CN106753209A - A kind of low-density high heat conduction casting glue - Google Patents
A kind of low-density high heat conduction casting glue Download PDFInfo
- Publication number
- CN106753209A CN106753209A CN201611091686.5A CN201611091686A CN106753209A CN 106753209 A CN106753209 A CN 106753209A CN 201611091686 A CN201611091686 A CN 201611091686A CN 106753209 A CN106753209 A CN 106753209A
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- CN
- China
- Prior art keywords
- low
- powder
- heat conduction
- density
- casting glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Component the invention discloses a kind of low-density high heat conduction casting glue including following and mass percent：Organosilicon polymer 25% 50%；Conduction powder 30% 60%；Low-density powder 0.5% 5%；Auxiliary agent 5% 15%, described low-density powder is one or more mixtures in hollow silica, aeroge, porous silicon low-density powder, graphene powder, packing material product of the invention has the characteristic of heat conduction, light weight simultaneously, solve some heat conduction of Code in Hazardous Special Locations demand, characteristics of light weight, there are all characteristics that simple casting glue is general, prepare it is simple and easy to apply, it is safe and reliable.
Description
Technical field
The present invention relates to Heat Conduction Material technical field, more particularly to a kind of low-density high heat conduction casting glue.
Background technology
Casting glue is used for the bonding of electronic component, and sealing, embedding and coating are protected.Casting glue belongs to before uncured
It is liquid, with mobility, glue viscosity according to the material of product, performance, production technology it is different and otherwise varied.Casting glue
Its use value could be realized after being fully cured, can be played after solidification it is waterproof and dampproof, dust-proof, heat conduction, secrecy, anticorrosion,
Heatproof, shockproof effect.But be to need the high thermal conductivity again to need relatively low density in some particular fields.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of low-density high heat conduction embedding that can solve the problem that above mentioned problem
Glue.
The technical scheme that is used to solve its technical problem of the present invention is：A kind of low-density high heat conduction casting glue, bag
Include following component and mass percent：
Organosilicon polymer 25%-50%；
Conduction powder 30%-60%；
Low-density powder 0.5%-5%；
Auxiliary agent 5%-15%.
During described low-density powder is hollow silica, aeroge, porous silicon low-density powder, graphene powder
One or more mixtures.
As a further improvement on the present invention, described organosilicon polymer refers to methylvinyl-polysiloxane, hydrogeneous
The mixture of one or two or more kinds in polysiloxanes.
As a further improvement on the present invention, described conduction powder refers to aluminum oxide, zinc oxide, aluminium nitride, boron nitride
In one kind or mixture of more than two kinds.
As a further improvement on the present invention, described auxiliary agent refers to coupling agent, platinum catalyst.
The beneficial effects of the invention are as follows：Packing material product of the invention has the characteristic of heat conduction, light weight simultaneously, solves
Some heat conduction of Code in Hazardous Special Locations demand, characteristics of light weight, there is all characteristics that simple casting glue is general, prepare simple and easy to apply, peace
It is complete reliable.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, is not intended to limit the scope of the present invention..
Embodiment：
1. raw material prepare as follows：
A. organosilicon polymer
A vinyl silicone oils, vinyl 0.20%, containing hydrogen silicone oil, the mixture of hydrogen content 0.18%
B. conduction powder
B1. alumina powder（D50=0.5~40μm）B2. SiO 2 powder（D50=5~45μm）
C. low-density powder
C1. hollow silica (D50=20 μm ~ 65 μm) c2. aeroges（D50=20nm ~100nm）C3. graphene powder
（1 ~ 20 layer）
D. auxiliary agent
D1 coupling agents, catalyst d2. combustion adjuvants
After above-mentioned conduction powder is dried, the ratio represented according to table 1 below is matched, and the powder after proportioning is entered using wet method
Row surface treatment, makes its powder surface wrap up one layer of coupling agent.It is being put into i.e. heat conduction embedding after planetary mixer stirring is vacuumized
Glue.
