960004419 dimethyl fumarate Drugs 0.000 claims abstract description 9
- 229920003063 hydroxymethyl cellulose Polymers 0.000 claims abstract description 9
- 229940031574 hydroxymethyl cellulose Drugs 0.000 claims abstract description 9
- 239000005033 polyvinylidene chloride Substances 0.000 claims abstract description 8
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims abstract description 7
- 238000003756 stirring Methods 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000010792 warming Methods 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 15
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 5
- 229920002678 cellulose Polymers 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 1
- 239000004327 boric acid Substances 0.000 claims 1
- 238000006356 dehydrogenation reaction Methods 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 239000001632 sodium acetate Substances 0.000 claims 1
- 235000017281 sodium acetate Nutrition 0.000 claims 1
- 150000003568 thioethers Chemical class 0.000 claims 1
- 229960001777 castor oil Drugs 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 30
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 12
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 12
- 235000019198 oils Nutrition 0.000 description 11
- 239000000047 product Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 6
- 239000010426 asphalt Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 6
- 229960001826 dimethylphthalate Drugs 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 239000001294 propane Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 229920000609 methyl cellulose Polymers 0.000 description 4
- 239000001923 methylcellulose Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- YIOCQGHBBNGBND-UHFFFAOYSA-N sodium;3-acetyl-6-methylpyran-3-ide-2,4-dione Chemical compound [Na+].CC(=O)[C-]1C(=O)C=C(C)OC1=O YIOCQGHBBNGBND-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of microelectronic chips to assemble sealant, it is composed of the following components: polyvinylidene chloride, polyketone resin, Amino resin, heat vulcanized silicone rubber, bromo propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, pentyl acetate, methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite powder, white fused alumina micro mist, cupric oxalate, boron nitride powder, tourmaline powder, Zirconium dioxide powder, titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, tricresyl phosphate (butoxyethyl group) ester, triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, hydroxymethyl cellulose, castor oil.Product of the present invention has good press flow viscosity, shore hardness, shear strength, elongation at break, tensile strength, and pressure-resistant stopping property is high, has excellent performance, and improves properties of product.
Description
Technical field
The present invention relates to a kind of microelectronic chips to assemble sealant, belongs to microelectronic chip package technique field.
Background technique
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Microelectric technique include system circuit design, device physics, technology, material preparation, automatic test and encapsulation,
A series of special technologies, the microelectric techniques such as assembling are the summations of every technology in microelectronics.Microelectronic chip
In installation process, it is necessary to be sealed using suitable mode, it is therefore desirable to use suitable sealant.
Summary of the invention
The purpose of the present invention is to provide a kind of microelectronic chips to assemble sealant, so that microelectronic chip is better achieved
The use function of assembling sealant makes product have preferable performance, improves product service performance.
To achieve the goals above, technical scheme is as follows.
A kind of microelectronic chip assembling sealant, is grouped as: polyvinylidene chloride 30~34 by the group of following mass fraction
Part, 28~32 parts of polyketone resin, 28~32 parts of Amino resin, 26~30 parts of heat vulcanized silicone rubber, bromo diphenylol third
28~32 parts of alkane epoxy resin, 28~32 parts of ready denier oil acid, 26~30 parts of N-Methyl pyrrolidone, allyl sulphide 28~
32 parts, 28~32 parts of ethyl propionate, 26~30 parts of pentyl acetate, 26~30 parts of methyl p-hydroxybenzoate, sodium dehydroacetate 26
~30 parts, 28~32 parts of dodecyl ethyoxyl sulfobetaines, 26~30 parts of dimethyl fumarate, attapulgite powder 24~
28 parts, 28~32 parts of white fused alumina micro mist, 26~30 parts of cupric oxalate, 24~28 parts of boron nitride powder, 26~30 parts of tourmaline powder, two
24~28 parts of Zirconium oxide powder, 24~28 parts of titania powder, 24~28 parts of tetrabutyl titanate, hydration zinc borate 22~26
Part, 18~22 parts of nano zine oxide, 16~20 parts of tricresyl phosphate (butoxyethyl group) ester, 16~20 parts of triphenyl phosphate, alkyl sulphur
16~20 parts of sour sodium, 16~20 parts of cocinic acid, 16~20 parts of glyceryl monostearate, 16~20 parts of hydroxymethyl cellulose, castor
100~200 parts of sesame oil.
Further, above-mentioned microelectronic chip assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
30 parts of alkene, 28 parts of polyketone resin, 28 parts of Amino resin, 26 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
28 parts of rouge, 28 parts of ready denier oil acid, 26 parts of N-Methyl pyrrolidone, 28 parts of allyl sulphide, 28 parts of ethyl propionate, acetic acid penta
26 parts of ester, 26 parts of methyl p-hydroxybenzoate, 26 parts of sodium dehydroacetate, 28 parts of dodecyl ethyoxyl sulfobetaines, rich horse
26 parts of dimethyl phthalate, 24 parts of attapulgite powder, 28 parts of white fused alumina micro mist, 26 parts of cupric oxalate, 24 parts of boron nitride powder, tourmaline
26 parts of powder, 24 parts of Zirconium dioxide powder, 24 parts of titania powder, 24 parts of tetrabutyl titanate, 22 parts of hydration zinc borate, nano oxygen
Change 18 parts of zinc, 16 parts of tricresyl phosphate (butoxyethyl group) ester, 16 parts of triphenyl phosphate, 16 parts of sodium alkyl sulfonate, 16 parts of cocinic acid,
16 parts of glyceryl monostearate, 16 parts of hydroxymethyl cellulose, 100 parts of castor oil.
Further, above-mentioned microelectronic chip assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
32 parts of alkene, 30 parts of polyketone resin, 30 parts of Amino resin, 28 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
30 parts of rouge, 30 parts of ready denier oil acid, 28 parts of N-Methyl pyrrolidone, 30 parts of allyl sulphide, 30 parts of ethyl propionate, acetic acid penta
28 parts of ester, 28 parts of methyl p-hydroxybenzoate, 28 parts of sodium dehydroacetate, 30 parts of dodecyl ethyoxyl sulfobetaines, rich horse
28 parts of dimethyl phthalate, 26 parts of attapulgite powder, 30 parts of white fused alumina micro mist, 28 parts of cupric oxalate, 26 parts of boron nitride powder, tourmaline
28 parts of powder, 26 parts of Zirconium dioxide powder, 26 parts of titania powder, 26 parts of tetrabutyl titanate, 24 parts of hydration zinc borate, nano oxygen
Change 20 parts of zinc, 18 parts of tricresyl phosphate (butoxyethyl group) ester, 18 parts of triphenyl phosphate, 18 parts of sodium alkyl sulfonate, 18 parts of cocinic acid,
18 parts of glyceryl monostearate, 18 parts of hydroxymethyl cellulose, 150 parts of castor oil.
Further, above-mentioned microelectronic chip assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
34 parts of alkene, 32 parts of polyketone resin, 32 parts of Amino resin, 30 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
32 parts of rouge, 32 parts of ready denier oil acid, 30 parts of N-Methyl pyrrolidone, 32 parts of allyl sulphide, 32 parts of ethyl propionate, acetic acid penta
30 parts of ester, 30 parts of methyl p-hydroxybenzoate, 30 parts of sodium dehydroacetate, 32 parts of dodecyl ethyoxyl sulfobetaines, rich horse
30 parts of dimethyl phthalate, 28 parts of attapulgite powder, 32 parts of white fused alumina micro mist, 30 parts of cupric oxalate, 28 parts of boron nitride powder, tourmaline
30 parts of powder, 28 parts of Zirconium dioxide powder, 28 parts of titania powder, 28 parts of tetrabutyl titanate, 26 parts of hydration zinc borate, nano oxygen
Change 22 parts of zinc, 20 parts of tricresyl phosphate (butoxyethyl group) ester, 20 parts of triphenyl phosphate, 20 parts of sodium alkyl sulfonate, 20 parts of cocinic acid,
20 parts of glyceryl monostearate, 20 parts of hydroxymethyl cellulose, 200 parts of castor oil.
Further, the white fused alumina micro mist is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30~
50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 3~12:4~8:1.
Further, the Zirconium dioxide powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30
~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 3~9:2~8:1.
Further, the viscosity of the bromo propanepoxy resin is 120~160mpa.s at 25 DEG C.
Further, the attapulgite powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 20
~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 2~8:3~9:1.
Further, the viscosity of the polyketone resin is 80~120mpa.s at 25 DEG C.
Further, steps are as follows for above-mentioned microelectronic chip assembling sealant preparation method:
(1) by the polyvinylidene chloride of the mass fraction, polyketone resin, Amino resin, heat vulcanized silicone rubber,
Bromo propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, acetic acid penta
Ester, methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite
Powder, white fused alumina micro mist are added in the castor oil of above-mentioned mass fraction, from room temperature with 2~5 DEG C of the speed of heating up per hour, side
Stirring side is warming up to 60~90 DEG C, stirs evenly, and is then let cool to room temperature in a manner of 4~10 DEG C, is mixed by cooling down per hour
Close object A；
(2) titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, the phosphorus of the mass fraction is added
Sour three (butoxyethyl group) esters, from room temperature with 5~8 DEG C of the speed of heating up per hour, warming while stirring to 80~90 DEG C, and
80~90 DEG C of 1~3h of holding, cooled to room temperature obtain mixture B；
(3) triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, the hydroxyl of the mass fraction is added
Methylcellulose, from room temperature with 8~10 DEG C of the speed of heating up per hour, warming while stirring is to 70~90 DEG C, in stirring
Under in 70~90 DEG C of 1~3h of holding, cooled to room temperature obtains mixture C；
(4) remaining ingredient of above-mentioned mass fraction is added in mixture C, is the true of -0.06~-0.1Mpa in vacuum degree
Under empty condition, from room temperature with 1~3 DEG C of the speed of heating up per hour, warming while stirring is stirred evenly to 50~70 DEG C, cooling
To room temperature, this product is obtained.
Invention has the beneficial effects that: the microelectronic chip in the present invention assembles sealant, composed of the following components: poly-
Vinylidene chloride, polyketone resin, Amino resin, heat vulcanized silicone rubber, bromo propanepoxy resin, tall oil
Fatty acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, pentyl acetate, methyl p-hydroxybenzoate, dehydroacetic acid
Sodium, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite powder, white fused alumina micro mist, cupric oxalate, nitridation
Boron powder, tourmaline powder, Zirconium dioxide powder, titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, phosphorus
Sour three (butoxyethyl group) esters, triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, hydroxylmethyl cellulose
Element.Process of preparing of the present invention is simple, and prepared product has good press flow viscosity, shore hardness, shear strength, breaks
Elongation, tensile strength are split, pressure-resistant stopping property is high, has excellent performance, and it is suitble to use in multiple fields, improves properties of product,
It processes easy to use.
Specific embodiment
A specific embodiment of the invention is described below with reference to embodiment, to better understand the present invention.
Embodiment 1
Microelectronic chip in the present embodiment assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
30 parts of alkene, 28 parts of polyketone resin, 28 parts of Amino resin, 26 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
28 parts of rouge, 28 parts of ready denier oil acid, 26 parts of N-Methyl pyrrolidone, 28 parts of allyl sulphide, 28 parts of ethyl propionate, acetic acid penta
26 parts of ester, 26 parts of methyl p-hydroxybenzoate, 26 parts of sodium dehydroacetate, 28 parts of dodecyl ethyoxyl sulfobetaines, rich horse
26 parts of dimethyl phthalate, 24 parts of attapulgite powder, 28 parts of white fused alumina micro mist, 26 parts of cupric oxalate, 24 parts of boron nitride powder, tourmaline
26 parts of powder, 24 parts of Zirconium dioxide powder, 24 parts of titania powder, 24 parts of tetrabutyl titanate, 22 parts of hydration zinc borate, nano oxygen
Change 18 parts of zinc, 16 parts of tricresyl phosphate (butoxyethyl group) ester, 16 parts of triphenyl phosphate, 16 parts of sodium alkyl sulfonate, 16 parts of cocinic acid,
16 parts of glyceryl monostearate, 16 parts of hydroxymethyl cellulose, 100 parts of castor oil.
The white fused alumina micro mist is made of the powder of three kinds of partial size mesh numbers, partial size mesh number be respectively 30~50 mesh, 50~
80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 3:4:1.
The Zirconium dioxide powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30~50 mesh, 50
~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 3:2:1.
The viscosity of the bromo propanepoxy resin is 120mpa.s at 25 DEG C.
The attapulgite powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 20~50 mesh, 50
~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 2:3:1.
The viscosity of the polyketone resin is 80mpa.s at 25 DEG C.
Steps are as follows for above-mentioned microelectronic chip assembling sealant preparation method:
(1) by the polyvinylidene chloride of the mass fraction, polyketone resin, Amino resin, heat vulcanized silicone rubber,
Bromo propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, acetic acid penta
Ester, methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite
Powder, white fused alumina micro mist are added in the castor oil of above-mentioned mass fraction, from room temperature with 2 DEG C of the speed of heating up per hour, while stirring
It mixes side and is warming up to 60 DEG C, stir evenly, then let cool to room temperature in a manner of 4 DEG C by cooling down per hour, obtain mixture A；
(2) titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, the phosphorus of the mass fraction is added
Sour three (butoxyethyl group) esters, from room temperature with 5 DEG C of the speed of heating up per hour, warming while stirring is protected to 80 DEG C, and at 80 DEG C
3h is held, cooled to room temperature obtains mixture B；
(3) triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, the hydroxyl of the mass fraction is added
Methylcellulose, from room temperature with 8 DEG C of the speed of heating up per hour, warming while stirring is to 70 DEG C, in 70 DEG C under stirring
3h is kept, cooled to room temperature obtains mixture C；
(4) remaining ingredient of above-mentioned mass fraction is added in mixture C, in the vacuum condition that vacuum degree is -0.06Mpa
Under, from room temperature with 1 DEG C of the speed of heating up per hour, warming while stirring is stirred evenly, is cooled to room temperature to 50 DEG C, obtains this
Product.
Embodiment 2
Microelectronic chip in the present embodiment assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
32 parts of alkene, 30 parts of polyketone resin, 30 parts of Amino resin, 28 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
30 parts of rouge, 30 parts of ready denier oil acid, 28 parts of N-Methyl pyrrolidone, 30 parts of allyl sulphide, 30 parts of ethyl propionate, acetic acid penta
28 parts of ester, 28 parts of methyl p-hydroxybenzoate, 28 parts of sodium dehydroacetate, 30 parts of dodecyl ethyoxyl sulfobetaines, rich horse
28 parts of dimethyl phthalate, 26 parts of attapulgite powder, 30 parts of white fused alumina micro mist, 28 parts of cupric oxalate, 26 parts of boron nitride powder, tourmaline
28 parts of powder, 26 parts of Zirconium dioxide powder, 26 parts of titania powder, 26 parts of tetrabutyl titanate, 24 parts of hydration zinc borate, nano oxygen
Change 20 parts of zinc, 18 parts of tricresyl phosphate (butoxyethyl group) ester, 18 parts of triphenyl phosphate, 18 parts of sodium alkyl sulfonate, 18 parts of cocinic acid,
18 parts of glyceryl monostearate, 18 parts of hydroxymethyl cellulose, 150 parts of castor oil.
The white fused alumina micro mist is made of the powder of three kinds of partial size mesh numbers, partial size mesh number be respectively 30~50 mesh, 50~
80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 8:6:1.
The Zirconium dioxide powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30~50 mesh, 50
~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 6:5:1.
The viscosity of the bromo propanepoxy resin is 140mpa.s at 25 DEG C.
The attapulgite powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 20~50 mesh, 50
~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 5:6:1.
The viscosity of the polyketone resin is 100mpa.s at 25 DEG C.
Steps are as follows for above-mentioned microelectronic chip assembling sealant preparation method:
(1) by the polyvinylidene chloride of the mass fraction, polyketone resin, Amino resin, heat vulcanized silicone rubber,
Bromo propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, acetic acid penta
Ester, methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite
Powder, white fused alumina micro mist are added in the castor oil of above-mentioned mass fraction, from room temperature with 3 DEG C of the speed of heating up per hour, while stirring
It mixes side and is warming up to 75 DEG C, stir evenly, then let cool to room temperature in a manner of 7 DEG C by cooling down per hour, obtain mixture A；
(2) titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, the phosphorus of the mass fraction is added
Sour three (butoxyethyl group) esters, from room temperature with 6 DEG C of the speed of heating up per hour, warming while stirring is protected to 85 DEG C, and at 85 DEG C
2h is held, cooled to room temperature obtains mixture B；
(3) triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, the hydroxyl of the mass fraction is added
Methylcellulose, from room temperature with 9 DEG C of the speed of heating up per hour, warming while stirring is to 80 DEG C, in 80 DEG C under stirring
2h is kept, cooled to room temperature obtains mixture C；
(4) remaining ingredient of above-mentioned mass fraction is added in mixture C, in the vacuum condition that vacuum degree is -0.08Mpa
Under, from room temperature with 2 DEG C of the speed of heating up per hour, warming while stirring is stirred evenly, is cooled to room temperature to 60 DEG C, obtains this
Product.
Embodiment 3
Microelectronic chip in the present embodiment assembles sealant, is grouped as by the group of following mass fraction: gathering inclined two chloroethene
34 parts of alkene, 32 parts of polyketone resin, 32 parts of Amino resin, 30 parts of heat vulcanized silicone rubber, bromo diphenol propane asphalt mixtures modified by epoxy resin
32 parts of rouge, 32 parts of ready denier oil acid, 30 parts of N-Methyl pyrrolidone, 32 parts of allyl sulphide, 32 parts of ethyl propionate, acetic acid penta
30 parts of ester, 30 parts of methyl p-hydroxybenzoate, 30 parts of sodium dehydroacetate, 32 parts of dodecyl ethyoxyl sulfobetaines, rich horse
30 parts of dimethyl phthalate, 28 parts of attapulgite powder, 32 parts of white fused alumina micro mist, 30 parts of cupric oxalate, 28 parts of boron nitride powder, tourmaline
30 parts of powder, 28 parts of Zirconium dioxide powder, 28 parts of titania powder, 28 parts of tetrabutyl titanate, 26 parts of hydration zinc borate, nano oxygen
Change 22 parts of zinc, 20 parts of tricresyl phosphate (butoxyethyl group) ester, 20 parts of triphenyl phosphate, 20 parts of sodium alkyl sulfonate, 20 parts of cocinic acid,
20 parts of glyceryl monostearate, 20 parts of hydroxymethyl cellulose, 200 parts of castor oil.
The white fused alumina micro mist is made of the powder of three kinds of partial size mesh numbers, partial size mesh number be respectively 30~50 mesh, 50~
80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 12:8:1.
The Zirconium dioxide powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30~50 mesh, 50
~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 9:8:1.
The viscosity of the bromo propanepoxy resin is 160mpa.s at 25 DEG C.
The attapulgite powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 20~50 mesh, 50
~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powders are 8:9:1.
The viscosity of the polyketone resin is 120mpa.s at 25 DEG C.
Steps are as follows for above-mentioned microelectronic chip assembling sealant preparation method:
(1) by the polyvinylidene chloride of the mass fraction, polyketone resin, Amino resin, heat vulcanized silicone rubber,
Bromo propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, acetic acid penta
Ester, methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite
Powder, white fused alumina micro mist are added in the castor oil of above-mentioned mass fraction, from room temperature with 5 DEG C of the speed of heating up per hour, while stirring
It mixes side and is warming up to 90 DEG C, stir evenly, then let cool to room temperature in a manner of 10 DEG C by cooling down per hour, obtain mixture A；
(2) titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, the phosphorus of the mass fraction is added
Sour three (butoxyethyl group) esters, from room temperature with 8 DEG C of the speed of heating up per hour, warming while stirring is protected to 90 DEG C, and at 90 DEG C
1h is held, cooled to room temperature obtains mixture B；
(3) triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, the hydroxyl of the mass fraction is added
Methylcellulose, from room temperature with 10 DEG C of the speed of heating up per hour, warming while stirring is to 90 DEG C, in 90 DEG C under stirring
1~3h is kept, cooled to room temperature obtains mixture C；
(4) remaining ingredient of above-mentioned mass fraction is added in mixture C, in the vacuum condition that vacuum degree is -0.1Mpa
Under, from room temperature with 3 DEG C of the speed of heating up per hour, warming while stirring is stirred evenly, is cooled to room temperature to 70 DEG C, obtains this
Product.
Embodiment 1, embodiment 2 and embodiment 3 and certain commercial product are tested for the property as a control group, as a result such as
Under:
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Control group | |
| Press flow viscosity/s | 77 | 80 | 79 | 50 |
| Density/kgm-3 | 1.4×103 | 1.1×103 | 1.2×103 | 1.1×103 |
| Solid content/% | 94 | 95 | 96 | 82 |
| Surface drying time/min | 5 | 6 | 5 | 10 |
| Shore hardness A type/HA | 38 | 35 | 40 | 25 |
| Shear strength/MPa | 2.5 | 2.4 | 2.7 | 1.8 |
| Elongation at break/% | 450 | 430 | 440 | 300 |
| Tensile strength/MPa | 2.4 | 2.3 | 2.4 | 1.5 |
| Pressure-resistant stopping property/bar | 0.44 | 0.55 | 0.45 | 0.11 |
From the result in upper table can be seen that sealant provided by the invention with good press flow viscosity, shore hardness,
Shear strength, elongation at break, tensile strength, pressure-resistant stopping property is high, has excellent performance.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (1)
1. a kind of microelectronic chip assembles sealant, it is characterised in that: be grouped as by the group of following mass fraction: gathering inclined two chloroethene
30~34 parts of alkene, 28~32 parts of polyketone resin, 28~32 parts of Amino resin, 26~30 parts of heat vulcanized silicone rubber, bromo
28~32 parts of propanepoxy resin, 28~32 parts of ready denier oil acid, 26~30 parts of N-Methyl pyrrolidone, allyl
28~32 parts of thioether, 28~32 parts of ethyl propionate, 26~30 parts of pentyl acetate, 26~30 parts of methyl p-hydroxybenzoate, dehydrogenation
26~30 parts of sodium acetate, 28~32 parts of dodecyl ethyoxyl sulfobetaines, 26~30 parts of dimethyl fumarate, attapulgite
24~28 parts of powder, 28~32 parts of white fused alumina micro mist, 26~30 parts of cupric oxalate, 24~28 parts of boron nitride powder, tourmaline powder 26
~30 parts, 24~28 parts of Zirconium dioxide powder, 24~28 parts of titania powder, 24~28 parts of tetrabutyl titanate, hydration boric acid
22~26 parts of zinc, 18~22 parts of nano zine oxide, 16~20 parts of tricresyl phosphate (butoxyethyl group) ester, triphenyl phosphate 16~20
Part, 16~20 parts of sodium alkyl sulfonate, 16~20 parts of cocinic acid, 16~20 parts of glyceryl monostearate, hydroxymethyl cellulose 16
~20 parts, 100~200 parts of castor oil；The white fused alumina micro mist is made of the powder of three kinds of partial size mesh numbers, partial size mesh number difference
For 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powders is 3~12:4~8:1；Described two
Zirconium oxide powder is made of the powder of three kinds of partial size mesh numbers, and partial size mesh number is respectively 30~50 mesh, 50~80 mesh, 80~100
Mesh, the mixing quality ratio of above-mentioned three kinds of powders are 3~9:2~8:1；The viscosity of the bromo propanepoxy resin exists
25 DEG C are 120~160mPa s；The attapulgite powder is made of the powder of three kinds of partial size mesh numbers, partial size mesh number point
Not Wei 20~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratios of above-mentioned three kinds of powders is 2~8:3~9:1；It is described poly-
The viscosity of ketone resin is 80~120mPa s at 25 DEG C；Steps are as follows for the microelectronic chip assembling sealant preparation method:
(1) by the polyvinylidene chloride of the mass fraction, polyketone resin, Amino resin, heat vulcanized silicone rubber, bromo
Propanepoxy resin, ready denier oil acid, N-Methyl pyrrolidone, allyl sulphide, ethyl propionate, pentyl acetate,
Methyl p-hydroxybenzoate, sodium dehydroacetate, dodecyl ethyoxyl sulfobetaines, dimethyl fumarate, attapulgite powder
End, white fused alumina micro mist are added in the castor oil of above-mentioned mass fraction, from room temperature with 2~5 DEG C of the speed of heating up per hour, while stirring
It mixes side and is warming up to 60~90 DEG C, stir evenly, then let cool to room temperature in a manner of 4~10 DEG C, mixed by cooling down per hour
Object A；
(2) titania powder, tetrabutyl titanate, hydration zinc borate, nano zine oxide, the tricresyl phosphate of the mass fraction is added
(butoxyethyl group) ester, from room temperature with 5~8 DEG C of the speed of heating up per hour, warming while stirring to 80~90 DEG C, and 80~
90 DEG C of 1~3h of holding, cooled to room temperature obtain mixture B；
(3) triphenyl phosphate, sodium alkyl sulfonate, cocinic acid, glyceryl monostearate, the methylol of the mass fraction is added
Cellulose, from room temperature with 8~10 DEG C of the speed of heating up per hour, warming while stirring to 70~90 DEG C, under stirring in
70~90 DEG C of 1~3h of holding, cooled to room temperature obtain mixture C；
(4) remaining ingredient of above-mentioned mass fraction is added in mixture C, in the vacuum that vacuum degree is -0.06~-0.1MP a
Under the conditions of, from room temperature with 1~3 DEG C of the speed of heating up per hour, warming while stirring is stirred evenly, is cooled to 50~70 DEG C
Room temperature obtains this product.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082923.1A CN106753226B (en) | 2016-11-30 | 2016-11-30 | A kind of microelectronic chip assembling sealant |
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|---|---|---|---|
| CN201611082923.1A CN106753226B (en) | 2016-11-30 | 2016-11-30 | A kind of microelectronic chip assembling sealant |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860923A (en) * | 2016-05-08 | 2016-08-17 | 王璐 | Sealant for electric power distribution cabinet |
| CN106047282A (en) * | 2016-05-31 | 2016-10-26 | 孟根森 | Sealant for computer network equipment installation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105860923A (en) * | 2016-05-08 | 2016-08-17 | 王璐 | Sealant for electric power distribution cabinet |
| CN106047282A (en) * | 2016-05-31 | 2016-10-26 | 孟根森 | Sealant for computer network equipment installation |
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