CN102838840A - Epoxy resin composition solution and preparation method thereof - Google Patents
Epoxy resin composition solution and preparation method thereof Download PDFInfo
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- CN102838840A CN102838840A CN2012103307898A CN201210330789A CN102838840A CN 102838840 A CN102838840 A CN 102838840A CN 2012103307898 A CN2012103307898 A CN 2012103307898A CN 201210330789 A CN201210330789 A CN 201210330789A CN 102838840 A CN102838840 A CN 102838840A
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Abstract
The invention discloses an epoxy resin composition solution in a B-step state. The homogeneous B-step state epoxy resin composition solution with a solid content of 10%-90% is synthesized by epoxy resin (A) and an epoxy hardener (B) by adopting an organic solvent through a solution polymerization process under protection of inert gases. A ratio of an equivalent weight of reactivity groups of the used epoxy hardener (B) and an equivalent weight of epoxy groups of the epoxy resin (A) is 0.1-3.0. The epoxy resin composition solution is good in stability, can serve as self-bonding paint and coating, tackiness agent, composite material soaking material and the like, and can be stored as long as 12 months at a condition of room temperature.
Description
Technical field
The present invention relates to the production field of composition epoxy resin, be specifically related to epoxy resin component solution that a kind of room temperature can B scalariform attitude of storing steady in a long-term and preparation method thereof
Background technology
The tackiness of epoxy resin, thermotolerance, wet fastness is good, and is therefore of many uses, and particularly the epoxy resin solution of B scalariform attitude is in the enameled wire manufacturing, tackiness agent, the fields such as impregnant of coating and matrix material all are widely used.But the epoxy resin component solution manufacturing method of traditional B scalariform attitude is first with Z type blade mixer, and equipment such as three-roller are the epoxy resin component of the solid-state B scalariform of reactor made attitude, are dissolved in the organic solvent and prepare; This method technological process is longer; The equipment input is bigger, and production process is difficult for stable control, and product stability is relatively poor; Reaction end is wayward, and lacks problems such as (being no more than 6 months under the room temperature condition usually) storage period.
Summary of the invention
The object of the present invention is to provide a kind of can steady in a long-termly the storage, and the B scalariform attitude epoxy resin component solution of the easy control of preparation condition and preparation method thereof.
That is, a kind of epoxy resin component solution is characterized by and comprises:
(A): epoxy resin;
(B): epoxy curing agent, the equivalent of reactive base that should (B) epoxy curing agent is 0.1～3.0 amount with respect to the normal ratio of the epoxy group(ing) of (A) epoxy resin;
(C): organic solvent, above-mentioned (A) and (B) be solvent with (C) under protection of inert gas, synthesized the epoxy resin component solution of solid content in 10%～90% B scalariform attitude through solution polymerization process.
The constituent solution of the invention described above can be stored so that B scalariform attitude is stable for a long time, and be more than 12 months the storage period under the room temperature condition.
Further scheme is:
(A)
Epoxy resin
The epoxy resin (A) that reaches described in the present invention can use well-known epoxy resin, comprises diphenylol propane epoxy resin, organic-silicon-modified diphenylol propane epoxy resin; Bromine modification diphenylol propane epoxy resin, chlorine modification diphenylol propane epoxy resin, diphenylol propane side chain type epoxy resin, the many epoxy resin of phenolic aldehyde; Glycerol epoxy resin, fatty acid glycerine ester epoxy resin, alicyclic Racemic glycidol fat, epoxy silicone; Four phenolic group epoxy resin, resorcinol type epoxy, tricyanic epoxy resin, bicyclopentadiene dioxide expoxy resin; Vinyl cyclohexene dioxide epoxy resin, polybutadiene epoxy resin, titanium dioxide double cyclopentenyl ether resin, biphenyl type epoxy resin; The phenol aralkyl-type epoxy resin, naphthalene type epoxy resin contains amino-type epoxy resin; The line style aliphatic epoxy resin, cycloaliphatic epoxy resin, a kind of in the Racemic glycidol ether type epoxy or their mixture etc.Wherein be preferably bisphenol A-type and bisphenol f type epoxy resin.
(B)
Epoxy curing agent
Described in the present invention and epoxy curing agent (B), comprise Dyhard RU 100 class solidifying agent, PHB, bismaleimides, aromatic amine curing agent (mphenylenediamine for example; M-xylene diamine, 4,4 '-diaminodiphenyl-methane, 4,4 '-diamino diphenyl sulfone; 4,4 '-diaminodiphenyl oxide, 4,4 '-N, N '-dimethylamino ditane; 6,6 '-two chloro-4,4 '-diaminodiphenyl-methane, 5,5 '-dimethyl--4; 4 '-diaminodiphenyl-methane, benzene dimethylamine, m-aminophenyl methylamine etc.), can use separately or also can mix and use two kinds or these two or more epoxy curing agents.Among the present invention; When adding (B) epoxy hardener, (A) epoxy resin and (B) adding proportion of epoxy hardener, comparatively ideal is to be expressed as 0.1≤(solidifying agent)/(epoxy resin)≤3.0 with the equivalent of the epoxy group(ing) in (A) and the equivalence ratio of the reactive base in the solidifying agent; Better is 0.8≤(solidifying agent)/(epoxy resin)≤1.25; Equivalence ratio has a part of unreacted not in above-mentioned scope the time, can cause product performance to break down.
(C)
Organic solvent
The present invention adopts organic solvent (C), has synthesized the epoxy resin component solution of B scalariform attitude through solution polymerization process, described in the present invention and organic solvent (C) comprise arene (benzene for example, toluene; YLENE etc.), ester is organic solvent (for example ETHYLE ACETATE, N-BUTYL ACETATE etc.); Alcohol is organic solvent (for example Virahol, butanols, terepthaloyl moietie etc.); Ether is organic solvent (for example ethylene glycol ethyl ether, butyl glycol ether, propylene glycol monomethyl ether etc.); Ketone is organic solvent (for example butanone, acetone, pimelinketone etc.); Amides organic solvent (for example N) can use separately or also can mix and use two kinds or these two or more organic solvents, and its usage quantity is with respect to total 100 mass parts of above-mentioned (A)～(B); Can be according to the needs of product end-use, addition is 10 mass parts～900 mass parts, better is 30 mass parts～300 mass parts.
Other compositions
Except that above-mentioned each composition, add additive in constituent solution of the present invention with the amount of not damaging the object of the invention, additive comprises: epoxide resin reactive diluent, epoxide resin reactive toughner, mineral filler, silane coupling agent, tinting material etc.
Above-mentioned epoxide resin reactive diluent comprises single epoxy group(ing) reactive thinner (for example propylene oxide, glycidyl allyl ether etc.), many epoxy group(ing) reactive thinner (diglycidylether for example; The divinyl bis-epoxy; Bicyclopentadiene dioxide etc.), triphenyl phosphite and r-GBL etc., these epoxide resin reactive diluents can use a kind of separately; Two kinds or two or more uses also capable of being combined; Can be according to the needs of product end-use, its usage quantity is with respect to total 100 mass parts of above-mentioned (A)～(B), and addition is 0 mass parts～40 mass parts.
Above-mentioned epoxide resin reactive toughner comprises epoxy compounds class endurable active toughener (for example epoxy glycerite lipid, epoxy fatty acid monoester class etc.), viton class endurable active toughener (thiorubber for example; The paracril class, X 050, urethanes; Chlorosulfonated polyethylene rubber etc.), polyamide resin lipid endurable active toughener (for example low-molecular-weight polyamide resin, modified polyamide resin etc.); Polyester resin endurable active toughener (for example W 166 ethers, polyglycerol ethers etc.), these epoxide resin reactive toughner can use a kind of separately; Two kinds or two or more uses also capable of being combined; Can be according to the needs of product end-use, its usage quantity is with respect to total 100 mass parts of above-mentioned (A)～(B), and addition is 0 mass parts～50 mass parts.
Above-mentioned mineral filler can be used well-known mineral filler, for example: silicon dioxide powder, aluminum oxide; White titanium pigment; Talcum powder etc., these fillers can use a kind of separately or make up two kinds or two or more uses, can be according to the needs of product end-use; Its usage quantity is with respect to total 100 mass parts of above-mentioned (A)～(B), and addition is 0 mass parts～80 mass parts.
The preparation of composition solution
One of preparation method of B scalariform attitude epoxy resin component solution of the present invention comprises the steps:
At normal temperatures organic solvent (C) is added reaction kettle, logical protection of inert gas adds epoxy resin (A) and epoxy hardener (B) under whipped state; Also can add above-mentioned other compositions (except the mineral filler) as additive according to the final performance need of product, under refluxad begin then to heat up, the control stirring velocity is at 80rpm～600rpm; Temperature rise rate in 0.5 ℃/min～5 ℃/min, better is in 1.5 ℃/min～3 ℃/min, makes still internal reaction temperature of charge rise to 50 ℃～180 ℃; Better is to rise to 80 ℃～130 ℃, and keeps this temperature and continue reaction 0.5 hour～12 hours, and better is 5～10 hours; After reaction 0.5 hour, whenever detect at a distance from sampling in 10～20 minutes, one of detection method can be poured sample solution in the xylene solvent into; Stirring is left standstill the back if the layering turbid phenomenon occurs, shows that then this reaction has arrived B scalariform attitude, and other detection method can adopt the viscosity of viscosity apparatus specimen solution; Occur uprushing if compare with initial sample viscosity, then this reaction of explanation has arrived B scalariform attitude, then reactant is cooled to below 50 ℃; According to the requirement of product final properties, also can further add the organic solvent that chooses kind and consumption, also can further add the mineral filler that chooses type and consumption; Afterwards; Stir, the finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
The preparation method of the another kind of preferred B scalariform attitude epoxy resin component solution of the present invention comprises the steps:
At normal temperatures organic solvent (C) is added reaction kettle, logical protection of inert gas adds epoxy resin (A) under whipped state; Also can add above-mentioned other compositions (except the mineral filler) as additive according to the final performance need of product, under refluxad begin then to heat up, the control stirring velocity is at 80rpm～600rpm; Still internal reaction temperature of charge rises to 50 ℃～180 ℃, and better is when rising to 80 ℃～130 ℃, adopts the sealing apparatus for feeding afterwards; Epoxy hardener (B) with solid form, perhaps to be mixed with the organic solution form, more or with the form that is mixed with organic suspension liquid is fed in raw material in the reaction kettle; And keep this temperature and continue reaction 0.5 hour～12 hours, better is 5～10 hours, after reaction 0.5 hour; Whenever detect at a distance from sampling in 10～20 minutes, one of detection method can be poured sample solution in the xylene solvent into, stirs to leave standstill the back if the layering turbid phenomenon occurs; Show that then this reaction has arrived B scalariform attitude, other detection method can adopt the viscosity of viscosity apparatus specimen solution, occurs uprushing if compare with initial sample viscosity; Then this reaction of explanation has arrived B scalariform attitude, then reactant is cooled to below 50 ℃, according to the requirement of product final properties; Also can further add the organic solvent that chooses kind and consumption; Also can further add the mineral filler that chooses type and consumption, afterwards, stir; The finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
The preparation method of the another kind of preferred B scalariform attitude epoxy resin component solution of the present invention comprises the steps:
Earlier part organic solvent (C) is joined with epoxy resin (A) at normal temperatures and mixes in the stirring tank, lead to protection of inert gas, be no more than under the condition of temperature of reaction afterwards, be mixed with the solution of the epoxy resin (A) of homogeneous system at reflux conditions and in temperature; In addition, at normal temperatures other part organic solvent (C) is added in the reaction kettle, under whipped state, add epoxy hardener (B) again; Also can add above-mentioned other compositions (except the mineral filler) as additive according to the final performance need of product, logical protection of inert gas under refluxad begins to heat up then; The control stirring velocity is at 80rpm～600rpm, and still internal reaction temperature of charge rises to 50 ℃～180 ℃, and better is when rising to 80 ℃～130 ℃; Adopt the sealing apparatus for feeding afterwards, with before mix epoxy resin (A) solution for preparing in the stirring tank and feed in raw material in the reaction kettle, and keep this temperature and continue reaction 0.5 hour～12 hours; Better is 5～10 hours, after reaction 0.5 hour, whenever detects at a distance from sampling in 10～20 minutes; One of detection method can be poured sample solution in the xylene solvent into, stirs to leave standstill the back if the layering turbid phenomenon occurs, shows that then this reaction has arrived B scalariform attitude; Other detection method can adopt the viscosity of viscosity apparatus specimen solution, occurs uprushing if compare with initial sample viscosity, and then this reaction of explanation has arrived B scalariform attitude; Then reactant is cooled to below 50 ℃,, also can further adds the organic solvent that chooses kind and consumption according to the requirement of product final properties; Also can further add the mineral filler that chooses type and consumption, afterwards, stir; The finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
Above-mentioned said being:
(a1), a kind of composition epoxy resin solution, be epoxy resin and epoxy curing agent in the reaction kettle of inert gas environment, be dissolved in organic solvent Hybrid Heating reaction evenly the solid content that forms of back be 10%～90% B scalariform attitude composition epoxy resin solution; The reactive base of used epoxy curing agent is 0.1～3.0 with the equivalence ratio of the epoxy group(ing) of epoxy resin.
(a2), like (a1) described composition epoxy resin solution: the mass ratio of the total addition level of said epoxy resin and epoxy curing agent and organic solvent addition is 1:0.1～1:0.9.
(a3), like (a1) or (a2) described composition epoxy resin solution: described epoxy curing agent is that in Dyhard RU 100 class solidifying agent, aromatic amine curing agent, PHB, the bismaleimides one or more mix and constitute.
(a4), like (a3) described composition epoxy resin solution: said organic solvent is that one or more mixing in aromatic hydrocarbon solvent, ester series solvent, pure series solvent, ether series solvent, ketone series solvent, the amide solvent constitute, and the mass ratio of the total addition level of said epoxy resin and epoxy curing agent and organic solvent addition is 1:0.3～1:0.6.
(a5), like (a1) described composition epoxy resin solution: after said epoxy resin, epoxy curing agent and organic solvent mix; Reflux conditions control temperature of reaction kettle down is 50 ℃～180 ℃; Reaction 0.5～12h; And then be cooled to below 50 ℃, can obtain B scalariform attitude composition epoxy resin solution.
(a6), like (a1) or (a5) described composition epoxy resin solution: earlier organic solvent is added reaction kettle; Under logical inert gas environment; Stir and add epoxy resin; Under the reflux conditions reaction kettle is warming up under 80 ℃～130 ℃ conditions, again epoxy curing agent is added hybrid reaction in the reaction kettle.
(a7), like (a1) or (a5) described composition epoxy resin solution: under logical inert gas environment; Earlier part organic solvent and epoxy resin adding reaction kettle internal heating are mixedly configured into homogeneous system solution, again residual solvent and epoxy curing agent are added hybrid reaction in the reaction kettle.
(a8), like (a6) described composition epoxy resin solution: said epoxy curing agent is configured to organic suspension solution and adds in the reaction kettle.
(a9), like (a4) described composition epoxy resin solution: described epoxy curing agent is that 0.25:1～4:1 mixed configuration obtains by Dyhard RU 100 class solidifying agent and aromatic amine curing agent by the basic equivalence ratio of reactivity.
B scalariform attitude epoxy resin component solution of the present invention is uniformly dispersed, and particularly stablizes at room temperature condition to reach storage period more than 1 year, applicable to self-adhesive lacquer, coating, tackiness agent and impregnant etc.
Embodiment
Further specify the present invention below in conjunction with embodiment, adopt following testing method in an embodiment:
Epoxy resin component solution reaches the determination methods of B scalariform attitude: sample solution is poured in the xylene solvent, stirred and leave standstill the back if the layering turbid phenomenon occurs, show that then this reaction has arrived B scalariform attitude;
The determination methods of B scalariform attitude epoxy resin component stability of solution: under the room temperature condition; The B scalariform attitude epoxy resin component solution example that does not add mineral filler is deposited in the sealed vessel; Sampling regularly joins (for example acetone) in the epoxy resin good solvent; Stir afterwards, if the sample that takes out can be dissolved in the solvent fully and form homogeneous system, then interpret sample still has good stability.
Embodiment 1
The B scalariform attitude epoxy resin component solution synthetic ratio of present embodiment sees the following form 1:
Table 1
Preparing method: under the normal temperature, solvent butyl acetate is added in the reaction kettle logical protection of inert gas; Under whipped state, add epoxy resin DER331 and DER736,5,5 '-dimethyl--4; 4 '-diaminodiphenyl-methane and PHB under refluxad begin to heat up then, and the control stirring velocity is at 150rpm; Heat-up rate makes the reaction mass temperature be increased to 120 ℃ at 1.5 ℃/min, and under this temperature, continues reaction 3 hours; This moment, the sampling judgement reached B scalariform attitude, fast the reaction mass temperature was cooled to below 50 ℃ then, and prepared B scalariform attitude epoxy resin component solution is homogeneous system; Solid content 50%, reach more than 12 months stable storage period.
Embodiment 2
The B scalariform attitude epoxy resin component solution synthetic ratio of present embodiment sees the following form 2:
Table 2
The preparation method: under the normal temperature, pimelinketone is added in the reaction kettle, logical protection of inert gas adds epoxy resin E-21 and CYDPG-207 again; Under refluxad begin then to heat up, the control stirring velocity is at 150rpm, and heat-up rate makes the reaction mass temperature be increased to 130 ℃ at 1.5 ℃/min; Add mphenylenediamine and bismaleimides then, and under this temperature, continue reaction 1 hour, this moment, the sampling judgement reached B scalariform attitude; Fast the reaction mass temperature is cooled to below 50 ℃ then, adds solvent acetone, stir; Prepared B scalariform attitude epoxy resin component solution is homogeneous system, solid content 38%, and reach more than 12 months stable storage period.
Embodiment 3
The B scalariform attitude epoxy resin component solution synthetic ratio of present embodiment sees the following form 2:
Table 3
The preparation method: under the normal temperature, pimelinketone is added in the reaction kettle, logical protection of inert gas adds epoxy resin E-39D again; Under refluxad begin then to heat up, the control stirring velocity is at 150rpm, and heat-up rate is at 1.5 ℃/min; Make the reaction mass temperature be increased to 120 ℃, add Dyhard RU 100 then, and under this temperature, continue reaction 9 hours; This moment, the sampling judgement reached B scalariform attitude, fast the reaction mass temperature was cooled to below 50 ℃ then, stirred; Prepared B scalariform attitude epoxy resin component solution is homogeneous system, solid content 50%, and reach more than 120 months stable storage period.
Claims (6)
1. can steady in a long-term store for one kind, and the preparation condition B scalariform attitude epoxy resin component solution and preparation method thereof of control easily, it is characterized by and comprise:
(A): epoxy resin;
(B): epoxy curing agent, the equivalent of reactive base that should (B) epoxy curing agent is 0.1～3.0 amount with respect to the normal ratio of the epoxy group(ing) of (A) epoxy resin;
(C): organic solvent; Above-mentioned (A) and (B) be solvent with (C) under protection of inert gas, synthesized the epoxy resin component solution of solid content in 10%～90% B scalariform attitude through solution polymerization process.
2. constituent solution as claimed in claim 1; Wherein epoxy curing agent (B) is characterized in that, comprises Dyhard RU 100 class solidifying agent; PHB; Bismaleimides, aromatic amine curing agent can use separately or also can mix and use two kinds or these two or more epoxy curing agents.
3. constituent solution as claimed in claim 1, wherein organic solvent (C) is characterized in that, comprises arene; Ester is an organic solvent, and alcohol is organic solvent, and ether is organic solvent; Ketone is organic solvent, and the amides organic solvent can use separately or also can mix and use two kinds or these two or more organic solvents; Its usage quantity can be according to the needs of product end-use with respect to total 100 mass parts of above-mentioned (A)～(B), and addition is 10 mass parts～90 mass parts.
4. one of preparation method of constituent solution as claimed in claim 1 is characterized in that, comprises the steps: at normal temperatures organic solvent (C) to be added reaction kettle; Logical protection of inert gas adds epoxy resin (A) and epoxy hardener (B) under whipped state, also can add above-mentioned other compositions as additive according to the final performance need of product; Under refluxad begin then to heat up, make still internal reaction temperature of charge rise to 50 ℃～180 ℃, and keep this temperature and continue reaction 0.5 hour～12 hours; After reaction 0.5 hour, whenever detect, when epoxy constituent level of response arrives B scalariform attitude at a distance from sampling in 10～20 minutes; Reactant is cooled to below 50 ℃; According to the requirement of product final properties, also can further add the organic solvent that chooses kind and consumption, also can further add the mineral filler that chooses type and consumption; Afterwards; Stir, the finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
5. one of preparation method of constituent solution as claimed in claim 1 is characterized in that, comprises the steps: at normal temperatures organic solvent (C) to be added reaction kettle; Logical protection of inert gas adds epoxy resin (A) under whipped state, also can add above-mentioned other compositions as additive according to the final performance need of product; Under refluxad begin then to heat up, still internal reaction temperature of charge rises to 50 ℃～180 ℃, adopts the sealing apparatus for feeding afterwards; Epoxy hardener (B) with solid form, perhaps to be mixed with the organic solution form, more or with the form that is mixed with organic suspension liquid is fed in raw material in the reaction kettle; And keep this temperature and continue reaction 0.5 hour～12 hours, after reaction 0.5 hour, whenever detect at a distance from sampling in 10～20 minutes; When epoxy constituent level of response arrives B scalariform attitude, reactant is cooled to below 50 ℃, according to the requirement of product final properties; Also can further add the organic solvent that chooses kind and consumption; Also can further add the mineral filler that chooses type and consumption, afterwards, stir; The finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
6. one of preparation method of the described constituent solution of claim 1; It is characterized in that; Comprise the steps: earlier logical at normal temperatures protection of inert gas; Again part organic solvent (C) and epoxy resin (A) are joined to mix in the stirring tank at reflux conditions and after temperature is no more than and under the condition of temperature of reaction, be mixed with the solution of the epoxy resin (A) of homogeneous system; In addition, at normal temperatures other part organic solvent (C) is added in the reaction kettle, under whipped state, add epoxy hardener (B) again; Also can add above-mentioned other compositions as additive according to the final performance need of product, under refluxad begin then to heat up, still internal reaction temperature of charge rises to 50 ℃～180 ℃; Adopt the sealing apparatus for feeding afterwards, with before mix epoxy resin (A) solution for preparing in the stirring tank and feed in raw material in the reaction kettle, and keep this temperature and continue reaction 0.5 hour～12 hours; After reaction 0.5 hour, whenever detect, when epoxy constituent level of response arrives B scalariform attitude at a distance from sampling in 10～20 minutes; Reactant is cooled to below 50 ℃,, also can further adds the organic solvent that chooses kind and consumption according to the requirement of product final properties; Also can further add the mineral filler that chooses type and consumption, afterwards, stir; The finished product are adjusted to suitable solid content and viscosity, promptly obtain the epoxy resin component solution of B scalariform attitude.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105237949A (en) * | 2014-06-12 | 2016-01-13 | 广东生益科技股份有限公司 | Thermosetting epoxy resin composition and applications thereof |
| CN111393949A (en) * | 2020-03-31 | 2020-07-10 | 苏州巨峰电气绝缘系统股份有限公司 | Self-adhesive paint, corona-resistant polyimide paint and preparation method thereof |
| CN111410891A (en) * | 2020-03-31 | 2020-07-14 | 苏州巨峰电气绝缘系统股份有限公司 | Self-adhesive corona-resistant polyimide paint, enameled wire and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031609A (en) * | 2004-09-27 | 2007-09-05 | 德国艾托科技公司 | Process for the preparation of a fibre-reinforced resin-coated sheet |
| CN101100502A (en) * | 2007-08-09 | 2008-01-09 | 同济大学 | B stage epoxy resin solution and preparing method thereof |
-
2012
- 2012-09-07 CN CN2012103307898A patent/CN102838840A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031609A (en) * | 2004-09-27 | 2007-09-05 | 德国艾托科技公司 | Process for the preparation of a fibre-reinforced resin-coated sheet |
| CN101100502A (en) * | 2007-08-09 | 2008-01-09 | 同济大学 | B stage epoxy resin solution and preparing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 关常参: "B阶环氧树脂的研究", 《粘接》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105237949A (en) * | 2014-06-12 | 2016-01-13 | 广东生益科技股份有限公司 | Thermosetting epoxy resin composition and applications thereof |
| CN105237949B (en) * | 2014-06-12 | 2017-11-03 | 广东生益科技股份有限公司 | A kind of thermosetting epoxy resin composition and application thereof |
| CN111393949A (en) * | 2020-03-31 | 2020-07-10 | 苏州巨峰电气绝缘系统股份有限公司 | Self-adhesive paint, corona-resistant polyimide paint and preparation method thereof |
| CN111410891A (en) * | 2020-03-31 | 2020-07-14 | 苏州巨峰电气绝缘系统股份有限公司 | Self-adhesive corona-resistant polyimide paint, enameled wire and preparation method thereof |
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Application publication date: 20121226 |