The embodiment of table 1
In order to verify the performance of product of the present invention, following test has been done (3.0mm is standard)：
First, Determination of conductive coefficients
By 5 kinds of heat conduction casting glues of system of embodiment in DR-III type heat flow method thermal conductivity test instrument, thickness control is surveyed in 3.0mm
Thermal conductivity factor, as a result shows table 2.
2nd, breakdown voltage test
By 5 kinds of heat conduction casting glues of system of embodiment in 50KV exchange insulation voltage-withstand tests, the breakdown potential that thickness control is surveyed in 3.0mm
Pressure, as a result shows table 2.
3rd, density performance test
By the 5 kinds of heat conduction casting glue of system test densitys on density tester of embodiment, as a result show table 2.
The low-density heat conduction casting glue test data result table of the invention of table 2
From above-mentioned data, the application of the material such as silica and hollow silica, aeroge, Graphene, relative and oxygen
Change aluminium density to decrease, and thermal conductivity factor reduction is not too much more, can meet the applied field to the heat conduction embedding requirement of low-density
Scape is used.
Claims (4)
1. a kind of low-density high heat conduction casting glue, it is characterised in that：Including following component and mass percent：
Organosilicon polymer 25%-50%；
Conduction powder 30%-60%；
Low-density powder 0.5%-5%；
Auxiliary agent 5%-15%；
Described low-density powder is the one kind in hollow silica, aeroge, porous silicon low-density powder, graphene powder
Or two or more mixtures.
2. a kind of low-density high heat conduction casting glue according to claim 1, it is characterised in that：Described organosilicon polymer
It refer to vinyl polysiloxane, benzene alkenyl polysiloxanes, methylbenzene olefin(e) acid siloxanes, methylvinyl-polysiloxane, hydrogeneous poly-
The mixture of one or two or more kinds in siloxanes.
3. a kind of low-density high heat conduction casting glue according to claim 1, it is characterised in that：Described conduction powder refers to
One kind or mixture of more than two kinds in aluminum oxide, zinc oxide, aluminium nitride, boron nitride.
4. a kind of low-density high heat conduction casting glue according to claim 1, it is characterised in that：Described auxiliary agent refers to coupling
Agent, platinum catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091686.5A CN106753209A (en) | 2016-12-01 | 2016-12-01 | A kind of low-density high heat conduction casting glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091686.5A CN106753209A (en) | 2016-12-01 | 2016-12-01 | A kind of low-density high heat conduction casting glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106753209A true CN106753209A (en) | 2017-05-31 |
Family
ID=58915544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611091686.5A Pending CN106753209A (en) | 2016-12-01 | 2016-12-01 | A kind of low-density high heat conduction casting glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106753209A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108084716A (en) * | 2017-12-18 | 2018-05-29 | 昆山裕凌电子科技有限公司 | A kind of low fuel-displaced high heat conduction Embedding Material and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337033A (en) * | 2011-08-18 | 2012-02-01 | 华南理工大学 | Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof |
| CN104479623A (en) * | 2014-12-03 | 2015-04-01 | 湖南皓志科技股份有限公司 | Normal-temperature solidified organic silicon pouring sealant having high thermal conductivity |
| CN104861661A (en) * | 2015-05-13 | 2015-08-26 | 浙江中天氟硅材料有限公司 | Low density heat conduction pouring sealant and preparation method thereof |
-
2016
- 2016-12-01 CN CN201611091686.5A patent/CN106753209A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337033A (en) * | 2011-08-18 | 2012-02-01 | 华南理工大学 | Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof |
| CN104479623A (en) * | 2014-12-03 | 2015-04-01 | 湖南皓志科技股份有限公司 | Normal-temperature solidified organic silicon pouring sealant having high thermal conductivity |
| CN104861661A (en) * | 2015-05-13 | 2015-08-26 | 浙江中天氟硅材料有限公司 | Low density heat conduction pouring sealant and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108084716A (en) * | 2017-12-18 | 2018-05-29 | 昆山裕凌电子科技有限公司 | A kind of low fuel-displaced high heat conduction Embedding Material and preparation method thereof |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |